CN104635428A - Focusing and leveling measurement apparatus based on image processing and method thereof - Google Patents
Focusing and leveling measurement apparatus based on image processing and method thereof Download PDFInfo
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- CN104635428A CN104635428A CN201310563436.7A CN201310563436A CN104635428A CN 104635428 A CN104635428 A CN 104635428A CN 201310563436 A CN201310563436 A CN 201310563436A CN 104635428 A CN104635428 A CN 104635428A
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Abstract
The invention discloses a focusing and leveling measurement apparatus based on image processing, which comprises a light source used for providing an illumination light beam; a projection unit used for performing incidence of the illumination light beam to the surface of an object to be measured according to a certain angle; a detection unit used for receiving the reflected light beam of the object to be measured; and a processing unit used for calculating the vertical position and inclination grade of the surface of the object to be measured according to the information carried by the reflected light beam; wherein the light source passes through a projection slit array of a projection unit and then is divided into multipath incident light. The projection slit array enables parallel arrangement with different spacing.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, particularly relate to a kind of focusing and leveling measurement apparatus based on image procossing for lithographic equipment and method.
Background technology
Projection mask aligner's (or claiming lithographic equipment) is the device in order to the pattern on mask to be projected to silicon chip surface by projection objective.In apparatus for projection exposure, automatic focusing levelling control system must be had the surface of silicon chip to be accurately set to the exposure position of specifying.Realize automatic focusing leveling controlling functions and have multiple different technical scheme, relatively more conventional is at present non-contact type photoelectricity measuring technique.
In contactless focusing and leveling sniffer, adopt scanning reflection mirror to modulate the light signal that silicon chip face reflects, and then by the electric signal that demodulation detector produces, the object of Measurement accuracy position of silicon wafer can be reached.But along with die size increases and the increase of exposure area, in order to improve measuring accuracy, need at the multiple measurement point of larger areal distribution, and be only applicable at comparatively zonule distribution measuring point based on the detecting strategy of scanning reflection mirror.
Based in CCD photodetection scheme, different hot spots has different corresponding relations on CCD between position and facular height, therefore can calculate the position of each hot spot on CCD according to the projected image of hot spot on CCD, thus determine facular height.Such as, because silicon chip surface reflectivity is inconsistent and the manufacturability difference of silicon chip, the groove in silicon chip, the imaging of hot spot on CCD can produce distortion, is fallen into oblivion even completely.Also there will be part to measure hot spot drop on the outside and situation that causes hot spot invalid of silicon chip when exposure area is in the edge of silicon chip.
Publication date is provide a kind of prescan scheme in United States Patent (USP) US5920398 patent on July 6th, 1999, to each measurement hot spot matching curve, and by the true face type of least square fitting curve simulation silicon chip, calculate the deviation between actual measured value and least square curve, just cast out when deviation is greater than preset value.Hot spot that is serious for distortion and that fall into groove can be given up thus improve measuring accuracy by the method, but must increase prescan flow process.
Publication date is provide one in United States Patent (USP) US6381004 patent on April 30th, 2002 according to position, current exposure field, judges the validity of each hot spot in spot array one by one, then selects effective hot spot to carry out the method measured.The method can solve the problem that fringing field is measured, but it is large to there is hot spot Effective judgement calculated amount, the defects such as hot spot selection and handoff procedure complexity.
Summary of the invention
In order to overcome the defect existed in prior art, the invention provides based on a kind of hot spot location mode of image acquisition with based on collection image characteristics extraction and localization method.
In order to realize foregoing invention object, the present invention discloses a kind of focusing and leveling measurement apparatus based on image procossing, comprising: a light source, for providing an illuminating bundle; One projecting cell, for being incident to an object under test surface at a certain angle by this illuminating bundle; One probe unit, for receiving the folded light beam through this object under test; One processing unit, calculates vertical position and the degree of tilt on this object under test surface for the information entrained by this folded light beam; Described light source is divided into multichannel incident light through the projection slit array of described projecting cell, it is characterized in that, described projection slit array forms so that different spacing is arranged in parallel.
Further, described projection slit array is formed so that different spacing is arranged in parallel by least three slits.This slit is the rectangular through-hole be positioned on opaque screen.The width of this slit is not identical.This probe unit is linear CCD, and the information entrained by this folded light beam is the light spot image that this linear CCD collects.After this processing unit eliminates the ground unrest of this CCD, characteristic boundary extraction and Facula Center Location are carried out to this light spot image.
The present invention discloses a kind of focusing leveling measuring method based on image procossing simultaneously, it is characterized in that, step one, makes it be divided into multichannel incident light through one by the slit array that different spacing is arranged in parallel one illuminating bundle; Step 2, detect by the light spot image of folded light beam of this multichannel incident light of an object under test reflection; Step 3, calculate vertical position and the degree of tilt on this object under test surface according to this light spot image.
Wherein, described step one comprises further: make it be divided into multichannel incident light through one by the slit array that at least three different spacing are arranged in parallel one illuminating bundle.Described step 3 comprises further: step 3.1, eliminate the ground unrest of the CCD in this light spot image; Step 3.2, characteristic boundary extraction and Facula Center Location are carried out to the light spot image of this elimination ground unrest.The method of carrying out characteristic boundary extraction in this step 3.2 is: adopt the level and smooth short-term fluctuation of moving average collimation method, the profile of outstanding hot spot.In this step 3.2, Facula Center Location comprises acquisition coarse positioning further and carry out several times fine positioning near the coarse positioning obtained; Step 3.3, calculate vertical position and the degree of tilt on described object under test surface according to described light spot image.This coarse positioning step comprises: (a), find the local maximum being no less than hot spot number in this light spot image; B (), the average calculating background gray scale and variance, calculate this light spot image of difference and this background gray threshold; C (), the characteristic according to this background gray threshold and this light spot image with rising edge and negative edge exclude the local maximum of the condition of not conforming to; (d), judge according to the width of each hot spot and spot separation the hot spot numbering that remaining local maximum is corresponding; This fine positioning step comprises: (e), use threshold method carry out fine positioning; (f), multiple fine positioning result is averaged; (g), hot spot image quality is given a mark; (h), calculating facular height.
Compared with prior art, the present invention does not use prescan flow process, adjustable by using projection slit to realize spot separation, by carrying out feature extraction to light spot image, spot center is determined in coarse positioning and multiple fine location, hot spot image quality is carried out to the image processing flow such as marking, can judge the validity of hot spot in conjunction with spot separation difference fast, hot spot that is serious for distortion and that fall into groove is given up, and improves computational accuracy.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is the structural representation of focusing and leveling system involved in the present invention;
Fig. 2 is the oblique incidence measuring system light path schematic diagram of focusing and leveling system involved in the present invention;
Fig. 3 is the projection slit schematic diagram of focusing and leveling system involved in the present invention;
Fig. 4 is the silicon chip surface hot spot imaging schematic diagram of focusing and leveling system involved in the present invention;
Fig. 5 is the light spot image that the CCD of focusing and leveling system involved in the present invention receives;
Fig. 6 is the light spot image processing flow chart of focusing and leveling system involved in the present invention;
Fig. 7 is the light spot image after Moving Average smoothing processing;
Fig. 8 is that light spot image is located and marking result schematic diagram under normal circumstances;
Fig. 9 is ditch slotted vane light spot image location and marking result schematic diagram;
Figure 10 is the distribution schematic diagram of five main spot used in the present invention.
Embodiment
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
Fig. 1 is the structural representation of the focusing leveling device involved by this patent.This focusing leveling device mainly comprises following cell mesh: mask 1, projection objective 2, work stage 3, silicon chip 4, light source 5, projecting cell 6, probe unit 7, signal processing unit 8, driver 9 and master controller 10.Projection objective 2 realizes the upper surface pattern of mask 1 being projected to the silicon chip 4 in work stage 3, the light that light source 5 sends incides on silicon chip 4 through projecting cell 6, after the reflection of silicon chip upper surface, be detected unit 7 to receive, by signal processing unit 8, opto-electronic conversion is carried out to the light signal received, after the links such as signal transacting, obtain silicon chip 4 upper surface in the vertical position of current measured zone and inclination, and send this information to master controller 10, primary controller 10 control and drive system 9 adjusts vertical position and the inclination of work stage 3, realize the controlling and adjustment of position of silicon wafer, silicon chip is made to be within the scope of the focal plane of projection objective 2, expose.
A focusing and leveling system can comprise multichannel oblique incidence measuring system.As Tu2Wei mono-tunnel oblique incidence measuring system light path schematic diagram.Wherein IL is incident light, and incident light is divided into multichannel incident light by projection slit 21, and multichannel incident light incides silicon chip 4 surface by projecting light path's system 23, and through silicon chip reflection, reflected light arrives image capturing system 22 by receiving light path system 24.Wherein projection slit 21 as shown in Figure 3, it has the gap that three arranged in parallel, be the rectangular opening that opaque screen opens.Parallel light beam becomes the rectangular light spot of standard after this projection slit.The shape in gap in projection slit, number, size and spacing are variable, and the present invention uses the projection slit of three rectangles, and three slit sizes are identical, and spacing is different.Such design is adopted to be to three hot spot differences be come.Image capturing system 22 can adopt linear CCD or area array CCD.
The sub-hot spot of three road rectangles through projection slit is imaged onto silicon chip surface by projecting light path's system 23, as shown in Figure 4, p1, p2 and p3 are that the sub-hot spot of three road rectangles is in silicon chip surface imaging, three sub-spot sizes are identical, and the spacing of hot spot P2 and P3 is greater than the spacing of hot spot P1 and P2.Receiving light path system 24 receives the light of silicon chip surface reflection, and Bing Jiang tri-road spot projection is to image capturing system 22, and the present invention adopts linear CCD to gather light spot image.Fig. 5 is the light spot image that linear CCD collects, and p1, p2, p3 represent three rectangular light spots, and Fig 5A represents light spot image under normal circumstances, Fig 5B represent hot spot fall into silicon chip groove cause beam spot deformation after image.
The technical program comprises the following steps the light spot image disposal route that CCD gathers: (a) eliminates the CCD ground unrest in light spot image; B () carries out feature extraction to light spot image, the burr reduced in image gives prominence to light spot shape; C () finds the local maximum being no less than hot spot number in image; D () calculates average and the variance of background gray scale, calculate the gray threshold of difference hot spot and background; E () excludes the local maximum of the condition of not conforming to according to the characteristic that gray threshold and light spot image have rising edge and a negative edge; F () judges according to the width of each hot spot and spot separation the hot spot numbering that in (e), remaining local maximum is corresponding; G () carries out multiple fine location near the coarse position of hot spot; H () is averaged multiple fine positioning result; I () is given a mark to hot spot image quality; J () calculates facular height.
This image processing method achieves the quick and precisely location of spot center by coarse positioning and fine positioning two-step approach; By giving a mark to hot spot image quality hot spot that is serious for distortion and that fall into groove being given up, judging hot spot validity fast according to spot separation difference.This image processing algorithm has good Technological adaptability.
In order to calculate the height of hot spot, the light spot image to CCD collects is needed to carry out characteristic boundary extraction and Facula Center Location.The light spot image process flow that this patent gathers CCD as shown in Figure 6.S1 eliminates CCD ground unrest.There is ground unrest when normal work obtains input signal in CCD, therefore the measured value of CCD is the sum total of actual value and ground unrest, to obtain actual value, then needs the ground unrest eliminating CCD.It is before the start of the measurement that the ground unrest of CCD calculates, and closes light source, obtain CCD background gray levels, CCD background gray levels is kept in internal memory as CCD noise floor value through running mean process.S2 carries out feature extraction to light spot image, and the burr reduced in image gives prominence to beam pattern.The level and smooth short-term fluctuation of Method of Moving Average Line can be adopted, the profile of outstanding hot spot.Formula 1-1 is the formula of moving average, and M is current hot spot data number, and n is windows radius:
formula 1-1
Fig. 7 is the light spot image after using Moving Average level and smooth, and can find out that the burr in image is smoothed out, the profile of light spot image becomes outstanding.
S3-S6 is the coarse positioning process of hot spot.S3 finds the local maximum being no less than hot spot number in image.Finding local maximum is that the position determining local maximum is just equivalent to the thick center that have found hot spot because the position of hot spot data local maximum is near spot center position.S4 calculates average and the variance of background gray scale, calculates the gray threshold of difference hot spot and background.Use the intensity value ranges of statistics of histogram glossing up background data, calculate mean value average and the variance sigma of background gray levels, experimentally add up, using average+4*sigma value as the gray threshold distinguishing hot spot and background.S5 excludes the local maximum of the condition of not conforming to according to the characteristic that gray threshold and light spot image have rising edge and a negative edge.S6 judges according to the width of each hot spot and spot separation the hot spot numbering that remaining local maximum is corresponding.Three spot width of the present embodiment are identical, and spacing is different, therefore can judge that hot spot is numbered according to spot separation and width.Mainly be divided into three kinds of situations: local maximum number is more than or equal to three, now choose three local maximums that gray-scale value is maximum, judge hot spot numbering according to spot separation.Local maximum number is two, judges hot spot numbering according to the spacing of two hot spots.Local maximum is 1, first according to gray threshold, light spot image data is carried out binaryzation and calculates spot width, if width meets three spot width, according to the position judgment hot spot numbering of this hot spot within the scope of spot width; If width meets two spot width, the position judgment hot spot numbering in width range according to spot width and hot spot.If only have a spot width, judge the distance on this hot spot and CCD two borders, if be judged to P3 close to the left side, otherwise be judged to P1.
After determining hot spot numbering, the coarse positioning process of hot spot terminates, and uses threshold method to carry out fine positioning to hot spot.S7 carries out multiple fine location near the coarse position of hot spot.Because the phenomenons such as silicon chip surface reflectivity is inconsistent, and light spot image data can produce saltus step, and hot spot is asymmetric, cause spot center to be difficult to determine.Different threshold values is used to carry out to hot spot the precision that spot location can be improved in multiple fine location.S8 adds up the result of multiple fine location, removes the result differed greatly, and is averaged obtains hot spot fine positioning position to residue fine positioning result.If multiple fine positioning result difference is all larger, illustrates that this beam spot deformation is serious, cannot fine positioning be carried out.
The image quality of S9 to hot spot is given a mark.Because silicon chip surface reflectivity is inconsistent, have groove in silicon chip, hot spot falls into the reasons such as silicon chip outside, and hot spot can produce distortion and even be buried in oblivion.By giving a mark to the image quality of hot spot, can judge whether certain hot spot exists and be out of shape the whether information such as serious.Marking is the acuity according to light spot image, symmetry, spot intensity and whether carried out that the many factors such as fine positioning comprehensively carry out judging.Fig. 8 is the marking result of one group of hot spot data.Experimentally add up, when the marking value of hot spot is 0, can determine that this hot spot falls into groove or falls into silicon chip outside, now hot spot is invalid.When hot spot marking value is less than threshold value, such as 0.5 time, this beam spot deformation is serious, can not participate in high computational.Fig. 8 and Fig. 9 is spot location and marking fructufy illustration, and wherein red line (R) is fine positioning result, and blue line (B) is coarse positioning result.
S10 calculates facular height, determines its weight in high computational, can improve the precision of high computational like this according to the marking result of each hot spot.The larger explanation optical quality of score value is better, and the position of spot location is more accurate, and the weight therefore in high computational is larger.
The present embodiment adopts five tunnel oblique incidence measuring systems, and three sub-hot spots on every road form a main spot.Main spot distribution schematic diagram as shown in Figure 10.Three sub-hot spots on every road are used for calculating the height value of main spot to best focal plane, and five main spot are used for focusing and leveling.
Be averaged according to the height of three sub-hot spots and the height of weight to three sub-hot spots of height, the height of main spot to best focal plane can be calculated.Calculate the height of five main spot respectively, five main spot can be obtained by measurement at the coordinate position of work stage.Position coordinates according to five main spot and the height value to best focal plane use least square fitting to go out a plane, and the height of this plane and tilt quantity have illustrated silicon chip current relative to the height of best zero plane and inclination.This height and tilting value are passed to primary controller 10 by focusing and leveling measuring system, and primary controller 10 controls height and the inclination that work stage driver 9 adjusts work stage, make the silicon chip in work stage be in the best focal plane of projection objective 2, achieve the object of focusing and leveling.
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (12)
1., based on a focusing and leveling measurement apparatus for image procossing, comprising:
One light source, for providing an illuminating bundle;
One projecting cell, for being incident to an object under test surface at a certain angle by described illuminating bundle;
One probe unit, for receiving the folded light beam through described object under test;
One processing unit, calculates vertical position and the degree of tilt on described object under test surface for the information entrained by described folded light beam;
Described light source is divided into multichannel incident light through the projection slit array of described projecting cell, it is characterized in that, described projection slit array forms so that different spacing is arranged in parallel.
2., as claimed in claim 1 based on the focusing and leveling measurement apparatus of image procossing, it is characterized in that, described projection slit array is formed so that different spacing is arranged in parallel by least three slits.
3., as claimed in claim 1 based on the focusing and leveling measurement apparatus of image procossing, it is characterized in that, described slit is the rectangular through-hole be positioned on opaque screen.
4., as claimed in claim 1 based on the focusing and leveling measurement apparatus of image procossing, it is characterized in that, the width of described slit is not identical.
5., as claimed in claim 1 based on the focusing and leveling measurement apparatus of image procossing, it is characterized in that, described probe unit is linear CCD, and the information entrained by described folded light beam is the light spot image that described linear CCD collects.
6., as claimed in claim 1 based on the focusing and leveling measurement apparatus of image procossing, it is characterized in that, after described processing unit eliminates the ground unrest of described CCD, characteristic boundary extraction and Facula Center Location are carried out to described light spot image.
7. based on a focusing leveling measuring method for image procossing, it is characterized in that, step one, make it be divided into multichannel incident light through one by the slit array that different spacing is arranged in parallel one illuminating bundle; Step 2, detect by the light spot image of folded light beam of the described multichannel incident light of an object under test reflection; Step 3, calculate vertical position and the degree of tilt on described object under test surface according to described light spot image.
8. as claimed in claim 7 based on the focusing leveling measuring method of image procossing, it is characterized in that, described step one comprises further: make it be divided into multichannel incident light through one by the slit array that at least three different spacing are arranged in parallel one illuminating bundle.
9. as claimed in claim 7 based on the focusing leveling measuring method of image procossing, it is characterized in that, described step 3 comprises further: step 3.1, eliminate the ground unrest of the CCD in described light spot image;
Step 3.2, characteristic boundary extraction and Facula Center Location are carried out to the light spot image of described elimination ground unrest;
Step 3.3, calculate vertical position and the degree of tilt on described object under test surface according to described light spot image.
10. as claimed in claim 7 based on the focusing leveling measuring method of image procossing, it is characterized in that, the method for carrying out characteristic boundary extraction in described step 3.2 is: adopt the level and smooth short-term fluctuation of moving average collimation method, the profile of outstanding hot spot.
11., as claimed in claim 7 based on the focusing leveling measuring method of image procossing, is characterized in that, in described step 3.2, Facula Center Location comprises acquisition coarse positioning further and carry out several times fine positioning near the coarse positioning obtained.
12. as claimed in claim 11 based on the focusing leveling measuring method of image procossing, and it is characterized in that, described coarse positioning step comprises:
(a), find the local maximum being no less than hot spot number in described light spot image;
B (), the average calculating background gray scale and variance, calculate the described light spot image of difference and described background gray threshold;
C (), the characteristic according to described background gray threshold and described light spot image with rising edge and negative edge exclude the local maximum of the condition of not conforming to;
(d), judge according to the width of each hot spot and spot separation the hot spot numbering that remaining local maximum is corresponding;
Described fine positioning step comprises:
E (), use threshold method carry out fine positioning;
(f), multiple fine positioning result is averaged;
(g), hot spot image quality is given a mark;
(h), calculating facular height.
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| CN105628204A (en) * | 2016-03-02 | 2016-06-01 | 安徽农业大学 | Self-adjusting hyperspectral imaging system and imaging method |
| CN106919005A (en) * | 2015-12-25 | 2017-07-04 | 佳能株式会社 | The method of testing equipment, exposure sources and manufacturing equipment |
| CN106933044A (en) * | 2015-12-30 | 2017-07-07 | 上海微电子装备有限公司 | The defocus slope compensating device and method of focusing and leveling |
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| CN112698380A (en) * | 2020-12-16 | 2021-04-23 | 南京大学 | Beam section processing method suitable for low-energy proton beam under strong background noise |
| CN114697535A (en) * | 2020-12-31 | 2022-07-01 | 上海微电子装备（集团）股份有限公司 | Multi-path synchronous focusing and leveling system and method for photoetching machine |
| CN113764298A (en) * | 2021-05-31 | 2021-12-07 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
| CN113764298B (en) * | 2021-05-31 | 2023-11-17 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
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