CN104681534B - Adjustable three-dimensional inductance element - Google Patents
Adjustable three-dimensional inductance element Download PDFInfo
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- CN104681534B CN104681534B CN201310629177.3A CN201310629177A CN104681534B CN 104681534 B CN104681534 B CN 104681534B CN 201310629177 A CN201310629177 A CN 201310629177A CN 104681534 B CN104681534 B CN 104681534B
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- cabling
- electric
- conductive junction
- adjustable
- junction points
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
Abstract
A kind of adjustable three-dimensional inductance element, including substrate, multiple conductive junction points, multiple electric-conductors, the first cabling and pound line.Substrate has upper surface, and multiple conductive junction points are formed at the upper surface of substrate.Multiple electric-conductors are embedded in substrate, and each electric-conductor is electrically connected at one of multiple conductive junction points conductive junction point.First cabling is embedded in substrate, and the first cabling is electrically connected at multiple electric-conductors two electric-conductors therein.The two ends of pound line are engaged between multiple conductive junction points two conductive junction points therein, and pound line, electric-conductor and the first cabling are collectively forming a three-dimensional inductance path.
Description
Technical field
The present invention is, on a kind of electrical equipment, to particularly relate to a kind of adjustable three-dimensional inductance element.
Background technology
Electronic Packaging usually needs passive device, such as inductor, capacitor and resistor, is adjusted to complete particular electrical circuit
It is humorous, for example, usually needing to complete particular electrical circuit by adding inductor in Electronic Packaging in many radio frequencies (RF) application
Tuning.Add the increase that discrete passive device is generally easily caused the size and weight of the encapsulation to Electronic Packaging.In addition, in electricity
Discrete passive device is added in son encapsulation usually needs an exclusive production line, and may need to set optional equipment and system
Journey, these optional equipments and processing procedure can cause higher production cost and may increase processing time.
For example, existing technology is solved by manufacturing passive device above the active circuits of an IC apparatus
Certainly these problems.However, integrated passive element is also required to various additional process, for example, need the upper protection in IC apparatus
Layer top forms interlayer, thereby allows passive device to be connected to the integrated circuit component of lower section.In addition, these prior arts are specific
, it is necessary at least two crystal grain of storehouse each other in example, to complete passive device.
The content of the invention
The embodiment of the present invention provides a kind of adjustable three-dimensional inductance element, its by the first cabling for being embedded in substrate,
And the pound line for being located at surface is combined, to realize the three-dimensional inductance of three dimensionality shaping.
The embodiment of the present invention provides a kind of adjustable three-dimensional inductance element, including a substrate, multiple conductive junction points, multiple leads
Electric part, one first cabling and a pound line.Substrate have a upper surface, the multiple conductive junction point be formed at substrate it is described on
Surface.The multiple electric-conductor is embedded in substrate, and each electric-conductor is electrically connected at one of them the multiple conduction and connect
Point.First cabling is embedded in substrate, and the first cabling is electrically connected at the multiple electric-conductor two electric-conductors therein.Pound
The two ends of line are engaged between the multiple conductive junction point two conductive junction points therein, and pound line, the multiple electric-conductor with
And first cabling be collectively forming a three-dimensional inductance path.
Another embodiment of the present invention also provides a kind of adjustable three-dimensional inductance element, including a substrate, multiple conductive junction points,
Multiple electric-conductors, multiple first cablings and multiple pounds of lines.Substrate has a upper surface, and the multiple conductive junction point is formed at base
The upper surface of plate.The multiple electric-conductor is embedded in substrate, and each conductive system is electrically connected at one of them institute
State multiple conductive junction points.The multiple first cabling is embedded in substrate, and each first cabling is electrically connected at the multiple lead
Electric part two electric-conductors therein.The two ends of each pound of line in the multiple pound line are engaged in the multiple conductive junction point wherein
Two conductive junction points between, the multiple pound line, the multiple electric-conductor and the multiple first cabling are collectively forming one
Three-dimensional inductance path.
The adjustable three-dimensional inductance element that the embodiment of the present invention is provided can make the first cabling embedded by being electrically connected at
In the electric-conductor of substrate, and realize and buried in vertical.The adjustable three-dimensional inductance element simultaneously can be by being embedded in the first of substrate
Cabling and the pound line positioned at surface, to realize the three-dimensional inductance path of three dimensionality shaping.
In order to be able to be further understood that the present invention, to reach technology, method and effect that set purpose is taken, is referred to
Below in connection with detailed description of the invention, accompanying drawing, it is believed that the purpose of the present invention, feature and feature, when can thus be able to deeply and
It is specific to understand, but accompanying drawing is only provided with annex and used with reference to explanation, not for the present invention person of being any limitation as.
Brief description of the drawings
Fig. 1 removes the schematic perspective view after pound line for the adjustable three-dimensional inductance element of one embodiment of the invention.
Fig. 2 is diagrammatic cross-section of Fig. 1 adjustable three-dimensional inductance element along A1-A1 lines.
Fig. 3 is diagrammatic cross-section of Fig. 1 adjustable three-dimensional inductance element along A2-A2 lines.
Fig. 4 is diagrammatic cross-section of Fig. 1 adjustable three-dimensional inductance element along A3-A3 lines.
Fig. 5 is the upper schematic diagram of Fig. 1 adjustable three-dimensional inductance element.
Fig. 6 is the schematic perspective view of the adjustable three-dimensional inductance element of one embodiment of the invention.
Fig. 7 is diagrammatic cross-section of Fig. 6 adjustable three-dimensional inductance element along A4-A4 lines.
Fig. 8 is diagrammatic cross-section of Fig. 6 adjustable three-dimensional inductance element along A5-A5 lines.
Fig. 9 is the upper schematic diagram of Fig. 6 adjustable three-dimensional inductance element.
Figure 10 to Figure 14 is respectively the upper schematic diagram of the adjustable three-dimensional inductance element of another embodiment of the present invention.
Figure 15 removes the schematic perspective view after pound line for the adjustable three-dimensional inductance element of another embodiment of the present invention.
Figure 16 is diagrammatic cross-section of Figure 15 adjustable three-dimensional inductance element along B1-B1 lines.
Figure 17 is diagrammatic cross-section of Figure 15 adjustable three-dimensional inductance element along B2-B2 lines.
Figure 18 is the upper schematic diagram of Figure 15 adjustable three-dimensional inductance element.
Figure 19 is the schematic perspective view of the adjustable three-dimensional inductance element of another embodiment of the present invention.
Figure 20 is diagrammatic cross-section of Figure 19 adjustable three-dimensional inductance element along B3-B3 lines.
Figure 21 is the upper schematic diagram of Figure 19 adjustable three-dimensional inductance element.
Wherein, description of reference numerals is as follows：
Adjustable three-dimensional inductance element W1, W2
Substrate 100
The upper surface 100S of substrate
Perforation T
Substrate 101
First circuit layer 102
Second circuit layer 104
Tertiary circuit layer 106
First dielectric layer 1021
Second dielectric layer 1041
3rd dielectric layer 1061
First conductive pattern 1022
Second conductive pattern 1042
3rd conductive pattern 1062
Connection pad 1022P, 1042P, 1062P
First lining 103
Second lining 105
3rd lining 107
First conductive junction point 201
Second conductive junction point 202
3rd conductive junction point 203
First conductive component 311
Second conductive component 312
3rd conductive component 313
First electric-conductor 301
Second electric-conductor 302
Pound line 500
First cabling 400
Second cabling 600
3rd cabling 700
Hatching line A1A1~A5A5, B1B1~B3B3
Embodiment
Please with reference to Fig. 6 to Fig. 8, Fig. 6 illustrates for the three-dimensional of the adjustable three-dimensional inductance element of one embodiment of the invention
Figure, Fig. 7 is diagrammatic cross-section of Fig. 6 adjustable three-dimensional inductance element along A4-A4 lines, and Fig. 8 is Fig. 6 adjustable three-dimensional electricity
Diagrammatic cross-section of the sensing unit along A5-A5 lines.Adjustable three-dimensional inductance element W1 includes substrate 100, multiple conductive junction points (for example
Including the first conductive junction point 201, the second conductive junction point 202), multiple electric-conductors (for example lead including the first electric-conductor 301, second
Electric part 302), the first cabling 400 and pound line 500, wherein conductive junction point is formed at the upper surface 100S of substrate 100, electric-conductor
And first cabling 400 be all embedded in substrate 100.It is therein that the two ends of pound line 500 are engaged in these conductive junction points 201,202
Between two conductive junction points.
First, please with reference to Fig. 1 to Fig. 3, Fig. 1 removes pound for the adjustable three-dimensional inductance element of one embodiment of the invention
Schematic perspective view after line, Fig. 2 is diagrammatic cross-section of Fig. 1 adjustable three-dimensional inductance element along A1-A1 lines, and Fig. 3 is Fig. 1
Diagrammatic cross-section of the adjustable three-dimensional inductance element along A2-A2 lines.Substrate 100 can be printed circuit board (PCB) (Printed
Wiring Board, PWB), substrate 100 can be used to support electronic component (figure do not illustrate) and can be used to provide electronic component electrical
Connection.In other embodiments, substrate 100 can be any carrier, such as semiconductor substrate, hard circuit board (flex-
Rigid wiring board) or ceramic substrate (such as LTCC (Low Temperature Co-fired
Ceramics, LTCC)).
It is noted that in embodiment as shown in Figure 2, substrate 100 can be multilayer board, and substrate 100 can
By substrate 101, multilayer circuit layer (for example including the first circuit layer 102, second circuit layer 104 and tertiary circuit layer 106) with
And multilayer lining (such as including the first lining 103, the second lining 105 and the 3rd lining 107) is constituted, wherein multilayer circuit
It is formed at the top of substrate 101 layer 102,104,106 and multilayer lining 103,105,107 mutual storehouses.
Specifically, second circuit layer 104 is formed at the top of the first circuit layer 102, and tertiary circuit layer 106 is formed at the
The top of two circuit layer 104.First lining 103 is located between the first circuit layer 102 and second circuit layer 104, the second lining 105
Between second circuit layer 104 and tertiary circuit layer 106.3rd lining 107 is formed above tertiary circuit layer 106, and the 3rd
The upper surface 100S of lining 107 is exposed in environment.
First circuit layer 102 may include the first dielectric layer 1021 and the first conductive pattern 1022, and second circuit layer 104 can
Including the second dielectric layer 1041 and the second conductive pattern 1042, and tertiary circuit layer 106 may include the 3rd dielectric layer 1061 with
And the 3rd conductive pattern 1062.(figure is not for example including the tie point needed for multiple cablings and All other routes for each conductive pattern
Illustrate).First conductive pattern 1022, the second conductive pattern 1042 and the 3rd conductive pattern 1062 may also include at least one respectively
Connection pad 1022P, 1042P, 1062P, connection pad 1022P, 1042P, 1062P are made by conductive material, to provide electric connection.
In embodiment as depicted, each lining 103,105,107 can have multiple perforation T, and the two of each perforation T
End may extend to multilayer circuit 102,104, one of 106 layer of layer.The perforation T of first lining 103 two ends are each extended over
To the first circuit layer 102 and second circuit layer 104, the perforation T of the second lining 105 two ends extend respectively to second circuit layer
104 and tertiary circuit layer 106, and the perforation T of the 3rd lining 107 one end extend to tertiary circuit layer 106, the 3rd lining
The 107 perforation T other end is exposed to the upper surface 100S of substrate 100.
Conductive junction point 201,202 is made by conductive material, to provide electric connection.The structure of conductive junction point 201,202
E.g. metal gasket, tin ball or elargol etc..Conductive junction point 201,202 can be the metal gasket for being formed at the upper surface 100S of substrate 100.
In other embodiments not illustrated, conductive junction point 201,202 can be exposed to the upper surface of substrate 100 for electric-conductor 301,302
100S part, so the shape of conductive junction point 201,202 in figure is by way of example only, and the non-limiting present invention.In addition, leading
The structure and quantity of electric contact 201,202 can be designed according to actual demand, and embodiments of the invention are not intended to limit.In this reality
In the adjustable three-dimensional inductance element W1 for applying example, the quantity of conductive junction point 201,202 may correspond to the number of electric-conductor 301,302
Amount.
Electric-conductor 301,302 is electrically connected at the multiple 201, one of 202 conductive junction points of conductive junction point.Such as
In embodiment shown in figure, each electric-conductor 301,302 can (the such as first conductive component 311, second be led by multiple conductive components
The conductive component 313 of soft copy 312 and the 3rd) and multiple connection pads (such as connection pad 1022P, connection pad 1042P and connection pad
1062P) constituted.
Specifically, be respectively formed with each perforation T of each lining 103,105,107 conductive component 311,312,
313, and the two ends of each conductive component 311,312,313 can contact in multilayer conductive pattern 1022,1042,1062 wherein it
One layer.The first conductive component 311 is formed with the perforation T of first lining 103, the two ends of the first conductive component 311 are contacted respectively
In the connection pad 1022P of the first conductive pattern 1022 and connection pad 1042P of the second conductive pattern 1042.In the perforation T of second lining 105
The second conductive component 312 is formed with, the two ends of the second conductive component 312 are contacted with the connection pad of the second conductive pattern 1042 respectively
The 1042P and connection pad 1062P of the 3rd conductive pattern 1062.The 3rd conductive component 313 is formed with the perforation T of 3rd lining 107,
The end thereof contacts of 3rd conductive component 313 are in the connection pad 1062P of the 3rd conductive pattern 1062.The other end of 3rd conductive component 313
The first conductive junction point 201 is contacted with, to be electrically connected at the first conductive junction point 201.
First electric-conductor 301 can be by the first conductive component 313, second of the conductive conductive component the 312, the 3rd of component 311, second
The connection pad 1042P of conductive pattern 1042 and the connection pad 1062P of the 3rd conductive pattern 1062 are constituted.Second electric-conductor 302 can be by
The two conductive conductive components 313 of component the 312, the 3rd and the connection pad 1062P of the 3rd conductive pattern 1062 are constituted.
Conductive component 311,312,313 is made up of the conductive material being filled in perforation T.In in practice, conductive component
311st, 312,313 be, for example, conductive plunger, and conductive material is filled in the way of forming conductive component 311,312,313 in perforation T
Tungsten plug processing procedure, aluminium connector processing procedure, copper connector processing procedure, silicide connector processing procedure or other appropriate filling process can be used,
The present invention is not any limitation as herein.In addition, in other embodiment, conductive component 311,312,313 can also be formed from
Conductive material layer on perforation T inwalls is constituted, and the conductive material layer conformally (conformingly) can be covered in and pass through
Hole T inwalls.
First cabling 400 is embedded in substrate 100, and the first cabling 400 is electrically connected at the multiple electric-conductor wherein
Two electric-conductors, for example, the first cabling 400 can be electrically connected at the multiple electric-conductor two the first electric-conductors therein
301.In addition, in the present embodiment, adjustable three-dimensional inductance element W1 may also include the second cabling 600, the second cabling 600 is buried
In in substrate 100, and the second cabling 600 is electrically connected at the multiple electric-conductor two electric-conductors therein, for example, second walks
Line 600 can be electrically connected at the multiple electric-conductor two the second electric-conductors 302 therein.
As shown in FIG. 2 and 3, the first cabling 400 is made up of a conductive layer, and the second cabling 600 is by another conduction
Layer is constituted.For example, a conductive layer (figure do not illustrate) can be initially formed in substrate 101, then, can graphical this conduction
Layer, wherein a part for patterned conductive layer can be as the first conductive pattern 1022, and another portion of patterned conductive layer
The first cabling 400 can be used as by dividing.Then, another conductive layer (figure is not illustrated) can be formed on the first lining 103, then, can be schemed
This another conductive layer of shapeization, wherein a part for this patterned another conductive layer can be as the second conductive pattern 1042, and schemes
Another part of this another conductive layer of shape can be used as the second cabling 600.Wherein, the pattern of these conductive layers is affiliated
Technical field those of ordinary skill can be according to actual use demand footpath row design.
Please with reference to Fig. 1, Fig. 4 and Fig. 5, Fig. 4 is section of Fig. 1 adjustable three-dimensional inductance element along A3-A3 lines
Schematic diagram, and Fig. 5 is the upper schematic diagram of Fig. 1 adjustable three-dimensional inductance element.In the present embodiment, the first cabling 400 with
And second cabling 600 all have elongate in shape.First cabling 400 and the second cabling 600 all can be by such as metal materials, alloy
The combined deposition single or multiple lift conductive material of material, conducting polymer composite or above-mentioned material is constituted.In addition, the first cabling
400 and second shape and the size of cabling 600 be that art those of ordinary skill can be according to actual use feelings
The row design of condition demand footpath, therefore embodiments of the invention are not any limitation as herein.
In one embodiment of the invention, the first cabling 400 can be formed by the method or inlaying process of patterned conductive layer,
It may include the following steps in the method for patterned conductive layer：First, one conductive layer of deposition (not illustrating) is in substrate 101, afterwards,
With photoetching process patterned conductive layer, to form the first conductive pattern 1022 and the first cabling 400.Afterwards, a dielectric material is deposited
(not illustrating) is expected in the first conductive pattern 1022, the first cabling 400 and substrate 101, to form the first dielectric layer 1021.On
Inlaying process the first cabling 400 of formation stated may include the following steps：First, a dielectric layer (not illustrating) is formed in substrate 101.
Then, patterned dielectric layer, to form multiple predetermined openings for forming the first conductive pattern 1022 and the first cabling 400, after
It is continuous, the conductive material of such as tungsten or copper is deposited on the first dielectric layer 1021 and inserting in above-mentioned opening.Thereafter, with for example chemical
Mechanical milling method grinds conductive material, to form the first conductive pattern 1022 and the first cabling 400.Depositing metal conductive material
The mode of material is, for example, spraying plating (spray coating), plating (electroplating), electroless plating
(electrolessplating), evaporation or sputter (sputtering) etc..Similarly, the second cabling 600 can also pass through figure
The method or inlaying process for changing conductive layer are formed.
First cabling 400 can be electrically connected at the first electric-conductor by the connection pad 1022P of the first conductive pattern 1022
301, and the second cabling 600 can be electrically connected at the second electric-conductor 302 by the connection pad 1042P of the second conductive pattern 1042.
Thereby, the first electric-conductor 301 can be used to be electrically connected with the first cabling 400 and be led positioned at the first of the upper surface 100S of substrate 100
Electric contact 201, the second electric-conductor 302 can be used to be electrically connected with the second cabling 600 and positioned at the upper surface 100S of substrate 100 the
Two conductive junction points 202, the first cabling 400 or the second electrically conducting for cabling 600 are moved up.The embodiment not illustrated in other
In, the first cabling 400 can also be directly contacted with the first electric-conductor 301 to complete to be electrically connected with, or the second cabling 600 also can be straight
The second electric-conductor 302 is contacted with to complete to be electrically connected with, so the shape of the first cabling 400 or the second cabling 600 in figure,
The annexation of the annexation and the second cabling 600 and the second electric-conductor 302 of first cabling 400 and the first electric-conductor 301
By way of example only, and the non-limiting present invention.
It is noted that adjustable three-dimensional inductance element W1 includes multiple first cablings 400 and multiple second walked
Line 600.It is that multiple second cablings 600 are wherein mutually side by side between multiple first cablings 400 each first cabling 400 therein
Each second cabling 600 between also for mutually side by side.Multiple first cablings 400 are all embedded in the same layer of substrate 100, multiple
Second cabling 600 is also all embedded in the same layer of substrate 100, and the first cabling 400 and the second cabling 600 are positioned at substrate 100
Different layers, wherein the second cabling 600 can be located at the first cabling 400 above or below.In addition, the first cabling 400 is walked with second
Line 600 does not overlap each other, that is to say, that the first cabling 400 is in upper surface 100S projection and the second cabling 600 in upper surface
100S projection does not overlap each other.Multiple first cablings 400 for example can be all formed in the substrate 101 of substrate 100.Namely
Say, the first conductive pattern 1022 and multiple first cablings 400 each first cabling 400 therein can be respectively in substrate 101
Patterned conductive material layer a part.Multiple second cablings 600 for example can be all formed on the first lining 103.Also
It is to say, the second conductive pattern 1042 and multiple second cablings 600 each second cabling 600 therein can be respectively the first lining
A part for patterned conductive material layer on 103.
As shown in figure 4, can be isolated between each cabling with the structure of substrate 100, specifically, multiple first cablings
It can be isolated between 400 each first cabling 400 therein with the first dielectric layer 1021, multiple second cablings 600 are wherein each
It can be isolated between individual second cabling 600 with the second dielectric layer 1041, and can be between the first cabling 400 and the second cabling 600
First lining 103 is isolated.Although it is worth noting that, each lining 103,105,107 of substrate 100 in figure only illustrate it is single
Sedimentary, but be able to should understand in art those of ordinary skill, each lining 103,105,107 also can be used to expression and change
Close the composite dielectric material layer of multiple dielectric layers.
As shown in FIG. 2 and 3, a pair of first electric-conductors 301 are connected to the both ends of the first cabling 400, a pair
Second electric-conductor 302 is connected to the both ends of the second cabling 600.In other non-illustrated embodiments, the first electric-conductor 301
The interlude of the first cabling 400 is may connect to, and the second electric-conductor 302 is also connected to the interlude of the second cabling 600.
Some conductive junction points (such as the first conductive junction point 201) in multiple conductive junction points correspond respectively to multiple first and led
Electric part 301, and some conductive junction points (such as the second conductive junction point 202) in multiple conductive junction points correspond respectively to multiple second
Electric-conductor 302.For example, a pair of first conductive junction points 201 correspond respectively to a pair of first electric-conductors 301, and a pair second
Conductive junction point 202 corresponds respectively to a pair of second electric-conductors 302.As shown in figure 4, the first conductive junction point 201 is in two row's straight lines
Configuration, the second conductive junction point 202 is also configured in two row's straight lines, and the first conductive junction point 201 and the second conductive junction point 202 are to hand over
Mispairing is put.
Please again in the lump reference picture 6 to Fig. 9, wherein Fig. 9 for Fig. 6 adjustable three-dimensional inductance element upper schematic diagram.Ginseng
Fig. 7 is examined, (for example the first conduction connects when a pound two ends of line 500 are engaged in the multiple conductive junction point two conductive junction points therein
Point 201 and second conductive junction point 202) between when, pound line 500, these electric-conductors (such as the first electric-conductor 301) and first walk
Line 400 can be collectively forming a three-dimensional inductance path.That is, pound line 500 can as three-dimensional inductance path a part, and institute
State three-dimensional inductance path by pound line 500, the first cabling 400 and be electrically connected at two first of the first cabling 400 it is conductive
Part 301 is constituted.Similarly, with reference to Fig. 8, the cabling 600 of pound line 500 and second can form another three-dimensional inductance path.Also, with reference to
Fig. 9, when one end of each of which bar pound line 500 of a plurality of pound line 500 is engaged in one first conductive junction point 201, and pound line 500
The other end is engaged in one second conductive junction point 202, i.e., each pound line 500 can be engaged in the first conductive junction point 201 diagonal
Between the second adjacent conductive junction point 202, the first cabling 400 is electrically connected to the second cabling 600, another can be formed and stood
Body inductance path.Foregoing any three-dimensional inductance path is the adjustable three-dimensional inductance element W1 that the embodiment of the present invention can be achieved,
In other words, the adjustable three-dimensional inductance element W1 of the embodiment of the present invention can be by changing such as foregoing any three-dimensional inductance path
Design and realize the characteristic of its adjustable (Tunable).
In the present embodiment, between being engaged in the multiple conductive junction point two conductive junction point therein when the two ends of pound line 500
When, adjustable three-dimensional inductance element W1 is using being located at the top of substrate 100 and tool Z-direction (implies that the upper surface 100S's of substrate 100
Normal direction) pound line, in conjunction with adopt buried in vertical (Vertical Embedded) first cabling 400 in substrate 100 or
Second cabling 600, to realize the three-dimensional inductance path of X-Y-Z dimensions shaping, and can make described via the configuration of adjustment pound line
There are adjustable three-dimensional inductance element W1 a variety of configurations to change.Specifically, the first cabling 400 for being embedded in substrate 100 or
Second cabling 600 can be by being electrically connected at the electric-conductor of tool Z-direction, and realize and buried in vertical.
The size and its configurable deep of first cabling 400 and the second cabling 600 can change the area of three-dimensional inductance path.
That is, can make three-dimensional inductance path that there is preferable stability by adjusting the first cabling 400 or the second cabling 600.
Furthermore, the first cabling 400 and the second cabling 600 being embedded in substrate 100 are not easy to collapse because of external environment influence
The phenomenons such as slump displacement.In addition, in follow-up component encapsulation processing procedure (such as film envelope processing procedure) or pound line process, the first cabling
400 and second cabling 600 also there is preferable stability because being embedded in substrate 100.In general, three-dimensional inductance path
Inductance value can increase and increase with the first cabling 400 and the size of the second cabling 600 and its configurable deep.
In addition, foregoing parallel adjacent continuous stereo inductance path can form a screw type (spiral) inductance, by adjusting
Density between the whole cabling 600 of first cabling 400 and/or second, can increase inductance value.Meanwhile, multiple first in substrate 100
It can be isolated between the cabling 600 of cabling 400 and/or second by the structure of substrate 100, to avoid producing parasitic capacitance.
Figure 10 to Figure 14 is refer to, Figure 10 to Figure 14 is respectively the adjustable three-dimensional inductance element of another embodiment of the present invention
Upper schematic diagram.The adjustable three-dimensional inductance element W1 not only has three-dimensional structure, and can be by adjusting matching somebody with somebody for pound line 500
Seated position and the characteristic for realizing its adjustable (Tunable).Specifically, with reference to Figure 10 and Figure 13, when the engagement of the two ends of pound line 500
When between the multiple conductive junction point two the first conductive junction points 201 therein, pound line 500 can be formed with the first cabling 400
Two kinds of three-dimensional inductance paths.With reference to Figure 11 and Figure 14, when the two ends of pound line 500 are engaged in two therein of the multiple conductive junction point
When between the second conductive junction point 202, pound line 500 can be with the three-dimensional inductance path of the second cabling 600 formation other two.With reference to Figure 12,
When the two ends of pound line 500 are engaged in the multiple conductive junction point conductive junction point 202 of one first conductive junction point 201 and one second therein
Between when, the first cabling 400 can be electrically connected to the second cabling 600 by pound line 500, can form another three-dimensional inductance road
Footpath.
Please also refer to Figure 15, Figure 16, Figure 17 and Figure 18, Figure 15 is electric for the adjustable three-dimensional of another embodiment of the present invention
Sensing unit removes the schematic perspective view after pound line, and Figure 16 is that section of Figure 15 adjustable three-dimensional inductance element along B1-B1 lines shows
It is intended to, Figure 17 is diagrammatic cross-section of Figure 15 adjustable three-dimensional inductance element along B2-B2 lines, and Figure 18 is the adjustable of Figure 15
The upper schematic diagram of three-dimensional inductance element.The adjustable three-dimensional inductance element W2 of the present embodiment and the adjustable of previous embodiment stand
Body inductance element W1 similarities are no longer described, and are entered below only for the difference between the present embodiment and previous embodiment
Row is described in detail.As illustrated, the adjustable three-dimensional inductance element W2 of the present embodiment also includes the 3rd cabling 700, the 3rd cabling
700 are formed at the upper surface 100S of substrate 100, and the 3rd cabling 700 is electrically connected at the multiple conductive junction point therein two
Individual conductive junction point (such as the 3rd conductive junction point 203).In addition, the adjustable three-dimensional inductance element W2 of the present embodiment can be without the
Two cablings 600 (ginseng Fig. 8).
3rd cabling 700 is led with conductive junction point (such as the first conductive junction point 201 and the 3rd conductive junction point 203) by same
Electric layer is constituted.As shown in figure 16, the upper surface 100S of substrate 100 can be initially formed a conductive layer (figure is not illustrated), then, can scheme
This conductive layer of shapeization, wherein a part for patterned conductive layer can be as the 3rd cabling 700, and patterned conductive layer is another
A part can be as conductive junction point, and the pattern of the conductive layer is that art tool usually intellectual can be according to reality
The design of use demand footpath row.The two ends of 3rd cabling 700 can contact in the multiple conductive junction point two the 3rd therein and lead
Electric contact 203, to complete to be electrically connected with.
3rd cabling 700 has elongate in shape, and the 3rd cabling 700 can be by such as metal material, alloy material, conductive height
The combined deposition single or multiple lift conductive material of molecular material or above-mentioned material is constituted.In addition, the shape of the 3rd cabling 700 with
Size is that art those of ordinary skill can design according to actual service condition demand footpath row, therefore the reality of the present invention
Example is applied not to be any limitation as herein.
It is noted that in the present embodiment, adjustable three-dimensional inductance element W2 include multiple first cablings 400 with
And multiple 3rd cablings 700.It is mutually side by side multiple three between multiple first cablings 400 each first cabling 400 therein
Also for mutually side by side between each the 3rd cabling 700 therein of cabling 700.First cabling 400 is not weighed mutually with the 3rd cabling 700
It is folded, that is to say, that the first cabling 400 is not mutual in upper surface 100S projection with the 3rd cabling 700 in upper surface 100S projection
Overlap.In addition, as shown in figure 17, can be isolated between the first cabling 400 and the 3rd cabling 700 with the structure of substrate 100.
A pair of the 3rd conductive junction points 203 are connected to the both ends of the 3rd cabling 700.As shown in figure 18, first is conductive
Contact 201 is configured in two row's straight lines, and the 3rd conductive junction point 203 is also configured in two row's straight lines, and the first conductive junction point 201 with
3rd conductive junction point 203 is interconnected.
Please also refer to Figure 19, Figure 20 and Figure 21, Figure 19 is first for the adjustable three-dimensional inductance of another embodiment of the present invention
The schematic perspective view of part, Figure 20 is diagrammatic cross-section of Figure 19 adjustable three-dimensional inductance element along B3-B3 lines, and Figure 21 is figure
The upper schematic diagram of 19 adjustable three-dimensional inductance element.The adjustable three-dimensional inductance element W2 and previous embodiment of the present embodiment
Adjustable three-dimensional inductance element W1 similarities no longer describe, it is and following only between the present embodiment and previous embodiment
Difference is described in detail.With reference to Figure 20, when a pound two ends of line 500 are engaged in two therein of the multiple conductive junction point
When between conductive junction point 201,203, the first cabling 400 can be electrically connected to the 3rd cabling 700 by pound line 500, with line formation one
Three-dimensional inductance path.
With reference to Figure 21, when one end of a plurality of each of which bar pound line 500 of pound line 500 is engaged in one first conductive junction point
201, and the other end of pound line 500 is engaged in one the 3rd conductive junction point 203, the first cabling 400 can be electrically connected into the 3rd and walked
Line 700, forms a continuous stereo inductance path.Foregoing any three-dimensional inductance path is the adjustable of the achievable embodiment of the present invention
Formula solid inductance element W2.For example, each pound line 500 can be engaged in 201 pairs of the first conductive junction point and phase diagonal
Between 203 pairs adjacent of the 3rd conductive junction point.Figure 15 to remaining process details such as Fig. 1 to Fig. 5 into Figure 21 of Figure 18 and Figure 19,
Described in Fig. 6 to Fig. 9 and Figure 10 to Figure 14, the art those of ordinary skill can should easily deduce embodiments thereof, herein
It is not added with repeating.
Embodiments of the invention are the foregoing is only, it is not limited to the scope of patent protection of the present invention.Any
Art personnel, in the design and scope for not departing from the present invention, the change made and the equivalence replacement of retouching are still this hair
In bright scope of patent protection.
Claims (10)
1. a kind of adjustable three-dimensional inductance element, it is characterised in that including：
One substrate, with a upper surface；
Multiple conductive junction points, are formed at the upper surface；
Multiple electric-conductors, are embedded in the substrate, and respectively the electric-conductor is electrically connected at one of them those conductive junction point；
One first cabling, is embedded in the substrate, and first cabling is electrically connected at those electric-conductors two conductions therein
Part；And
A pound line, this pound of line two ends are engaged between those conductive junction points two conductive junction points therein, and this pound of line, those lead
Electric part and first cabling are collectively forming a three-dimensional inductance path.
2. adjustable three-dimensional inductance element according to claim 1, in addition to one second cabling, second cabling are embedded in the base
In plate, and second cabling is electrically connected at those electric-conductors two electric-conductors therein, wherein when this pound of line two ends are engaged in
When between those conductive junction points two conductive junction points therein, first cabling is electrically connected to second cabling by this pound of line,
To form the three-dimensional inductance path.
3. adjustable three-dimensional inductance element according to claim 2, wherein first cabling are embedded in the base with second cabling
The different layers of plate.
4. adjustable three-dimensional inductance element according to claim 3, wherein first cabling do not overlap each other with second cabling.
5. adjustable three-dimensional inductance element according to claim 2, wherein first cabling be electrically connected at those electric-conductors its
In two the first electric-conductors, and first cabling is electrically connected to those conductive junction points by two first electric-conductors respectively
Two the first conductive junction points therein, and second cabling is electrically connected at those electric-conductors two the second electric-conductors therein,
And second cabling is electrically connected to those conductive junction points two second conductions therein by two second electric-conductors respectively
Contact, this pound of line one end is engaged in one of two first conductive junction points, and this pound of line other end is engaged in this two second and led
One of electric contact.
6. adjustable three-dimensional inductance element according to claim 1, in addition to one the 3rd cabling, are formed at the upper table of the substrate
Face, and the 3rd cabling is electrically connected at those conductive junction points two conductive junction points therein, wherein when this pound of line two ends engagement
When between those conductive junction points two conductive junction points therein, first cabling is electrically connected to the 3rd and walked by this pound of line
Line, to form the three-dimensional inductance path.
7. adjustable three-dimensional inductance element according to claim 6, wherein first cabling do not overlap each other with the 3rd cabling.
8. adjustable three-dimensional inductance element according to claim 6, wherein first cabling be electrically connected at those electric-conductors its
In two the first electric-conductors, and first cabling is electrically connected to those conductive junction points by two first electric-conductors respectively
Two the first conductive junction points therein, and the 3rd cabling is electrically connected at those conductive junction points two the 3rd conductions therein and connect
Point, this pound of line one end is engaged in one of two first conductive junction points, and this pound of line other end is engaged in this two the 3rd conductions
One of contact.
9. adjustable three-dimensional inductance element according to claim 1, the wherein substrate be selected from it is following at least one：Partly lead
Structure base board, printed circuit board (PCB) and ceramic substrate.
10. a kind of adjustable three-dimensional inductance element, it is characterised in that including
One substrate, with a upper surface；
Multiple conductive junction points, are formed at the upper surface；
Multiple electric-conductors, are embedded in the substrate, and respectively the electric-conductor is electrically connected at one of them those conductive junction point；
Multiple first cablings, are embedded in the substrate, and respectively first cabling is electrically connected at two therein of those electric-conductors
Electric-conductor；And
Multiple pounds of lines, respectively this pound of line two ends be engaged between those conductive junction points two conductive junction points therein, those pound of line, should
A little electric-conductors and those first cablings are collectively forming a three-dimensional inductance path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310629177.3A CN104681534B (en) | 2013-11-29 | 2013-11-29 | Adjustable three-dimensional inductance element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310629177.3A CN104681534B (en) | 2013-11-29 | 2013-11-29 | Adjustable three-dimensional inductance element |
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| CN104681534B true CN104681534B (en) | 2017-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310629177.3A Active CN104681534B (en) | 2013-11-29 | 2013-11-29 | Adjustable three-dimensional inductance element |
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| CN108054151B (en) * | 2017-12-07 | 2019-11-22 | 合肥海诺恒信息科技有限公司 | A kind of variable package substrate of inductance |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6417754B1 (en) * | 1997-12-08 | 2002-07-09 | The Regents Of The University Of California | Three-dimensional coil inductor |
| CN101325115A (en) * | 2007-06-15 | 2008-12-17 | 财团法人工业技术研究院 | Inductive element |
| CN101964249A (en) * | 2010-05-27 | 2011-02-02 | 日月光半导体制造股份有限公司 | Power inductor structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8963674B2 (en) * | 2010-12-20 | 2015-02-24 | Mediatek Singapore Pte. Ltd. | Tunable inductor |
-
2013
- 2013-11-29 CN CN201310629177.3A patent/CN104681534B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6417754B1 (en) * | 1997-12-08 | 2002-07-09 | The Regents Of The University Of California | Three-dimensional coil inductor |
| CN101325115A (en) * | 2007-06-15 | 2008-12-17 | 财团法人工业技术研究院 | Inductive element |
| CN101964249A (en) * | 2010-05-27 | 2011-02-02 | 日月光半导体制造股份有限公司 | Power inductor structure |
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| CN104681534A (en) | 2015-06-03 |
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