CN104681513A - FC (Flip Chip) encapsulation chip heat dissipation system of piezoelectric ceramic fan - Google Patents
FC (Flip Chip) encapsulation chip heat dissipation system of piezoelectric ceramic fan Download PDFInfo
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- CN104681513A CN104681513A CN201310637618.4A CN201310637618A CN104681513A CN 104681513 A CN104681513 A CN 104681513A CN 201310637618 A CN201310637618 A CN 201310637618A CN 104681513 A CN104681513 A CN 104681513A
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- heat dissipation
- fan
- chip
- piezoelectric ceramic
- fans
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Abstract
The invention provides a system for realizing high-efficiency air-cooling heat dissipation by utilizing a piezoelectric ceramic fan based on a structure of an FC (Flip Chip) encapsulation chip. The system is characterized in that the fan adopts piezoelectric ceramic fan groups; wind directions (wind outlets) of two groups of fans are opposite, and only one group of fans works at each time; the peripheral part of the system is sealed; the wind outlets formed in two ends are provided with dust filtering devices. An air-cooling heat dissipation device has the advantages that wide contact area and narrow space between the front surface of the FC encapsulation chip and a metal contact are fully utilized, and quick heat dissipation on the back surface of the chip is realized by utilizing high-speed air flow; the heat dissipation system can be matched with a front-surface heat dissipation system for use at the same time, and the heat dissipation system and the front-surface heat dissipation system are not mutually affected; the fans in two directions can be successively started in different time periods, and the fans can beneficially respectively blow away dust on opposite dust removing devices; the voltage needed by the piezoelectric ceramic fan groups is low, no noise is generated, the wind volume is large, and the reliability is strong; the miniaturization of the fan system is beneficial for the miniaturization of the system, for example, the miniaturization is beneficial for the heat dissipation of a CPU (Central Processing Unit) and a GPU (Graphic Processing Unit) of a PC (Personal Computer), a traditional fan with huge occupied area can be eliminated, hardware can be more compact, and a computer host can be more miniaturized.
Description
Technical field
The present invention relates to semiconductor device packaging technique and chip cooling field, be specially a kind of FC packaged chip cooling system based on Piezoelectric Ceramic Fan.
Background technology
The develop rapidly of world today chip science and technology, in order to stride forward to more high-performance, chip package adopts FC method for packing on a large scale, and shorter contact connects and brings less parasitic capacitance, brings less encapsulation volume simultaneously.
Chip performance makes rapid progress, and volume is more and more less, and in chip package, heat dissipation problem becomes the key factor of restriction chip performance lifting simultaneously.Conventional motors adds the fan of blade rotary pattern, because wind direction directionality is bad, wind speed is low, has been difficult to competent work of dispelling the heat by force.Particularly its noise is large, and electromagnetic interference is serious, does not meet the development trend of the quiet and environmental protection of product.So, just find out the scheme such as water-cooled, oil cooling, but all because cost is high, complex structure is huge.
Piezoelectric Ceramic Fan great advantage is exactly because its vibration frequency is high, the defect that so wind concentration and indiffusion, directionality is good, speed is fast, magnetic leakage free, the directionality overcoming conventional fan is poor, wind speed spreads slowly and easily.Under equal-wattage, its air cooling effect is obviously better than conventional fan.In addition, other performance index of ultrasonic fan are also all better than conventional fan, and its structure is simple, volume is little, lightweight, noise is little, the life-span is long, power-cut automatic lock is waited indefinitely.
In order to improve the heat dispersion of FC encapsulation, be necessary to propose the more effective and reliable cooling system of one.
Summary of the invention
The present invention, on the basis of FC encapsulating structure, proposes a kind of FC packaged chip cooling system based on Piezoelectric Ceramic Fan, its objective is and will improve chip cooling efficiency, makes cooling system microminiaturized simultaneously.
To achieve these goals, the invention provides a kind of FC packaged chip cooling system based on Piezoelectric Ceramic Fan, comprising: Piezoelectric Ceramic Fan group, dust cleaning apparatus, sealing device, chip.
Described Piezoelectric Ceramic Fan group air port is relative.
Described dust filtration device is positioned at two and goes out outside air intake vent.
Described sealing device to except dust cleaning apparatus and extraneous air connection position seal.
Described chip is square.
After adopting the encapsulating structure in the present invention, have the following advantages compared with existing fan cooling structure: make full use of the FC packaged chip back side and the vast contact area of hard contact and narrow space, utilize high velocity air to realize the quick heat radiating of chip back.
Further, bidirectional fan can be opened in succession in different time sections, is conducive to the dust blowing away opposite dust cleaning apparatus respectively.
Further, Piezoelectric Ceramic Fan group required voltage is low, noiselessness, and air quantity is large, and reliability is strong, is independent of each other.
Further, this cooling system can coordinate front cooling system to use simultaneously.
Further, the microminiaturization of fan system is conducive to the microminiaturization of system.
Accompanying drawing explanation
Fig. 1 is the vertical view of a kind of FC packaged chip cooling system based on Piezoelectric Ceramic Fan of the present invention;
Fig. 2 is the side cross-section structure of Fig. 1 along axis;
In above accompanying drawing: 1. Piezoelectric Ceramic Fan group 2. dust filtration device 3. sealing device.
Dust filtration device is not drawn in Fig. 2.
Embodiment
For enabling above-mentioned feature of the present invention, object and advantage more become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Because the present invention focuses on interpretation principle, therefore, native country does not represent final products.
Embodiment: a kind of FC packaged chip cooling system based on Piezoelectric Ceramic Fan.
A kind of FC packaged chip cooling system based on Piezoelectric Ceramic Fan, shown in accompanying drawing 1-2, comprise 1. Piezoelectric Ceramic Fan groups, each two groups of left and right, and point mouth is relative, opens 2. dust filtration devices in turn, be positioned at both sides and go out air intake vent 3. sealing device with certain frequency, sealing except dust cleaning apparatus with outside air connected region, 4. figure chips is square
Above-described embodiment, only for make a detailed explanation content of the present invention, its object is to allow those skilled in the art are afamiliar with particular content of the present invention and implementing according to this.Allly do not depart from any equivalence change that Spirit Essence of the present invention does or modify, all should belong within protection scope of the present invention.
Claims (7)
1., based on a FC packaged chip cooling system for Piezoelectric Ceramic Fan, comprise pcb board, chip, sealing system, dust cleaning apparatus, Piezoelectric Ceramic Fan group; It is characterized in that, chip is square.
2. chip as claimed in claim 1, is characterized in that, be packaged on pcb board in FC mode.
3., as claimed in claim 1 based on the FC packaged chip cooling system of Piezoelectric Ceramic Fan, it is characterized in that, described fan group is positioned at chip both sides.
4. fan group as claimed in claim 3, it is characterized in that, air port is relative.
5. fan group as claimed in claim 3, it is characterized in that, described fan group volume is very little, only accounts for duct cross-section less than 1/2.
6. fan group as claimed in claim 3, is characterized in that two groups of fans take turns to operate with certain hour interval.
7., as claimed in claim 1 based on the FC packaged chip cooling system of Piezoelectric Ceramic Fan, it is characterized in that, described hermetically-sealed construction to beyond dust cleaning apparatus and extraneous air connection position encapsulate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310637618.4A CN104681513A (en) | 2013-12-03 | 2013-12-03 | FC (Flip Chip) encapsulation chip heat dissipation system of piezoelectric ceramic fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310637618.4A CN104681513A (en) | 2013-12-03 | 2013-12-03 | FC (Flip Chip) encapsulation chip heat dissipation system of piezoelectric ceramic fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104681513A true CN104681513A (en) | 2015-06-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310637618.4A Pending CN104681513A (en) | 2013-12-03 | 2013-12-03 | FC (Flip Chip) encapsulation chip heat dissipation system of piezoelectric ceramic fan |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104681513A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09275172A (en) * | 1996-04-01 | 1997-10-21 | Hitachi Ltd | Semiconductor device and mounting structure therefor |
| JPH11307969A (en) * | 1998-04-17 | 1999-11-05 | Kenwood Corp | Structure for cooling heating component |
| CN200947713Y (en) * | 2006-09-15 | 2007-09-12 | 刘胜 | Heat radiator for electrical component |
| KR100826320B1 (en) * | 2007-05-17 | 2008-05-06 | 미래디지털(주) | Dehumidification and air-clean device |
| CN201462561U (en) * | 2009-09-02 | 2010-05-12 | 苏州力创科技有限公司 | LED outdoor lamp |
| CN201491430U (en) * | 2009-07-03 | 2010-05-26 | 山东英特力光通信开发有限公司 | Electronic equipment case |
| CN101886802A (en) * | 2009-05-12 | 2010-11-17 | 建准电机工业股份有限公司 | Lamp |
| US20110108250A1 (en) * | 2009-11-09 | 2011-05-12 | Alex Horng | Heat Dissipating device |
-
2013
- 2013-12-03 CN CN201310637618.4A patent/CN104681513A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09275172A (en) * | 1996-04-01 | 1997-10-21 | Hitachi Ltd | Semiconductor device and mounting structure therefor |
| JPH11307969A (en) * | 1998-04-17 | 1999-11-05 | Kenwood Corp | Structure for cooling heating component |
| CN200947713Y (en) * | 2006-09-15 | 2007-09-12 | 刘胜 | Heat radiator for electrical component |
| KR100826320B1 (en) * | 2007-05-17 | 2008-05-06 | 미래디지털(주) | Dehumidification and air-clean device |
| CN101886802A (en) * | 2009-05-12 | 2010-11-17 | 建准电机工业股份有限公司 | Lamp |
| CN201491430U (en) * | 2009-07-03 | 2010-05-26 | 山东英特力光通信开发有限公司 | Electronic equipment case |
| CN201462561U (en) * | 2009-09-02 | 2010-05-12 | 苏州力创科技有限公司 | LED outdoor lamp |
| US20110108250A1 (en) * | 2009-11-09 | 2011-05-12 | Alex Horng | Heat Dissipating device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150603 |