CN104576528A - Array substrate of organic electroluminescent display panel, manufacturing method and display device - Google Patents
Array substrate of organic electroluminescent display panel, manufacturing method and display device Download PDFInfo
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- CN104576528A CN104576528A CN201510012581.5A CN201510012581A CN104576528A CN 104576528 A CN104576528 A CN 104576528A CN 201510012581 A CN201510012581 A CN 201510012581A CN 104576528 A CN104576528 A CN 104576528A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L2021/775—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Abstract
The invention discloses an array substrate, a manufacturing method and a display device of an organic electroluminescent display panel. According to the manufacturing method of the array substrate, after a first photosensitive organic layer is formed, prebaking treatment is carried out on the first photosensitive organic layer, a solvent in the first photosensitive organic layer is removed, and therefore adhesion between the first photosensitive organic layer and a film layer where a pixel electrode is located is enhanced, and photonasty of the first photosensitive organic layer is reduced; then, a second photosensitive organic layer is formed on the first photosensitive organic layer, and the composition technology is carried out on the second photosensitive organic layer to form a spacer graph, and the first photosensitive organic layer cannot be affected; the composition technology is carried out on the first photosensitive organic layer to form a pixel limit layer graph, and primary curing treatment is carried out on the spacer graph and the pixel limit layer graph. Therefore primary curing treatment can be omitted, so that the manufacturing technology of a spacer and the pixel limit layer is simplified. The problem that organic material residues cannot exist is solved.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of array base palte of organic EL display panel, manufacture method and display unit.
Background technology
In existing display floater, organic EL display panel (Organic ElectroluminesecentDisplay, OLED), by means of features such as its low-power consumption, high color saturation, wide viewing angles, becomes the main flow in display field gradually.
In existing organic EL display panel array base palte manufacturing process in; after formation pixel electrode, general adopt polyimide material to form each pixel region for limiting organic EL display panel successively pixel confining layers and for cushioning External Force Acting to protect the chock insulator matter of each rete in organic EL display panel.Particularly, the manufacturing process of pixel confining layers is as follows: first, and the figure of pixel electrode applies one deck polyimide material; Then, the figure that front baking, exposure and development treatment form pixel confining layers is carried out to polyimide material; Wherein, the time of front baking process is generally 100s-200s, and the temperature of front baking process is generally 100 DEG C-120 DEG C; Finally, process is cured to the figure of pixel confining layers.The manufacturing process of chock insulator matter and the manufacturing process of pixel confining layers similar: first, the figure of pixel confining layers applies one deck polyimide material; Then, the figure that front baking, exposure and development treatment form chock insulator matter is carried out to polyimide material; Wherein, the time of front baking process is generally 100s-200s, and the temperature of front baking process is generally 100 DEG C-120 DEG C; Finally, process is cured to the figure of chock insulator matter.This shows, the manufacture craft of pixel confining layers and chock insulator matter is comparatively complicated.
In order to simplify the manufacture craft of pixel confining layers and chock insulator matter, gray tone mask plate can be first adopted to form the figure of pixel confining layers and chock insulator matter by patterning processes, then the figure of pixel confining layers and chock insulator matter is cured, but the residual problem of polyimide material can be there is in the figure of the pixel confining layers adopting this manufacture craft to make and chock insulator matter.
Therefore, how optimizing the manufacture craft of pixel confining layers and chock insulator matter, is the technical problem that those skilled in the art need solution badly.
Summary of the invention
In view of this, embodiments provide a kind of array base palte of organic EL display panel, manufacture method and display unit, in order to optimize the manufacture craft of pixel confining layers and chock insulator matter.
Therefore, embodiments provide a kind of manufacture method of array base palte of organic EL display panel, comprising:
The underlay substrate being formed with pixel electrode figure forms the first photosensitive organic layer;
Front baking process is carried out to described first photosensitive organic layer, removes the solvent in described first photosensitive organic layer;
The first photosensitive organic layer after described front baking process forms the second photosensitive organic layer;
Patterning processes is carried out to described second photosensitive organic layer, is formed and comprise chock insulator matter figure;
Patterning processes is carried out to the first photosensitive organic layer be formed on the underlay substrate of chock insulator matter figure, is formed and comprise pixel confining layers figure;
Process is cured to described chock insulator matter figure and described pixel confining layers figure.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, described front baking process is carried out to described first photosensitive organic layer, specifically comprises:
In the time range of 150s-400s, described first photosensitive organic layer is carried out to the front baking process of 100 DEG C-120 DEG C.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, described front baking process is carried out to described first photosensitive organic layer, specifically comprises:
In the time range of 100s-200s, described first photosensitive organic layer is carried out to the front baking process of 120 DEG C-140 DEG C.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, the described underlay substrate being formed with pixel electrode figure forming the first photosensitive organic layer, specifically comprising:
Coating polyimide material, acryl material or phenolic resin material on the underlay substrate being formed with pixel electrode figure.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, the described underlay substrate being formed with pixel electrode figure forming the first photosensitive organic layer, specifically comprising:
The underlay substrate being formed with pixel electrode figure is formed the first photosensitive organic layer that thickness is 1-2 μm.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, described on the first photosensitive organic layer after described front baking process formed the second photosensitive organic layer, specifically comprise:
Coating polyimide material, acryl material or phenolic resin material on the first photosensitive organic layer after described front baking process.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, described patterning processes is carried out to described second photosensitive organic layer, is formed and comprise chock insulator matter figure, specifically comprise:
In the time range of 100s-200s, described second photosensitive organic layer is carried out to the front baking process of 100 DEG C-120 DEG C;
The photosensitive organic layer of after front baking process second is exposed, development treatment, formed comprise chock insulator matter figure.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, described the first photosensitive organic layer to being formed on the underlay substrate of chock insulator matter figure carries out patterning processes, is formed and comprises pixel confining layers figure, specifically comprise:
Described first photosensitive organic layer is exposed, development treatment, formed comprise pixel confining layers figure.
The embodiment of the present invention additionally provides a kind of array base palte of organic EL display panel, and the said method adopting the embodiment of the present invention to provide makes.
The embodiment of the present invention additionally provides a kind of display unit, comprises the array base palte of the above-mentioned organic EL display panel that the embodiment of the present invention provides.
The array base palte of the above-mentioned organic EL display panel that the embodiment of the present invention provides, manufacture method and display unit, in the manufacture method of this array base palte, after the photosensitive organic layer of formation first, front baking process is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, to strengthen the adhesiveness between the first photosensitive organic layer and pixel electrode place rete, and reduce the photonasty of the first photosensitive organic layer; Afterwards, the first photosensitive organic layer forms the second photosensitive organic layer, and patterning processes formation chock insulator matter figure is carried out to the second photosensitive organic layer, can not have an impact to the first photosensitive organic layer; Afterwards, patterning processes is carried out to the first photosensitive organic layer and forms pixel confining layers figure, and one-step solidification process is carried out to chock insulator matter figure and pixel confining layers figure; Like this, one-step solidification process can be reduced, thus the manufacture craft of chock insulator matter and pixel confining layers can be simplified, and, the problem that organic material is residual can not be there is.
Accompanying drawing explanation
The flow chart of the manufacture method of the array base palte of the organic EL display panel that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 a-Fig. 2 d is respectively the structural representation of array base palte when performing each step of the organic EL display panel that the embodiment of the present invention provides.
Embodiment
Below in conjunction with accompanying drawing, the embodiment of the array base palte of the organic EL display panel that the embodiment of the present invention provides, manufacture method and display unit is described in detail.
In accompanying drawing, the shape of each rete and thickness do not reflect the actual proportions of array base palte, and object just signal illustrates content of the present invention.
The manufacture method of the array base palte of a kind of organic EL display panel that the embodiment of the present invention provides, as shown in Figure 1, comprises the steps:
S101, on the underlay substrate being formed with pixel electrode figure formed the first photosensitive organic layer;
S102, front baking process is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer;
S103, on the photosensitive organic layer of first after front baking process formed the second photosensitive organic layer;
S104, patterning processes is carried out to the second photosensitive organic layer, formed and comprise chock insulator matter figure;
S105, patterning processes is carried out to the first photosensitive organic layer be formed with on the underlay substrate of chock insulator matter figure, formed and comprise pixel confining layers figure;
S106, process is cured to chock insulator matter figure and pixel confining layers figure.
The said method that the embodiment of the present invention provides, after the photosensitive organic layer of formation first, front baking process is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, to strengthen the adhesiveness between the first photosensitive organic layer and pixel electrode place rete, and reduce the photonasty of the first photosensitive organic layer; Like this, the first photosensitive organic layer forms the second photosensitive organic layer, and carry out the second photosensitive organic layer, in the process of patterning processes formation chock insulator matter figure, to have an impact to the first photosensitive organic layer; Afterwards, patterning processes is carried out to the first photosensitive organic layer and forms pixel confining layers figure, and one-step solidification process is carried out to chock insulator matter figure and pixel confining layers figure; Like this, one-step solidification process can be reduced, thus the manufacture craft of chock insulator matter and pixel confining layers can be simplified, and, the problem that organic material is residual can not be there is.
In the specific implementation, step S102 in the said method that the embodiment of the present invention provides, front baking process is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, specifically can by extending the solvent removed the mode of the time of the front baking process of the first photosensitive organic layer in the first photosensitive organic layer; Or, also by improving the solvent removed the mode of the temperature of the front baking process of the first photosensitive organic layer in the first photosensitive organic layer, can not limit at this.
In the specific implementation, step S102 in the said method that the embodiment of the present invention provides, front baking process is carried out to the first photosensitive organic layer, specifically can realize in the following manner: in the time range of 150s-400s, the first photosensitive organic layer is carried out to the front baking process of 100 DEG C-120 DEG C; Namely under the condition identical with the temperature of front baking process in the manufacture craft of existing array base palte, by extending the time to the front baking process of the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, to strengthen the adhesiveness between the first photosensitive organic layer and pixel electrode place rete, and reduce the photonasty of the first photosensitive organic layer, like this, the second photosensitive organic layer is formed afterwards on the first photosensitive organic layer, and carry out the second photosensitive organic layer, in the process of patterning processes formation chock insulator matter figure, to have an impact to the first photosensitive organic layer.
In the specific implementation, step S102 in the said method that the embodiment of the present invention provides, front baking process is carried out to the first photosensitive organic layer, specifically can realize in the following manner:: in the time range of 100s-200s, the first photosensitive organic layer is carried out to the front baking process of 120 DEG C-140 DEG C; Namely under the condition identical with the time of front baking process in the manufacture craft of existing array base palte, by improving the temperature to the front baking process of the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, to strengthen the adhesiveness between the first photosensitive organic layer and pixel electrode place rete, and reduce the photonasty of the first photosensitive organic layer, like this, the second photosensitive organic layer is formed afterwards on the first photosensitive organic layer, and carry out the second photosensitive organic layer, in the process of patterning processes formation chock insulator matter figure, to have an impact to the first photosensitive organic layer.
It should be noted that, in the temperature by improving the front baking process of the first photosensitive organic layer, when removing the solvent in the first photosensitive organic layer, in order to ensure the photonasty of the first photosensitive organic layer, to avoid affecting step S105, normally carrying out of patterning processes is carried out to the first photosensitive organic layer, generally step S102 is controlled below 140 DEG C as good the temperature that the first photosensitive organic layer carries out front baking process.
In the specific implementation, step S101 in the said method that the embodiment of the present invention provides, the underlay substrate being formed with pixel electrode figure forms the first photosensitive organic layer, specifically can realize in the following manner: coating polyimide material, acryl material or phenolic resin material on the underlay substrate being formed with pixel electrode figure; Wherein, polyimide material has higher chemical stability, is preferred material.
In the specific implementation, the step S101 in the said method that the embodiment of the present invention provides, the underlay substrate being formed with pixel electrode figure forms the first photosensitive organic layer, is generally good by the THICKNESS CONTROL of the first photosensitive organic layer 1-2 μm of scope.
In the specific implementation, step S103 in the said method that the embodiment of the present invention provides, the photosensitive organic layer of after front baking process first forms the second photosensitive organic layer, specifically can realize in the following manner: coating polyimide material, acryl material or phenolic resin material on the photosensitive organic layer of first after front baking process; Wherein, polyimide material has higher chemical stability, is preferred material.
It should be noted that, the material of the second photosensitive organic layer can be identical with the material of the first photosensitive organic layer; Or the material of the second photosensitive organic layer also can be different from the material of the first photosensitive organic layer, do not limit at this.
In the specific implementation, the step S104 in the said method that the embodiment of the present invention provides, carries out patterning processes to the second photosensitive organic layer, is formed and comprises chock insulator matter figure, specifically can comprise the steps:
First, in the time range of 100s-200s, the second photosensitive organic layer is carried out to the front baking process of 100 DEG C-120 DEG C; Wherein, the time of the second photosensitive organic layer being carried out to front baking process in the time of front baking process and the manufacture craft of existing array base palte is identical, and the temperature of the second photosensitive organic layer being carried out to front baking process in the temperature of front baking process and the manufacture craft of existing array base palte is identical;
Then, the photosensitive organic layer of second after front baking process to be exposed, development treatment, formed and comprise chock insulator matter figure.
In the specific implementation, step S105 in the said method that the embodiment of the present invention provides, patterning processes is carried out to the first photosensitive organic layer be formed on the underlay substrate of chock insulator matter figure, formation comprises pixel confining layers figure, specifically can realize in the following manner: the first photosensitive organic layer to be exposed, development treatment, be formed and comprise pixel confining layers figure.
Be described in detail below by the concrete specific implementation of example to the manufacture method of the array base palte of the above-mentioned organic EL display panel that the embodiment of the present invention provides.For the thin-film transistor in the array base palte of organic EL display panel for top gate type (grid namely in thin-film transistor is positioned at the top of active layer) is described, its manufacture method, as shown in Fig. 2 a-Fig. 2 d, specifically comprises the steps:
(1), on the underlay substrate 3 being formed with thin-film transistor 1 and pixel electrode 2 figure the first photosensitive organic layer 4 is formed, as shown in Figure 2 a;
(2), to the first photosensitive organic layer 4 carry out 150s-400s, the front baking process of 100 DEG C-120 DEG C, remove the solvent in the first photosensitive organic layer 4;
This step is with under the condition identical with the temperature of front baking process in the manufacture craft of existing array base palte, and by extending the time to the front baking process of the first photosensitive organic layer, the solvent removed in the first photosensitive organic layer is that example is described;
(3), on the photosensitive organic layer of first after front baking process 4 the second photosensitive organic layer 5 is formed, as shown in Figure 2 b;
(4), 100s-200s, the front baking process of 100 DEG C-120 DEG C are carried out to the second photosensitive organic layer 5;
(5), to the second photosensitive layer 5 after front baking process expose, development treatment, formed comprise chock insulator matter 6 figure, as shown in Figure 2 c;
(6), to the first photosensitive organic layer 4 be formed on the underlay substrate 3 of chock insulator matter 6 figure expose, development treatment, formed comprise pixel confining layers 7 figure, as shown in Figure 2 d;
(7), process is cured to chock insulator matter 6 figure and pixel confining layers 7 figure.
It should be noted that, in the said method that the embodiment of the present invention provides, manufacture craft and the existing manufacture craft of the parts such as thin-film transistor and pixel electrode are similar, do not repeat at this.
It should be noted that, in the above-mentioned array base palte that the embodiment of the present invention provides, the type of thin-film transistor is not limited to top gate type, can be also bottom gate type, not limit at this.Further, the above-mentioned array base palte that the embodiment of the present invention provides can be applied to top emission type organic EL display panel, or, also can be applied to bottom emitting type organic EL display panel, not limit at this.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of array base palte of organic EL display panel, the said method adopting the embodiment of the present invention to provide makes, the enforcement of the array base palte of this organic EL display panel see the embodiment of the manufacture method of the array base palte of above-mentioned organic EL display panel, can repeat part and repeats no more.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of display unit, comprise the array base palte of the above-mentioned organic EL display panel that the embodiment of the present invention provides, this display unit can be: any product or parts with Presentation Function such as mobile phone, panel computer, television set, display, notebook computer, DPF, navigator.The enforcement of this display unit see the embodiment of the array base palte of above-mentioned organic EL display panel, can repeat part and repeats no more.
The array base palte of a kind of organic EL display panel that the embodiment of the present invention provides, manufacture method and display unit, in the manufacture method of this array base palte, after the photosensitive organic layer of formation first, front baking process is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, to strengthen the adhesiveness between the first photosensitive organic layer and pixel electrode place rete, and reduce the photonasty of the first photosensitive organic layer; Afterwards, the first photosensitive organic layer forms the second photosensitive organic layer, and patterning processes formation chock insulator matter figure is carried out to the second photosensitive organic layer, can not have an impact to the first photosensitive organic layer; Afterwards, patterning processes is carried out to the first photosensitive organic layer and forms pixel confining layers figure, and one-step solidification process is carried out to chock insulator matter figure and pixel confining layers figure; Like this, one-step solidification process can be reduced, thus the manufacture craft of chock insulator matter and pixel confining layers can be simplified, and, the problem that organic material is residual can not be there is.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a manufacture method for the array base palte of organic EL display panel, is characterized in that, comprising:
The underlay substrate being formed with pixel electrode figure forms the first photosensitive organic layer;
Front baking process is carried out to described first photosensitive organic layer, removes the solvent in described first photosensitive organic layer;
The first photosensitive organic layer after described front baking process forms the second photosensitive organic layer;
Patterning processes is carried out to described second photosensitive organic layer, is formed and comprise chock insulator matter figure;
Patterning processes is carried out to the first photosensitive organic layer be formed on the underlay substrate of chock insulator matter figure, is formed and comprise pixel confining layers figure;
Process is cured to described chock insulator matter figure and described pixel confining layers figure.
2. the method for claim 1, is characterized in that, describedly carries out front baking process to described first photosensitive organic layer, specifically comprises:
In the time range of 150s-400s, described first photosensitive organic layer is carried out to the front baking process of 100 DEG C-120 DEG C.
3. the method for claim 1, is characterized in that, describedly carries out front baking process to described first photosensitive organic layer, specifically comprises:
In the time range of 100s-200s, described first photosensitive organic layer is carried out to the front baking process of 120 DEG C-140 DEG C.
4. the method as described in any one of claim 1-3, is characterized in that, the described underlay substrate being formed with pixel electrode figure forming the first photosensitive organic layer, specifically comprising:
Coating polyimide material, acryl material or phenolic resin material on the underlay substrate being formed with pixel electrode figure.
5. the method as described in any one of claim 1-3, is characterized in that, the described underlay substrate being formed with pixel electrode figure forming the first photosensitive organic layer, specifically comprising:
The underlay substrate being formed with pixel electrode figure is formed the first photosensitive organic layer that thickness is 1-2 μm.
6. the method as described in any one of claim 1-3, is characterized in that, described on the first photosensitive organic layer after described front baking process formed the second photosensitive organic layer, specifically comprise:
Coating polyimide material, acryl material or phenolic resin material on the first photosensitive organic layer after described front baking process.
7. the method as described in any one of claim 1-3, is characterized in that, describedly carries out patterning processes to described second photosensitive organic layer, is formed and comprises chock insulator matter figure, specifically comprise:
In the time range of 100s-200s, described second photosensitive organic layer is carried out to the front baking process of 100 DEG C-120 DEG C;
The photosensitive organic layer of after front baking process second is exposed, development treatment, formed comprise chock insulator matter figure.
8. the method as described in any one of claim 1-3, is characterized in that, described the first photosensitive organic layer to being formed on the underlay substrate of chock insulator matter figure carries out patterning processes, is formed and comprises pixel confining layers figure, specifically comprise:
Described first photosensitive organic layer is exposed, development treatment, formed comprise pixel confining layers figure.
9. an array base palte for organic EL display panel, is characterized in that, adopts the manufacture method as described in any one of claim 1-8 to make.
10. a display unit, is characterized in that, comprising: the array base palte of organic EL display panel as claimed in claim 9.
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