CN104635428B - A kind of focusing and leveling measurement apparatus and method based on image procossing - Google Patents
A kind of focusing and leveling measurement apparatus and method based on image procossing Download PDFInfo
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- CN104635428B CN104635428B CN201310563436.7A CN201310563436A CN104635428B CN 104635428 B CN104635428 B CN 104635428B CN 201310563436 A CN201310563436 A CN 201310563436A CN 104635428 B CN104635428 B CN 104635428B
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Abstract
The present invention discloses a kind of focusing and leveling measurement apparatus based on image procossing, including：One light source, for providing an illuminating bundle；One projecting cell, for the illuminating bundle to be incident into an object under test surface at a certain angle；One probe unit, for receiving through the reflected beams of the object under test；One processing unit, vertical position and the gradient on the object under test surface are calculated for the information according to entrained by the reflected beams；The light source is divided into multichannel incident light by the projection slit array of the projecting cell, it is characterised in that the projection slit array is formed so that different spacing are arranged in parallel.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, more particularly to it is a kind of for lithographic equipment based on image
The focusing and leveling measurement apparatus and method for the treatment of.
Background technology
Projection mask aligner（Or lithographic equipment）It is to be used to for the pattern on mask to project to silicon chip table by projection objective
The device in face.In apparatus for projection exposure, it is necessary to have automatic focusing levelling control system that the surface of silicon chip is set accurately to
The exposure position specified.Realize that automatic focusing leveling control function there are various different technical schemes, current the more commonly used right and wrong
Contact photoelectric e measurement technology.
In contactless focusing and leveling detection device, the optical signal that silicon chip face reflects is entered using scanning reflection mirror
Row modulation, then again by demodulating the electric signal produced by detector, can reach the purpose of accurate measurement position of silicon wafer.But
As die size increases the increase with exposure area, in order to improve certainty of measurement, it is necessary in the multiple surveys of larger area distribution
Amount point, and the detecting strategy for being based on scanning reflection mirror is only applicable in smaller area distribution measuring point.
In based on CCD photodetection schemes, different hot spots have different correspondences on CCD between position and facular height
Relation, therefore position of each hot spot on CCD can be calculated according to projected image of the hot spot on CCD, so that it is determined that going out
Facular height.Because silicon chip surface reflectivity is inconsistent and technique sex differernce of silicon chip, such as the groove in silicon chip, hot spot exists
Imaging on CCD can produce distortion, or even completely annihilated.Also occur that part is surveyed when exposure area is in the edge of silicon chip
Amount hot spot falls outside silicon chip and causes the invalid situation of hot spot.
Publication date is right to provide a kind of prescan scheme in the United States Patent (USP) US5920398 patents of on July 6th, 1999
Each measurement hot spot is fitted a curve, and with the true face type of least square fitting curve simulation silicon chip, calculates actual survey
Deviation between value and least square curve, just casts out when deviation is more than preset value.The method can distortion it is serious with
And fall into the hot spot of groove and give up so as to improve certainty of measurement, but have to increase prescan flow.
Publication date is a kind of according to current exposure to be provided in the United States Patent (USP) US6381004 patents of on April 30th, 2002
Field position, judges the validity of each hot spot in spot array, the method for then selecting effective hot spot to measure one by one.Should
Method can solve the problems, such as edge field measurement, but have that hot spot Effective judgement is computationally intensive, and hot spot is selected and switched
The defects such as journey complexity.
The content of the invention
In order to overcome defect present in prior art, the present invention to provide a kind of hot spot location mode based on IMAQ
With based on collection image characteristics extraction and localization method.
In order to realize foregoing invention purpose, the present invention discloses a kind of focusing and leveling measurement apparatus based on image procossing, wraps
Include：One light source, for providing an illuminating bundle；One projecting cell, treats for the illuminating bundle to be incident into one at a certain angle
Survey body surface；One probe unit, for receiving through the reflected beams of the object under test；One processing unit, for anti-according to this
Information entrained by irradiating light beam calculates vertical position and the gradient on the object under test surface；The light source is single by the projection
The projection slit array of unit is divided into multichannel incident light, it is characterised in that the projection slit array is with different spacing parallels
Row are formed.
Further, the projection slit array is formed by least three slits so that different spacing are arranged in parallel.This is narrow
Seam is the rectangular through-hole on opaque screen.The width of the slit is differed.The probe unit is linear CCD, the reflected light
Information entrained by beam is the light spot image that the linear CCD is collected.It is right after the processing unit eliminates the ambient noise of the CCD
The light spot image carries out characteristic boundary extraction and Facula Center Location.
Present invention simultaneously discloses a kind of focusing leveling measuring method based on image procossing, it is characterised in that step one, general
One illuminating bundle makes it be divided into multichannel incident light by one by different spacing slit array arranged in parallel；Step 2,
Detect the light spot image of the reflected beams of the multichannel incident light reflected by an object under test；Step 3, according to the light spot image
Calculate vertical position and the gradient on the object under test surface.
Wherein, the step one is further included：By an illuminating bundle by one by least three different spacing parallels
The slit array of row makes it be divided into multichannel incident light.The step 3 is further included：Step 3.1, eliminate the hot spot
The ambient noise of the CCD in image；Step 3.2, the light spot image to the elimination ambient noise carry out characteristic boundary extraction and light
Spot centralized positioning.The method that characteristic boundary extraction is carried out in the step 3.2 is：Short-term fluctuation is smoothed using rolling average collimation method,
The profile of prominent hot spot.Facula Center Location further includes to obtain coarse positioning and in the coarse positioning for obtaining in the step 3.2
Nearby carry out fine positioning several times；Step 3.3, the vertical position that the object under test surface is calculated according to the light spot image and
Gradient.The coarse positioning step includes：（a）, find the local maximum no less than hot spot number in the light spot image；（b）, meter
The average and variance of background gray scale are calculated, the difference light spot image and the background gray threshold is calculated；（c）, according to the background ash
There is the characteristic of rising edge and trailing edge to exclude the local maximum of the condition of not conforming to for degree threshold value and the light spot image；（d）, basis
The width and hot spot spacing of each hot spot judge the corresponding hot spot numbering of remaining local maximum；The fine positioning step includes：
（e）, using threshold method carry out fine positioning；（f）, multiple fine positioning result is averaged；（g）, to hot spot image quality give a mark；
（h）, calculate facular height.
Compared with prior art, the present invention does not use prescan flow, and hot spot spacing is realized by using projection slit
Adjustable, by carrying out feature extraction to light spot image, coarse positioning and multiple fine positioning determine spot center, to hot spot image quality
The image processing flow such as give a mark is carried out, the validity of hot spot can be quickly judged with reference to hot spot spacing difference, distortion is serious
And fall into the hot spot of groove and give up, and improve computational accuracy.
Brief description of the drawings
Can be obtained further by following detailed description of the invention and institute's accompanying drawings on the advantages and spirit of the present invention
Solution.
Fig. 1 is the structural representation of focusing and leveling system involved in the present invention；
Fig. 2 is the oblique incidence measuring system light path schematic diagram of focusing and leveling system involved in the present invention；
Fig. 3 is the projection slit schematic diagram of focusing and leveling system involved in the present invention；
Fig. 4 is the silicon chip surface hot spot imaging schematic diagram of focusing and leveling system involved in the present invention；
Fig. 5 is the light spot images that receive of CCD of focusing and leveling system involved in the present invention；
Fig. 6 is the light spot image process chart of focusing and leveling system involved in the present invention；
Fig. 7 is the light spot image after Moving Average smoothing processing；
Fig. 8 is that light spot image is positioned and marking result schematic diagram under normal circumstances；
Fig. 9 is ditch slotted vane light spot image positioning and marking result schematic diagram；
Figure 10 is the distribution schematic diagram of five main spots used in the present invention.
Specific embodiment
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
Fig. 1 is the structural representation of the focusing leveling device involved by this patent.The focusing leveling device mainly include with
Lower unit part：Mask 1, projection objective 2, work stage 3, silicon chip 4, light source 5, projecting cell 6, probe unit 7, signal transacting list
Unit 8, driver 9 and master controller 10.Projection objective 2 realizes projecting in the pattern of mask 1 silicon chip 4 in work stage 3
Upper surface, the light that light source 5 sends is incided on silicon chip 4 through projecting cell 6, from after the reflection of silicon chip upper surface, is detected unit 7
Receive, after 8 pairs of optical signals for receiving of signal processing unit carry out the links such as opto-electronic conversion, signal transacting, obtain silicon chip 4
Upper surface communicates this information to master controller 10 in the vertical position of current measured zone and inclination, and main controller 10 is controlled
The vertical position of the adjustment work stage 3 of driver 9 and inclination, realize the control and adjustment of position of silicon wafer, silicon chip is in projection thing
In the range of the focal plane of mirror 2, it is exposed.
One focusing and leveling system can include multichannel oblique incidence measuring system.If Fig. 2 is the measurement of oblique incidence all the way system
System light path schematic diagram.Wherein IL is incident light, and incident light is divided into multichannel incident light by projection slit 21, and multichannel incident light passes through
Projecting light path's system 23 incides the surface of silicon chip 4, is reflected through silicon chip, and reflected light reaches IMAQ by receiving light path system 24
System 22.Wherein projection slit 21 is open on as opaque screen as shown in figure 3, there is three gaps arranged in parallel thereon
Rectangular opening.Parallel light beam is by being changed into the rectangular light spot of standard after the projection slit.The shape in gap, individual in projection slit
Number, size and spacing are variable, and, using three projection slits of rectangle, three slit sizes are identical, and spacing is different for the present invention.
It is in order to three hot spots are distinguished using such design.Image capturing system 22 can be using linear CCD or face battle array
CCD。
Silicon chip surface is imaged onto by projecting light path's system 23 by three road rectangle sub-light spots of projection slit, such as Fig. 4 institutes
Show, p1, p2 and p3 be three road rectangle sub-light spots in silicon chip surface imaging, three sub- spot sizes are identical, hot spot P2 and P3
Spacing more than hot spot P1 and P2 spacing.Receiving light path system 24 receives the light of silicon chip surface reflection, and the road hot spots of Bing Jiang tri- are thrown
, to image capturing system 22, the present invention is using linear CCD collection light spot image for shadow.The hot spot figure that Fig. 5 is collected for linear CCD
Picture, p1, p2, p3 represents three rectangular light spots, and Fig 5A represent light spot image under normal circumstances, and Fig 5B represent that hot spot falls into
Silicon chip groove causes the image after beam spot deformation.
The technical program is comprised the following steps to the light spot image processing method that CCD is gathered：A () is eliminated in light spot image
CCD ambient noises；B () carries out feature extraction to light spot image, the burr reduced in image protrudes light spot shape；C () finds figure
No less than the local maximum of hot spot number as in；D () calculates the average and variance of background gray scale, calculate difference hot spot and the back of the body
The gray threshold of scape；E () according to gray threshold and light spot image there is rising edge and the characteristic of trailing edge to exclude the condition of not conforming to
Local maximum；F () judges according to the width and hot spot spacing of each hot spot（e）In the corresponding light of remaining local maximum
Spot is numbered；G () carries out multiple fine positioning near the coarse position of hot spot；H () is averaged to multiple fine positioning result；I () is to light
Spot image quality is given a mark；J () calculates facular height.
The image processing method realizes the quick and precisely positioning of spot center by coarse positioning and fine positioning two-step method；It is logical
The hot spot that is serious and falling into groove that will distort of giving a mark hot spot image quality is crossed to give up, it is different quick according to hot spot spacing
Judge hot spot validity.The image processing algorithm has good Technological adaptability.
In calculating the height of hot spot, it is necessary to the light spot image collected to CCD carries out characteristic boundary extraction and hot spot
The heart is positioned.The light spot image process flow that this patent is gathered to CCD is as shown in Figure 6.S1 eliminates CCD ambient noises. CCD
There is ambient noise when normal work obtains input signal, thus CCD measured value be actual value and ambient noise sum total,
To obtain actual value, then need to eliminate the ambient noise of CCD.It is before the start of the measurement, to close that the ambient noise of CCD is calculated
Light source, obtains CCD background gray levels, CCD background gray levels is processed and is stored in internal memory by moving average and is carried on the back as CCD
Scape noise figure.S2 carries out feature extraction to light spot image, and the burr reduced in image protrudes beam pattern.Can be using mobile flat
The equal smooth short-term fluctuation of line method, the profile of prominent hot spot.Formula 1-1 is the formula of rolling average, and M is that current hot spot data are compiled
Number, n is windows radius：
Formula 1-1
Fig. 7 is the light spot image after using Moving Average smooth, it can be seen that the burr in image is smoothed, hot spot
The profile of image becomes prominent.
S3-S6 is the coarse positioning process of hot spot.No less than the local maximum of hot spot number in S3 searching images.Searching office
Portion's maximum is because the position of hot spot data local maximum is near spot center position, it is determined that local maximum
Position is equivalent to have found the thick center of hot spot.S4 calculates the average and variance of background gray scale, calculates difference hot spot and the back of the body
The gray threshold of scape.Using the intensity value ranges of statistics of histogram glossing up background data, the flat of background gray levels is calculated
Average average and variance sigma, according to experiment statisticses, using average+4*sigma values as difference hot spot and the ash of background
Degree threshold value.S5 according to gray threshold and light spot image have the characteristic of rising edge and trailing edge exclude the condition of not conforming to it is local most
Big value.S6 judges the corresponding hot spot numbering of remaining local maximum according to the width and hot spot spacing of each hot spot.This implementation
Three spot widths of example are identical, and spacing is different, therefore may determine that glossing up is numbered according to hot spot spacing and width.Main point
It is three kinds of situations：Local maximum number is more than or equal to three, now chooses three maximum local maximums of gray value, according to
Hot spot spacing judges hot spot numbering.Local maximum number is two, and hot spot numbering is judged according to two spacing of hot spot.It is local
Maximum is 1, and light spot image data are carried out into binaryzation according to gray threshold first calculates spot width, if width meets three
Individual spot width, the position judgment hot spot numbering according to the hot spot in the range of spot width；If it is wide that width meets two hot spots
Degree, the position judgment hot spot numbering according to spot width and hot spot in width range.If only one of which spot width, judging should
Two distances on border of hot spot and CCD, if being judged to P3 close to the left side, are otherwise judged to P1.
The coarse positioning process that hot spot after hot spot is numbered is determined terminates, and fine positioning is carried out to hot spot using threshold method.S7
Multiple fine positioning is carried out near the coarse position of hot spot.Because silicon chip surface reflectivity is inconsistent, light spot image data can be produced
Saltus step, the phenomenon such as hot spot is asymmetric, causes spot center to be difficult to determine.Multiple fine positioning is carried out to hot spot using different threshold values
The precision of spot location can be improved.S8 counts the result of multiple fine positioning, the result that removal differs greatly, to remaining fine positioning
Result is averaged and obtains hot spot fine positioning position.If multiple fine positioning result difference all than larger, illustrates that the beam spot deformation is tight
Weight, it is impossible to carry out fine positioning.
S9 gives a mark to the image quality of hot spot.Because silicon chip surface reflectivity is inconsistent, there are groove, hot spot in silicon chip
The reasons such as silicon chip outside are fallen into, hot spot can be deformed or even be annihilated.Given a mark by the image quality to hot spot, can be with
Judge the information such as certain hot spot whether there is and whether deformation is serious.Marking is the acuity according to light spot image, right
Whether title property, spot intensity and carried out what many factors such as fine positioning were comprehensively judged.Fig. 8 is one group of hot spot data
Marking result.According to experiment statisticses, when the marking value of hot spot is 0, it may be determined that the hot spot falls into groove or falls into silicon chip
Outside, now hot spot is invalid.When hot spot marking value is less than threshold value, such as when 0.5, the beam spot deformation is serious, it is impossible to participate in height
Calculate.Fig. 8 and Fig. 9 is spot location and marking result instance graph, wherein red line（R）It is fine positioning result, blue line（B）Determine for thick
Position result.
S10 calculates facular height, and the marking result according to each hot spot determines its weight in high computational, so may be used
To improve the precision of high computational.Score value is bigger, and explanation optical quality is better, and the position of spot location is more accurate, therefore in height
Weight in calculating is bigger.
The present embodiment uses five tunnel oblique incidence measuring systems, and the sub- hot spot of three per road constitutes a main spot.Key light
Spot distribution schematic diagram is as shown in Figure 10.Three sub- hot spots per road are used for calculating main spot to the height value of optimal focal plane, five
Individual main spot is used for focusing and leveling.
The weight of height and height according to three sub- hot spots carries out averagely, to calculate to three height of sub- hot spot
Height of the main spot to optimal focal plane.Five height of main spot, coordinate of five main spots in work stage are calculated respectively
Position can be obtained by measurement.Position coordinates according to five main spots and the height value to optimal focal plane use a most young waiter in a wineshop or an inn
Multiplication fits a plane, and the height and tilt quantity of the plane have illustrated currently height of the silicon chip relative to optimal zero plane
And inclination.This is highly passed to main controller 10 by focusing and leveling measuring system with tilting value, and the control work stage of main controller 10 drives
The height of the adjustment work stage of device 9 and inclination, make the silicon chip in work stage be in the optimal focal plane of projection objective 2, realize tune
The purpose of burnt leveling.
Simply preferred embodiment of the invention described in this specification, above example is only used to illustrate the present invention
Technical scheme rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical scheme of experiment, all should be within the scope of the present invention.
Claims (12)
1. a kind of focusing and leveling measurement apparatus based on image procossing, including：
One light source, for providing an illuminating bundle；
One projecting cell, for the illuminating bundle to be incident into an object under test surface at a certain angle；
One probe unit, for receiving the reflected beams through the object under test；
One processing unit, the vertical position on the object under test surface is calculated for the information according to entrained by the reflected beams
And gradient；
The light source is divided into multichannel incident light by the projection slit array of the projecting cell, it is characterised in that the throwing
Shadow slit array is formed so that different spacing are arranged in parallel.
2. the focusing and leveling measurement apparatus of image procossing are based on as claimed in claim 1, it is characterised in that the projection slit
Array is formed by least three projection slits so that different spacing are arranged in parallel.
3. the focusing and leveling measurement apparatus of image procossing are based on as claimed in claim 2, it is characterised in that the projection slit
It is the rectangular through-hole on opaque screen.
4. the focusing and leveling measurement apparatus of image procossing are based on as claimed in claim 2, it is characterised in that the projection slit
Width differ.
5. the focusing and leveling measurement apparatus of image procossing are based on as claimed in claim 1, it is characterised in that the probe unit
It is linear CCD, the information entrained by the reflected beams is the light spot image that the linear CCD is collected.
6. the focusing and leveling measurement apparatus of image procossing are based on as claimed in claim 5, it is characterised in that the processing unit
After eliminating the ambient noise of the CCD, characteristic boundary extraction and Facula Center Location are carried out to the light spot image.
7. a kind of focusing leveling measuring method based on image procossing, it is characterised in that step one, by an illuminating bundle by one
It is set to be divided into multichannel incident light by different spacing slit array arranged in parallel；Step 2, detection are by an object under test
The light spot image of the reflected beams of the multichannel incident light of reflection；Step 3, according to the light spot image calculate it is described to be measured
The vertical position of body surface and gradient.
8. the focusing leveling measuring method of image procossing is based on as claimed in claim 7, it is characterised in that the step one is entered
One step includes：One illuminating bundle is made it by a slit array being made up of at least three different spacing slit arranged in parallel
It is divided into multichannel incident light.
9. the focusing leveling measuring method of image procossing is based on as claimed in claim 7, it is characterised in that the step 3 is entered
One step includes：The ambient noise of step 3.1, the CCD eliminated in the light spot image；
Step 3.2, the light spot image to the elimination ambient noise carry out characteristic boundary extraction and Facula Center Location；
Step 3.3, vertical position and gradient that the object under test surface is calculated according to the light spot image.
10. the focusing leveling measuring method of image procossing is based on as claimed in claim 9, it is characterised in that the step 3.2
In carry out the method for characteristic boundary extraction and be：Short-term fluctuation, the profile of prominent hot spot are smoothed using rolling average collimation method.
11. focusing leveling measuring methods based on image procossing as claimed in claim 9, it is characterised in that the step 3.2
Middle Facula Center Location is further included to obtain coarse positioning and carries out fine positioning several times near the coarse positioning for obtaining.
12. focusing leveling measuring methods based on image procossing as claimed in claim 11, it is characterised in that the coarse positioning
Step includes：
No less than the local maximum of hot spot number in (a), the searching light spot image；
B (), the average and variance that calculate background gray scale, calculate the gray threshold for distinguishing the light spot image and the background；
(c), there is rising edge and the characteristic of trailing edge to exclude not according to the gray threshold of the light spot image and the background
The local maximum of conjunction condition；
D (), the width according to each hot spot and hot spot spacing judge the corresponding hot spot numbering of remaining local maximum；
The fine positioning step includes：
(e), carry out fine positioning using threshold method；
(f), multiple fine positioning result is averaged；
(g), hot spot image quality is given a mark；
(h), calculate facular height.
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| JP6682263B2 (en) * | 2015-12-25 | 2020-04-15 | キヤノン株式会社 | Detecting apparatus, exposure apparatus, and article manufacturing method |
| CN106933044B (en) * | 2015-12-30 | 2019-03-12 | 上海微电子装备（集团）股份有限公司 | The defocus slope compensating device and method of focusing and leveling |
| CN105628204B (en) * | 2016-03-02 | 2017-09-15 | 安徽农业大学 | A kind of Hyperspectral imager and imaging method automatically adjusted |
| JP6415479B2 (en) * | 2016-06-01 | 2018-10-31 | キヤノン株式会社 | Exposure apparatus, exposure method, and semiconductor package manufacturing method |
| CN107121159A (en) * | 2016-12-23 | 2017-09-01 | 哈尔滨医科大学附属第二医院 | A kind of automatic light path calibration method recognized based on based endoscopic imaging and system |
| CN109164123A (en) * | 2017-06-29 | 2019-01-08 | 宝山钢铁股份有限公司 | The sample previewing method and device of X fluorescence spectrometer |
| CN108711134A (en) * | 2018-04-09 | 2018-10-26 | 湖北三江航天万峰科技发展有限公司 | A kind of high-frequency linear array ccd image processing |
| CN112698380A (en) * | 2020-12-16 | 2021-04-23 | 南京大学 | Beam section processing method suitable for low-energy proton beam under strong background noise |
| CN114697535B (en) * | 2020-12-31 | 2023-05-30 | 上海微电子装备（集团）股份有限公司 | Multi-channel synchronous focusing and leveling system and method for photoetching machine |
| CN113764298B (en) * | 2021-05-31 | 2023-11-17 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
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