CN104662184B - The metal assembly that microsphere for wireless communication tower is filled - Google Patents
The metal assembly that microsphere for wireless communication tower is filled Download PDFInfo
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- CN104662184B CN104662184B CN201380050435.0A CN201380050435A CN104662184B CN 104662184 B CN104662184 B CN 104662184B CN 201380050435 A CN201380050435 A CN 201380050435A CN 104662184 B CN104662184 B CN 104662184B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F3/1112—Making porous workpieces or articles with particular physical characteristics comprising hollow spheres or hollow fibres
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F2003/1106—Product comprising closed porosity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Abstract
Radio communication tower assembly is at least partly formed by the metal of microsphere filling.The density that the metal of microsphere filling is formed is less than 2.7g/cm3, thermal conductivity is more than 1W/mK, and thermal coefficient of expansion is less than 30 μm/mK.Being suitable for the microsphere of the metal of such microsphere filling includes, for example, glass microspheres, mullite microsphere, alumina microspheres, aluminosilicate microspheres body, ceramic microspheres, silica carbosphere body, carbosphere body, and its mixture of two or more.
Description
The reference of related application
The priority for the U.S. Provisional Application 61/707,085 submitted for 28th this application claims September in 2012.
Technical field
The various embodiments of the present invention are related to the component based on metal on wireless communication tower.
Background technology
In the field of telecommunications, All Around The World is being increased so that the new service of support and number year by year for bandwidth requirement
Increased user, wireless system is thus set to be shifted towards higher frequency band.Trend in the industry is from nothing by base station electronic device
The tower base of line communication tower moves to upper zone (that is, tower top electronic device)；Make great efforts to reduce the logical of connection tower top and base apparatus
Believe the loss of signal in cable.With the component of more and more numbers is moved to the top of tower, these are increasingly concerned with
The weight of component.
The content of the invention
A kind of embodiment is a kind of equipment, and it includes：
Radio communication tower assembly, the metal that its at least part is filled by microsphere are formed,
The metal of wherein described microsphere filling is less than 2.7 grams of (" g/cm per cubic centimeter in the density of 25 DEG C of measurements3”)。
Embodiment
The various embodiments of the present invention are related to the radio communication tower assembly at least partly formed by the material based on metal.
Such material based on metal can have some properties it is applied to tower top application, especially including the close of some scopes
Degree, thermal conductivity and thermal coefficient of expansion.Such radio communication tower assembly can especially include radio frequency (" RF ") cavity filter,
Radiator, crust (enclosures), tower top supporting attachment (tower-top support accessories), and combinations thereof.
Material based on metal
As mentioned above, radio communication tower assembly can be formed at least partly by the material based on metal.As used in this application,
" based on metal " material is comprising material metal as main (that is, more than 25 percentage by weights (" wt% ")) component.
In various embodiments, the material based on metal can be comprising total amount at least 50wt%, at least 60wt%, at least 70wt%,
At least 80wt%, at least 90wt% or at least 95wt% one or more metals.In some embodiments, it is a kind of or more
Kind metal accounts for the completely or generally whole of the material based on metal.As used in this application, term " substantially all " refers to respectively
From the not described component that is less than 10 parts (" ppm ") being in parts per million present.In interchangeable embodiment, the material based on metal can
To be the composite of metal and one or more fillers (as described in more detail below), and it therefore can include minor proportion
One or more metals of (for example, from as little as 5wt% at most 99wt%).
The metal component of material based on metal can be any metal or metal found as is generally known in the art or from now on
Combination (that is, metal alloy).In various embodiments, the material based on metal can include low density metals such as aluminium or
Magnesium, or other metals such as nickel, iron, bronze, copper, and their alloy.In one or more embodiments, based on metal
Material can include metal alloy, such as aluminium or magnesium and their alloy.In some embodiments, the material based on metal
Material includes aluminium.In various embodiments, aluminium accounts at least 50wt%, at least of the metal component of the material based on metal
60wt%, at least 70wt%, at least 80wt%, at least 90wt%, at least 95wt%, substantially all or whole.Therefore, exist
In various embodiments, the material based on metal can be the material based on aluminium.In addition, the aluminium used can be aluminium alloy, example
Such as AA 6061.Alloy 6061 generally comprises 97.9wt% aluminium, 0.6wt% silicon, 0.28wt% copper, 1.0wt% magnesium,
With 0.2wt% chromium.
As described above, the material based on metal can have some properties.In various embodiments, the material based on metal
The density of material is less than 2.7 grams of (" g/cm per cubic centimeter3"), less than 2.6g/cm3, less than 2.5g/cm3, less than 2.4g/cm3, it is small
In 2.3g/cm3, less than 2.2g/cm3, less than 2.1g/cm3, or less than 2.0g/cm3.In such embodiment, based on gold
The density of the material of category can be at least 0.1g/cm3.Because the material based on metal can include polymer-metal composite wood
Material, as discussed below, the density value that the application provides can measure at 25 DEG C according to ASTM D792.For non-polymer/metal
Composite, density can be determined according to ASTM D1505 by density gradient method.
In various embodiments, the thermal conductivity of the material based on metal is more than 1 Watt per meter Kelvin (" W/mK "),
More than 2W/mK, more than 3W/mK, more than 4W/mK, more than 5W/mK, or more than 6W/mK.In such embodiment party
In formula, the thermal conductivity of the material based on metal can be at most 50W/mK, or at most 100W/mK, at most 180W/mK,
Or at most 250W/mK.All heat conductivity values that the application provides are at 25 DEG C according to ISO 22007-2 (transient state flat heat source [heat
Disk (hot disc)] method) measurement.In various embodiments, the thermal expansion of the linear, isotropic of the material based on metal
Less than 50 microns every meter of Kelvins of coefficient (" CTE ") (" μm/mK ", and it is equal to ppm/ DEG C), less than 45 μm/mK, it is less than
40 μm/mK, less than 35 μm/mK, less than 30 μm/mK, or less than 26 μm/mK.In such embodiment, it is based on
The CTE of the material of metal can be at least 10 μm/mK.All CTE values that the application provides are according to following test method part
The method measurement of offer.
In various embodiments, the tensile strength of the material based on metal is at least 5.0 MPas (" MPa ").So
Embodiment in, the ultimate tensile strength of the material based on metal is typically not more than 500MPa.Because the application institute
The material based on metal stated is directed to polymer-metal composite, all tensile strength values all bases that the application provides
ASTM D638 are measured.Sample for being only metal, then tensile property is measured according to ASTM B557M.
In various embodiments, the material based on metal can be foaming metal.As used in this application, term " foaming
Metal " refers to the metal of the loose structure with the void space hole (void-space pores) for including certain volume fraction.
The metal of foaming metal can be any metal for suitably preparing the known in the art of foaming metal or finding from now on.For example, hair
The metal of bubble metal can especially be selected from aluminium, magnesium, and copper, and their alloy.In some embodiments, foaming metal can
To be foaming aluminum.
In various embodiments, the density of foaming metal can be 0.1 to 2.0g/cm3, it is 0.1 to 1.0g/cm3, or
For 0.25 to 0.5g/cm3.In some embodiments, the relative density of foaming metal can be 0.03 to 0.9, be 0.1 to
0.7, or for 0.14 to 0.5, (i.e., otherwise wherein relative density (dimensionless) is defined as the density of foaming metal with base metal
For the non-foamed sample of same metal) the ratio between density.In addition, the thermal conductivity of foaming metal can be 5 to 150W/mK, it is 8
To 125W/mK, or it is 15 to 80W/mK.In addition, the CTE of foaming metal can be 15 to 25 μm/mK, or it is 19 to 23
μm/m·K.In various embodiments, the tensile strength of foaming metal can be 5 to 500MPa, be 20 to 400MPa, be 50
For 60 to 200MPa, or it is 80 to 200MPa to 300MPa.
In various embodiments, foaming metal can be the foaming metal of closed pore.As it is known in the art, term " closed pore "
The void space hole for referring to major part in the wherein material based on metal be isolated hole (that is, not with other void spaces
Hole be connected with each other) structure.Typically 1 to 8 millimeter of the hole size (" mm ") of the foaming metal of closed pore.
In various embodiments, foaming metal can be the foaming metal of perforate.As it is known in the art, term " perforate "
Refer to that the void space hole of major part in the wherein material based on metal is (that is, adjacent with one or more for the hole being connected with each other
Near hole open contact (open contact)) structure.The hole size typically 0.5 of the foaming metal of perforate to
10mm。
Commercially available foaming metal can be used in various embodiments described herein.For example, suitable foaming aluminum
Material can derive from Isotech Inc by sheet-form or with 3- dimension cast forms.Such material can also each press sheet material
Form derives from FoamtechTM Corporation、RacematTMBV and ReadeTM International
Corporation。
In various embodiments, particularly when using the foaming metal of perforate, foaming metal may have surface district
Domain or a part of surface region, itself or be (a) non-foamed metal, or (b) is coated with the material based on polymer.In such reality
Apply in mode, therefore foaming metal may have zero defect or the substantially surface of zero defect (that is, smooth).Such surface can
To promote plating metal and allow to be formed wherein to need the component of smooth surface, such as the situation of fin, intensity needed for it is not
Only it can be realized with single foaming structure.Moreover, under such thickness, fin generally will not show the weight of structural member
Increase is write, therefore it is retaining non-foamed structure or is filling (or at least partly filling) foaming structure with the material based on polymer
Void space hole to increase in terms of intensity be probably gratifying.When surface region is non-foamed, non-foamed part
Mean depth from surface can be 0.05 to 5mm.The example of the suitable foaming metal with non-foamed surface region is steady
Surely the aluminum foam changed, commercially available from AlusionTM, it is the Cymat Technologies of Toronto department.
Improving other methods of heat dissipation of foaming metal can be, for example, using the air duct through foaming core, from
And allow air to circulate in the case where not influenceing product overall performance, the performance is, for example, to retain sealing crust to protect
The component that pad is lived.This method is especially suitable for situations below, wherein the outer layer using non-foamed, i.e. wherein circulate and only pass through
The passage of locality specific occurs in core.
When the material based on polymer is used to provide zero defect or substantially flawless surface or for filling or at least
When being partially filled with foaming structure to increase intensity, the applicable thickness of such material based on polymer is 0.05mm, so as to
Complete the polymer-metal network structure to be interpenetrated through foaming metal to be formed.For these embodiments based on poly-
The example of the material of compound includes thermosetting epoxy resin, or thermoplastic amorphous or crystalline polymer.In a kind of embodiment
In, the material based on polymer is thermosetting epoxy resin.The method that this area is any conventional or finds from now on can be used, will
Material based on polymer is applied to surface region, or it is penetrated into the structure of foaming metal.For example, such apply can
To be implemented as described below：Vacuum flow-casting (vacuum casting) or pressure injection (pressure impregnation), or in pressure
It is lower to use thermoplastic insert injection moulding (insert molding).Polymeric material can be used for filled with appropriate filler in itself
Reduce density, calorific intensity, and/or thermal conductivity enhancing.Such filler can include silica, quartz, aluminum oxide, nitridation
Boron, aluminium nitride, graphite, carbon black, CNT, aluminum slice and fiber, glass fibre, glass or ceramic microspheres, and its two
The combination of kind or more kind.
In various embodiments, the material based on metal can be the metal of microsphere filling.As used in this application, art
Language " microsphere " refers to that mass median diameter (" D50 ") is less than the filler material of 500 microns (" μm ").Suitable for the micro- of the application
Spheroid filler can generally have spherical or made of substantially spherical shape.Metal in the metal of microsphere filling can be above-mentioned
Any metal.As mentioned above, the metal of the material based on metal can be aluminium.Therefore, in some embodiments, microsphere is filled out
The metal filled can be the aluminium of microsphere filling.
In various embodiments, the density of the metal of microsphere filling can be 0.6 to 2g/cm3.In addition, microsphere
The thermal conductivity of the metal of filling can be 5 to 150W/mK.In addition, the CTE of the linear, isotropic of the metal of microsphere filling
Can be 8 to 25 μm/mK.In various embodiments, microsphere filling metal tensile strength can be 0.8 to
60Kpsi (~5.5 to 413.7MPa).
Various types of microsphere fillers can be used for the metal filled suitable for the microsphere of the application.In various implementations
In mode, microsphere filler is hollow.In addition, in some embodiments, microsphere can be selected from：Glass microspheres, not
Come stone microsphere, alumina microspheres, aluminosilicate microspheres body (also known as cenosphere), ceramic microspheres, silica-carbon microballoon
Body, carbosphere body, and its mixture of two or more.
In various embodiments, the size distribution D10 suitable for the microsphere of the application can be 8 to 30 μm.In addition,
The D50 of microsphere can be 10 to 70 μm.In addition, the D90 of microsphere can be 25 to 120 μm.Equally, the real density of microsphere
Can be 0.1 to 0.7g/cm3.As it is known in the art, "true" density be cut down intergranular space space density measurement (with
" accumulation " density is opposite).The real density of microsphere can use helium substituted type dry type automatic densitometer (for example, Acupic
1330, manufactured by Shimadzu Corporation) measure, such as it is described in european patent application EP 1156021A1.It is moreover, suitable
CTE for the microsphere of the application can be 0.1 to 8 μm/mK.Equally, the thermal conductivity of the microsphere suitably used can be with
For 0.5 to 5W/mK.Microsphere can also be metallic cover.
In various embodiments, microsphere can account for 1 to 95 percent by volume (" vol% "), be 10 to 80vol%,
Or be 30 to 70vol%, the cumulative volume of the metal based on microsphere filling.
In one or more embodiments, the conventional filler material group that microsphere can optionally with one or more types
Close.The example of conventional filler material includes silica and aluminum oxide.
The metal of commercially available microsphere filling can be used in various embodiments described herein.As one kind
The example of commercially available product is SComPTM, purchased from Powdermet Inc., Euclid, OH, USA.
In various embodiments, the metal of microsphere filling may have surface region or a part of surface region, institute
Surface region or the metal for (a) non-microsphere filling are stated, or is coated with for (b) with the material based on polymer.In such reality
Apply in mode, therefore the metal of microsphere filling may have zero defect or the substantially surface of zero defect (that is, smooth), this can
To promote plating metal and allow to be formed wherein to need the component (for example, fin) of smooth surface.When surface region is non-microballoon
Body filling when, the mean depth from surface that the part of non-microsphere filling has can be 0.2 to 5mm.
When using based on the material of polymer to provide defect-free surface, such material based on polymer can be applied
Thickness is 50 to 1,000 μm.Using the material based on polymer be used for these embodiments example and method with more than
It is identical on those described in foaming metal.
Radio communication tower assembly
It is as mentioned above, it is any one or more of in the above-mentioned material based on metal to can be used at least partly manufacture channel radio
Believe tower assembly.As used in this application, " radio communication tower assembly " refers to any part of following equipment：Electronic communication equipment, entirely
Ball alignment system (" GPS ") equipment, or similar devices, or its part or part., should although using term " tower "
Pay attention to, these equipment in fact need not install or design and installation is on tower；On the contrary, it is also contemplated that other elevated positions,
Such as radio mast, building, upright stone tablet, or tree.The example of such component includes but is not limited to, antenna, transmitter, receiver,
Transceiver, digital signal processor, control circuit (control electronics), gps receiver, power supply, and electrical component
The crust of outer cover.Alternatively, it is also possible to use what can generally be found in such power equipment such as RF wave filters and radiator
Component.In addition it is also possible to including tower top supporting attachment, such as platform and installation hardware.
As mentioned above, radio communication tower assembly can be RF wave filters.RF wave filters are the keys in far end radio frequency head end
Element.RF wave filters are used to eliminate the signals of some frequencies, and are typically used as the component of duplexer and homodromy will be more
Individual frequency band combination or separation.RF wave filters will also function to key in the minimum interference between the system operated with different frequency bands
Effect.
RF cavity filters are conventional RF wave filters.Prepare these wave filters with various designs and physical geometry
Common practice be by aluminium by die casting roughing product be cast into needed for structure or machine-building into final geometry.RF is filtered
Device, they feature, they manufacture, they machining and their overall manufacturing be all described in, for example, the U.S.
Patent 7,847,658 and 8,072,298.
It is as mentioned above, the material based on polymer can be used on the material based on metal provide smooth surface and/or
Filler as the material based on metal.For example, epoxy resin composite material can be used for the table for being coated with the material based on metal
At least a portion in face.Exemplary epoxy composite material is described in U.S. Provisional Patent Application 61/557,918 (" should the Shen of ' 918
Please ").Furthermore it is possible to make the surface metalation of the material based on metal and/or the material based on polymer, such as it is described in '
918 applications.
In various embodiments, at least a portion of the above-mentioned material based on metal can plate metal, and this is RF cavitys
What wave filter was generally carried out.For example, metal level such as copper, silver or gold can be deposited on based on gold by various plating techniques
On the material of category, or it is inserted between the material layer based on polymer.The example of suitable plating technique it is seen, for example, '
918 applications.
In one embodiment, radio communication tower assembly can be radiator.(can be with as it is well known in the art radiator
It is the component for far end radio frequency head end) generally include substrate and heat diffusing member (or " fin ").Heat diffusing member is usual
Formed by high conductance material such as copper.In one embodiment, the fin manufactured according to description of the invention can wrap
The substrate formed by any of above material based on metal is included, while uses conventional heat diffusing member.In various embodiments,
When using foaming metal (particularly hole-opening foaming metal), substrate can have non-foamed surface as described above.
In various embodiments, radio communication tower assembly can be the crust for including and/or protecting electric equipment.It is such
The example of crust can be, for example, the MRH-24605 LTE far end radio frequency head ends derived from MTI Inc.
In one or more embodiments, radio communication tower assembly can be support member, such as manufacturing platform
Clasping stent (fastening brackets) or component.Specific component includes but is not limited to, antenna holder, support bracket, collaboration
Locating platform (co-location platforms), clamp system, subregion frame assembly (sector frame
Assemblies), ice bridge box (ice bridge kits), three subregion t- shapes mounting assembly (tri-sector t-mount
Assemblies), lamp installation system, and waveguide bridge (wave-guide bridges).
By the above-mentioned radio communication tower assembly of the herein described material manufacture based on metal can according to it is any known or under
The metalworking technology that text discusses is carried out, such as is molded, and is bent (bending), die casting, machining, and combinations thereof.
Method of testing
Density
The density of composite sample determines at 25 DEG C according to ASTM D792.For the only sample containing metal, according to ASTM
D1505 determines density by density gradient method.
Thermal conductivity
Thermal conductivity determines according to ISO 22007-2 (transient state flat heat source [hot plate] method).
Thermal coefficient of expansion
CTE uses thermomechanical analyzer (Thermomechanical Analyzer) (TMA 2940, derived from TA
Instruments) determine.Expand profile to produce using 5 DEG C/min of the rate of heat addition, expansion contour curve is calculated as below in CTE
Slope：CTE=Δs L/ (Δ T x L), wherein Δ L are the changes (μm) of sample length, and L is the initial length (m) of sample, Δ
T is the change (DEG C) of temperature.On the second heating curves, it is 20 DEG C to 60 DEG C to measure the temperature range in the slope region.
Tensile strength
Tensile property measures (tensile strength and % elongation at breaks) on the epoxy resin formulation of solidification according to ASTM
D638 is carried out using the strain rate of 1 type tensile bar and 0.2 inch/minute.For aluminum metal sample, according to ASTM B557M
Measure tensile property.
Glass transition temperature (Tg)
Following measurement Tg：Sample is put into differential scanning calorimetry (DSC) (" DSC "), the calorimeter is with 10 DEG C/min of heating
And cooling, first time heat scan is from 0 to 250 DEG C, to second of heat scan from 0 to 250 DEG C.Tg is reported as from 0 to 250
DEG C the second heat scan on second order trnasition half height value.
Embodiment
Embodiment 1- materials compare
Foaming aluminum sample (S1) in table 1 below is combined with conventional aluminium (Comp.A), three kinds of epoxy resin composite materials
The PEI (Comp.E) of thing (Comp.B-D) and glass-filled is compared.Foaming aluminum is 25.4mm thickness samples, and its is close
Spend for 0.41g/cm3, mainly with open-celled structure, derived from Cymat Technologies, Ltd.Conventional aluminium is aluminium alloy 6061.
Mixing, casting and the curing of epoxy resin composite material composition (Comp.B-D) are described generally below carrying out.Glass is filled out
The PEI filled is ULTEMTM3452, this is a kind of PEI with 45% fiber glass packing, commercially available from GE
Plastics。
Comp.B-D preparation process
Include for term described below and title：D.E.N.425 is epoxy resin, and its EEW is 172, and commercially available from
The Dow Chemical Company；D.E.R.383 is epoxy resin, and its EEW is 171, and commercially available from The Dow
Chemical Company；" NMA " represents methylnadic anhydride, and commercially available from Polysciences；" ECA100 " is represented
Epoxy Curing Agent 100, commercially available from Dixie Chemical, and ECA 100 generally comprises the methyl four more than 80%
Hydrogen phthalic anhydride and 10% tetrabydrophthalic anhydride being more than；" 1MI " expression 1- methylimidazoles, and commercially available from
Aldrich Chemical；W12EST is the quartz that the epoxy silane that D50 granularities are 16 μm is handled, and commercially available
From Quarzwerke.
The filler of necessary amounts is dried overnight in vacuum drying oven in~70 DEG C of temperature.The epoxy of acid anhydride curing agent will be included
Resin is preheated to~60 DEG C respectively.Epoxy resin, the acid anhydride of warm for loading the warm of specified amount into wide opening plastic containers are hard
Agent and 1- methylimidazoles, turn round and round manually, then heat the filler of warm.Then by the content of container in FlackTek
SpeedMixerTMOn with about 800 to about 2000rpm mixing, the mixer has the cycle of multiple~1-2 duration minute.
The preparation of mixing is fitted into the 500 of controlled temperature into 1000-mL resin kettles, its be provided with glass stirring handle and
CarryThe overhead stirrer of blade and vavuum pump and vacuum controller for pumping.Typical pumping scheme exists
About 55 DEG C to the about 75 DEG C uses following representational stage is carried out：5 minutes, 80rpm, 100 supports；5 minutes, 80rpm, 50 supports；5 points
Clock, 80rpm, 20 supports, use N2Reach~760 supports；5 minutes, 80rpm, 20 supports, use N2Reach~760 supports；3 minutes, 80rpm, 20
Support；5 minutes, 120rpm, 10 supports；5 minutes, 180rpm, 10 supports；5 minutes, 80rpm, 20 supports；With 5 minutes, 80rpm, 30 supports.Root
It according to the scale of preparation to be evacuated, can optionally increase the time in high vacuum, and use the high vacuum of 5 supports on demand.
The mixture of the pumping of warm is reached into atmospheric pressure, and is poured into the die assembly of warm as described below.
For following particular molds, about 350 grams to 450 grams of a certain amount of mixture is generally poured into the open side of mould.Make to be full of
Mould in 80 DEG C of baking ovens standing upright about 16 hours, then raise temperature and kept for altogether 10 hours at 140 DEG C；Then rise
High-temperature is simultaneously kept for 4 hours altogether at 225 DEG C；Then environment temperature (about 25 DEG C) is slowly cooled to.
Die assembly
To two at each edge with certain angle otch~355mm square metals plate each lays one
DUOFOILTM(~330mm x 355mm x~0.38mm).By thickness~3.05mm U- spacer bars and with~3.175mm
ID x~4.75mm OD (being used as packing ring) organic silicon rubber pipe is placed between each plate, mould is kept close to C- fixtures.Make
With before, mould is preheated in about 65 DEG C of baking ovens.Identical molding methods are applicable to following casting, and it has less
Metallic plate and the thicker U- spacer bars of use, appropriate organic silicon rubber pipe of the adjustment as packing ring.
The material of table 1- radio communication tower assemblies compares
N/D=undetermineds
* typical 6061 alloy is (unmeasured；The data of report derive from www.efunda.com)
The unmeasured properties of *；The data of report derive from GE product data sheets
* * flow directions/horizontal direction
Plating process is carried out according to the description provided in U.S. Provisional Patent Application No. 61/557,918
Foaming aluminum with good epidermis finish provide can plating surface
As seen from Table 1, foaming aluminum provide can be compared with thermosets relatively low thermal coefficient of expansion, while can with it is normal
Advise aluminium and keep enough thermal conductivities compared to significantly reduced density.
The foaming aluminum that embodiment 2- is filled with thermosetting epoxy resin
According to procedure below, size is cast in the epoxy preparation of filling as 2 " x2 " x0.5 " foaming aluminium block and is consolidated
Change.The epoxy preparation used be DER 332+50/50 methylnadic anhydrides/Epoxy Curing Agent 100 (i.e.,
MTHPA), it contains 65wt%SILBOND 126EST.Foaming aluminum foams are identical with described in above example 1.
After epoxy composite as described above is mixed and is evacuated, the liquid epoxy mixture that foaming aluminum is added in resin kettle,
And using stirrer paddle by its holding position to prevent it from floating.Container is closed, following applying vacuum is up to 35 minutes to be steeped from aluminium
Air is removed in foam body and forces liquid epoxies to enter metal aperture：10 supports are kept for 10 minutes, and 5 supports are kept for 5 minutes, and 10 supports are protected
Hold 5 minutes, 20 supports are kept for 5 minutes, and 30 supports keep 5min.Then container is made to return to atmospheric pressure.By 550 mil thick U- intervals
Bar puts mould into, and about 1/2 pumping mixture is poured into die assembly (above-mentioned), then makes the aluminum foam for absorbing epoxy resin
Piece holding position, remaining epoxy resin is poured on top.Solidification 16 hours is carried out at 80 DEG C, is then solidified at 140 DEG C
10 hours, solidification 4 hours is finally carried out at 200 DEG C, is completed.
The averag density of gained composite is 1.65g/cm3, average CTE is 23.6 to 29.4 μm/mK, and linearly
Isotropic thermal conductivity is 5.1W/mK.
Claims (8)
1. a kind of equipment, it includes：
Radio communication tower assembly, the metal that its at least part is filled by microsphere are formed,
The metal of wherein described microsphere filling is less than 2.7 grams of (" g/cm per cubic centimeter in the density of 25 DEG C of measurements3"),
The thermal conductivity of metal measurement at 25 DEG C of wherein described microsphere filling is W/mK more than 1 Watt per meter Kelvin, its
Described in microsphere filling metal have within the temperature range of -35 to 120 DEG C be less than 30 microns of every meter of Kelvins i.e. μm/
The thermal coefficient of expansion CTE of mK linear, isotropic,
The metal of wherein described microsphere filling, which includes, is selected from following microsphere：Glass microspheres, mullite microsphere, oxidation
Aluminium microsphere, ceramic microspheres, silica-carbon microsphere, carbosphere body, and the foregoing mixture of two or more.
2. the equipment of claim 1, wherein the metal in the metal of microsphere filling is selected from aluminium, magnesium, and their conjunction
Gold.
3. the equipment of any one of preceding claims, wherein the metal of microsphere filling is in the density of 25 DEG C of measurements
0.6 to 2g/cm3, wherein the thermal conductivity of metal measurement at 25 DEG C of microsphere filling is 5 to 150W/mK, wherein described
The CTE of metal linear, isotropic with 8 to 25 μm/mK within the temperature range of -35 to 120 DEG C of microsphere filling.
4. the equipment of claim 1, wherein the tensile strength of the metal of microsphere filling is 0.8 to 60kpsi.
5. the equipment of claim 1, wherein the size distribution D10 of the microsphere is 8 to 30 μm, D50 be 10 to 70 μm and
D90 is 25-120 μm, wherein the real density of the microsphere is 0.1 to 0.7g/cm3。
6. the equipment of claim 1, wherein the microsphere accounts for 1 to 95 volume %, the metal based on microsphere filling
Cumulative volume.
7. the equipment of claim 1, wherein the wireless communication tower component is selected from radio frequency (" RF ") cavity filter, radiator,
Crust, tower top supporting attachment, and the foregoing combination of two or more.
8. the equipment of claim 1, wherein the wireless communication tower component is RF cavity filters, wherein the microsphere is filled
At least a portion of metal be copper facing and/or silver.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261707085P | 2012-09-28 | 2012-09-28 | |
| US61/707,085 | 2012-09-28 | ||
| PCT/US2013/059390 WO2014052020A1 (en) | 2012-09-28 | 2013-09-12 | Microsphere-filled-metal components for wireless-communication towers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104662184A CN104662184A (en) | 2015-05-27 |
| CN104662184B true CN104662184B (en) | 2018-03-02 |
Family
ID=49230874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380050435.0A Expired - Fee Related CN104662184B (en) | 2012-09-28 | 2013-09-12 | The metal assembly that microsphere for wireless communication tower is filled |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20150225815A1 (en) |
| EP (1) | EP2900838A1 (en) |
| JP (1) | JP2016518694A (en) |
| KR (1) | KR20150060728A (en) |
| CN (1) | CN104662184B (en) |
| BR (1) | BR112015006630A2 (en) |
| CA (1) | CA2881164A1 (en) |
| MX (1) | MX2015004107A (en) |
| TW (1) | TWI607094B (en) |
| WO (1) | WO2014052020A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2894268C (en) * | 2012-12-20 | 2021-01-05 | Dow Global Technologies Llc | Polymer composite components for wireless-communication towers |
| EP3548259A4 (en) * | 2016-11-30 | 2020-06-24 | Continental Structural Plastics, Inc. | Two piece bonded vehicle components formed by sheet molding compound-resin transfer molding assemblies |
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Also Published As
| Publication number | Publication date |
|---|---|
| MX2015004107A (en) | 2015-07-06 |
| TWI607094B (en) | 2017-12-01 |
| JP2016518694A (en) | 2016-06-23 |
| TW201413002A (en) | 2014-04-01 |
| EP2900838A1 (en) | 2015-08-05 |
| CA2881164A1 (en) | 2014-04-03 |
| WO2014052020A1 (en) | 2014-04-03 |
| KR20150060728A (en) | 2015-06-03 |
| BR112015006630A2 (en) | 2017-07-04 |
| US20150225815A1 (en) | 2015-08-13 |
| CN104662184A (en) | 2015-05-27 |
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