CN104658924B - A kind of packaging technology suitable for small lot circuit - Google Patents
A kind of packaging technology suitable for small lot circuit Download PDFInfo
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- CN104658924B CN104658924B CN201510063587.5A CN201510063587A CN104658924B CN 104658924 B CN104658924 B CN 104658924B CN 201510063587 A CN201510063587 A CN 201510063587A CN 104658924 B CN104658924 B CN 104658924B
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- circuit
- minutes
- worked
- curing agent
- low temperature
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- 238000012536 packaging technology Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000005538 encapsulation Methods 0.000 claims abstract description 19
- 238000012360 testing method Methods 0.000 claims abstract description 14
- 230000032683 aging Effects 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 230000035882 stress Effects 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses a kind of packaging technology suitable for small lot circuit.Encapsulation, aging are followed successively by with testing progress simultaneously, whole process：Circuit is allowed to immerse in curing agent；Mould is raised to specified S2 DEG C of high temperature for S1 DEG C together with circuit from room temperature；Circuit is worked at S2 DEG C t1 minutes, kept for t2 minutes after down circuitry, t1, t2 processes, until solidification is completed is repeated several times；S3 DEG C is dropped to from S2 DEG C, circuit is worked at S3 DEG C t3 minutes, is kept for t4 minutes after power-off, t3, t4 is repeated several times.The beneficial effects of the invention are as follows：The saving time.The high mechanical strength after circuit or the chip stress that break-make electric energy is produced with reducing in encapsulation process repeatedly, encapsulation in encapsulation process, reliability is high, improves yield rate.
Description
Technical field
The present invention relates to a kind of packaging technology of circuit, the packaging technology of small lot circuit is especially adapted for use in.
Background technology
Encapsulation is necessary for some circuits, is also vital.Because some circuits will be isolated from the outside,
To prevent that corrosion of the impurity in air to chip and lead from causing electric property to decline, while some circuit integrated packages and electricity
After the completion of the element manufacturings such as resistance, electric capacity, it is still necessary to confidentiality, shock resistance and interference free performance are improved with packing forms,
In order in harsh environment, such as Aeronautics and Astronautics, deep-sea and battlefield.Encapsulation technology directly affects circuit self performance
Play the design and manufacture with PCB.
According to the structural requirement of different product, the packaged types such as embedding, encapsulating and plastic packaging can be divided into.In terms of encapsulating material,
Epoxy resin price is relatively relatively inexpensive, moulding process is simple, be adapted to production, reliability is also higher, therefore epoxide resin material is sealed
Dress have developed rapidly nearly ten years.80%~90% (Japanese almost all) of foreign countries' semiconductor devices is sealed by epoxide resin material at present
Dress.
Conventional epoxy encapsulation mode needs special purpose machinery, the purchase cost of the machine, operation and maintenance cost compared with
Height, itself noise is big, if the circuit of small lot can also waste of materials, so small lot circuit thermoplastic envelope should not use these
Special purpose machinery.
Generally, all it is that normal temperature test is done after encapsulated circuit in laboratory, to reduce fault rate, then does aging
Experiment, finally does high/low temperature test.The circuit being generally used in harsh environment aging dozens of will be counted even under the high temperature conditions
Thousand hours, this repetition experiment needs the plenty of time, and in some projects, the time is at full stretch, although these circuits
Less, but design and the circuit that makes these and be used in harsh environment will be devoted a tremendous amount of time quantity, therefore do aging examination
The time tested is inadequate.
In encapsulation process, stress can be produced between circuit and encapsulating material.Each several part temperature is different when circuit works, with envelope
Also stress can be produced between package material.These stress can cause intensity to decline, shock resistance is poor, problems of crack, in high temperature
Or when being worked under low temperature environment, circuit or wafer damage can be caused.
At this stage for there is following two in small lot circuit manufacturing process：One is how to shorten the production time,
Two be the quality and qualification rate that product is improved by how to reduce stress, and the two problems are required for solving.
The content of the invention
In order to solve the above problems, the invention discloses a kind of packaging technology suitable for small lot circuit.It will encapsulate, always
Change and carried out simultaneously with test, whole process is followed successively by：
(a) first toward pouring into curing agent in mould, then circuit is put into mould, allowed in circuit immersion curing agent；Or first
Circuit is put into mould, then pours into curing agent, allows circuit to immerse in curing agent；
(b) mould is raised to specified S2 DEG C of high temperature for S1 DEG C together with circuit from room temperature；
(c) circuit is worked at S2 DEG C t1 minutes, kept for t2 minutes after power-off, t1, t2 processes, this mistake is repeated several times
Curing agent is no longer liquid at the end of journey；
(d) specified S3 DEG C of low temperature is dropped to from S2 DEG C, circuit is worked t3 minutes at S3 DEG C of low temperature, t4 is kept after power-off
Minute, t3, t4 process is repeated several times；
(e) it is repeated several times（c）（d）High/low temperature process；
(f) again from low temperature S3 DEG C be raised to S2 DEG C of high temperature, circuit is worked at S2 DEG C t1 minutes, after down circuitry keep
T2 minutes, t1, t2 process is repeated several times.
In the foregoing circuit course of work, test is arranged, substandard product is eliminated.
For the circuit to be worked below 110 DEG C, curing agent preferably is HL-1108 epoxy curing agents.
For the circuit to be worked more than 110 DEG C, curing agent preferably is epoxy resin HASUNBOND 739.
For the circuit that will be worked, t1=t2=10 minutes, S1=25 DEG C, S2=from 125 degree Celsius to subzero 55 degree Celsius
125 DEG C, in step (c) in triplicate；T3=t4=10 minutes, S3 was subzero 55 DEG C Celsius, in step (d) in triplicate；
In step（e）In（c）（d）High/low temperature process at least repeat ten times.
For from the 110 degree Celsius circuits that will be worked to 40 degrees below zero Celsius, t1=t2=15 minutes, S1=25 DEG C, S2=
110 DEG C, in step (c) in triplicate；T3=t4=15 minutes, S3 was subzero 40 DEG C Celsius, in step (d) in triplicate；
（e）In step（c）（d）High/low temperature process at least repeat ten times.
The beneficial effects of the invention are as follows：Encapsulation, aging and test are combined as a complete flow in an orderly manner, in this stream
The other experiment effects of the two of each step all without prejudice tos, have saved the time, have accelerated speed of production in journey.In encapsulation process,
Circuit power on/off repeatedly, to reduce the stress produced in encapsulation process.Finished product after encapsulation is operationally, although circuit portions
Temperature is different, but the infringement that stress is caused is decreased obviously.The anti-vibrating and impact performance of finished product after encapsulation more preferably, improves reliability
Property, quality is improved, yield rate is improved, the confidentiality and mechanical strength of circuit is added.
Brief description of the drawings
Fig. 1 is that mould used is encapsulated in embodiment.
Fig. 2 liquid-state epoxy resins high-temperature curing agent is in a mold.
Circuit to be packaged in Fig. 3 embodiments.
In Fig. 4 embodiments in circuit immersion curing agent.
Fig. 5 is temperature-time curve.
1. mould in figure, 2. epoxy curing agents, 3. circuits.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
Fig. 3 is circuit to be packaged in embodiment, when circuit is by for subzero 55 degree to 125 degree Celsius Celsius of environment
In, it is necessary to anti-vibration and impact, encapsulation are to not only increase its confidentiality, also add mechanical strength.
The encapsulation of the circuit, aging are carried out simultaneously with test, whole process is followed successively by：
(a) first toward pouring into curing agent in mould, then circuit is put into mould, allowed in circuit immersion curing agent；
(b) mould is raised to specified S2 DEG C of high temperature for S1 DEG C together with circuit from room temperature；
(c) circuit is worked at S2 DEG C t1 minutes, kept for t2 minutes after power-off, t1, t2 processes, this mistake is repeated several times
Curing agent is no longer liquid at the end of journey；
(d) specified S3 DEG C of low temperature is dropped to from S2 DEG C, circuit is worked t3 minutes at S3 DEG C of low temperature, t4 is kept after power-off
Minute, t3, t4 process is repeated several times；
(e) it is repeated several times（c）（d）High/low temperature process；
(f) again from low temperature S3 DEG C be raised to S2 DEG C of high temperature, circuit is worked at S2 DEG C t1 minutes, after down circuitry keep
T2 minutes, t1, t2 process is repeated several times.
In the foregoing circuit course of work, test is completed, substandard product is eliminated.In step (c), curing agent by
Liquid is converted into solid-state, and the existing state worked on power of circuit has the state of power-off, and iterative cycles again, can be effective
Reduce the stress that encapsulation and work are produced.In step (e), although curing agent has been cured, but experiment repeatedly is helped
In further reduction stress, and make bad products be exposed in advance.
The curing agent used be epoxy resin HASUNBOND 739, t1=t2=10 minutes, S1=25 DEG C, S2=125 DEG C,
In step (c) in triplicate；T3=t4=10 minutes, S3 was subzero 55 DEG C Celsius, in step (d) in triplicate；In step（e）
In（c）（d）High/low temperature process at least repeat ten times.In step（f）Middle completion aging and test.
In embodiment, when circuit by for 40 degrees below zero into 110 degree of environment.By the encapsulation of the circuit, aging with
Test is carried out simultaneously, and curing agent is HL-1108 epoxy curing agents, and whole process is followed successively by：
(a) first circuit is put into mould, then pours into curing agent, allow circuit to immerse in curing agent；
(b) mould is raised to specified S2 DEG C of high temperature for S1 DEG C together with circuit from room temperature；
(c) circuit is worked at S2 DEG C t1 minutes, kept for t2 minutes after power-off, t1, t2 processes, this mistake is repeated several times
Curing agent is no longer liquid at the end of journey；
(d) specified S3 DEG C of low temperature is dropped to from S2 DEG C, circuit is worked t3 minutes at S3 DEG C of low temperature, t4 is kept after power-off
Minute, t3, t4 process is repeated several times；
(e) it is repeated several times（c）（d）High/low temperature process；
(f) again from low temperature S3 DEG C be raised to S2 DEG C of high temperature, circuit is worked at S2 DEG C t1 minutes, after down circuitry keep
T2 minutes, t1, t2 process is repeated several times.
In the foregoing circuit course of work, high/low temperature test is completed, substandard product is eliminated, t3=t4=10 minutes,
S3 is subzero 55 DEG C, in step (d) in triplicate；In step（e）In（c）（d）High/low temperature process at least repeat ten times.
Step（f）Middle completion aging and high/low temperature test.
The present invention can be not only used for circuit package, can be used for the encapsulation of semiconductor chip.The present invention can be by ability
The technical staff in domain makees some modifications under the premise of the spirit of the present invention is not departed from, but the modification made is still the application's
In scope of the claims.
Claims (4)
1. a kind of packaging technology suitable for small lot circuit, encapsulation, aging is carried out simultaneously with test, whole process is successively
For：
(a) first toward pouring into curing agent in mould, then circuit is put into mould, allowed in circuit immersion curing agent；Or first by electricity
Road is put into mould, then pours into curing agent, allows circuit to immerse in curing agent；
(b) mould is raised to specified S2 DEG C of high temperature for S1 DEG C together with circuit from room temperature；
(c) circuit is worked at S2 DEG C t1 minutes, kept for t2 minutes after power-off, t1 is repeated several times, t2 processes, this process terminates
When curing agent be no longer liquid；
(d) specified S3 DEG C of low temperature is dropped to from S2 DEG C, circuit is worked t3 minutes at S3 DEG C of low temperature, is kept for t4 minutes after power-off,
T3, t4 process is repeated several times；
(e) the high/low temperature process of (c) (d) is repeated several times；
(f) again from low temperature S3 DEG C be raised to S2 DEG C of high temperature, circuit is worked at S2 DEG C t1 minutes, t2 point kept after down circuitry
Clock, is repeated several times t1, t2 process；
In the foregoing circuit course of work, test is arranged, substandard product is eliminated.
2. a kind of packaging technology suitable for small lot circuit according to claim 1, it is characterized in that：
For the circuit to be worked below 110 DEG C, curing agent is HL-1108 epoxy curing agents；
For the circuit to be worked more than 110 DEG C, curing agent is epoxy resin HASUNBOND 739.
3. a kind of packaging technology suitable for small lot circuit according to claim 1, it is characterized in that：
For the circuit that will be worked, t1=t2=10 minutes, S1=25 DEG C, S2=from 125 degree Celsius to subzero 55 degree Celsius
125 DEG C, in step (c) in triplicate；
T3=t4=10 minutes, S3 was subzero 55 DEG C Celsius, in step (d) in triplicate；
The high/low temperature process of (c) (d) is at least repeated ten times in step (e).
4. a kind of packaging technology suitable for small lot circuit according to claim 1, it is characterized in that：
For from the 110 degree Celsius circuits that will be worked to 40 degrees below zero Celsius, t1=t2=15 minutes, S1=25 DEG C, S2=
110 DEG C, in step (c) in triplicate；
T3=t4=15 minutes, S3 was subzero 40 DEG C Celsius, in step (d) in triplicate；
The high/low temperature process of (c) (d) is at least repeated ten times in (e) step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510063587.5A CN104658924B (en) | 2015-02-06 | 2015-02-06 | A kind of packaging technology suitable for small lot circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510063587.5A CN104658924B (en) | 2015-02-06 | 2015-02-06 | A kind of packaging technology suitable for small lot circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104658924A CN104658924A (en) | 2015-05-27 |
| CN104658924B true CN104658924B (en) | 2017-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510063587.5A Expired - Fee Related CN104658924B (en) | 2015-02-06 | 2015-02-06 | A kind of packaging technology suitable for small lot circuit |
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| Country | Link |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1477690A (en) * | 2002-08-21 | 2004-02-25 | 南茂科技股份有限公司 | Test method of complex semiconductor packaged structure |
| CN101021547A (en) * | 2006-03-30 | 2007-08-22 | 信息产业部电子第五研究所 | Bare chip test and aging screening temporary packaging carrier |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060273313A1 (en) * | 2005-06-01 | 2006-12-07 | Power Digital Card Co., Ltd. & Chien-Yuan Chen | IC packaging technique |
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2015
- 2015-02-06 CN CN201510063587.5A patent/CN104658924B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1477690A (en) * | 2002-08-21 | 2004-02-25 | 南茂科技股份有限公司 | Test method of complex semiconductor packaged structure |
| CN101021547A (en) * | 2006-03-30 | 2007-08-22 | 信息产业部电子第五研究所 | Bare chip test and aging screening temporary packaging carrier |
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| Publication number | Publication date |
|---|---|
| CN104658924A (en) | 2015-05-27 |
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| CB03 | Change of inventor or designer information |
Inventor after: Zhu Xiangbing Inventor after: Zhu Jiajun Inventor after: Shi Yinqiao Inventor after: Zhang Xuefeng Inventor after: Sang Kun Inventor after: Yang Hongyun Inventor after: Chen Jin Inventor before: Zhu Jiajun Inventor before: Zhu Xiangbing Inventor before: Shi Yinqiao Inventor before: Zhang Xuefeng Inventor before: Sang Kun Inventor before: Yang Hongyun Inventor before: Chen Jin |
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| CF01 | Termination of patent right due to non-payment of annual fee |