CN104597300A - Manufacturing method of electric test board for electric performance test - Google Patents
Manufacturing method of electric test board for electric performance test Download PDFInfo
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- CN104597300A CN104597300A CN201410775612.8A CN201410775612A CN104597300A CN 104597300 A CN104597300 A CN 104597300A CN 201410775612 A CN201410775612 A CN 201410775612A CN 104597300 A CN104597300 A CN 104597300A
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- pcb board
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- performance test
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Abstract
The invention discloses a manufacturing method of an electric test board for an electric performance test. The manufacturing method includes the steps: 1 coating a PCB (printed circuit board) covered with a copper layer with photo-sensitive resist; 2 mounting a film board with a circuit on exposure equipment, and placing the PCB under the film board to realize exposure; 3 placing the PCB in low-concentration sodium hydroxide solution for corrosion; 4 placing the corroded PCB in high-temperature and high-concentration ferric trichloride solution for corrosion; 5 cleaning the PCB with pure water at the temperature of 40-50 DEG C; 6 placing the PCB in room-temperature high-concentration sodium hydroxide solution for corrosion; 7 cleaning the PCB. The manufacturing method can effectively solve the problem that an existing electric test board manufacturing method cannot rapidly or efficiently manufacture the electric test board, and the manufacturing method is simple and reliable and can be widely applied to the field of electric test board manufacture.
Description
Technical field
The present invention relates to a kind of method for making of the electrical measurement plate for electric performance test, particularly relate to a kind of method for making of the electrical measurement plate for LCD product electric performance test.
Background technology
Corresponding test will be done to its electrical property after product completes by the company of the liquid crystal display such as current production LCD, concrete grammar is connected with electric logging device by product, picture can be shown after product energising, people judge the performance of product by picture display situation, and normally whether response time, picture be complete and clear etc.All need to carry out electrical property detection to product to production run and the final all links of shipment from the development of new product, therefore need to make corresponding electrical measurement plate, by electrical measurement plate, product and electric logging device are linked together, reach the object of energising display.
And in existing electrical measurement plate manufacture craft, because the method adopted is perfect not, and electrical measurement plate can not rapidly and efficiently must be made.
Content of the present invention
The object of this invention is to provide a kind of method for making of the electrical measurement plate for electric performance test, the method for making solving existing electrical measurement plate can not quick, the efficient problem must producing electrical measurement plate.
The technical solution adopted for the present invention to solve the technical problems is: a kind of method for making of the electrical measurement plate for electric performance test, comprises the steps:
Step 1: the pcb board being coated with layers of copper is smeared one deck photoresists, thickness is 20 ~ 30um;
Step 2: will the film panel assembly of circuit be arranged on exposure sources, then the pcb board through step 1 is placed on immediately below film plate; Then open exposure machine, penetrate film plate with UV illumination, irradiation time is 80 ~ 90S, intensity of illumination 60 ~ 90 milliwatts/square centimeter, and once irradiating is shaping;
Step 3: the ratio pcb board after step 2 processes being placed on NaOH and water is corrode in the low-concentration sodium hydroxide solution of 10g:1000g, and corrosion duration is 50 ~ 60S, and the temperature of sodium hydroxide solution is 40 ~ 50 DEG C;
Step 4: the pcb board after step 3 processes is placed in the liquor ferri trichloridi of high temperature, high concentration and corrodes, in liquor ferri trichloridi, the ratio of ferric trichloride and water is 100g:200g, corrosion duration is 2 ~ 3min, and the temperature of liquor ferri trichloridi is 95 ~ 100 DEG C;
Step 5: the pcb board pure water after step 4 processes is cleaned up, pure water temperature is 40 ~ 50 DEG C;
Step 6: the pcb board after step 5 processes is placed in the high-concentration sodium hydroxide solution of normal temperature and corrodes, in high-concentration sodium hydroxide solution, the ratio of NaOH and water is 100g:1000g, and corrosion duration is 1 ~ 2min;
Step 7: the pcb board after step 6 processes is cleaned up.
In order to make exposure faster, save production time cost, in step 2, UV light vertical irradiation film plate.
In order to make pcb board carry out can step 6 with the temperature of 40 ~ 50 DEG C described in reaction, avoid because the temperature difference of uprushing, and cause splitting glue, the circuit copper cash on pcb board is caused to rupture, described step 5 also comprises the PCB cleaned up with pure water to be placed in drying plant dries, and bake out temperature is 40 ~ 50 DEG C.
Preferably, the photoresists described in step 1 are one-pack-type photoresists.
Preferably, described being cleaned up by pcb board after step 6 processes adopts Ultrasonic Cleaning or be placed in pure water to clean in step 7.
Beneficial effect of the present invention: UV light irradiation time is 80 ~ 90S, intensity of illumination 60 ~ 90 milliwatts/square centimeter, and exposure effect is good, can make photoresists fully expose; The ratio of NaOH and water is corrode in the low-concentration sodium hydroxide solution of 10g:1000g, and corrosion duration is 50 ~ 60S, makes modified photoresists can be sufficiently rinsed totally; Corrode in the liquor ferri trichloridi of high temperature, high concentration, in liquor ferri trichloridi, the ratio of ferric trichloride and water is 100g:200g, corrosion duration is 2 ~ 3min, the temperature of liquor ferri trichloridi is 95 ~ 100 DEG C, the photoresists because of sex change can be made to be washed off two exposed copper out fully corroded, high temperature can accelerated reaction, makes corrosion at short notice fully completely; Clean up with the pure water that temperature is 40 ~ 50 DEG C, to ensure in the high-concentration sodium hydroxide solution being placed into the normal temperature described in step 6 in corrosion process, there will not be the situation of temperature difference cataclysm, avoid excessive temperature differentials and the moment caused splits glue, two cause the copper cash on pcb board to rupture, and destroy the car load work of monoblock pcb board.In whole method, various reaction is all carried out in much the same temperature, and temperature of reaction does not exist the large difference variation of moment, there will not be because the large difference variation of moment, and produces harmful effect to pcb board, reduce the yield of product; The liquor ferri trichloridi of temperature, high concentration can make the time of washing copper process be greatly diminished simultaneously, completely anyway fully, improves the yield rate of product simultaneously.
The present invention effectively can solve the method for making of existing electrical measurement plate can not quick, the efficient problem must producing electrical measurement plate, and method is simple and reliable, can be widely used in the making field of electrical measurement plate.
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment
Embodiment, a kind of method for making of the electrical measurement plate for electric performance test, comprises the steps:
Step 1: the pcb board being coated with layers of copper is smeared one deck photoresists, thickness is 20 ~ 30um;
Step 2: will the film panel assembly of circuit be arranged on exposure sources, then the pcb board through step 1 is placed on immediately below film plate; Then open exposure machine, penetrate film plate with UV illumination, irradiation time is 80 ~ 90S, intensity of illumination 60 ~ 90 milliwatts/square centimeter, and once irradiating is shaping; UV light vertical irradiation film plate;
Step 3: the ratio pcb board after step 2 processes being placed on NaOH and water is corrode in the low-concentration sodium hydroxide solution of 10g:1000g, and corrosion duration is 50 ~ 60S, and the temperature of sodium hydroxide solution is 40 ~ 50 DEG C;
Step 4: the pcb board after step 3 processes is placed in the liquor ferri trichloridi of high temperature, high concentration and corrodes, in liquor ferri trichloridi, the ratio of ferric trichloride and water is 100g:200g, corrosion duration is 2 ~ 3min, and the temperature of liquor ferri trichloridi is 95 ~ 100 DEG C;
Step 5: the pcb board pure water after step 4 processes is cleaned up, pure water temperature is 40 ~ 50 DEG C;
Step 6: the pcb board after step 5 processes is placed in the high-concentration sodium hydroxide solution of normal temperature and corrodes, in high-concentration sodium hydroxide solution, the ratio of NaOH and water is 100g:1000g, and corrosion duration is 1 ~ 2min;
Step 7: the pcb board after step 6 processes is cleaned up.
Described step 5 also comprises the PCB cleaned up with pure water to be placed in drying plant dries, and bake out temperature is 40 ~ 50 DEG C.
Photoresists described in step 1 are one-pack-type photoresists.
Described being cleaned up by pcb board after step 6 processes adopts Ultrasonic Cleaning or be placed in pure water to clean in step 7.
Claims (5)
1., for a method for making for the electrical measurement plate of electric performance test, it is characterized in that: comprise the steps:
Step 1: the pcb board being coated with layers of copper is smeared one deck photoresists, thickness is 20 ~ 30um;
Step 2: will the film panel assembly of circuit be arranged on exposure sources, then the pcb board through step 1 is placed on immediately below film plate; Then open exposure machine, penetrate film plate with UV illumination, irradiation time is 80 ~ 90S, intensity of illumination 60 ~ 90 milliwatts/square centimeter, and once irradiating is shaping;
Step 3: the ratio pcb board after step 2 processes being placed on NaOH and water is corrode in the low-concentration sodium hydroxide solution of 10g:1000g, and corrosion duration is 50 ~ 60S, and the temperature of sodium hydroxide solution is 40 ~ 50 DEG C;
Step 4: the pcb board after step 3 processes is placed in the liquor ferri trichloridi of high temperature, high concentration and corrodes, in liquor ferri trichloridi, the ratio of ferric trichloride and water is 100g:200g, corrosion duration is 2 ~ 3min, and the temperature of liquor ferri trichloridi is 95 ~ 100 DEG C;
Step 5: the pcb board pure water after step 4 processes is cleaned up, pure water temperature is 40 ~ 50 DEG C;
Step 6: the pcb board after step 5 processes is placed in the high-concentration sodium hydroxide solution of normal temperature and corrodes, in high-concentration sodium hydroxide solution, the ratio of NaOH and water is 100g:1000g, and corrosion duration is 1 ~ 2min;
Step 7: the pcb board after step 6 processes is cleaned up.
2. the method for making of the electrical measurement plate for electric performance test according to claim 1, is characterized in that: in step 2, UV light vertical irradiation film plate.
3. the method for making of the electrical measurement plate for electric performance test according to claim 1, is characterized in that: described step 5 also comprises the PCB cleaned up with pure water to be placed in drying plant dries, and bake out temperature is 40 ~ 50 DEG C.
4. the method for making of the electrical measurement plate for electric performance test according to claim 1, is characterized in that: the photoresists described in step 1 are one-pack-type photoresists.
5. the method for making of the electrical measurement plate of the LCD product electric performance test according to Claims 1-4 any one, is characterized in that: described being cleaned up by pcb board after step 6 processes adopts Ultrasonic Cleaning or be placed in pure water to clean in step 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775612.8A CN104597300B (en) | 2014-12-15 | 2014-12-15 | A kind of production method of electrical measurement plate for electric performance test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775612.8A CN104597300B (en) | 2014-12-15 | 2014-12-15 | A kind of production method of electrical measurement plate for electric performance test |
Publications (2)
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| CN104597300A true CN104597300A (en) | 2015-05-06 |
| CN104597300B CN104597300B (en) | 2018-11-09 |
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| CN201410775612.8A Active CN104597300B (en) | 2014-12-15 | 2014-12-15 | A kind of production method of electrical measurement plate for electric performance test |
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| CN101271275A (en) * | 2008-04-28 | 2008-09-24 | 彩虹集团电子股份有限公司 | Horn net manufacturing technique by etching method |
| CN101374386A (en) * | 2007-08-24 | 2009-02-25 | 富葵精密组件(深圳)有限公司 | Method for preparing printed circuit board |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| KR20110034177A (en) * | 2009-09-28 | 2011-04-05 | 티에스씨멤시스(주) | Probe unit and method of manufacturing the same |
| CN103249253A (en) * | 2013-05-17 | 2013-08-14 | 梅州华盛电路板有限公司 | High precision aluminium base material circuit board manufacturing process and system |
| CN103889157A (en) * | 2014-02-13 | 2014-06-25 | 九江华祥科技股份有限公司 | Method for making thick copper printed circuit board |
| CN104023480A (en) * | 2014-06-13 | 2014-09-03 | 金悦通电子（翁源）有限公司 | Processing method for shortening PCB plating process |
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2014
- 2014-12-15 CN CN201410775612.8A patent/CN104597300B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374386A (en) * | 2007-08-24 | 2009-02-25 | 富葵精密组件(深圳)有限公司 | Method for preparing printed circuit board |
| CN101271275A (en) * | 2008-04-28 | 2008-09-24 | 彩虹集团电子股份有限公司 | Horn net manufacturing technique by etching method |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| KR20110034177A (en) * | 2009-09-28 | 2011-04-05 | 티에스씨멤시스(주) | Probe unit and method of manufacturing the same |
| CN103249253A (en) * | 2013-05-17 | 2013-08-14 | 梅州华盛电路板有限公司 | High precision aluminium base material circuit board manufacturing process and system |
| CN103889157A (en) * | 2014-02-13 | 2014-06-25 | 九江华祥科技股份有限公司 | Method for making thick copper printed circuit board |
| CN104023480A (en) * | 2014-06-13 | 2014-09-03 | 金悦通电子（翁源）有限公司 | Processing method for shortening PCB plating process |
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| CN104597300B (en) | 2018-11-09 |
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Effective date of registration: 20211223 Address after: 245000 hi tech electronic information Pioneer Park, Xintang Road, Xiuning Economic Development Zone, Huangshan City, Anhui Province Patentee after: Xiuning Qiyun Urban Construction Investment Co.,Ltd. Address before: 245000 Yaoshun Industrial Park, economic development zone, Xiuning County, Huangshan City, Anhui Province Patentee before: HUANGSHAN ZHONGXIAN MICRO-ELECTRONICS CO.,LTD. |