CN104638056A - Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers - Google Patents

Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers Download PDF

Info

Publication number
CN104638056A
CN104638056A CN201310569505.5A CN201310569505A CN104638056A CN 104638056 A CN104638056 A CN 104638056A CN 201310569505 A CN201310569505 A CN 201310569505A CN 104638056 A CN104638056 A CN 104638056A
Authority
CN
China
Prior art keywords
cleaning
silicon wafers
pure water
cleaning method
volume fraction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310569505.5A
Other languages
Chinese (zh)
Inventor
王建树
王庆钱
时利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG FORTUNE ENERGY Co Ltd
Original Assignee
ZHEJIANG FORTUNE ENERGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG FORTUNE ENERGY Co Ltd filed Critical ZHEJIANG FORTUNE ENERGY Co Ltd
Priority to CN201310569505.5A priority Critical patent/CN104638056A/en
Publication of CN104638056A publication Critical patent/CN104638056A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers. A slot type cleaning process is added between a cleaning and texturing process and a diffusing process. The cleaning method comprises the following specific steps of firstly, preliminarily cleaning silicon wafers which cannot be diffused in time after being textured by using pure water; secondly, cleaning the preliminarily cleaned silicon wafers by using HCl solution with the volume fraction of 1-5%; thirdly, continuously cleaning the silicon wafers twice by using pure water; fourthly, cleaning the silicon wafers cleaned by the pure water by using HF solution with the volume fraction of 1-3%; and finally continuously cleaning the silicon wafers twice by using pure water and diffusing the silicon wafers. The cleaning method has the advantages that by the technical scheme, short-circuit current in electrical performance parameters of polycrystalline silicon solar cells has 20-40 milliamperes of gain, and the photoelectric conversion efficiency has 0.05-0.1% of gain.

Description

A kind of being used for removes metal impurities cleaning method before polysilicon chip spreads
Technical field
The present invention relates to crystal silicon solar batteries sheet and manufacture field, relating to a kind of for removing metal impurities cleaning method before polysilicon chip diffusion particularly.
Background technology
In preparation technology's flow process of crystal silicon solar batteries sheet, it is first the absorption reducing surface reflectivity, increase light by preparing matte at silicon chip surface.In actual production process, often there will be that the silicon chip after making herbs into wool is exposed does not enter diffusion technology in atmosphere in time, cause silicon chip surface to be oxidized and stain phenomenon.In addition, the inert metal ion that naked silicon chip is self-contained does not clean up phenomenon completely in cleaning and texturing technique.Above-mentioned phenomenon all can affect the unit for electrical property parameters of polysilicon solar battery slice.
Summary of the invention
The object of this invention is to provide a kind of for removing metal impurities cleaning method before polysilicon chip diffusion, reaching the object can stablized sustainable volume production, improve short circuit current and photoelectric conversion efficiency.
In order to solve the problem, the technical solution that the present invention adopts is to provide a kind of for removing metal impurities cleaning method before polysilicon chip diffusion, and between diffusion twice technique, increase one slot type cleaning at cleaning and texturing, concrete technology flow process is as follows:
(1) silicon chip failing to enter in time diffusing procedure after making herbs into wool is placed in pure water tentatively to clean;
(2) silicon chip after preliminary cleaning being placed in volume fraction is that the HCl solution of 1-5% cleans;
(3) then doublely to clean through pure water;
(4) silicon chip cleaned through pure water being placed in volume fraction is that the HF solution of 1-3% cleans;
(5) finally double through pure water cleaning, enter diffusing procedure.
The invention has the beneficial effects as follows that the unit for electrical property parameters short circuit currents of polysilicon solar battery slice has the gain of 20-40 milliampere, and photoelectric conversion efficiency has the gain of 0.05-0.1% by adopting technique scheme.
Accompanying drawing explanation
Fig. 1 concrete technology flow process for removing metal impurities cleaning method before polysilicon chip diffusion provided by the invention.
Embodiment
Below according to the technical solution for removing metal impurities cleaning method before polysilicon chip diffusion provided by the invention, specific embodiments is below adopted to be described further.The present embodiment is carried out under the condition that the technique of making herbs into wool, diffusion, etching, PECVD, each procedure of silk screen printing is identical with former technique, and wherein A represents former process program, and B represents technical scheme provided by the invention.Embodiment is as follows:
(1) silicon chip failing to enter in time diffusing procedure after making herbs into wool is placed in pure water tentatively to clean;
(2) by tentatively cleaning after silicon chip be placed in volume fraction be 2% HCl solution clean, reaction temperature is normal temperature;
(3) then doublely to clean through pure water;
(4) silicon chip cleaned through pure water is placed in volume fraction be 2.5% HF solution clean, reaction temperature is normal temperature;
(5) finally double through pure water cleaning, enter diffusion, etching, PECVD, silkscreen process successively.
The unit for electrical property parameters of the polysilicon solar battery slice adopting present embodiment to prepare is as shown in the table:
Experimental result shows: in the unit for electrical property parameters of the polysilicon solar battery slice adopting technical scheme B provided by the invention to prepare, short circuit electricity improves 39 milliamperes, and photoelectric conversion efficiency improves 0.06%.

Claims (1)

1., for removing a metal impurities cleaning method before polysilicon chip diffusion, between diffusion twice technique, increase one slot type cleaning at cleaning and texturing, concrete technology flow process is as follows:
(1) silicon chip failing to enter in time diffusing procedure after making herbs into wool is placed in pure water tentatively to clean;
(2) silicon chip after preliminary cleaning being placed in volume fraction is that the HCl solution of 1-5% cleans;
(3) then doublely to clean through pure water;
(4) silicon chip cleaned through pure water being placed in volume fraction is that the HF solution of 1-3% cleans;
(5) finally double through pure water cleaning, enter diffusing procedure.
CN201310569505.5A 2013-11-13 2013-11-13 Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers Pending CN104638056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310569505.5A CN104638056A (en) 2013-11-13 2013-11-13 Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310569505.5A CN104638056A (en) 2013-11-13 2013-11-13 Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers

Publications (1)

Publication Number Publication Date
CN104638056A true CN104638056A (en) 2015-05-20

Family

ID=53216565

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310569505.5A Pending CN104638056A (en) 2013-11-13 2013-11-13 Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers

Country Status (1)

Country Link
CN (1) CN104638056A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105327887A (en) * 2015-10-28 2016-02-17 江苏辉伦太阳能科技有限公司 Chain type device for removing and recycling metal impurities through cyclic utilization of cleaning fluid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105327887A (en) * 2015-10-28 2016-02-17 江苏辉伦太阳能科技有限公司 Chain type device for removing and recycling metal impurities through cyclic utilization of cleaning fluid

Similar Documents

Publication Publication Date Title
JP6666438B2 (en) Manufacturing method of local back contact solar cell
JP6553731B2 (en) N-type double-sided battery wet etching method
CN102212885B (en) Texturing method for polycrystalline silicon solar cells
CN102181935B (en) Method and corrosive liquid for making texture surface of monocrystalline silicon
CN104218122B (en) A kind of etching method of the polysilicon emitter rate reducing diamond wire cutting
CN102770968A (en) Method for manufacturing a back contact solar cell
CN102593263A (en) Preparation method of N-type crystalline silicon back emitter junction solar battery and corrosive liquid
CN103178159A (en) Crystalline silicon solar cell etching method
CN104362221A (en) Method for preparing polycrystalline silicon solar cell by RIE texturing
CN101635319B (en) Method for manufacturing back aluminium diffused N type solar cell
CN202307914U (en) Next-generation structure high-efficiency crystalline silicon battery
JP5817046B2 (en) Manufacturing method of back contact type crystalline silicon solar cell
CN102623559A (en) Process for preparing emitter without dead layer of solar cell by oxidation
CN103094417A (en) Solar cell manufacture method for emitting electrode structure with low-high-low doping density
CN102789970A (en) Preparation method for fast recovery diode chip
CN104134706B (en) Graphene silicon solar cell and manufacturing method thereof
CN104112795B (en) A kind of production method of silicon heterogenous solar cell
CN102683492B (en) Preparation method of double-sided back contact crystalline silicon solar cell
CN103618029A (en) Method for manufacturing MWT photovoltaic cell with passivated back
US8445311B2 (en) Method of fabricating a differential doped solar cell
CN104638056A (en) Cleaning method for removing metallic contaminations before diffusion of polycrystalline silicon wafers
CN102709391B (en) A kind of preparation method of selective emitter solar battery
CN103943729A (en) Metallization production method of efficient solar cells
JP2015106585A (en) Method for manufacturing solar cell element and solar cell module
CN101976707A (en) Manufacturing technology of crystalline silicon selective emitting electrode solar cell

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20150520