CN104662462A - 光通信用透镜及光通信模块 - Google Patents

光通信用透镜及光通信模块 Download PDF

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Publication number
CN104662462A
CN104662462A CN201380048386.7A CN201380048386A CN104662462A CN 104662462 A CN104662462 A CN 104662462A CN 201380048386 A CN201380048386 A CN 201380048386A CN 104662462 A CN104662462 A CN 104662462A
Authority
CN
China
Prior art keywords
lens
foot
optical communication
optical
inner peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380048386.7A
Other languages
English (en)
Chinese (zh)
Inventor
正木义治
中塚雄三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of CN104662462A publication Critical patent/CN104662462A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Lens Barrels (AREA)
CN201380048386.7A 2012-09-19 2013-09-02 光通信用透镜及光通信模块 Pending CN104662462A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-205417 2012-09-19
JP2012205417 2012-09-19
PCT/JP2013/073494 WO2014045850A1 (ja) 2012-09-19 2013-09-02 光通信用のレンズ及び光通信モジュール

Publications (1)

Publication Number Publication Date
CN104662462A true CN104662462A (zh) 2015-05-27

Family

ID=50341168

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380048386.7A Pending CN104662462A (zh) 2012-09-19 2013-09-02 光通信用透镜及光通信模块

Country Status (3)

Country Link
JP (1) JPWO2014045850A1 (ja)
CN (1) CN104662462A (ja)
WO (1) WO2014045850A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107646145A (zh) * 2015-05-29 2018-01-30 奥斯兰姆奥普托半导体有限责任公司 具有辐射源的光电子组件
CN110537301A (zh) * 2017-02-08 2019-12-03 普林斯顿光电子股份有限公司 包括集成于包封物中的光学结构的vcsel照明器封装
CN112622218A (zh) * 2020-12-04 2021-04-09 无锡鑫巨宏智能科技有限公司 一种精密光学镜头注塑成型工艺

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7197354B2 (ja) * 2018-12-28 2022-12-27 Hoya株式会社 レンズユニット及びレンズユニットの製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1123417A (zh) * 1993-11-18 1996-05-29 富士通株式会社 用于两路发送的光学组件
JP2005209840A (ja) * 2004-01-22 2005-08-04 Konica Minolta Opto Inc 半導体レーザ装置及び光ピックアップ装置
CN1668941A (zh) * 2002-07-08 2005-09-14 皇家飞利浦电子股份有限公司 光学透镜部件及包括这种透镜部件的光学透镜设置结构
US20060114579A1 (en) * 2004-11-29 2006-06-01 Konica Minolta Holdings, Inc. Optical element holding structure, optical element lens-barrel and optical communication module
CN101441304A (zh) * 2007-11-19 2009-05-27 鸿富锦精密工业（深圳）有限公司 镜片及镜头模组
WO2010016303A1 (ja) * 2008-08-08 2010-02-11 コニカミノルタオプト株式会社 樹脂製基板、マイクロチップ及び射出成形金型
CN102207561A (zh) * 2010-03-31 2011-10-05 兄弟工业株式会社 长长度透镜

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002350608A (ja) * 2001-05-23 2002-12-04 Konica Corp 撮像レンズ、撮像装置、金型及び撮像レンズの成形方法
JP4659848B2 (ja) * 2008-03-06 2011-03-30 オリンパスメディカルシステムズ株式会社 撮像モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1123417A (zh) * 1993-11-18 1996-05-29 富士通株式会社 用于两路发送的光学组件
CN1668941A (zh) * 2002-07-08 2005-09-14 皇家飞利浦电子股份有限公司 光学透镜部件及包括这种透镜部件的光学透镜设置结构
JP2005209840A (ja) * 2004-01-22 2005-08-04 Konica Minolta Opto Inc 半導体レーザ装置及び光ピックアップ装置
US20060114579A1 (en) * 2004-11-29 2006-06-01 Konica Minolta Holdings, Inc. Optical element holding structure, optical element lens-barrel and optical communication module
CN101441304A (zh) * 2007-11-19 2009-05-27 鸿富锦精密工业（深圳）有限公司 镜片及镜头模组
WO2010016303A1 (ja) * 2008-08-08 2010-02-11 コニカミノルタオプト株式会社 樹脂製基板、マイクロチップ及び射出成形金型
CN102207561A (zh) * 2010-03-31 2011-10-05 兄弟工业株式会社 长长度透镜

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107646145A (zh) * 2015-05-29 2018-01-30 奥斯兰姆奥普托半导体有限责任公司 具有辐射源的光电子组件
CN107646145B (zh) * 2015-05-29 2020-06-30 奥斯兰姆奥普托半导体有限责任公司 具有辐射源的光电子组件
CN110537301A (zh) * 2017-02-08 2019-12-03 普林斯顿光电子股份有限公司 包括集成于包封物中的光学结构的vcsel照明器封装
US11128100B2 (en) 2017-02-08 2021-09-21 Princeton Optronics, Inc. VCSEL illuminator package including an optical structure integrated in the encapsulant
CN110537301B (zh) * 2017-02-08 2022-03-01 普林斯顿光电子股份有限公司 包括集成于包封物中的光学结构的vcsel照明器封装
CN112622218A (zh) * 2020-12-04 2021-04-09 无锡鑫巨宏智能科技有限公司 一种精密光学镜头注塑成型工艺

Also Published As

Publication number Publication date
WO2014045850A1 (ja) 2014-03-27
JPWO2014045850A1 (ja) 2016-08-18

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Application publication date: 20150527