TWI680609B - Antenna structure - Google Patents

Antenna structure Download PDF

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Publication number
TWI680609B
TWI680609B TW106122677A TW106122677A TWI680609B TW I680609 B TWI680609 B TW I680609B TW 106122677 A TW106122677 A TW 106122677A TW 106122677 A TW106122677 A TW 106122677A TW I680609 B TWI680609 B TW I680609B
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Taiwan
Prior art keywords
antenna structure
item
scope
patent application
structure according
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TW106122677A
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Chinese (zh)
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TW201907617A (en
Inventor
蔡明汎
Ming Fan Tsai
邱志賢
Chih Hsien Chiu
蔡宗賢
Tsung Hsien Tsai
楊超雅
Chao Ya Yang
陳嘉揚
Chia Yang Chen
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矽品精密工業股份有限公司
Siliconware Precision Industries Co., Ltd.
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Priority to TW106122677A priority Critical patent/TWI680609B/en
Priority to CN201710585197.3A priority patent/CN109216884B/en
Publication of TW201907617A publication Critical patent/TW201907617A/en
Application granted granted Critical
Publication of TWI680609B publication Critical patent/TWI680609B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

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Abstract

一種天線結構,其平面投影形狀係包括複數個元素圖案,且各該元素圖案係包含兩基礎圖形,其中,該些元素圖案之任三相鄰者的相對兩條形心連線係未位於同一直線路徑上,以形成非直線狀的天線結構,故相較於由直線所構成之天線結構之外形,於相同之天線路徑下,本發明之天線結構不僅可縮小天線佈設面積75%,並提高天線效能50%以上。 An antenna structure whose plane projection shape system includes a plurality of element patterns, and each element pattern system includes two basic patterns, wherein the two centroid connection lines of any three adjacent ones of the element patterns are not located on the same plane. On a straight path to form a non-linear antenna structure, the antenna structure of the present invention can not only reduce the antenna layout area by 75%, but also increase the antenna layout area by 75% compared with the shape of a straight antenna structure. Antenna efficiency is more than 50%.

Description

天線結構    Antenna structure   

本發明係有關一種天線結構,尤指一種用於封裝件之天線結構。 The present invention relates to an antenna structure, and more particularly to an antenna structure for a package.

隨著電子產業的蓬勃發展,電子產品也逐漸邁向多功能、高性能的趨勢。目前無線通訊技術已廣泛應用於各式各樣的消費性電子產品以利接收或發送各種無線訊號。為了滿足消費性電子產品的外觀設計需求,無線通訊模組之製造與設計係朝輕、薄、短、小之需求作開發,其中,平面天線(Patch Antenna)因具有體積小、重量輕與製造容易等特性而廣泛利用於如手機(cell phone)等電子產品之無線通訊模組中。 With the vigorous development of the electronics industry, electronic products are gradually moving towards the trend of multifunctional and high performance. At present, wireless communication technology has been widely used in a variety of consumer electronic products to facilitate receiving or sending various wireless signals. In order to meet the appearance design requirements of consumer electronics, the manufacturing and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, patch antennas have small size, light weight, and manufacturing. Easy to use and widely used in wireless communication modules of electronic products such as cell phones.

第1A至1B圖係習知各式無線通訊模組1之平面示意圖。如第1A至1B圖所示,該無線通訊模組1係包括:一基板10、設於該基板10上之一天線結構11a,11b以及至少一電子元件12。 1A to 1B are schematic plan views of various wireless communication modules 1 according to the prior art. As shown in FIGS. 1A to 1B, the wireless communication module 1 includes a substrate 10, an antenna structure 11 a and 11 b provided on the substrate 10, and at least one electronic component 12.

惟,習知無線通訊模組1中,該些天線結構11a,11b都是直線或規則的單一圖形構成,致使該些天線結構11a,11b因其圖形限制而難以提升天線功率。 However, in the conventional wireless communication module 1, the antenna structures 11a and 11b are formed by a straight or regular single pattern, which makes it difficult for the antenna structures 11a and 11b to increase the antenna power due to their graphic limitations.

另外,天線的材質改變亦對功率有顯著的影響,但前述無線通訊模組1的系統化封裝通常都使用PCB印刷方式形成該些天線結構11a,11b,而這種印刷天線在材質上的變化不大,致使局限了目前系統化封裝天線效能。 In addition, the material change of the antenna also has a significant impact on the power, but the systematic packaging of the aforementioned wireless communication module 1 usually uses PCB printing to form the antenna structures 11a, 11b, and the material changes of this printed antenna It is not large, which limits the efficiency of the current systematic package antenna.

因此,如何克服上述習知技術之種種問題以增益天線信號以及提高天線效能,實已成目前亟欲突破的課題。 Therefore, how to overcome the problems of the above-mentioned conventional technologies to gain antenna signals and improve antenna performance has become a topic that is currently desperate to be broken.

鑑於上述習知技術之種種缺失,本發明係揭露一種天線結構,其平面投影形狀係包括有複數個元素圖案,其中,各該元素圖案係包含兩基礎圖形,且該些元素圖案之任三相鄰者的相對兩條形心連線並未位於同一直線路徑上。 In view of the lack of the above-mentioned conventional technologies, the present invention discloses an antenna structure whose plane projection shape includes a plurality of element patterns, wherein each of the element patterns includes two basic patterns and any three phases of the element patterns Neighbors' two centroid lines are not on the same straight path.

前述之天線結構係為基板的平面印刷天線。 The aforementioned antenna structure is a planar printed antenna that is a substrate.

前述之天線結構係為基板線路與導電盲孔所構成的立體結構。 The aforementioned antenna structure is a three-dimensional structure composed of a substrate circuit and a conductive blind hole.

前述之天線結構係為導電立體結構,例如,其材質係為電鍍、無電鍍或沖壓銅材。 The aforementioned antenna structure is a conductive three-dimensional structure. For example, the antenna structure is electroplated, electroless plated, or stamped copper.

前述之天線結構係設於空間結構上,且該空間結構係定義有三維座標。 The aforementioned antenna structure is provided on a space structure, and the space structure is defined by three-dimensional coordinates.

前述之天線結構中,該平面投影係定義有二維空間座標。 In the aforementioned antenna structure, the plane projection system defines a two-dimensional space coordinate.

前述之天線結構中,該兩基礎圖形係為類S字形與類2字形。 In the aforementioned antenna structure, the two basic patterns are S-like and 2-like.

前述之天線結構中,該兩基礎圖形係為類5字形與類Z字形。 In the aforementioned antenna structure, the two basic patterns are a quasi-Zigzag shape and a zigzag-like shape.

前述之天線結構中,該兩基礎圖形係為類U形與類倒U形。 In the aforementioned antenna structure, the two basic patterns are U-like and inverted U-like.

前述之天線結構中,該兩條形心連線之佈設係形成一夾角。 In the aforementioned antenna structure, the arrangement of the connection between the two centroids forms an included angle.

前述之天線結構中,該些元素圖案之至少兩相鄰者係物理接觸。 In the aforementioned antenna structure, at least two adjacent ones of the element patterns are in physical contact.

前述之天線結構中,該些元素圖案之至少兩相鄰者係未物理接觸。 In the aforementioned antenna structure, at least two adjacent ones of the element patterns are not physically contacted.

由上可知,本發明之天線結構中,係藉由其平面投影的外形以兩基礎圖形構成元素圖案,且令該些元素圖案之任三相鄰者的相對兩條形心連線並未位於同一直線路徑上,以形成非直線狀的天線結構,故相較於習知由直線所構成之天線結構之外形,於相同之天線路徑下,本發明之天線結構不僅可縮小天線佈設面積75%,並提高天線效能50%以上。 As can be seen from the above, in the antenna structure of the present invention, an element pattern is constituted by two basic figures through the shape of its plane projection, and the two centroid lines of any three adjacent ones of the element patterns are not located at On the same straight path to form a non-linear antenna structure, compared with the conventional antenna structure made of straight lines, the antenna structure of the present invention can not only reduce the antenna layout area by 75% under the same antenna path. And improve antenna performance by more than 50%.

1‧‧‧無線通訊模組 1‧‧‧Wireless communication module

10,40‧‧‧基板 10,40‧‧‧ substrate

11a,11b,2,2’‧‧‧天線結構 11a, 11b, 2,2’‧‧‧‧antenna structure

12‧‧‧電子元件 12‧‧‧Electronic components

2a,2b,2c‧‧‧元素圖案 2a, 2b, 2c‧‧‧Element pattern

20,21‧‧‧基礎圖形 20,21‧‧‧Basic graphics

200‧‧‧本體部 200‧‧‧Body

220‧‧‧回饋部 220‧‧‧Feedback

30‧‧‧介電體 30‧‧‧ Dielectric

30a‧‧‧第一介電層 30a‧‧‧First dielectric layer

30b‧‧‧第二介電層 30b‧‧‧Second dielectric layer

31‧‧‧第一線路層 31‧‧‧First circuit layer

31’‧‧‧第一金屬層 31’‧‧‧first metal layer

31”,33”‧‧‧導電材 31 ”, 33” ‧‧‧ conductive material

310,330‧‧‧導電盲孔 310,330‧‧‧Conductive blind hole

32‧‧‧第二線路層 32‧‧‧Second circuit layer

33‧‧‧第三線路層 33‧‧‧Third circuit layer

33’‧‧‧第三金屬層 33’‧‧‧third metal layer

34‧‧‧絕緣保護層 34‧‧‧Insulation protective layer

35‧‧‧表面處理層 35‧‧‧Surface treatment layer

4‧‧‧電子封裝件 4‧‧‧electronic package

42‧‧‧封裝層 42‧‧‧Encapsulation

9‧‧‧承載件 9‧‧‧ Carrier

a‧‧‧夾角 a‧‧‧ angle

L1,L2‧‧‧形心連線L1, L2 ‧‧‧ centroid connection

第1A至1B圖係為習知各式無線通訊模組之平面示意圖;第2A圖係為本發明之天線結構應用於電子封裝件上之立體示意圖;第2B圖係為第2A圖之局部放大平面示意圖;第2C圖係為第2A圖之天線結構之局部放大平面示意圖;第3A至3D圖係為本發明之天線結構之製法之剖面示 意圖;以及。 Figures 1A to 1B are schematic plan views of conventional wireless communication modules; Figure 2A is a schematic perspective view of the antenna structure of the present invention applied to electronic packages; Figure 2B is a partial enlargement of Figure 2A Plan 2C; Figure 2C is a partially enlarged plan schematic view of the antenna structure of Figure 2A; Figures 3A to 3D are schematic cross-sectional views of the manufacturing method of the antenna structure of the present invention; and

第4A及4B圖係為本發明之天線結構應用於電子封裝件上之其它實施例之立體示意圖。 4A and 4B are three-dimensional schematic diagrams of other embodiments of the antenna structure of the present invention applied to an electronic package.

以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如“上”及“一”等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size shall still fall within the scope of this invention without affecting the effects and goals that the invention can produce. The technical content disclosed by the invention can be covered. At the same time, the terms such as “上” and “一” used in this specification are only for the convenience of description, and are not intended to limit the scope of the present invention. Substantially changing the technical content should also be regarded as the scope in which the present invention can be implemented.

第2A圖係為具有天線結構2之電子封裝件4之立體示意圖。如第2A圖所示,所述之電子封裝件4係包括一設有電子元件(圖未示)之基板40、一形成於該基板40上之天線結構2、以及一包覆該電子元件而外露該天線結構2之封裝層42。 FIG. 2A is a schematic perspective view of the electronic package 4 with the antenna structure 2. As shown in FIG. 2A, the electronic package 4 includes a substrate 40 provided with an electronic component (not shown), an antenna structure 2 formed on the substrate 40, and a cover for the electronic component. The encapsulation layer 42 of the antenna structure 2 is exposed.

所述之基板40係包含線路結構,其具有至少一介電層 及設於該介電層上之線路層,如扇出(fan out)型重佈線路層(redistribution layer,簡稱RDL)。具體地,形成該介電層之材質係例如預浸材(prepreg,簡稱PP)、聚醯亞胺(polyimide,簡稱PI)、環氧樹脂(epoxy)或玻纖(glass fiber),且形成該線路層之材質係為金屬,如銅。應可理解地,該介電層與該線路層之數量可依需求設計。 The substrate 40 includes a circuit structure, which has at least one dielectric layer and a circuit layer disposed on the dielectric layer, such as a fan out redistribution layer (RDL). Specifically, the material forming the dielectric layer is, for example, prepreg (PP), polyimide (PI), epoxy, or glass fiber, and forms the dielectric layer. The material of the circuit layer is metal, such as copper. It should be understood that the number of the dielectric layer and the circuit layer can be designed according to requirements.

所述之電子元件係電性連接該基板40,其可為主動元件、被動元件或其二者組合,且該主動元件係例如半導體晶片,而該被動元件係例如電阻、電容及電感。 The electronic component is electrically connected to the substrate 40, which may be an active component, a passive component, or a combination of both, and the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

所述之封裝層42係為絕緣材,如聚醯亞胺(polyimide,簡稱PI)、乾膜(dry film)、環氧樹脂(epoxy)或封裝材(molding compound),其可用壓合(lamination)或模壓(molding)之方式形成於該基板40上。 The encapsulation layer 42 is an insulating material, such as polyimide (PI), dry film, epoxy, or molding compound, which can be laminated. ) Or molding is formed on the substrate 40.

所述之天線結構2係為基板40的平面印刷天線,其具有相分離之本體部200與回饋部220(如第2B圖所示),該本體部200之平面投影的外形(如第2C圖所示)包括:複數(本實施中顯示三個)元素圖案2a,2b,2c,且各該元素圖案2a,2b,2c係包含兩基礎圖形20,21,其中,該些元素圖案2a,2b,2c之任三相鄰者的兩條形心連線L1,L2並未位於同一直線路徑上。 The antenna structure 2 is a planar printed antenna of the substrate 40, which has a main body portion 200 and a feedback portion 220 (as shown in FIG. 2B) which are separated from each other. The planar projection shape of the main body portion 200 (as shown in FIG. 2C) (Shown) includes: plural (three are shown in this embodiment) element patterns 2a, 2b, 2c, and each of the element patterns 2a, 2b, 2c includes two basic patterns 20, 21, among which, these element patterns 2a, 2b The two centroid lines L1, L2 of any three neighbors of, 2c are not located on the same straight path.

於本實施例中,該平面投影係定義有二維空間座標,如第2A及2C圖所示之XY軸,且該兩基礎圖形20,21係不相同,例如,第2C圖所示之虛線所界定之類5字形與類Z字形。應可理解地,可依需求調整虛線之位置,使該 兩基礎圖形20,21呈現類S字形與類2字形(如第2B圖所示,係第2C圖之字形於轉角處呈弧形)、或者呈現類U形與類倒U形等形式。 In this embodiment, the plane projection system defines a two-dimensional space coordinate, such as the XY axis shown in FIGS. 2A and 2C, and the two basic figures 20 and 21 are different. For example, the dotted line shown in FIG. 2C It is defined as a class 5 shape and a class Z shape. It should be understood that the position of the dotted line can be adjusted as required so that the two basic graphics 20, 21 present a S-like shape and a 2-like shape (as shown in FIG. 2B, the zigzag shape in FIG. 2C is curved at the corner) , Or present U-like and inverted U-like forms.

再者,該兩條形心連線L1,L2之佈設係形成一夾角a,且該些元素圖案2a,2b,2c之至少兩相鄰者係物理接觸,例如相連。應可理解地,該些元素圖案之至少兩相鄰者係未物理接觸,例如斷開(可參考相分離之本體部200與回饋部220之方式)。 Furthermore, the arrangement of the two centroid connecting lines L1, L2 forms an included angle a, and at least two adjacent ones of the element patterns 2a, 2b, 2c are in physical contact, for example, connected. It should be understood that at least two neighbors of the element patterns are not in physical contact, such as being disconnected (refer to the manner of the separated main body part 200 and the feedback part 220).

又,該基板40及該天線結構2之製法並不需使用特殊製程或設備,僅需使用一般有機基板的製法即可製成,且該天線結構2可於該基板40中獨立一層製作,或屬於線路層之一部分或鋪地層之一部分,使該天線結構2與該基板40之線路結構可一同製作,如第3A至3D圖所示,具體如下說明。 In addition, the manufacturing method of the substrate 40 and the antenna structure 2 does not need to use a special process or equipment, and it only needs to be manufactured using a general organic substrate manufacturing method, and the antenna structure 2 may be manufactured in a separate layer in the substrate 40, It belongs to a part of the circuit layer or a part of the ground layer, so that the antenna structure 2 and the circuit structure of the substrate 40 can be made together, as shown in FIGS. 3A to 3D, as described below.

如第3A圖所示,於一承載件9上結合一基材(如銅箔基板),該基材係包含一第一介電層30a及設於該第一介電層30a上下側之第一金屬層31’與第二金屬層,且該第一金屬層31’結合該承載件9,並圖案化該第二金屬層以形成第二線路層32。 As shown in FIG. 3A, a substrate (such as a copper foil substrate) is bonded to a carrier 9, and the substrate includes a first dielectric layer 30 a and first and second dielectric layers 30 a provided on the upper and lower sides of the first dielectric layer 30 a. A metal layer 31 ′ and a second metal layer, and the first metal layer 31 ′ is combined with the carrier 9, and the second metal layer is patterned to form a second circuit layer 32.

如第3B圖所示,壓合一具有第三金屬層33’之第二介電層30b於該第一介電層30a與第二線路層32上,使該第一介電層30a與該第二介電層30b結合成一介電體30。之後移除該承載件9。 As shown in FIG. 3B, a second dielectric layer 30b having a third metal layer 33 'is laminated on the first dielectric layer 30a and the second circuit layer 32, so that the first dielectric layer 30a and the The second dielectric layer 30b is combined into a dielectric body 30. The carrier 9 is removed thereafter.

如第3C圖所示,圖案化該第一與第三金屬層 31’,33’,再以雷射方式於該介電體30上形成複數盲孔以外露部分該第二線路層32。之後,以電鍍或沉積等方式形成導電材31”,33”於該第一與第三金屬層31’,33’上,以令該導電材31”與該第一金屬層31’作為第一線路層31,且該導電材33”與該第三金屬層33’作為第三線路層33,且該導電材31”,33”一併形成於該盲孔中以形成導電盲孔310,330,使該第一線路層31與該第三線路層33藉由該些導電盲孔310,330電性連接該第二線路層32。 As shown in FIG. 3C, the first and third metal layers 31 ', 33' are patterned, and then a plurality of blind holes with exposed portions of the second circuit layer 32 are formed on the dielectric body 30 by laser. Thereafter, conductive materials 31 ", 33" are formed on the first and third metal layers 31 ', 33' by electroplating or deposition, so that the conductive material 31 "and the first metal layer 31 'are used as the first The circuit layer 31, and the conductive material 33 "and the third metal layer 33 'are used as the third circuit layer 33, and the conductive materials 31", 33 "are formed in the blind hole together to form conductive blind holes 310, 330, so that The first circuit layer 31 and the third circuit layer 33 are electrically connected to the second circuit layer 32 through the conductive blind holes 310 and 330.

如第3D圖所示,於該介電體30、該第一線路層31與該第三線路層33別形成絕緣保護層34,且該絕緣保護層34形成有複數外露該第一與第三線路層31,33之開孔,以於該開孔中之第一與第三線路層31,33上形成表面處理層35(如鎳/金材)。 As shown in FIG. 3D, an insulation protection layer 34 is formed on the dielectric body 30, the first circuit layer 31 and the third circuit layer 33, and the insulation protection layer 34 is formed with a plurality of exposed first and third layers. The openings of the circuit layers 31 and 33 are such that a surface treatment layer 35 (such as a nickel / gold material) is formed on the first and third circuit layers 31 and 33 in the openings.

於本實施例中,該天線結構2可為該第一線路層31或該第三線路層33之其中一部分,但於其它實施例中,該天線結構2亦可為該第二線路層32之其中一部分。換言之,於形成該第一線路層31、第二線路層32或第三線路層33時可同時形成該天線路結構2。 In this embodiment, the antenna structure 2 may be a part of the first circuit layer 31 or the third circuit layer 33, but in other embodiments, the antenna structure 2 may also be a part of the second circuit layer 32. Part of it. In other words, when the first circuit layer 31, the second circuit layer 32, or the third circuit layer 33 is formed, the antenna circuit structure 2 can be formed at the same time.

應可理解地,該天線結構2可為基板線路(如第一至第三線路層31,32,33)與導電盲孔310,330所構成的立體結構,但其平面投影的外形仍如第2A或2C圖所示之態樣。具體地,該天線結構2係設於空間結構(如該介電體30)上,且該空間結構係定義有三維座標,如第2A圖所示之XYZ軸。 It should be understood that the antenna structure 2 may be a three-dimensional structure composed of a substrate circuit (such as the first to third circuit layers 31, 32, 33) and conductive blind holes 310, 330, but the shape of the plane projection is still the same as that of 2A or The state shown in Figure 2C. Specifically, the antenna structure 2 is disposed on a space structure (such as the dielectric body 30), and the space structure is defined by a three-dimensional coordinate, such as the XYZ axis shown in FIG. 2A.

因此,依據立體天線型式,該天線結構2可延伸佈設於該基板40之各表面,或如第4A及4B圖所示之天線結構2’立設於該基板40上,且該天線結構2,2’之平面投影可為XY軸、YZ軸或XZ軸之其中一方位之平面投影。具體地,如第4A及4B圖所示,該天線結構2’係為導電立體結構,其構造係為沖壓銅材架體,其平面投影的外形仍如第2A及2C圖所示之態樣。 Therefore, according to the stereo antenna type, the antenna structure 2 can be extended on each surface of the substrate 40, or the antenna structure 2 'as shown in Figs. 4A and 4B is erected on the substrate 40, and the antenna structure 2, The 2 ′ plane projection may be a plane projection in one of the XY, YZ, or XZ axes. Specifically, as shown in Figs. 4A and 4B, the antenna structure 2 'is a conductive three-dimensional structure, and its structure is a stamped copper frame. The shape of the plane projection is still as shown in Figs. 2A and 2C. .

綜上所述,本發明之天線結構2,2’中,係對天線圖形以天線原理圖型為理論基礎,散射出不同的造型組合,藉此採用效率較高的基礎圖形20,21(如類5字形與類Z字形),組成單一元素圖案2a,2b,2c,再以此元素圖案2a,2b,2c進行延伸組合,以形成效率較高的天線結構2,2’(即非直線狀),故相較於由直線所構成之天線結構之外形,於相同之天線路徑下,本發明之天線結構2,2’不僅可縮小天線佈設面積75%,並提高天線效能50%以上。 In summary, in the antenna structures 2, 2 'of the present invention, the antenna pattern is based on the antenna schematic pattern, and different modeling combinations are scattered, thereby using the more efficient basic pattern 20, 21 (such as 5 shape and Z shape) to form a single element pattern 2a, 2b, 2c, and then extend and combine this element pattern 2a, 2b, 2c to form a more efficient antenna structure 2, 2 '(that is, non-linear shape) ), Compared with the shape of the antenna structure formed by straight lines, under the same antenna path, the antenna structure 2, 2 'of the present invention can not only reduce the antenna layout area by 75%, but also improve the antenna efficiency by more than 50%.

上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

Claims (13)

一種天線結構,其平面投影形狀係包括有複數個元素圖案,其中,各該元素圖案係包含兩基礎圖形,且任三個相鄰之元素圖案之相對兩條形心連線並未位於同一直線路徑上,且該複數個相鄰元素圖案之形心連線係構成一呈類S字形的曲線,其中,於該曲線上具有一曲率反轉點以將該曲線分為多個彎折段,且位於相對外側的該彎折段係圍繞位於相對內層的該彎折段。An antenna structure whose plane projection shape includes a plurality of element patterns, wherein each element pattern includes two basic patterns, and the two centroid lines connecting any three adjacent element patterns are not on the same straight line On the path, the centroid connecting lines of the plurality of adjacent element patterns form an S-shaped curve, wherein there is a curvature reversal point on the curve to divide the curve into a plurality of bending segments, The bent section located on the relatively outer side surrounds the bent section located on the relatively inner layer. 如申請專利範圍第1項所述之天線結構,其中,該天線結構係為基板的平面印刷天線。The antenna structure according to item 1 of the scope of patent application, wherein the antenna structure is a planar printed antenna of a substrate. 如申請專利範圍第1項所述之天線結構,其中,該天線結構係為基板線路與導電盲孔所構成的立體結構。The antenna structure according to item 1 of the scope of patent application, wherein the antenna structure is a three-dimensional structure composed of a substrate circuit and a conductive blind hole. 如申請專利範圍第1項所述之天線結構,其中,該天線結構係為導電立體結構。The antenna structure according to item 1 of the scope of patent application, wherein the antenna structure is a conductive three-dimensional structure. 如申請專利範圍第4項所述之天線結構,其中,形成該天線結構之材質係為銅材。The antenna structure according to item 4 of the scope of patent application, wherein the material forming the antenna structure is copper. 如申請專利範圍第1項所述之天線結構,其中,該天線結構係設於空間結構上,且該空間結構係定義有三維座標。The antenna structure according to item 1 of the scope of patent application, wherein the antenna structure is provided on a space structure, and the space structure is defined by a three-dimensional coordinate. 如申請專利範圍第1項所述之天線結構,其中,該平面投影係定義有二維空間座標。The antenna structure according to item 1 of the scope of patent application, wherein the plane projection system defines a two-dimensional space coordinate. 如申請專利範圍第1項所述之天線結構,其中,該兩基礎圖形係為類S字形與類2字形。The antenna structure according to item 1 of the scope of patent application, wherein the two basic patterns are S-shaped and 2-shaped. 如申請專利範圍第1項所述之天線結構,其中,該兩基礎圖形係為類5字形與類Z字形。The antenna structure according to item 1 of the scope of the patent application, wherein the two basic patterns are a quasi-Zigzag shape and a zigzag-like shape. 如申請專利範圍第1項所述之天線結構,其中,該兩基礎圖形係為類U形與類倒U形。The antenna structure according to item 1 of the scope of patent application, wherein the two basic patterns are U-like and inverted U-like. 如申請專利範圍第1項所述之天線結構,其中,該兩條形心連線係形成一夾角。The antenna structure according to item 1 of the scope of patent application, wherein the two centroid connection lines form an included angle. 如申請專利範圍第1項所述之天線結構,其中,該些元素圖案之至少兩相鄰者係物理接觸。The antenna structure according to item 1 of the scope of patent application, wherein at least two adjacent ones of the element patterns are in physical contact. 如申請專利範圍第1項所述之天線結構,其中,該些元素圖案之至少兩相鄰者係未物理接觸。 The antenna structure according to item 1 of the scope of patent application, wherein at least two adjacent ones of the element patterns are not in physical contact.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452553B1 (en) * 1995-08-09 2002-09-17 Fractal Antenna Systems, Inc. Fractal antennas and fractal resonators
US20030151556A1 (en) * 1997-11-07 2003-08-14 Nathan Cohen Fractal antenna ground counterpoise, ground planes, and loading elements and microstrip patch antennas with fractal structure
EP1359640A1 (en) * 2002-04-30 2003-11-05 Roke Manor Research Limited A fractal antenna and method of design
US20050110682A1 (en) * 2003-11-21 2005-05-26 Allen Tran Wireless communications device pseudo-fractal antenna
US20050195112A1 (en) * 2000-01-19 2005-09-08 Baliarda Carles P. Space-filling miniature antennas
US20060164306A1 (en) * 2005-01-21 2006-07-27 Hung-Yue Chang Multi-band antenna and design method thereof
US20110025576A1 (en) * 2009-07-30 2011-02-03 Shau-Gang Mao Multi-band microstrip meander-line antenna

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1166031C (en) * 2001-02-13 2004-09-08 财团法人工业技术研究院 Sheet antenna
CN102005643B (en) * 2010-10-14 2013-06-19 厦门大学 Three-frequency Koch fractal ring mirror image dipole antenna
CN201904434U (en) * 2010-11-17 2011-07-20 启碁科技股份有限公司 Broad-band antenna
CN103700931B (en) * 2013-12-13 2016-01-20 中科院杭州射频识别技术研发中心 A kind of small fractal crotch anti-metal tag antenna of loading opening resonant ring
US9947516B2 (en) * 2014-06-03 2018-04-17 Tokyo Electron Limited Top dielectric quartz plate and slot antenna concept
CN106410382A (en) * 2016-09-11 2017-02-15 河南师范大学 High-gain directional antenna
CN106887688A (en) * 2017-03-30 2017-06-23 苏州伟尼特美智能科技有限公司 Micro-strip paster antenna and its manufacture method based on Minkowski

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452553B1 (en) * 1995-08-09 2002-09-17 Fractal Antenna Systems, Inc. Fractal antennas and fractal resonators
US20030151556A1 (en) * 1997-11-07 2003-08-14 Nathan Cohen Fractal antenna ground counterpoise, ground planes, and loading elements and microstrip patch antennas with fractal structure
US20050195112A1 (en) * 2000-01-19 2005-09-08 Baliarda Carles P. Space-filling miniature antennas
EP1359640A1 (en) * 2002-04-30 2003-11-05 Roke Manor Research Limited A fractal antenna and method of design
US20050110682A1 (en) * 2003-11-21 2005-05-26 Allen Tran Wireless communications device pseudo-fractal antenna
US20060164306A1 (en) * 2005-01-21 2006-07-27 Hung-Yue Chang Multi-band antenna and design method thereof
US20110025576A1 (en) * 2009-07-30 2011-02-03 Shau-Gang Mao Multi-band microstrip meander-line antenna

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