CN104681534A - Adjustable three-dimensional inductance element - Google Patents
Adjustable three-dimensional inductance element Download PDFInfo
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- CN104681534A CN104681534A CN201310629177.3A CN201310629177A CN104681534A CN 104681534 A CN104681534 A CN 104681534A CN 201310629177 A CN201310629177 A CN 201310629177A CN 104681534 A CN104681534 A CN 104681534A
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- cabling
- electric
- conductive junction
- substrate
- adjustable
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
Abstract
The invention discloses an adjustable three-dimensional inductance element which comprises a substrate, a plurality of conductive contacts, a plurality of conductive parts, a first routing line and a pound line, wherein the substrate is provided with an upper surface; the conductive contacts are formed on the upper surface of the substrate; the conductive parts are buried in the substrate; each conductive part is electrically connected to one conductive contact of the conductive contacts; the first routing line is buried in the substrate and is electrically connected to two conductive parts of the conductive parts; two ends of the pound line are jointed between the two conductive contacts of the conductive contacts; the pound line, the conductive parts and the first routing line commonly form a three-dimensional inductance path.
Description
Technical field
The present invention is about a kind of electric component, refers to a kind of adjustable three-dimensional inductance element especially.
Background technology
Electronic Packaging usually needs passive device, such as inductor, capacitor and resistor etc., carrying out particular electrical circuit tuning, such as, usually having needed in Electronic Packaging, to have carried out the tuning of particular electrical circuit by adding inductor in many radio frequencies (RF) application.Add discrete passive device and usually easily cause the size of this encapsulation and the increase of weight to Electronic Packaging.In addition, in Electronic Packaging, add discrete passive device usually need an exclusive production line, and may need to arrange optional equipment and processing procedure, these optional equipments and processing procedure can cause higher production cost and may increase processing time.
For example, existing technology solves these problems by manufacturing passive device above the active circuits of an integrated circuit (IC) apparatus.But integrated passive element also needs various additional process, such as, need to form interlayer above the up-protective layer of integrated circuit (IC) apparatus, allow passive device to be connected to the integrated circuit component of below by this.In addition, in these prior art concrete examples, at least two crystal grain of storehouse are each other needed, to complete passive device.
Summary of the invention
The embodiment of the present invention provides a kind of adjustable three-dimensional inductance element, and it is by being embedded in the first cabling in substrate, and combines the pound line being positioned at surface, to realize the shaping three-dimensional inductance of three dimensionality.
The embodiment of the present invention provides a kind of adjustable three-dimensional inductance element, comprises a substrate, multiple conductive junction point, multiple electric-conductor, one first cabling and a pound line.Substrate has a upper surface, and described multiple conductive junction point is formed at the described upper surface of substrate.Described multiple electric-conductor is embedded in substrate, and each electric-conductor is electrically connected at one of them described multiple conductive junction point.First cabling is embedded in substrate, and the first cabling is electrically connected at described multiple electric-conductor two electric-conductors wherein.The two ends of pound line are engaged between described multiple conductive junction point two conductive junction points wherein, and pound line, described multiple electric-conductor and the first cabling form a three-dimensional inductance path jointly.
Another embodiment of the present invention also provides a kind of adjustable three-dimensional inductance element, comprises a substrate, multiple conductive junction point, multiple electric-conductor, multiple first cabling and multiple pounds of lines.Substrate has a upper surface, and described multiple conductive junction point is formed at the described upper surface of substrate.Described multiple electric-conductor is embedded in substrate, and each conductive system is electrically connected at one of them described multiple conductive junction point.Described multiple first cabling is embedded in substrate, and each first cabling is electrically connected at described multiple electric-conductor two electric-conductors wherein.The two ends of each pound of line in described multiple pounds of lines are engaged between described multiple conductive junction point two conductive junction points wherein, and described multiple pounds of lines, described multiple electric-conductor and described multiple first cabling form a three-dimensional inductance path jointly.
The adjustable three-dimensional inductance element that the embodiment of the present invention provides can make the first cabling by being electrically connected at the electric-conductor being embedded in substrate, and realizes burying vertically.Described adjustable three-dimensional inductance element also by being embedded in the first cabling of substrate and being positioned at the pound line of surface, realizes the three-dimensional inductance path that three dimensionality is shaping.
In order to technology, method and effect that the present invention takes for reaching set object further can be understood, refer to following detailed description for the present invention, accompanying drawing, believe object of the present invention, feature and feature, when being goed deep into thus and concrete understanding, but accompanying drawing and annex only provide with reference to and use is described, be not used for the present invention's in addition limitr.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view after the adjustable three-dimensional inductance element of one embodiment of the invention removes pound line.
Fig. 2 is the generalized section of adjustable three-dimensional inductance element along A1-A1 line of Fig. 1.
Fig. 3 is the generalized section of adjustable three-dimensional inductance element along A2-A2 line of Fig. 1.
Fig. 4 is the generalized section of adjustable three-dimensional inductance element along A3-A3 line of Fig. 1.
Fig. 5 is the upper schematic diagram of the adjustable three-dimensional inductance element of Fig. 1.
Fig. 6 is the schematic perspective view of the adjustable three-dimensional inductance element of one embodiment of the invention.
Fig. 7 is the generalized section of adjustable three-dimensional inductance element along A4-A4 line of Fig. 6.
Fig. 8 is the generalized section of adjustable three-dimensional inductance element along A5-A5 line of Fig. 6.
Fig. 9 is the upper schematic diagram of the adjustable three-dimensional inductance element of Fig. 6.
Figure 10 to Figure 14 is respectively the upper schematic diagram of the adjustable three-dimensional inductance element of another embodiment of the present invention.
Figure 15 is the schematic perspective view after the adjustable three-dimensional inductance element of another embodiment of the present invention removes pound line.
Figure 16 is the generalized section of adjustable three-dimensional inductance element along B1-B1 line of Figure 15.
Figure 17 is the generalized section of adjustable three-dimensional inductance element along B2-B2 line of Figure 15.
Figure 18 is the upper schematic diagram of the adjustable three-dimensional inductance element of Figure 15.
Figure 19 is the schematic perspective view of the adjustable three-dimensional inductance element of another embodiment of the present invention.
Figure 20 is the generalized section of adjustable three-dimensional inductance element along B3-B3 line of Figure 19.
Figure 21 is the upper schematic diagram of the adjustable three-dimensional inductance element of Figure 19.
Wherein, description of reference numerals is as follows:
Adjustable three-dimensional inductance element W1, W2
Substrate 100
The upper surface 100S of substrate
Perforation T
Substrate 101
First circuit layer 102
Second circuit layer 104
Tertiary circuit layer 106
First dielectric layer 1021
Second dielectric layer 1041
3rd dielectric layer 1061
First conductive pattern 1022
Second conductive pattern 1042
3rd conductive pattern 1062
Connection pad 1022P, 1042P, 1062P
First lining 103
Second lining 105
3rd lining 107
First conductive junction point 201
Second conductive junction point 202
3rd conductive junction point 203
First conduction component 311
Second conduction component 312
3rd conduction component 313
First electric-conductor 301
Second electric-conductor 302
Pound line 500
First cabling 400
Second cabling 600
3rd cabling 700
Hatching line A1A1 ~ A5A5, B1B1 ~ B3B3
Embodiment
Please with reference to Fig. 6 to Fig. 8, Fig. 6 is the schematic perspective view of the adjustable three-dimensional inductance element of one embodiment of the invention, Fig. 7 is the generalized section of adjustable three-dimensional inductance element along A4-A4 line of Fig. 6, and Fig. 8 is the generalized section of adjustable three-dimensional inductance element along A5-A5 line of Fig. 6.Adjustable three-dimensional inductance element W1 comprises substrate 100, multiple conductive junction point (such as comprising the first conductive junction point 201, second conductive junction point 202), multiple electric-conductor (such as comprising the first electric-conductor 301, second electric-conductor 302), the first cabling 400 and pound line 500, wherein conductive junction point is formed at the upper surface 100S of substrate 100, and electric-conductor and the first cabling 400 are all embedded in substrate 100.The two ends of pound line 500 are engaged between these conductive junction points 201,202 two conductive junction points wherein.
First, please with reference to Fig. 1 to Fig. 3, Fig. 1 is the schematic perspective view after the adjustable three-dimensional inductance element of one embodiment of the invention removes pound line, Fig. 2 is the generalized section of adjustable three-dimensional inductance element along A1-A1 line of Fig. 1, and Fig. 3 is the generalized section of adjustable three-dimensional inductance element along A2-A2 line of Fig. 1.Substrate 100 can be printed circuit board (PCB) (Printed Wiring Board, PWB), and substrate 100 can in order to support electronic component (figure does not illustrate) and can be electrically connected in order to provide electronic component.In other embodiments, substrate 100 can be any carrier, such as semiconductor substrate, hard circuit board (flex-rigid wiring board) or ceramic substrate (such as LTCC (Low Temperature Co-fired Ceramics, LTCC)).
It is worth mentioning that, in embodiment as shown in Figure 2, substrate 100 can be multilayer board, substrate 100 can be made up of substrate 101, multilayer circuit layer (such as comprising the first circuit layer 102, second circuit layer 104 and tertiary circuit layer 106) and multilayer lining (such as comprising the first lining 103, second lining 105 and the 3rd lining 107), is wherein formed at above substrate 101 multilayer circuit layer 102,104,106 and the mutual storehouse of multilayer lining 103,105,107.
Specifically, second circuit layer 104 is formed at above the first circuit layer 102, and tertiary circuit layer 106 is formed at above second circuit layer 104.First lining 103 is between the first circuit layer 102 and second circuit layer 104, and the second lining 105 is between second circuit layer 104 and tertiary circuit layer 106.3rd lining 107 is formed at above tertiary circuit layer 106, and the upper surface 100S of the 3rd lining 107 is exposed in environment.
First circuit layer 102 can comprise the first dielectric layer 1021 and the first conductive pattern 1022, second circuit layer 104 can comprise the second dielectric layer 1041 and the second conductive pattern 1042, and tertiary circuit layer 106 can comprise the 3rd dielectric layer 1061 and the 3rd conductive pattern 1062.Each conductive pattern such as comprises the tie point (figure does not illustrate) needed for multiple cabling and All other routes.First conductive pattern 1022, second conductive pattern 1042 and the 3rd conductive pattern 1062 also can comprise at least one connection pad 1022P, 1042P, 1062P respectively, and connection pad 1022P, 1042P, 1062P are made by electric conducting material, to provide electric connection.
In embodiment as shown in the figure, each lining 103,105,107 can have multiple perforation T, and the two ends of each perforation T may extend to one of them layer of multilayer circuit layer 102,104,106.The two ends of the perforation T of the first lining 103 extend to the first circuit layer 102 and second circuit layer 104 respectively, the two ends of the perforation T of the second lining 105 extend to second circuit layer 104 and tertiary circuit layer 106 respectively, and one end of the perforation T of the 3rd lining 107 extends to tertiary circuit layer 106, the other end of the perforation T of the 3rd lining 107 is exposed to the upper surface 100S of substrate 100.
Conductive junction point 201,202 is made by electric conducting material, to provide electric connection.Structure example metal gasket, tin ball or the elargol etc. in this way of conductive junction point 201,202.Conductive junction point 201,202 can be the metal gasket being formed at substrate 100 upper surface 100S.In the embodiment that other do not illustrate, conductive junction point 201,202 can be the part that electric-conductor 301,302 is exposed to substrate 100 upper surface 100S, illustrates so the shape of conductive junction point 201,202 in figure is only, and non-limiting the present invention.In addition, structure and the quantity of conductive junction point 201,202 can design according to actual demand, and embodiments of the invention do not limit.In the adjustable three-dimensional inductance element W1 of the present embodiment, the quantity of conductive junction point 201,202 may correspond to the quantity in electric-conductor 301,302.
Electric-conductor 301,302 is electrically connected at one of them conductive junction point of described multiple conductive junction point 201,202.In embodiment as shown in the figure, each electric-conductor 301,302 can be made up of multiple conduction component (such as the first conduction component 311, second conduction component 312 and the 3rd conduction component 313) and multiple connection pad (such as connection pad 1022P, connection pad 1042P and connection pad 1062P).
Specifically, be formed with conduction component 311,312,313 in each perforation T of each lining 103,105,107 respectively, and the two ends of each conduction component 311,312,313 can be contacted with one of them layer of multilayer conductive pattern 1022,1042,1062.The two ends being formed with the first conduction component 311, first conduction component 311 in the perforation T of the first lining 103 are contacted with the first conductive pattern 1022 connection pad 1022P and the second conductive pattern 1042 connection pad 1042P respectively.The two ends being formed with the second conduction component 312, second conduction component 312 in the perforation T of the second lining 105 are contacted with the second conductive pattern 1042 connection pad 1042P and the 3rd conductive pattern 1062 connection pad 1062P respectively.The end thereof contacts of the 3rd conduction component the 313, three conduction component 313 is formed in the 3rd conductive pattern 1062 connection pad 1062P in the perforation T of the 3rd lining 107.The other end of the 3rd conduction component 313 is contacted with the first conductive junction point 210, to be electrically connected at the first conductive junction point 210.
First electric-conductor 301 can be made up of the first conduction component 311, second conduction component 312, the 3rd conduction component 313, second conductive pattern 1042 connection pad 1042P and the 3rd conductive pattern 1062 connection pad 1062P.Second electric-conductor 302 can be made up of the second conduction component 312, the 3rd conduction component 313 and the 3rd conductive pattern 1062 connection pad 1062P.
Conduction component 311,312,313 is made up of the electric conducting material be filled in perforation T.In practice, conduction component 311,312,313 is such as conductive plunger, can use tungsten plug processing procedure, aluminium connector processing procedure, copper connector processing procedure, silicide connector processing procedure or other suitable filling process in perforation T filled conductive material in the mode forming conduction component 311,312,313, the present invention is not limited at this.In addition, in other embodiments, conduction component 311,312,313 also can be made up of the conductive material layer be formed on perforation T inwall, and described conductive material layer conformally (conformingly) can be covered in perforation T inwall.
First cabling 400 is embedded in substrate 100, and the first cabling 400 is electrically connected at described multiple electric-conductor two electric-conductors wherein, and such as, the first cabling 400 can be electrically connected at described multiple electric-conductor two the first electric-conductors 301 wherein.In addition, in the present embodiment, adjustable three-dimensional inductance element W1 also can comprise the second cabling 600, second cabling 600 is embedded in substrate 100, and the second cabling 600 is electrically connected at described multiple electric-conductor two electric-conductors wherein, such as, the second cabling 600 can be electrically connected at described multiple electric-conductor two the second electric-conductors 302 wherein.
As shown in FIG. 2 and 3, the first cabling 400 is made up of a conductive layer, and the second cabling 600 is made up of another conductive layer.For example, first can form a conductive layer (figure do not illustrate) in substrate 101, then, can graphical this conductive layer, wherein a part for patterned conductive layer can be used as the first conductive pattern 1022, and another part of patterned conductive layer can be used as the first cabling 400.Then, another conductive layer (figure does not illustrate) can be formed on the first lining 103, then, can graphical this another conductive layer, wherein a part for this another conductive layer patterned can be used as the second conductive pattern 1042, and another part of this another conductive layer patterned can be used as the second cabling 600.Wherein, the pattern of these conductive layers described is that art those of ordinary skill can according to the user demand footpath row design of reality.
Please with reference to Fig. 1, Fig. 4 and Fig. 5, Fig. 4 is the generalized section of adjustable three-dimensional inductance element along A3-A3 line of Fig. 1, and Fig. 5 is the upper schematic diagram of the adjustable three-dimensional inductance element of Fig. 1.In the present embodiment, the first cabling 400 and the second cabling 600 all have elongate in shape.First cabling 400 and the second cabling 600 all can be made up of the combined deposition single or multiple lift electric conducting material of such as metal material, alloy material, conducting polymer composite or above-mentioned material.In addition, the shape of the first cabling 400 and the second cabling 600 and size are that art those of ordinary skill can design according to the service condition demand footpath row of reality, therefore embodiments of the invention are not limited at this.
In one embodiment of the invention, first cabling 400 is formed by the method for patterned conductive layer or inlaying process, can comprise the following steps: first in the method for patterned conductive layer, deposit a conductive layer (not illustrating) in substrate 101, afterwards, with photoetching process patterned conductive layer, to form the first conductive pattern 1022 and the first cabling 400.Afterwards, a dielectric material (not illustrating) is deposited on the first conductive pattern 1022, first cabling 400 and substrate 101, to form the first dielectric layer 1021.Above-mentioned inlaying process forms the first cabling 400 and can comprise the following steps: first, forms a dielectric layer (not illustrating) in substrate 101.Then, patterned dielectric layer, to form the opening of multiple predetermined formation first conductive pattern 1022 and the first cabling 400, follow-up, the electric conducting material depositing such as tungsten or copper is on the first dielectric layer 1021 and insert in above-mentioned opening.Thereafter, with such as chemical mechanical milling method grinding electric conducting material, to form the first conductive pattern 1022 and the first cabling 400.The mode of depositing metal conductive material is such as spraying plating (spray coating), plating (electroplating), electroless plating (electrolessplating), evaporation or sputter (sputtering) etc.Similarly, the second cabling 600 is also by method or the inlaying process formation of patterned conductive layer.
First cabling 400 by the connection pad 1022P of the first conductive pattern 1022 to be electrically connected at the first electric-conductor 301, and the second cabling 600 by the connection pad 1042P of the second conductive pattern 1042 to be electrically connected at the second electric-conductor 302.By this, first electric-conductor 301 can in order to be electrically connected the first cabling 400 and to be positioned at first conductive junction point 201 of substrate 100 upper surface 100S, second electric-conductor 302 can in order to be electrically connected the second cabling 600 and to be positioned at second conductive junction point 202 of substrate 100 upper surface 100S, to move on the electrically conducting of the first cabling 400 or the second cabling 600.In the embodiment that other do not illustrate, first cabling 400 also directly can be contacted with the first electric-conductor 301 to complete electric connection, or the second cabling 600 also directly can be contacted with the second electric-conductor 302 to complete electric connection, illustrate so the shape of the first cabling 400 in figure or the second cabling 600, the first cabling 400 and the annexation of the first electric-conductor 301 and the annexation of the second cabling 600 and the second electric-conductor 302 are only, and non-limiting the present invention.
It is worth mentioning that, adjustable three-dimensional inductance element W1 includes multiple first cabling 400 and multiple second cabling 600.Being mutually side by side between multiple first cabling 400 wherein each the first cabling 400, is also mutually side by side between multiple second cabling 600 wherein each the second cabling 600.Multiple first cablings 400 are all embedded in the same layer of substrate 100, multiple second cablings 600 are also all embedded in the same layer of substrate 100, and the first cabling 400 and the second cabling 600 are the different layers being positioned at substrate 100, wherein the second cabling 600 can be positioned at above or below the first cabling 400.In addition, the first cabling 400 and the second cabling 600 do not overlap each other, and that is, the first cabling 400 does not overlap each other in the projection of upper surface 100S and the second cabling 600 in the projection of upper surface 100S.Multiple first cabling 400 such as can all be formed in the substrate 101 of substrate 100.That is, the first conductive pattern 1022 and multiple first cabling 400 wherein each the first cabling 400 can be respectively a part for the patterned conductive material layer in substrate 101.Multiple second cabling 600 such as can all be formed on the first lining 103.That is, the second conductive pattern 1042 and multiple second cabling 600 wherein each the second cabling 600 can be respectively a part for the patterned conductive material layer on the first lining 103.
As shown in Figure 4, can be isolated with the structure of substrate 100 between each cabling, specifically, can be isolated with the first dielectric layer 1021 between multiple first cabling 400 wherein each the first cabling 400, can be isolated with the second dielectric layer 1041 between multiple second cabling 600 wherein each the second cabling 600, and can be isolated with the first lining 103 between the first cabling 400 and the second cabling 600.It should be noted that, although each lining 103,105,107 of substrate 100 only illustrates single sedimentary deposit in figure, but should understand in art those of ordinary skill, each lining 103,105,107 also can in order to represent coincide multiple dielectric layer composite dielectric material layer.
As shown in FIG. 2 and 3, a pair first electric-conductors 301 are connected to the both ends of the first cabling 400, and a pair second electric-conductors 302 are connected to the both ends of the second cabling 600.In other non-illustrated embodiments, the first electric-conductor 301 can be connected to the interlude of the first cabling 400, and the second electric-conductor 302 also can be connected to the interlude of the second cabling 600.
Some conductive junction points (such as the first conductive junction point 201) in multiple conductive junction point correspond respectively to multiple first electric-conductor 301, and some conductive junction points (such as the second conductive junction point 202) in multiple conductive junction point correspond respectively to multiple second electric-conductor 302.For example, a pair first conductive junction points 201 correspond respectively to a pair first electric-conductors 301, and a pair second conductive junction points 202 correspond respectively to a pair second electric-conductors 302.As shown in Figure 4, the first conductive junction point 201 configures in two row's straight lines, and the second conductive junction point 202 also configures in two row's straight lines, and the first conductive junction point 201 and the second conductive junction point 202 are interconnected.
Please answer in the lump with reference to Fig. 6 to Fig. 9, wherein Fig. 9 is the upper schematic diagram of the adjustable three-dimensional inductance element of Fig. 6.With reference to figure 7, when a pound line 500 two ends are engaged between described multiple conductive junction point two conductive junction points wherein (such as the first conductive junction point 201 and the second conductive junction point 202), pound line 500, these electric-conductors (such as the first electric-conductor 301) and the first cabling 400 can form a three-dimensional inductance path jointly.That is, pound line 500 can be used as a part for three-dimensional inductance path, and described three-dimensional inductance path system is made up of pound line 500, first cabling 400 and two the first electric-conductors 301 being electrically connected at the first cabling 400.In like manner, with reference to figure 8, pound line 500 and the second cabling 600 can form another kind of three-dimensional inductance path.Again, with reference to figure 9, when one end of many pound lines 500 each pound line 500 wherein is engaged in one first conductive junction point 201, and the other end of pound line 500 is engaged in one second conductive junction point 202, namely each pound line 500 can be engaged between the first conductive junction point 201 and the second adjacent conductive junction point 202 diagonal, first cabling 400 is electrically connected to the second cabling 600, another three-dimensional inductance path can be formed.Aforementioned arbitrary three-dimensional inductance path can realize the adjustable stereoscopic electric sensing unit W1 of the embodiment of the present invention, in other words, the adjustable stereoscopic electric sensing unit W1 of the embodiment of the present invention realizes the characteristic of its adjustable (Tunable) by the design changed as aforementioned arbitrary three-dimensional inductance path.
In the present embodiment, when pound line 500 two ends are engaged between described multiple conductive junction point two conductive junction points wherein, adjustable three-dimensional inductance element W1 can utilize and be positioned at above substrate 100 and the pound line of tool Z-direction (normal direction of meaning and substrate 100 upper surface 100S), combine again to adopt vertically and bury (Vertical Embedded) first cabling 400 or second cabling 600 in substrate 100, realize the three-dimensional inductance path that X-Y-Z dimension is shaping, and described adjustable three-dimensional inductance element W1 can be made to have the change of multiple configuration via the configuration of adjustment pound line.Specifically, be embedded in the first cabling 400 in substrate 100 or the second cabling 600 by being electrically connected at the electric-conductor of tool Z-direction, and realize vertical in bury.
The size of the first cabling 400 and the second cabling 600 and its configurable deep can change the area of three-dimensional inductance path.That is, by adjusting the first cabling 400 or the second cabling 600 and making three-dimensional inductance path have better stability.Moreover, be embedded in the first cabling 400 in substrate 100 and the second cabling 600 dropping place that is not easy to cave in because of external environment influence and the phenomenon such as move.In addition, in follow-up component encapsulation processing procedure (such as film envelope processing procedure) or pound line process, the first cabling 400 and the second cabling 600 also have better stability because being embedded in substrate 100.Generally speaking, the inductance value of three-dimensional inductance path can increase along with the size of the first cabling 400 and the second cabling 600 and its configurable deep and increase.
In addition, aforementioned parallel adjacent continuous stereo inductance path can form a spiral type (spiral) inductance, by adjusting the density between the first cabling 400 and/or the second cabling 600, can increase inductance value.Meanwhile, multiple first cabling 400 in substrate 100 and/or the structure by substrate 100 between the second cabling 600 isolated, with avoid produce parasitic capacitance.
Please refer to Figure 10 to Figure 14, Figure 10 to Figure 14 is respectively the upper schematic diagram of the adjustable three-dimensional inductance element of another embodiment of the present invention.Described adjustable three-dimensional inductance element W1 not only has three-dimensional structure, and realizes the characteristic of its adjustable (Tunable) by the allocation position of adjustment pound line 500.Specifically, with reference to Figure 10 and Figure 13, when pound line 500 two ends are engaged between described multiple conductive junction point two the first conductive junction points 201 wherein, pound line 500 can form two kinds of three-dimensional inductance path with the first cabling 400.With reference to Figure 11 and Figure 14, when pound line 500 two ends are engaged between described multiple conductive junction point two the second conductive junction points 202 wherein, pound line 500 can form another two kinds of three-dimensional inductance path with the second cabling 600.With reference to Figure 12, when pound line 500 two ends are engaged between described multiple conductive junction point one first conductive junction point 201 wherein and one second conductive junction point 202, first cabling 400 can be electrically connected to the second cabling 600 by pound line 500, can form another three-dimensional inductance path.
Please also refer to Figure 15, Figure 16, Figure 17 and Figure 18, Figure 15 is the schematic perspective view after the adjustable three-dimensional inductance element of another embodiment of the present invention removes pound line, Figure 16 is the generalized section of adjustable three-dimensional inductance element along B1-B1 line of Figure 15, Figure 17 is the generalized section of adjustable three-dimensional inductance element along B2-B2 line of Figure 15, and Figure 18 is the upper schematic diagram of the adjustable three-dimensional inductance element of Figure 15.The adjustable three-dimensional inductance element W2 of the present embodiment and the adjustable three-dimensional inductance element W1 similarity of previous embodiment no longer describe, and are only described in detail for the difference between the present embodiment and previous embodiment below.As shown in the figure, the adjustable three-dimensional inductance element W2 of the present embodiment also comprises the 3rd cabling 700,3rd cabling 700 is formed at the upper surface 100S of substrate 100, and the 3rd cabling 700 is electrically connected at described multiple conductive junction point two conductive junction points wherein (such as the 3rd conductive junction point 203).In addition, the adjustable three-dimensional inductance element W2 of the present embodiment can not have the second cabling 600 (ginseng Fig. 8).
3rd cabling 700 is made up of same conductive layer with conductive junction point (such as the first conductive junction point 201 and the 3rd conductive junction point 203).As shown in figure 16, the upper surface 100S of substrate 100 first can form a conductive layer (figure does not illustrate), then, can graphical this conductive layer, wherein a part for patterned conductive layer can be used as the 3rd cabling 700, and another part of patterned conductive layer can be used as conductive junction point, the pattern of described conductive layer is that art has and usually knows that the knowledgeable can according to the user demand footpath row design of reality.The two ends of the 3rd cabling 700 can be contacted with described multiple conductive junction point two the 3rd conductive junction points 203 wherein, to complete electric connection.
3rd cabling 700 has elongate in shape, and the 3rd cabling 700 can be made up of the combined deposition single or multiple lift electric conducting material of such as metal material, alloy material, conducting polymer composite or above-mentioned material.In addition, the shape of the 3rd cabling 700 and size are that art those of ordinary skill can design according to the service condition demand footpath row of reality, therefore embodiments of the invention are not limited at this.
It is worth mentioning that, in the present embodiment, adjustable three-dimensional inductance element W2 includes multiple first cabling 400 and multiple 3rd cabling 700.Being mutually side by side between multiple first cabling 400 wherein each the first cabling 400, is also mutually side by side between multiple 3rd cabling 700 wherein each the 3rd cabling 700.First cabling 400 and the 3rd cabling 700 do not overlap each other, and that is, the first cabling 400 does not overlap each other in the projection of upper surface 100S and the 3rd cabling 700 in the projection of upper surface 100S.In addition, as shown in figure 17, can be isolated with the structure of substrate 100 between the first cabling 400 and the 3rd cabling 700.
A pair the 3rd conductive junction points 203 are connected to the both ends of the 3rd cabling 700.As shown in figure 18, the first conductive junction point 201 configures in two row's straight lines, and the 3rd conductive junction point 203 also configures in two row's straight lines, and the first conductive junction point 201 and the 3rd conductive junction point 203 are interconnected.
Please also refer to Figure 19, Figure 20 and Figure 21, Figure 19 is the schematic perspective view of the adjustable three-dimensional inductance element of another embodiment of the present invention, Figure 20 is the generalized section of adjustable three-dimensional inductance element along B3-B3 line of Figure 19, and Figure 21 is the upper schematic diagram of the adjustable three-dimensional inductance element of Figure 19.The adjustable three-dimensional inductance element W2 of the present embodiment and the adjustable three-dimensional inductance element W1 similarity of previous embodiment no longer describe, and are only described in detail for the difference between the present embodiment and previous embodiment below.With reference to Figure 20, when a pound line 500 two ends are engaged between described multiple conductive junction point two conductive junction points 201,203 wherein, the first cabling 400 can be electrically connected to the 3rd cabling 700 by pound line 500, forms a three-dimensional inductance path with line.
With reference to Figure 21, when one end of many pound lines 500 each pound line 500 wherein is engaged in one first conductive junction point 201, and the other end of pound line 500 is engaged in one the 3rd conductive junction point 203, the first cabling 400 can be electrically connected to the 3rd cabling 700, form a continuous stereo inductance path.Aforementioned arbitrary three-dimensional inductance path can realize the adjustable three-dimensional inductance element W2 of the embodiment of the present invention.For example, each bar of pound line 500 can be engaged in diagonal the first conductive junction point 201 to the 3rd adjacent conductive junction point 203 between.All the other process details in Figure 15 to Figure 18 and Figure 19 to Figure 21 are as described in Fig. 1 to Fig. 5, Fig. 6 to Fig. 9 and Figure 10 to Figure 14, and the art those of ordinary skill should know its execution mode by inference easily, do not add repeat at this.
The foregoing is only embodiments of the invention, it is also not used to limit scope of patent protection of the present invention.Any those skilled in the art, not departing from design of the present invention and scope, the equivalence of the change done and retouching is replaced, and is still in scope of patent protection of the present invention.
Claims (10)
1. an adjustable three-dimensional inductance element, is characterized in that, comprising:
One substrate, has a upper surface;
Multiple conductive junction point, is formed at this upper surface;
Multiple electric-conductor, is embedded in this substrate, and respectively this electric-conductor is electrically connected at one of them those conductive junction point;
One first cabling, is embedded in this substrate, and this first cabling is electrically connected at those electric-conductors two electric-conductors wherein; And
A pound line, this pound of line two ends are engaged between those conductive junction points two conductive junction points wherein, and this pound of line, those electric-conductors and this first cabling form a three-dimensional inductance path jointly.
2. adjustable three-dimensional inductance element according to claim 1, also comprise one second cabling, this second cabling is embedded in this substrate, and this second cabling is electrically connected at those electric-conductors two electric-conductors wherein, wherein when this pound of line two ends are engaged between those conductive junction points two conductive junction points wherein, this first cabling is electrically connected to this second cabling by this pound of line, to form this three-dimensional inductance path.
3. adjustable three-dimensional inductance element according to claim 2, wherein this first cabling and this second cabling are embedded in the different layers of this substrate.
4. adjustable three-dimensional inductance element according to claim 3, wherein this first cabling and this second cabling do not overlap each other.
5. adjustable three-dimensional inductance element according to claim 2, wherein this first cabling is electrically connected at those electric-conductors two the first electric-conductors wherein, and this first cabling is electrically connected to those conductive junction points two the first conductive junction points wherein respectively by these two first electric-conductors, and this second cabling is electrically connected at those electric-conductors two the second electric-conductors wherein, and this second cabling is electrically connected to those conductive junction points two the second conductive junction points wherein respectively by these two second electric-conductors, this pound of line one end is engaged in one of these two first conductive junction points, and this pound of line other end is engaged in one of these two second conductive junction points.
6. adjustable three-dimensional inductance element according to claim 1, also comprise one the 3rd cabling, be formed at this upper surface of this substrate, and the 3rd cabling is electrically connected at those conductive junction points two conductive junction points wherein, wherein when this pound of line two ends are engaged between those conductive junction points two conductive junction points wherein, this first cabling is electrically connected to the 3rd cabling by this pound of line, to form this three-dimensional inductance path.
7. adjustable three-dimensional inductance element according to claim 6, wherein this first cabling and the 3rd cabling do not overlap each other.
8. adjustable three-dimensional inductance element according to claim 6, wherein this first cabling is electrically connected at those electric-conductors two the first electric-conductors wherein, and this first cabling is electrically connected to those conductive junction points two the first conductive junction points wherein respectively by these two first electric-conductors, and the 3rd cabling is electrically connected at those conductive junction points two the 3rd conductive junction points wherein, this pound of line one end is engaged in one of these two first conductive junction points, and this pound of line other end is engaged in one of these two the 3rd conductive junction points.
9. adjustable three-dimensional inductance element according to claim 1, wherein this substrate for be selected from following at least one of them: semiconductor substrate, printed circuit board (PCB) and ceramic substrate.
10. an adjustable three-dimensional inductance element, is characterized in that, comprises
One substrate, has a upper surface;
Multiple conductive junction point, is formed at this upper surface;
Multiple electric-conductor, is embedded in this substrate, and respectively this electric-conductor is electrically connected at one of them those conductive junction point;
Multiple first cabling, is embedded in this substrate, and respectively this first cabling is electrically connected at those electric-conductors two electric-conductors wherein; And
Multiple pounds of lines, respectively this pound of line two ends are engaged between those conductive junction points two conductive junction points wherein, and those pound of line, those electric-conductors and those the first cablings form a three-dimensional inductance path jointly.
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| CN201310629177.3A CN104681534B (en) | 2013-11-29 | 2013-11-29 | Adjustable three-dimensional inductance element |
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| CN201310629177.3A CN104681534B (en) | 2013-11-29 | 2013-11-29 | Adjustable three-dimensional inductance element |
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| CN104681534B CN104681534B (en) | 2017-11-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054151A (en) * | 2017-12-07 | 2018-05-18 | 刘曼华 | A kind of variable package substrate of inductance |
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|---|---|---|---|---|
| US6417754B1 (en) * | 1997-12-08 | 2002-07-09 | The Regents Of The University Of California | Three-dimensional coil inductor |
| CN101325115A (en) * | 2007-06-15 | 2008-12-17 | 财团法人工业技术研究院 | Inductive element |
| CN101964249A (en) * | 2010-05-27 | 2011-02-02 | 日月光半导体制造股份有限公司 | Power inductor structure |
| US20120154073A1 (en) * | 2010-12-20 | 2012-06-21 | Wen-Chang Lee | Tunable inductor |
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2013
- 2013-11-29 CN CN201310629177.3A patent/CN104681534B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6417754B1 (en) * | 1997-12-08 | 2002-07-09 | The Regents Of The University Of California | Three-dimensional coil inductor |
| CN101325115A (en) * | 2007-06-15 | 2008-12-17 | 财团法人工业技术研究院 | Inductive element |
| CN101964249A (en) * | 2010-05-27 | 2011-02-02 | 日月光半导体制造股份有限公司 | Power inductor structure |
| US20120154073A1 (en) * | 2010-12-20 | 2012-06-21 | Wen-Chang Lee | Tunable inductor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054151A (en) * | 2017-12-07 | 2018-05-18 | 刘曼华 | A kind of variable package substrate of inductance |
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| CN104681534B (en) | 2017-11-03 |
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