CN104576528B - Array base palte, preparation method and the display device of organic EL display panel - Google Patents
Array base palte, preparation method and the display device of organic EL display panel Download PDFInfo
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- CN104576528B CN104576528B CN201510012581.5A CN201510012581A CN104576528B CN 104576528 B CN104576528 B CN 104576528B CN 201510012581 A CN201510012581 A CN 201510012581A CN 104576528 B CN104576528 B CN 104576528B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L2021/775—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Abstract
The invention discloses a kind of array base palte of organic EL display panel, preparation method and display device, in the preparation method of the array base palte, after the first photosensitive organic layer is formed, front baking processing is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer, with the adhesiveness between film layer where enhancing first photosensitive organic layer and pixel electrode, and reduce the photonasty of the first photosensitive organic layer；Afterwards, the second photosensitive organic layer is formed on the first photosensitive organic layer, and technique is patterned to the second photosensitive organic layer and forms spacer material figure, the first photosensitive organic layer will not be had an impact；Afterwards, technique is patterned to the first photosensitive organic layer and forms pixel restriction layer pattern, and layer pattern is limited to spacer material figure and pixel and carries out one-step solidification processing；So, it is possible to reduce one-step solidification processing, so as to simplify the manufacture craft of spacer material and pixel confining layers, also, be not in the problem of organic material remains.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of array base palte of organic EL display panel, system
Make method and display device.
Background technology
In existing display panel, organic EL display panel (Organic Electroluminesecent
Display, OLED) by its low-power consumption, high color saturation, wide viewing angle the features such as, be increasingly becoming the main flow of display field.
In existing organic EL display panel in the manufacturing process of array base palte, formed pixel electrode it
Afterwards, the pixel of each pixel region for limiting organic EL display panel is typically sequentially formed using polyimide material
Confining layers and for buffering external force effect to protect the spacer material of each film layer in organic EL display panel.Specifically, as
The manufacturing process of plain confining layers is as follows：First, one layer of polyimide material is coated on the figure of pixel electrode；Then, to poly-
Acid imide material carries out front baking, exposure and development treatment forms the figure of pixel confining layers；Wherein, the time of front baking processing is general
For 100s-200s, the temperature of front baking processing is generally 100 DEG C -120 DEG C；Finally, the figure of pixel confining layers is carried out at solidification
Reason.The manufacturing process of spacer material is similar with the manufacturing process of pixel confining layers：First, one is coated on the figure of pixel confining layers
Layer polyimide material；Then, front baking is carried out to polyimide material, exposure and development treatment forms the figure of spacer material；Its
In, the time of front baking processing is generally 100s-200s, and the temperature of front baking processing is generally 100 DEG C -120 DEG C；Finally, to dottle pin
The figure of thing carries out curing process.It can thus be seen that pixel confining layers and the manufacture craft of spacer material are complex.
In order to simplify the manufacture craft of pixel confining layers and spacer material, a structure first can be passed through using gray tone mask plate
Figure technique forms the figure of pixel confining layers and spacer material, and then the figure of pixel confining layers and spacer material is solidified, but
The pixel confining layers and the figure of spacer material made using the manufacture craft can have the problem of polyimide material residual.
Therefore, how to optimize pixel confining layers and the manufacture craft of spacer material, be those skilled in the art's urgent need to resolve
Technical problem.
The content of the invention
In view of this, the embodiments of the invention provide a kind of array base palte of organic EL display panel, making side
Method and display device, to optimize the manufacture craft of pixel confining layers and spacer material.
Therefore, the embodiments of the invention provide a kind of preparation method of the array base palte of organic EL display panel,
Including：
The first photosensitive organic layer is formed on the underlay substrate formed with pixel electrode figure；
Front baking processing is carried out to the described first photosensitive organic layer, removes the solvent in the first photosensitive organic layer；
The second photosensitive organic layer is formed on the first photosensitive organic layer after front baking processing；
Technique is patterned to the described second photosensitive organic layer, formation includes spacer material figure；
Technique is patterned to the first photosensitive organic layer on the underlay substrate formed with spacer material figure, formation includes picture
Element limits layer pattern；
Layer pattern is limited to the spacer material figure and the pixel and carries out curing process.
It is described to described first in the above method provided in an embodiment of the present invention in a kind of possible implementation
Photosensitive organic layer carries out front baking processing, specifically includes：
In 150s-400s time range, the described first photosensitive organic layer is carried out at 100 DEG C -120 DEG C of front baking
Reason.
It is described to described first in the above method provided in an embodiment of the present invention in a kind of possible implementation
Photosensitive organic layer carries out front baking processing, specifically includes：
In 100s-200s time range, the described first photosensitive organic layer is carried out at 120 DEG C -140 DEG C of front baking
Reason.
It is described formed with picture in the above method provided in an embodiment of the present invention in a kind of possible implementation
The first photosensitive organic layer is formed on the underlay substrate of plain electrode pattern, is specifically included：
Coating polyimide material, acryl material or phenolic resin on the underlay substrate formed with pixel electrode figure
Material.
It is described formed with picture in the above method provided in an embodiment of the present invention in a kind of possible implementation
The first photosensitive organic layer is formed on the underlay substrate of plain electrode pattern, is specifically included：
The first photosensitive organic layer that thickness is 1-2 μm is formed on the underlay substrate formed with pixel electrode figure.
It is described described in process in the above method provided in an embodiment of the present invention in a kind of possible implementation
The second photosensitive organic layer is formed on the first photosensitive organic layer after front baking processing, is specifically included：
Coating polyimide material, acryl material or phenol on the first photosensitive organic layer after front baking processing
Urea formaldehyde material.
It is described to described second in the above method provided in an embodiment of the present invention in a kind of possible implementation
Photosensitive organic layer is patterned technique, and formation includes spacer material figure, specifically included：
In 100s-200s time range, the described second photosensitive organic layer is carried out at 100 DEG C -120 DEG C of front baking
Reason；
The second photosensitive organic layer after front baking is handled is exposed, development treatment, formation includes spacer material figure.
In a kind of possible implementation, in the above method provided in an embodiment of the present invention, it is described to formed with every
The first photosensitive organic layer on the underlay substrate of underbed figure is patterned technique, and formation includes pixel and limits layer pattern, specifically
Including：
Described first photosensitive organic layer is exposed, development treatment, formation includes pixel and limits layer pattern.
The embodiment of the present invention additionally provides a kind of array base palte of organic EL display panel, is implemented using the present invention
The above method that example provides makes.
The embodiment of the present invention additionally provides a kind of display device, including above-mentioned organic electroluminescence hair provided in an embodiment of the present invention
The array base palte of light display panel.
Array base palte, preparation method and the display dress of above-mentioned organic EL display panel provided in an embodiment of the present invention
Put, in the preparation method of the array base palte, after the first photosensitive organic layer is formed, the first photosensitive organic layer is carried out at front baking
Reason, the solvent in the first photosensitive organic layer is removed, it is viscous between film layer where enhancing first photosensitive organic layer and pixel electrode
Attached property, and reduce the photonasty of the first photosensitive organic layer；Afterwards, the second photosensitive organic layer is formed on the first photosensitive organic layer,
And technique is patterned to the second photosensitive organic layer and forms spacer material figure, the first photosensitive organic layer will not be had an impact；It
Afterwards, technique is patterned to the first photosensitive organic layer and forms pixel restriction layer pattern, and to spacer material figure and pixel confining layers
Figure carries out one-step solidification processing；So, it is possible to reduce one-step solidification processing, so as to simplify spacer material and pixel confining layers
Manufacture craft, also, be not in organic material residual the problem of.
Brief description of the drawings
Fig. 1 is the flow of the preparation method of the array base palte of organic EL display panel provided in an embodiment of the present invention
Figure；
Fig. 2 a- Fig. 2 d are respectively that the array base palte of organic EL display panel provided in an embodiment of the present invention is performing
Structural representation during each step.
Embodiment
Below in conjunction with the accompanying drawings, the array base palte to organic EL display panel provided in an embodiment of the present invention, making
The embodiment of method and display device is described in detail.
The shape of each film layer and thickness do not reflect the actual proportions of array base palte in accompanying drawing, and purpose is schematically illustrate hair
Bright content.
A kind of preparation method of the array base palte of organic EL display panel provided in an embodiment of the present invention, such as Fig. 1
It is shown, comprise the following steps：
S101, the first photosensitive organic layer is formed on the underlay substrate formed with pixel electrode figure；
S102, front baking processing is carried out to the first photosensitive organic layer, remove the solvent in the first photosensitive organic layer；
S103, the second photosensitive organic layer is formed on the first photosensitive organic layer after being handled by front baking；
S104, technique is patterned to the second photosensitive organic layer, formation includes spacer material figure；
S105, technique is patterned to the first photosensitive organic layer on the underlay substrate formed with spacer material figure, formed
Layer pattern is limited including pixel；
S106, layer pattern progress curing process is limited spacer material figure and pixel.
The above method provided in an embodiment of the present invention, after the first photosensitive organic layer is formed, the first photosensitive organic layer is entered
The processing of row front baking, removes the solvent in the first photosensitive organic layer, to strengthen the first photosensitive organic layer and film layer where pixel electrode
Between adhesiveness, and reduce the first photosensitive organic layer photonasty；So, it is photosensitive that second is formed on the first photosensitive organic layer
Organic layer, and the second photosensitive organic layer is patterned technique formed spacer material figure during, photosensitive to first will not have
Machine layer has an impact；Afterwards, technique is patterned to the first photosensitive organic layer and forms pixel restriction layer pattern, and to spacer material figure
Shape and pixel limit layer pattern and carry out one-step solidification processing；So, it is possible to reduce one-step solidification processing, so as to simplify dottle pin
The manufacture craft of thing and pixel confining layers, also, be not in the problem of organic material remains.
In the specific implementation, the step S102 in the above method provided in an embodiment of the present invention, to the first photosensitive organic layer
Carry out front baking processing, remove the first photosensitive organic layer in solvent, specifically can by extend to the first photosensitive organic layer before
The mode for drying the time of processing removes the solvent in the first photosensitive organic layer；Or can also be photosensitive to first by improving
The mode of the temperature of the front baking processing of organic layer removes the solvent in the first photosensitive organic layer, does not limit herein.
In the specific implementation, the step S102 in the above method provided in an embodiment of the present invention, to the first photosensitive organic layer
Front baking processing is carried out, can be specifically accomplished by the following way：It is photosensitive to first organic in 150s-400s time range
Layer carries out 100 DEG C -120 DEG C of front baking processing；I.e. in the temperature phase handled with front baking in the manufacture craft of existing array base palte
With under conditions of, by extending the time of the front baking processing to the first photosensitive organic layer, remove molten in the first photosensitive organic layer
Agent, with the adhesiveness between film layer where enhancing first photosensitive organic layer and pixel electrode, and reduce the first photosensitive organic layer
Photonasty, so, the second photosensitive organic layer is formed on the first photosensitive organic layer afterwards, and structure is carried out to the second photosensitive organic layer
During figure technique forms spacer material figure, the first photosensitive organic layer will not be had an impact.
In the specific implementation, the step S102 in the above method provided in an embodiment of the present invention, to the first photosensitive organic layer
Front baking processing is carried out, can be specifically accomplished by the following way：：It is photosensitive to first organic in 100s-200s time range
Layer carries out 120 DEG C -140 DEG C of front baking processing；I.e. in the time phase handled with front baking in the manufacture craft of existing array base palte
With under conditions of, by improving the temperature of the front baking processing to the first photosensitive organic layer, remove molten in the first photosensitive organic layer
Agent, with the adhesiveness between film layer where enhancing first photosensitive organic layer and pixel electrode, and reduce the first photosensitive organic layer
Photonasty, so, the second photosensitive organic layer is formed on the first photosensitive organic layer afterwards, and structure is carried out to the second photosensitive organic layer
During figure technique forms spacer material figure, the first photosensitive organic layer will not be had an impact.
It should be noted that the temperature handled in the front baking by improving to the first photosensitive organic layer, it is photosensitive to remove first
It is photosensitive to first to avoid influenceing step S105 in order to ensure the photonasty of the first photosensitive organic layer during solvent in organic layer
Organic layer is patterned being normally carried out for technique, and step S102 is typically carried out to the temperature of front baking processing to the first photosensitive organic layer
Control is preferred below 140 DEG C.
In the specific implementation, the step S101 in the above method provided in an embodiment of the present invention, formed with pixel electrode
The first photosensitive organic layer is formed on the underlay substrate of figure, can be specifically accomplished by the following way：Formed with pixel electrode
Coating polyimide material, acryl material or phenolic resin material on the underlay substrate of figure；Wherein, polyimide material has
There is higher chemical stability, be preferred material.
In the specific implementation, the step S101 in the above method provided in an embodiment of the present invention, formed with pixel electrode
The first photosensitive organic layer is formed on the underlay substrate of figure, typically by the thickness control of the first photosensitive organic layer in 1-2 μ ms
It is preferred.
In the specific implementation, the step S103 in the above method provided in an embodiment of the present invention, after being handled by front baking
The first photosensitive organic layer on formed the second photosensitive organic layer, can specifically be accomplished by the following way：Handled by front baking
Coating polyimide material, acryl material or phenolic resin material on the first photosensitive organic layer afterwards；Wherein, polyimides material
Material has higher chemical stability, is preferred material.
It should be noted that the material of the second photosensitive organic layer can be identical with the material of the first photosensitive organic layer；Or
The material of second photosensitive organic layer can also be different from the material of the first photosensitive organic layer, do not limit herein.
In the specific implementation, the step S104 in the above method provided in an embodiment of the present invention, to the second photosensitive organic layer
Technique is patterned, formation includes spacer material figure, specifically may include steps of：
First, in 100s-200s time range, the second photosensitive organic layer is carried out at 100 DEG C -120 DEG C of front baking
Reason；Wherein, the second photosensitive organic layer is carried out in the time of front baking processing and the manufacture craft of existing array base palte at front baking
The time of reason is identical, before being carried out to the second photosensitive organic layer in the temperature of front baking processing and the manufacture craft of existing array base palte
The temperature for drying processing is identical；
Then, the second photosensitive organic layer after front baking is handled is exposed, development treatment, formation includes spacer material
Figure.
In the specific implementation, the step S105 in the above method provided in an embodiment of the present invention, to formed with spacer material figure
The first photosensitive organic layer on the underlay substrate of shape is patterned technique, and formation includes pixel and limits layer pattern, can specifically lead to
Cross in the following manner realization：First photosensitive organic layer is exposed, development treatment, formation includes pixel and limits layer pattern.
Below by a specific example to above-mentioned organic EL display panel provided in an embodiment of the present invention
The specific implementation of the preparation method of array base palte is described in detail.With the array base of organic EL display panel
Thin film transistor (TFT) in plate is to illustrate exemplified by top gate type (grid i.e. in thin film transistor (TFT) is located at the top of active layer), its
Preparation method, as shown in Fig. 2 a- Fig. 2 d, specifically comprise the following steps：
(1) the first photosensitive organic layer, is formed on the underlay substrate 3 formed with thin film transistor (TFT) 1 and the figure of pixel electrode 2
4, as shown in Figure 2 a；
(2) 150s-400s, the processing of 100 DEG C -120 DEG C of front baking, are carried out to the first photosensitive organic layer 4, it is photosensitive to remove first
Solvent in organic layer 4；
The step with the manufacture craft of existing array base palte front baking handle temperature under the same conditions, pass through
Extend the time handled the front baking of the first photosensitive organic layer, illustrated exemplified by the solvent in the first photosensitive organic layer of removal；
(3) the second photosensitive organic layer 5, is formed on the first photosensitive organic layer 4 after being handled by front baking, such as Fig. 2 b institutes
Show；
(4) 100s-200s, is carried out to the second photosensitive organic layer 5,100 DEG C -120 DEG C of front baking is handled；
(5), the second photosensitive layer 5 after front baking is handled is exposed, development treatment, formation includes the figure of spacer material 6
Shape, as shown in Figure 2 c；
(6), the first photosensitive organic layer 4 on the underlay substrate 3 formed with the figure of spacer material 6 is exposed, at development
Reason, formation include the figure of pixel confining layers 7, as shown in Figure 2 d；
(7) curing process, is carried out to the figure of spacer material 6 and the figure of pixel confining layers 7.
It should be noted that in the above method provided in an embodiment of the present invention, the portion such as thin film transistor (TFT) and pixel electrode
The manufacture craft of part is similar with existing manufacture craft, will not be described here.
It should be noted that in above-mentioned array base palte provided in an embodiment of the present invention, the type of thin film transistor (TFT) is not
It is confined to top gate type, or bottom gate type, do not limit herein.Also, above-mentioned array base palte provided in an embodiment of the present invention
Top emission type organic EL display panel is can apply to, or, bottom emitting type organic electroluminescent can also be applied to
Display panel, do not limit herein.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of array base of organic EL display panel
Plate, made using the above method provided in an embodiment of the present invention, the implementation of the array base palte of the organic EL display panel
The embodiment of the preparation method of the array base palte of above-mentioned organic EL display panel is may refer to, it is no longer superfluous to repeat part
State.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of display device, including the embodiment of the present invention carries
The array base palte of the above-mentioned organic EL display panel supplied, the display device can be：Mobile phone, tablet personal computer, television set,
Any product or part with display function such as display, notebook computer, DPF, navigator.The display device
Implementation may refer to the embodiment of the array base palte of above-mentioned organic EL display panel, repeats part and repeats no more.
Array base palte, preparation method and the display dress of a kind of organic EL display panel provided in an embodiment of the present invention
Put, in the preparation method of the array base palte, after the first photosensitive organic layer is formed, the first photosensitive organic layer is carried out at front baking
Reason, the solvent in the first photosensitive organic layer is removed, it is viscous between film layer where enhancing first photosensitive organic layer and pixel electrode
Attached property, and reduce the photonasty of the first photosensitive organic layer；Afterwards, the second photosensitive organic layer is formed on the first photosensitive organic layer,
And technique is patterned to the second photosensitive organic layer and forms spacer material figure, the first photosensitive organic layer will not be had an impact；It
Afterwards, technique is patterned to the first photosensitive organic layer and forms pixel restriction layer pattern, and to spacer material figure and pixel confining layers
Figure carries out one-step solidification processing；So, it is possible to reduce one-step solidification processing, so as to simplify spacer material and pixel confining layers
Manufacture craft, also, be not in organic material residual the problem of.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (8)
- A kind of 1. preparation method of the array base palte of organic EL display panel, it is characterised in that including：The first photosensitive organic layer is formed on the underlay substrate formed with pixel electrode figure；Front baking processing is carried out to the described first photosensitive organic layer, removes the solvent in the first photosensitive organic layer；The second photosensitive organic layer is formed on the first photosensitive organic layer after front baking processing；Technique is patterned to the described second photosensitive organic layer, formation includes spacer material figure；Technique is patterned to the first photosensitive organic layer on the underlay substrate formed with spacer material figure, formation includes pixel limit Given layer figure；Layer pattern is limited to the spacer material figure and the pixel and carries out curing process.
- 2. the method as described in claim 1, it is characterised in that it is described that front baking processing is carried out to the described first photosensitive organic layer, Specifically include：In 150s-400s time range, 100 DEG C -120 DEG C of front baking is carried out to the described first photosensitive organic layer and is handled.
- 3. the method as described in claim 1, it is characterised in that it is described that front baking processing is carried out to the described first photosensitive organic layer, Specifically include：In 100s-200s time range, 120 DEG C -140 DEG C of front baking is carried out to the described first photosensitive organic layer and is handled.
- 4. the method as described in claim any one of 1-3, it is characterised in that described in the substrate formed with pixel electrode figure The first photosensitive organic layer is formed on substrate, is specifically included：Coating polyimide material, acryl material or phenolic resin material on the underlay substrate formed with pixel electrode figure Material.
- 5. the method as described in claim any one of 1-3, it is characterised in that described in the substrate formed with pixel electrode figure The first photosensitive organic layer is formed on substrate, is specifically included：It is 1-2 μ that thickness is formed on the underlay substrate formed with pixel electrode figuremThe first photosensitive organic layer.
- 6. the method as described in claim any one of 1-3, it is characterised in that it is described by the front baking processing after first The second photosensitive organic layer is formed on photosensitive organic layer, is specifically included：Coating polyimide material, acryl material or phenolic aldehyde tree on the first photosensitive organic layer after front baking processing Fat material.
- 7. the method as described in claim any one of 1-3, it is characterised in that described that structure is carried out to the described second photosensitive organic layer Figure technique, formation include spacer material figure, specifically included：In 100s-200s time range, 100 DEG C -120 DEG C of front baking is carried out to the described second photosensitive organic layer and is handled；The second photosensitive organic layer after front baking is handled is exposed, development treatment, formation includes spacer material figure.
- 8. the method as described in claim any one of 1-3, it is characterised in that described to the substrate base formed with spacer material figure The first photosensitive organic layer on plate is patterned technique, and formation includes pixel and limits layer pattern, specifically includes：Described first photosensitive organic layer is exposed, development treatment, formation includes pixel and limits layer pattern.
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| CN103839964A (en) * | 2012-11-20 | 2014-06-04 | 乐金显示有限公司 | Organic electro-luminescent device and method of fabricating the same |
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