CN104602435A - 射频功率发射装置的支撑装置 - Google Patents
射频功率发射装置的支撑装置 Download PDFInfo
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- CN104602435A CN104602435A CN201310533009.4A CN201310533009A CN104602435A CN 104602435 A CN104602435 A CN 104602435A CN 201310533009 A CN201310533009 A CN 201310533009A CN 104602435 A CN104602435 A CN 104602435A
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CN201310533009.4A CN104602435B (zh) | 2013-10-30 | 2013-10-30 | 射频功率发射装置的支撑装置 |
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CN201310533009.4A CN104602435B (zh) | 2013-10-30 | 2013-10-30 | 射频功率发射装置的支撑装置 |
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CN104602435A true CN104602435A (zh) | 2015-05-06 |
CN104602435B CN104602435B (zh) | 2017-02-15 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5685941A (en) * | 1994-06-02 | 1997-11-11 | Applied Materials, Inc. | Inductively coupled plasma reactor with top electrode for enhancing plasma ignition |
JP2010153274A (ja) * | 2008-12-26 | 2010-07-08 | Meiko:Kk | プラズマ処理装置 |
CN101877312A (zh) * | 2009-04-28 | 2010-11-03 | 东京毅力科创株式会社 | 等离子体处理装置 |
CN102054649A (zh) * | 2009-10-27 | 2011-05-11 | 东京毅力科创株式会社 | 等离子体处理装置以及等离子体处理方法 |
CN102136407A (zh) * | 2009-12-31 | 2011-07-27 | 丽佳达普株式会社 | 基板处理装置的导引架 |
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- 2013-10-30 CN CN201310533009.4A patent/CN104602435B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5685941A (en) * | 1994-06-02 | 1997-11-11 | Applied Materials, Inc. | Inductively coupled plasma reactor with top electrode for enhancing plasma ignition |
JP2010153274A (ja) * | 2008-12-26 | 2010-07-08 | Meiko:Kk | プラズマ処理装置 |
CN101877312A (zh) * | 2009-04-28 | 2010-11-03 | 东京毅力科创株式会社 | 等离子体处理装置 |
CN102054649A (zh) * | 2009-10-27 | 2011-05-11 | 东京毅力科创株式会社 | 等离子体处理装置以及等离子体处理方法 |
CN102136407A (zh) * | 2009-12-31 | 2011-07-27 | 丽佳达普株式会社 | 基板处理装置的导引架 |
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Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |
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Effective date of registration: 20210127 Address after: No.188, Taihua Road, Jinqiao Export Processing Zone (South District), Pudong New Area, Shanghai, 201206 Patentee after: China micro semiconductor equipment (Shanghai) Co.,Ltd. Patentee after: Nanchang Medium and Micro Semiconductor Equipment Co.,Ltd. Address before: 201201 Shanghai City Jingqiao export processing zone of Pudong New Area (South) Taihua Road No. 188 Patentee before: China micro semiconductor equipment (Shanghai) Co.,Ltd. |