CN104584713A - Substrate inspecting method and substrate inspecting system using same - Google Patents
Substrate inspecting method and substrate inspecting system using same Download PDFInfo
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- CN104584713A CN104584713A CN201480001348.0A CN201480001348A CN104584713A CN 104584713 A CN104584713 A CN 104584713A CN 201480001348 A CN201480001348 A CN 201480001348A CN 104584713 A CN104584713 A CN 104584713A
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- substrate
- warpage
- described substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/167—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by projecting a pattern on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
To inspect a substrate, the substrate, before a component is provided on a mounter, is first transferred to a work stage. Then, the warpage of the substrate is inspected. Next, the substrate is transferred to the mounter if it is determined that the substrate is good according to the inspection result, and the substrate is confirmed as being defective without transferring the substrate to the mounter if it is determined that the substrate is defective according to the inspection result. Accordingly, unnecessary work can be prevented, and the productivity of a product and inspection efficiency can be increased.
Description
Technical field
The present invention relates to substrate inspecting method and utilize the base plate inspection system of the method, relate more particularly to a kind ofly improve the substrate inspecting method of production rate and checking efficiency and utilize the base plate inspection system of the method.
Background technology
Usually, a printed circuit board (PCB) (printed circuit board is at least had in electronic installation; PCB), this printed circuit board (PCB) is provided with circuit pattern, connection gasket (pad) portion, carries out the multiple circuit elements such as the driving chip be electrically connected with described connection gasket portion.
This described printed circuit board (PCB), in the backing plate region of naked (Bare) substrate, after coating lead, manufactures in the mode terminal of electronic unit being combined in plumbous coating zone.In the past, before electronic unit is arranged on printed circuit board (PCB), perform soldering paste inspection (solder paste inspection, SPI) operation, check plumbous whether being correctly coated on the backing plate region of printed circuit board (PCB), after electronic unit is arranged on printed circuit board (PCB), perform automatic visual inspection (automated optical inspection, AOI) operation, checks whether be correctly arranged on the polytype defective of printed circuit board (PCB) for described electronic unit.
But, described printed circuit board (PCB) is only to detect occur before welding (soldering) defective by the inspection of operation described above, and thisly defectively not only cause when mounting electronic parts that the underproof possibility such as to misplug or do not insert very high, and on former underproof naked substrate mounting electronic parts, cause and produce substandard product in a large number, and perform unnecessary operation, make likely to reduce the productivity ratio of product and the efficiency of inspection.
Summary of the invention
Thus problem to be solved by this invention is that providing a kind of improves the productivity ratio of product and the substrate inspecting method of checking efficiency.
Another problem to be solved of the present invention is that providing a kind of improves the productivity of product and the base plate inspection system of checking efficiency.
According to the substrate inspecting method of an exemplary embodiment of the present invention, it is characterized in that, comprising: also will not be transported to the step of workbench (work stage) with the substrate of fitting machine (mounter) installing component; Check the step of the warpage (warpage) of described substrate; Described check result is as qualified in substrate as described in being judged as, then described substrate is transported to the step of described fitting machine; And described check result is as defective in substrate as described in being judged as, then described substrate is not transported to described fitting machine, but is defined as underproof step.
As an embodiment, check that the step of the warpage of described substrate can comprise: the step judging whether described substrate exists warpage; As described in substrate there is not warpage, then described substrate is judged as qualified step; As described in substrate there is warpage, then detect the step of the warpage degree of described substrate; As described in the warpage degree of substrate be in allowed band, then described substrate is judged as qualified step; And as described in the warpage degree of substrate exceed allowed band, then described substrate is judged as underproof step.Now, as described in substrate there is warpage time, before carrying out detecting the step of described substrate warp degree, described substrate inspecting method also can comprise the step of the warpage showing described substrate with 3-dimensional image.
As an embodiment, described substrate inspecting method also can comprise as described in check result be judged as described in substrate qualified, then the warp information of described substrate is sent to the step of described fitting machine.Such as, described warp information can comprise at least one in warpage coordinate information, warped shapes information, each region warp information, warpage degree information.
In the case, described substrate inspecting method also can comprise: receive the step according to the feedback of the corresponding object information of described warp information from described fitting machine; And the step performed the statistical analysis of described corresponding object information and the derivation of supplementary corresponding scheme.
As an embodiment, described substrate inspecting method also comprises: if the subregion of described substrate exists warpage, but all the other regions do not exist warpage or warpage when being in good in described allowed band, then described substrate is judged as the step that part is qualified; And if described check result is judged as that described substrate portion is qualified, then described substrate is transported to the step of described fitting machine.And, if described substrate inspecting method also can comprise described check result be judged as that described substrate portion is qualified, then the warp information of described substrate is sent to the step of described fitting machine, such as, described warp information can comprise the assembling in each region or unassembled order.
As an embodiment, described substrate inspecting method, before the step of warpage checking described substrate, also can comprise the step obtaining described substrate height information, check the step of the warpage of described substrate, then perform based on described obtained substrate height information.Such as, the step obtaining described substrate height information can comprise: the step of irradiating grating pattern light to described substrate; Obtain the step being formed the pattern image of the described grating pattern light of reflection by described substrate; And utilize described obtained pattern image, calculate the step of described substrate height information.
As an embodiment, described substrate inspecting method, before the step of warpage checking described substrate, also can comprise the step of the distance between at least two or more identification mark measuring and be formed on described substrate.In the case, check the step of the warpage of described substrate also can to comprise described each identification mark between distance and the step that compares of reference range.
According to the base plate inspection system of another embodiment exemplary of the present invention, comprising: workbench delivery section, warpage inspection portion, fitting machine delivery section.Workbench delivery section also will not be transported to workbench (work stage) with the substrate of fitting machine (mounter) installing component.Warpage inspection portion checks the warpage (warpage) of described substrate, thus judges the whether qualified of described substrate.Fitting machine delivery section, as described in the check result of warpage inspection portion be judged as described in substrate qualified time, described substrate is transported to described fitting machine by it.
As an embodiment, described warpage inspection portion comprises: warpage judging part, judges whether described substrate exists warpage; Warpage test section, as described in substrate there is warpage, then detect the warpage degree of described substrate; And the whether qualified judging part of substrate, as described in substrate do not exist warpage and as described in the warpage degree of substrate be in allowed band, then judge that described substrate is qualified, as described in the warpage degree of substrate exceed allowed band, then judge that described substrate is defective.As described in the subregion of substrate there is warpage, but there is not warpage or warpage degree when being in good in allowed band in all the other regions, the whether qualified judging part of described substrate can judge that described substrate is that part is qualified, described base plate inspection system also can comprise delivery section, it sends warp information to described fitting machine, and wherein said warp information comprises the assembling in each region of described substrate or unassembled order.
Such as, described warpage inspection portion also can comprise display part, and it shows the warpage of described substrate with 3-dimensional image.Such as, described display part can comprise: shape display part, and it shows the 3D shape of described substrate; Display shape adjusting portion, its regulate shown by the 3D shape of described substrate; And warp information display part, its display is about described substrate warp information.
As an embodiment, described base plate inspection system also can comprise elevation information acquisition unit, and it obtains the elevation information of described substrate.In the case, described warpage inspection portion then based on the substrate height information obtained by described elevation information acquisition unit, checks the warpage of described substrate.Such as, described elevation information acquisition unit can comprise: Projection Division, and it irradiates grating pattern light to described substrate; Camera section, it obtains the pattern image being formed the described grating pattern light of reflection by described substrate; And control part, it utilizes described obtained pattern image, calculates described substrate height information.
As an embodiment, described base plate inspection system also can comprise distance measuring portion, its measurement is formed at the distance between the identification mark of more than at least 2 on described substrate, described warpage inspection portion, distance between described each identification mark and reference range are compared, thus checks the warpage of described substrate.
And described warpage inspection portion, when receiving the feedback according to the corresponding object information of warp information from described fitting machine, performs the statistical analysis of described corresponding object information and the derivation supplementing corresponding scheme.
According to the present invention, before for substrate installing component, check the warpage of substrate, be judged as that underproof substrate is not transported to fitting machine, and be defined as defective in advance, thus unnecessary operation and a large amount of phenomenon of producing substandard product can be prevented in advance, make it possible to improve the productivity ratio of product and the efficiency of inspection.
And, by display to shape and the warpage relevant information of the substrate that warpage checks, operating personnel easily can grasp and detect the warpage betiding substrate, can utilize predetermined input tool, substrate shape shown by adjustment, and the allowed band setting warpage.
Accompanying drawing explanation
Fig. 1 is the flow chart representing substrate inspecting method according to an embodiment of the invention.
Fig. 2 is the flow chart of an embodiment of the process of the warpage of the inspection substrate represented in the substrate inspecting method of Fig. 1.
Fig. 3 is the concept map representing base plate inspection system according to an embodiment of the invention.
Fig. 4 is the block diagram of an embodiment of the warpage inspection portion of the base plate inspection system representing Fig. 3.
Fig. 5 represents display part according to the warpage inspection portion of Fig. 4 and is embodied thus carry out the concept map of an example of the picture shown.
Embodiment
The present invention can realize various change, and can have variform, specific embodiment is wherein illustrated in accompanying drawing below and is described in detail in this manual.But the present invention is not limited to specific publicity pattern, all changes in thought of the present invention and technical scope, equivalent and sub all should be included.
First, second term such as grade can be used in various structural element is described, but said structure key element is not limited to above-mentioned term.The object of above-mentioned term is only that a structural element is different from another structural element.Such as, when not exceeding interest field of the present invention, the 1st structural element can be named as the 2nd structural element, and equally, the 2nd structural element also can be named as the 1st structural element.
The term used in the application, just in order to the word that specific embodiment uses is described, its object is not restriction the present invention.The performance of odd number should comprise the performance of plural number, unless clearly represented another kind of implication in the text.In this application, " to comprise " or the term such as " having " is interpreted as, being to specify feature described in the description, numeral, step, action, inscape, parts or its existence of combining, not representing and eliminating other features one or more or numeral, step, action, inscape, parts or its existence of combining or additional possibility in advance.
Unless otherwise defined, comprise technical or scientific term, as used herein all terms, implication is identical with the implication that the technical staff on affiliated field understands usually.
Usually that use and with the identical term defined in dictionary, its implication should be interpreted as the meaning identical with the implication that correlation technique linguistic context has.Unless clearly defined in the application, should not be construed as idealized or excessive formal implication.
Below, with reference to accompanying drawing, the preferred embodiments of the present invention are described in more details.。
Fig. 1 is the flow chart representing substrate inspecting method according to an embodiment of the invention.
With reference to Fig. 1, in order to check substrate according to one embodiment of the invention, first also workbench (work stage) (S110) will be transported to the substrate of fitting machine (mounter) installing component.
Then, check warpage (warpage) (S120) of described substrate.The warpage of described substrate can appear at described substrate from be just made as defective, described Substrate manufacture after bend, the thickness of described substrate is compared in thin etc. the situation of size.Being pursuant to this, because there is flexing or sagging, thus likely there is described warpage in described substrate.
Then, described check result is qualified as substrate as described in being judged as, then described substrate is transported to described fitting machine (S130).
Particularly, when being judged as qualified by described warpage inspection (S120), as in the pastly, described substrate is transported to described fitting machine, thus performs the operation of installing component.
Then, when described check result is as defective in substrate as described in being judged as, then described substrate is not transported to described fitting machine, but is defined as defective (S140).
Particularly, when being judged as defective by described warpage inspection (S120), as in the pastly, do not perform and described substrate is transported to described fitting machine, thus the operation of installing component, but be directly defined as defective.
Therefore, when warpage is serious, be defined as defective before the operation performing installing component in advance, thus utilize described fitting machine when described substrate installing component, can prevent in advance, the situation mispluging or do not insert, or when described substrate is checked, the situation of the error checked.
Fig. 2 is the flow chart of an embodiment of the process of the warpage of the inspection substrate represented in the substrate inspecting method of Fig. 1.
With reference to Fig. 2, as an embodiment of the process of the warpage of the described substrate of inspection, first judge whether described substrate exists warpage (S122).
As row, whether exist about described warpage, the view data that can obtain based on the measurement by 3D shape and performing.
As an embodiment, before the warpage checking described substrate, the elevation information of described substrate can be obtained in advance.Check that the process of the warpage of described substrate can perform based on obtained described substrate height information.Such as, in order to obtain described substrate height information, irradiating grating pattern light to described substrate, obtaining by described substrate after forming the pattern image of described grating pattern light of reflection, utilize the described pattern image obtained, the elevation information of described substrate can be calculated.In the case, be radiated at the grating pattern light of described substrate, can perform N time (N is the natural number of more than 2) while conveying grating, the elevation information of described substrate can utilize bucket algorithm (bucket algorithm) to calculate.
In addition, before checking the warpage of described substrate, the distance between the identification mark of more than at least 2 that is formed on described substrate can be measured in advance.In such a case, check the process of described substrate warp, can be performed by the distance between more described each identification mark and reference range.
Whether there is warpage judged result as on described substrate, as described in the warpage of substrate do not exist, then it is qualified described substrate to be judged as.Particularly, the check result of described warpage, as substrate as described in being judged as does not exist warpage, then it is qualified described substrate to be judged as.
And, as as described in there is warpage in substrate, then detect the warpage degree (S126) of described substrate, as as described in the warpage degree of substrate be in allowed band, it is qualified then described substrate to be judged as, as as described in the warpage degree of substrate exceed allowed band, then described substrate is judged as defective.
As mentioned above, detect the result of the warpage degree of described substrate, the warpage degree of described substrate is in allowed band, and when to be judged as described substrate be qualified, described substrate is transported to described fitting machine (S130).In the case, can transmit the information about described warpage and the information to described judged result (hereinafter referred to as " warp information ") to described fitting machine, described warp information can comprise warpage coordinate information, warped shapes information, each region warp information, warpage degree information etc.
In addition, if there is warpage in the subregion of described substrate, but there is not warpage or warpage when being in good in allowed band in all the other regions, because described qualified region can build-up member, therefore, now can be judged as that described substrate portion is qualified, and be transported to described fitting machine (S130).In the case, can transmit warp information to described fitting machine, described warp information can comprise warpage coordinate information, warped shapes information, each region warp information, warpage degree information, the assembling in each region or unassembled order etc.
In addition, before the warpage degree detecting described substrate (S126), the warpage (S124) of described substrate can be shown with 3-dimensional image.
The detection of described warpage degree and the setting of described allowed band based on the benchmark of input in advance and information, can be automatically performed by computer etc.Unlike this, the detection of described warpage degree and the setting of described allowed band, based on shown described 3-dimensional image, directly can be performed by operating personnel in a manual manner.
Below, with reference to the accompanying drawing embodiment being illustrated as the base plate inspection system performing substrate inspecting method as above specifically.
Fig. 3 is the concept map representing base plate inspection system according to an embodiment of the invention.
With reference to Fig. 3, the base plate inspection system 100 according to one embodiment of the invention comprises workbench delivery section 110, warpage inspection portion 120 and fitting machine delivery section 130.
Described workbench delivery section 110 is not for being also transported to workbench with the substrate BD of fitting machine MT installing component PT.Described workbench delivery section 110 can perform the process (S110) the described substrate being illustrated in Fig. 1 and Fig. 2 being transported to workbench.
Described warpage inspection portion 120 checks the warpage of described substrate BD, thus judges that described substrate BD's is whether qualified.Described warpage inspection portion 120 can perform the checking process (S120) of the warpage of the described substrate being illustrated in Fig. 1 and Fig. 2.
Fig. 4 is the block diagram of an embodiment of the warpage inspection portion of the base plate inspection system representing Fig. 3.
With reference to Fig. 4, as an embodiment, described warpage inspection portion 120 can comprise the whether qualified judging part 126 of warpage judging part 122, warpage test section 124 and substrate.
Described warpage judging part 122 judges whether described substrate BD exists warpage.Described warpage judging part 122 can perform the process (S122) judging whether described substrate BD exists warpage being illustrated in Fig. 1 and Fig. 2.
Described warpage test section 124, as described in substrate BD there is warpage time, then detect the warpage degree of described substrate BD.Described warpage test section 124 can perform the process (S126) of the warpage degree of the described substrate BD of the detection being illustrated in Fig. 1 and Fig. 2.
The whether qualified judging part 126 of described substrate, as as described in the warpage BD of substrate do not exist or as described in the warpage degree of substrate BD be in allowed band time, then judge that described substrate BD is qualified, as described in the warpage degree of substrate BD exceed allowed band time, then judge that described substrate BD is defective.Described substrate whether qualified judging part 126 can perform in fact be illustrated in Fig. 1 and Fig. 2, in the process (S120) checking described substrate warp, judge the process that the process that whether qualified described substrate is is identical.
Described warpage inspection portion 120 can also comprise display part 128, and it shows the warpage of described substrate BD with 3-dimensional image.
Fig. 5 represents display part according to the warpage inspection portion of Fig. 4 and is embodied thus carry out the concept map of an example of the picture shown.
With reference to Fig. 4 and Fig. 5, described display part 128 can perform and be illustrated in Fig. 1's and Fig. 2, show the process (S120) of the warpage of described substrate BD with 3-dimensional image, and described 3-dimensional image can be shown in the screen 28 of the device as display (monitor).
As an embodiment, described display part 128 can comprise shape display part 128a, display shape adjusting portion 128b, warp information display part 128c.
Described warped shapes display part 128a shows the 3D shape of described substrate BD, makes to allow operating personnel easily grasp warpage degree or the form of described substrate BD.As an embodiment, the 3D shape 28a of described substrate BD can be shown at the screen 28 of device as the display (monitor) being illustrated in Fig. 5.
Described display shape adjusting portion 128b with automatically or the mode inputted by operating personnel receive the direction of observation of shown described substrate BD and multiplying power etc., thus the 3D shape 28a of described substrate BD shown by regulating.As an embodiment, utilize the shape adjustment instrument 28b of the screen 28 of the device be shown in as the display being illustrated in Fig. 5 (monitor), operating personnel based on by as can the input mode of input unit of mouse or keyboard or touch manner, thus can regulate the 3D shape 28a representing described substrate BD.Such as, utilize the instrument being positioned at described shape adjustment instrument 28b top, the direction of observation of described substrate BD can be regulated, utilize the described instrument being positioned at described shape adjustment instrument 28b bottom, the multiplying power of described substrate BD can be regulated.
Described warp information display part 128c show about described substrate BD's and warp information.As an embodiment, can as the screen 28 of device of display (monitor) being illustrated in Fig. 5, display comprises warpage results (Warpage Result), shrinks the warp information 28c of result (Shrinkage Result), maximum warpage (Max Warpage) etc.Described warpage results is as the measurement result of warpage being present in described substrate BD, the maximum height of described substrate BD, minimum constructive height, difference in height, skew (offset) etc. can be comprised, and the information that described contraction result is shunk as described substrate BD, shrinkage, X-direction skew, Y direction skew can be comprised.Described maximum warpage, as the allowed band of warpage, can show the value set for the type of described substrate BD or the value automatically calculated, different or in the lump with it, can be undertaken inputting or revising by operating personnel separately.
Refer again to Fig. 4, described fitting machine delivery section 130, as described in the check result of warpage inspection portion 120 be judged as described in substrate BD qualified time, then described substrate BD is transported to described fitting machine MT.Described fitting machine delivery section 130 can perform and be illustrated in Fig. 1 and Fig. 2, described substrate BD is moved to the process (S130) of described fitting machine MT.
In addition, as the explanation in Fig. 2, described fitting machine MT can receive described warp information.Described fitting machine MT based on received described warp information, to described substrate BD build-up member PT, can utilize described warp information, can regulate the speed of this head, height etc.And described fitting machine MT can will feed back to welding inspection equipment (figure slightly) according to the corresponding object information of described warp information.In the case, described welding inspection equipment can analyze described corresponding object information, can statistically carry out analyzing or derive supplementary corresponding scheme.
Corresponding scheme as a supplement, such as, to be judged as described substrate BD qualified because being in allowed band for the warpage degree of described substrate BD, or there is warpage because of the subregion of described substrate BD, but there is not warpage or be in allowed band and be judged as eligible state in all the other regions, thus give described fitting machine MT this information transmission, but likely there is fitting machine at described fitting machine MT and fail the situation of specific region parts being assemblied in this substrate BD or substrate BD.Now, allowed band can be reduced by the unit-sized set.In addition, before inspection warpage, from described fitting machine MT receive head speed, highly, the state of maximum distortion angle of assembling information, by the comparison with the information be included in corresponding object information, thus can the whether abnormal of head be judged, institute's judged result information can be shown or retransfer to described fitting machine MT.
As an embodiment, described base plate inspection system 100 also can comprise the elevation information acquisition unit 140 obtaining described substrate BD elevation information.
Now, described warpage inspection portion 120, based on the substrate BD elevation information obtained by described elevation information acquisition unit 140, checks the warpage of described substrate BD.
Such as, described elevation information acquisition unit 140 comprises Projection Division 142, camera section 144 and control part 146.Grating pattern light is irradiated to described substrate BD in described Projection Division 142.Described camera section 144 obtains the pattern image being formed the described grating pattern light of reflection by described substrate BD.Described control part 146 utilizes the described pattern image obtained, and calculates described substrate BD elevation information.Described elevation information acquisition unit 140 can perform the height measurement process being illustrated in Fig. 1 Fig. 2.
As an embodiment, described base plate inspection system 100 can also comprise distance measuring portion (not shown), its measurement is formed at the distance between more than at least 2 identification marks on described substrate BD, distance between the more described each identification mark in described warpage inspection portion 120 and reference range, thus check the warpage of described substrate BD.
According to as above-mentioned substrate inspecting method and base plate inspection system, before parts are installed on substrate, check the warpage of substrate, to be judged as that underproof substrate is not transported to fitting machine, but be defined as defective in advance, thus unnecessary operation and a large amount of phenomenon of producing substandard product can be prevented in advance, the productivity ratio of product and the efficiency of inspection can be improved.
In addition, checked substrate shape and the warpage relevant information of warpage by display, thus operating personnel can have been allowed easily to grasp and detect the warpage betiding substrate, predetermined input tool can have been utilized, substrate shape shown by adjustment, and the allowed band setting warpage.
In detailed description of the present invention illustrated in the preamble, though to be illustrated with reference to the preferred embodiments of the present invention, those skilled in the art or the those of ordinary skill that should understand the technical field of the invention all can to the various modifications and changes of the invention process in the scope not departing from thought of the present invention described in claims of the present invention and technical field.Therefore, aforesaid explanation and following accompanying drawing should be interpreted as being not intended to limit technological thought of the present invention, but to the example that the present invention carries out.
Claims (20)
1. a substrate inspecting method, wherein, comprising:
Also will not be transported to the step of workbench (work stage) with the substrate of fitting machine (mounter) installing component;
Check the step of the warpage (warpage) of described substrate;
Described check result is as qualified in substrate as described in being judged as, then described substrate is transported to the step of described fitting machine; And
Described check result is as defective in substrate as described in being judged as, then described substrate is not transported to described fitting machine, but is defined as underproof step.
2. substrate inspecting method according to claim 1, wherein,
Check that the step of the warpage of described substrate comprises:
Judge the step whether described substrate existing warpage;
As described in substrate there is not warpage, then described substrate is judged as qualified step;
As described in substrate there is warpage, then detect the step of the warpage degree of described substrate;
As described in the warpage degree of substrate be in allowed band, then described substrate is judged as qualified step; And
As described in the warpage degree of substrate exceed allowed band, then described substrate is judged as underproof step.
3. substrate inspecting method according to claim 2, wherein,
As described in substrate there is warpage time, before carrying out detecting the step of described substrate warp degree,
Also comprise the step of the warpage showing described substrate with 3-dimensional image.
4. substrate inspecting method according to claim 2, wherein,
Also comprise as described in check result be judged as described in substrate qualified, then the warp information of described substrate is sent to the step of described fitting machine.
5. substrate inspecting method according to claim 4, wherein,
Described warp information comprises at least one in warpage coordinate information, warped shapes information, each region warp information, warpage degree information.
6. substrate inspecting method according to claim 4, wherein,
Also comprise from described fitting machine reception according to the feedback step of the corresponding object information of described warp information; And
Perform the step to the statistical analysis of described corresponding object information and the derivation of supplementary corresponding scheme.
7. substrate inspecting method according to claim 2, wherein,
Also comprise:
If the subregion of described substrate exists warpage, but there is not warpage or warpage when being in good in described allowed band in all the other regions, then described substrate is judged as the step that part is qualified; And
If described check result is judged as that described substrate portion is qualified, then described substrate is transported to the step of described fitting machine.
8. substrate inspecting method according to claim 7, wherein,
If also comprise described check result to be judged as that described substrate portion is qualified, then the warp information of described substrate is sent to the step of described fitting machine,
Described warp information comprises the assembling in each region or unassembled order.
9. substrate inspecting method according to claim 1, wherein,
Before the step of warpage checking described substrate,
Also comprise the step obtaining described substrate height information,
Check the step of the warpage of described substrate,
Then perform based on described obtained substrate height information.
10. substrate inspecting method according to claim 9, wherein,
The step obtaining described substrate height information comprises:
The step of grating pattern light is irradiated to described substrate;
Obtain the step being formed the pattern image of the described grating pattern light of reflection by described substrate; And
Utilize described obtained pattern image, calculate the step of described substrate height information.
11. substrate inspecting methods according to claim 1, wherein,
Before the step of warpage checking described substrate,
Also comprise the step of the distance between at least two or more identification mark measuring and be formed on described substrate,
Check that the step of the warpage of described substrate comprises:
By the step that the distance between described each identification mark and reference range compare.
12. 1 kinds of base plate inspection systems, wherein, comprising:
Workbench delivery section, it also will not be transported to workbench (work stage) with the substrate of fitting machine (mounter) installing component;
Warpage inspection portion, it checks the warpage (warpage) of described substrate, thus judges the whether qualified of described substrate; And
Fitting machine delivery section, as described in the check result of warpage inspection portion be judged as described in substrate qualified time, described substrate is transported to described fitting machine by it.
13. base plate inspection systems according to claim 12, wherein,
Described warpage inspection portion comprises:
Warpage judging part, judges whether described substrate exists warpage;
Warpage test section, as described in substrate there is warpage, then detect the warpage degree of described substrate; And
The whether qualified judging part of substrate, as described in substrate do not exist warpage and as described in the warpage degree of substrate be in allowed band, then judge that described substrate is qualified, as described in the warpage degree of substrate exceed allowed band, then judge that described substrate is defective.
14. base plate inspection systems according to claim 13, wherein,
As described in the subregion of substrate there is warpage, but there is not warpage or warpage when being in good in allowed band in all the other regions, and the whether qualified judging part of described substrate judges that described substrate is that part is qualified,
Also comprise delivery section, it sends warp information to described fitting machine, and wherein said warp information comprises the assembling in each region of described substrate or unassembled order.
15. base plate inspection systems according to claim 13, wherein,
Described warpage inspection portion also comprises display part, and it shows the warpage of described substrate with 3-dimensional image.
16. base plate inspection systems according to claim 15, wherein,
Described display part comprises:
Shape display part, it shows the 3D shape of described substrate;
Display shape adjusting portion, its regulate shown by the 3D shape of described substrate; And
Warp information display part, its display is about the information of described substrate warp.
17. base plate inspection systems according to claim 12, wherein,
Also comprise elevation information acquisition unit, it obtains the elevation information of described substrate,
Described warpage inspection portion,
It, based on the substrate height information obtained by described elevation information acquisition unit, checks the warpage of described substrate.
18. base plate inspection systems according to claim 17, wherein,
Described elevation information acquisition unit comprises:
Projection Division, it irradiates grating pattern light to described substrate;
Camera section, it obtains the pattern image being formed the described grating pattern light of reflection by described substrate; And
Control part, it utilizes described obtained pattern image, calculates described substrate height information.
19. base plate inspection systems according to claim 12, wherein,
Also comprise distance measuring portion, its measurement is formed at the distance between the identification mark of more than at least 2 on described substrate,
Described warpage inspection portion,
Distance between described each identification mark and reference range are compared, thus checks the warpage of described substrate.
20. base plate inspection systems according to claim 12, wherein,
Described warpage inspection portion,
When receiving the feedback according to the corresponding object information of warp information from described fitting machine, perform the statistical analysis of described corresponding object information and the derivation supplementing corresponding scheme.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130100454 | 2013-08-23 | ||
| KR10-2013-0100454 | 2013-08-23 | ||
| KR20140108752A KR20150023205A (en) | 2013-08-23 | 2014-08-21 | Board inspection method and board inspection system using the same |
| KR10-2014-0108752 | 2014-08-21 | ||
| PCT/KR2014/007880 WO2015026212A1 (en) | 2013-08-23 | 2014-08-25 | Substrate inspecting method and substrate inspecting system using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104584713A true CN104584713A (en) | 2015-04-29 |
| CN104584713B CN104584713B (en) | 2017-06-13 |
Family
ID=53020732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480001348.0A Active CN104584713B (en) | 2013-08-23 | 2014-08-25 | Substrate inspecting method and the base plate inspection system using the method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20160209207A1 (en) |
| EP (1) | EP3038444B1 (en) |
| JP (1) | JP6144841B2 (en) |
| KR (2) | KR20150023205A (en) |
| CN (1) | CN104584713B (en) |
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| CN106403840A (en) * | 2016-09-09 | 2017-02-15 | 蚌埠中建材信息显示材料有限公司 | Method for detecting curvature of ultrathin float glass |
| CN108372081A (en) * | 2017-01-31 | 2018-08-07 | 阿尔法设计株式会社 | Apparatus for coating, coating method, program |
| CN110870401A (en) * | 2018-06-28 | 2020-03-06 | 株式会社高永科技 | Electronic device and method for determining unqualified mounting reason of substrate component |
| CN114303451A (en) * | 2019-09-11 | 2022-04-08 | 株式会社富士 | Component mounting machine |
| US11395450B2 (en) | 2018-06-28 | 2022-07-19 | Koh Young Technology Inc. | Electronic apparatus and method for determining cause of mounting failure for component mounted on substrate |
| US11428644B2 (en) | 2018-11-27 | 2022-08-30 | Koh Young Technology Inc. | Method and electronic apparatus for displaying inspection result of board |
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| CN108702866B (en) * | 2016-02-18 | 2020-10-16 | 株式会社富士 | Component determination device and component determination method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106403840A (en) * | 2016-09-09 | 2017-02-15 | 蚌埠中建材信息显示材料有限公司 | Method for detecting curvature of ultrathin float glass |
| CN108372081A (en) * | 2017-01-31 | 2018-08-07 | 阿尔法设计株式会社 | Apparatus for coating, coating method, program |
| CN110870401A (en) * | 2018-06-28 | 2020-03-06 | 株式会社高永科技 | Electronic device and method for determining unqualified mounting reason of substrate component |
| CN110870401B (en) * | 2018-06-28 | 2022-02-11 | 株式会社高迎科技 | Electronic device and method for determining unqualified mounting reason of substrate component |
| US11395450B2 (en) | 2018-06-28 | 2022-07-19 | Koh Young Technology Inc. | Electronic apparatus and method for determining cause of mounting failure for component mounted on substrate |
| US11428644B2 (en) | 2018-11-27 | 2022-08-30 | Koh Young Technology Inc. | Method and electronic apparatus for displaying inspection result of board |
| CN114303451A (en) * | 2019-09-11 | 2022-04-08 | 株式会社富士 | Component mounting machine |
| CN114303451B (en) * | 2019-09-11 | 2024-01-30 | 株式会社富士 | Component mounting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3038444B1 (en) | 2019-03-20 |
| KR20150023205A (en) | 2015-03-05 |
| CN104584713B (en) | 2017-06-13 |
| KR20160017659A (en) | 2016-02-16 |
| US20160209207A1 (en) | 2016-07-21 |
| JP6144841B2 (en) | 2017-06-07 |
| EP3038444A4 (en) | 2017-04-05 |
| JP2016530522A (en) | 2016-09-29 |
| EP3038444A1 (en) | 2016-06-29 |
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