CN104575485A - Controllable compound sound absorption plate - Google Patents
Controllable compound sound absorption plate Download PDFInfo
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- CN104575485A CN104575485A CN201410844110.6A CN201410844110A CN104575485A CN 104575485 A CN104575485 A CN 104575485A CN 201410844110 A CN201410844110 A CN 201410844110A CN 104575485 A CN104575485 A CN 104575485A
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Abstract
The invention relates to the technical field of sound absorption, in particular relates to a controllable compound sound absorption plate. The controllable compound sound absorption plate comprises a plate body consisting of a plurality of layers of piezoelectric films which are arranged in a fitting manner, a noise frequency collection element and a sound absorption controller, wherein a plurality of penetrating sound absorption holes are formed in each layer of piezoelectric film; at least part of the sound absorption holes in every two adjacent layers of piezoelectric films are communicated in a staggering manner so as to form muffling gaps; the noise frequency collection element is used for acquiring the frequency of environmental noise; the signal receiving port of the sound absorption controller is connected with the signal output port of the noise frequency collection element; the sound absorption controller is electrically connected with a pressure thin film through a wire so as to apply excitation voltage to the piezoelectric films. In the working process, the excitation voltage is applied to the piezoelectric films to generate deformation, so that the apertures on the piezoelectric films are correspondingly changed or the sizes of the muffling gaps are indirectly changed by changing the staggering degree; therefore, the effective sound absorption frequency band of the sound absorption structure is expanded. Compared with the prior art, the controllable compound sound absorption plate has the characteristics of high easiness in structural processing, low production cost and outstanding sound absorption effect.
Description
Technical field
The present invention relates to sound absorption technique field, particularly relate to a kind of controlled sound-absorbing composite board.
Background technology
In noise control engineering, microperforated panel resonant structure is a kind of sound absorption technique of extensive employing.As everyone knows, microperforated panel structure wears to be less than with aperture the slit that the micropore of 1.0mm or width be less than 1.0mm on the thin plate that thickness of slab is less than 1.0mm, percentage of perforation is between 0.3-5%, and postlaminar part leaves the air layer of certain thickness (1-20cm), does not fill out any acoustic absorbant in cavity.The sound absorbing mechanism of its resonance sound-absorbing structure is, the system class of the air layer composition corresponding thereto of each perforation on microperforated panel is similar to Helmholtz resonator, and microperforated panel resonance sound-absorbing structure can be regarded as the parallel connection of many Helmholtz resonators.Just excite air vibration in cavity when sound wave enters after aperture, if when frequency of sound wave is identical with this structure resonant frequency, chamber air just resonates, perforated plate pore-throat place air column is of reciprocating vibration, and speed, amplitude reach maximal value, and friction is also maximum with damping; Now, make acoustic energy change heat energy into maximum, namely sound energy consumption is maximum, thus plays efficient sound absorption.
Based on above-mentioned performance advantage, microperforated panel resonant structure is widely applied in various fields, as aircraft noise reduction, gymnasium sound absorption, ventilating duct sound absorption etc.But the pore size cross sectional face of micropore gap xsect that is less or slit is less, and difficulty of processing is larger; And for existing traditional individual layer microperforated panel resonance sound-absorbing structure, its centre frequency that effectively absorbs sound fix and frequency band narrow nature of the noise circumstance that it can not tackle above-mentioned complexity effectively.
In view of this, urgently looking for another way is optimized design for existing microperforated panel resonant structure, effectively to overcome above-mentioned defect, on the basis promoting technology capability, for the sound absorption adapting to different occasion requires to provide reliable guarantee.
Summary of the invention
(1) technical matters that will solve
The technical problem to be solved in the present invention solves the sound-absorbing composite board providing a kind of handling ease, controllable sound absorbing capabilities.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of controlled sound-absorbing composite board, comprise the plate body of the multi-layer piezoelectric film formation that laminating is arranged, noise frequency acquisition elements and sound absorption controller; Wherein, every layer of described piezoelectric membrane is provided with multiple through sound-absorbing hole, and at least part of described sound-absorbing hole dislocation on piezoelectric membrane described in adjacent two layers is communicated with, and forms noise elimination gap; Described noise frequency acquisition elements is for obtaining neighbourhood noise frequency; The receiver port of described sound absorption controller is connected with the signal output port of described noise frequency acquisition elements, and described sound absorption controller is electrically connected with described pressure film by lead-in wire, to apply driving voltage to described piezoelectric membrane.
Preferably, described noise frequency acquisition elements is microphone, and exports described sound absorption controller according to the noise frequency obtained in the mode of voltage signal.
Preferably, described sound absorption controller is voltage modulation circuit.
Preferably, described voltage modulation circuit is configured with: memory module, stores the aperture of described sound-absorbing hole and the first relation table of driving voltage threshold value on default piezoelectric membrane, and second relation table in the aperture of noise frequency and described sound-absorbing hole; Multilevel iudge module, searches described first relation table and described second relation table successively according to described noise frequency, obtains the required driving voltage applied.
Preferably, described in adjacent two layers, the relative position of piezoelectric membrane is adjustable, to adjust the size in described noise elimination gap.
Preferably, the perforation shape on every layer of described piezoelectric membrane, size are identical with arrangement mode.
Preferably, perforation shape, size and arrangement mode on every layer of described piezoelectric membrane are different.
Preferably, described piezoelectric membrane is multipolymer piezoelectric membrane, crosslinked polypropylene piezoelectric membrane or PVDF piezoelectric film.
Preferably, all sound-absorbing hole described in adjacent two layers between piezoelectric membrane all misplace connection.
(3) beneficial effect
Technique scheme tool of the present invention has the following advantages:
Controlled sound-absorbing composite board provided by the invention, effectively make use of the inverse piezoelectric effect characteristic of piezoelectric membrane, and the piezoelectric membrane that lamination coating is arranged all offers sound-absorbing hole, and is communicated with formation noise elimination gap in the dislocation of binding face place, forms microperforated panel structure thus.Setting like this, adds and only needs man-hour to process larger hole on piezoelectric membrane, and namely the adjacent two layers film arranged by dislocation can form small size sound absorption gap, is easy to processing, solves the problem that prior art processes micropore or slit difficulty on acoustic board.In addition, in the course of work, sound absorption controller environmentally noise frequency can apply excitation electrical field to piezoelectric membrane, the deformation of piezoelectric membrane makes the aperture of the sound-absorbing hole on it produce corresponding change, or change degree of misalignment between adj acent piezoelectric film, thus indirectly can change the size in the noise elimination gap that laminating place is formed, realize noise elimination gap size and there is adjustability, acoustic board is capable of circulation in real time for the controlled Active Absorption performance of different frequency noise thus, expands effective sound sucting band of this sound absorption structure.Compared with prior art, have structure handling ease, production cost is low, acoustically effective outstanding feature.
Accompanying drawing explanation
Fig. 1 is the one-piece construction schematic diagram of controlled sound-absorbing composite board described in the specific embodiment of the invention;
Fig. 2 is the vertical view of plate body shown in Fig. 1;
Fig. 3 is the A-A sectional view of Fig. 2.
In figure:
Plate body 1, piezoelectric membrane 11, sound-absorbing hole 111, piezoelectric membrane 12, sound-absorbing hole 121, noise elimination gap 13, sound absorption controller 2, noise frequency acquisition elements 3.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Refer to Fig. 1, the figure shows the one-piece construction schematic diagram of controlled sound-absorbing composite board described in present embodiment.
The piezoelectric membrane 11 that the plate body 1 of this controlled sound-absorbing composite board is arranged by laminating and piezoelectric membrane 12 are formed.Every lamination conductive film is provided with multiple through sound-absorbing hole, and the sound-absorbing hole 111 on piezoelectric membrane 11 and the sound-absorbing hole 121 on piezoelectric membrane 12 misplace at binding face and are communicated with, and form noise elimination gap 13.Specifically please also refer to Fig. 2 and Fig. 3, wherein, Fig. 2 is the vertical view of plate body shown in Fig. 1, and Fig. 3 is the A-A sectional view of Fig. 2.Here " dislocation be communicated with " refers to, when piezoelectric membrane 11 and piezoelectric membrane 12 are fitted, the center of the sound-absorbing hole between two membranes is not on same straight line, only has the local of sound-absorbing hole to be in connected state, other parts cover by face.Just excite air vibration in cavity when sound wave enters behind noise elimination gap 13, when frequency of sound wave is identical with this structure resonant frequency, chamber air just resonates, and makes acoustic energy change heat energy into, thus plays efficient sound absorption.
In this programme, piezoelectric membrane 11 and piezoelectric membrane 12 are electrically connected respectively by the control signal output terminal of lead-in wire with sound absorption controller 2, and the receiver port of sound absorption controller 2 is connected with the signal output port of noise frequency acquisition elements 3.Noise frequency acquisition elements 3 for obtaining neighbourhood noise frequency, and exports sound absorption controller 2 to, and then applies driving voltage by sound absorption controller 2 to piezoelectric membrane 11 and piezoelectric membrane 12, forms alternating electric field.Setting like this, the inverse piezoelectric effect of piezoelectric membrane is utilized to produce deformation, make the piercing aperture on piezoelectric membrane produce corresponding change, realize the controlled Active Absorption performance of this sound absorption plate body for different frequency noise, expand effective sound sucting band of this sound absorption structure.
Should be appreciated that aforementioned sound absorption controller 2 can adopt single-chip microcomputer to be that control module performs, voltage modulation circuit also can be adopted to apply driving voltage.The concrete arrangements of components of this voltage modulation circuit according to existing techniques in realizing, therefore can repeat no more herein.
Wherein, the relative position of piezoelectric membrane 11 and piezoelectric membrane 12 is adjustable, to adjust the size in noise elimination gap 13, adapts to different application scenarios.Special instruction, this plate body 1 is not limited to be fitted by two-layer piezoelectric membrane shown in figure and forms, and in fact, the piezoelectric membrane laminating of other plural layer also can be adopted as required to form this plate body 1, such as, three layers or four layers etc.In addition, two-layer piezoelectric membrane can be all monolithic membrane, obviously, only with regard to the realization of microperforated panel structure, also can comprise the sub-film that lamination coating is arranged.
For every lamination conductive film, perforation shape on it, size can be identical with arrangement mode, or perforation shape, size are identical with any one or the two selectivity in arrangement mode, identical driving voltage is exported by sound absorption controller 2, and then produce identical varying aperture, or degree of misalignment between change piezoelectric membrane, thus the size that indirectly can change the noise elimination gap 13 that laminating place is formed.Certainly, perforation shape, size and arrangement mode on every straton film are different, export different driving voltage respectively, regulate and control, adapt to different application situations for different piezoelectric membranes 1 during concrete control by sound absorption controller 2.Such as, the shape of sound-absorbing hole 111 and sound-absorbing hole 121 can be the circular hole shown in figure, also can according to being set to rectangle, sexangle, ellipse or irregularly shaped; Each sound-absorbing hole can matrix arrangement as shown in FIG., and other modes also can be adopted to arrange.
Certainly, compared to exporting the design of identical driving voltage to each piezoelectric membrane, in theory, the single-chip microcomputer design that different driving voltage exports or voltage modulation circuit design will be relatively loaded down with trivial details.
Wherein, noise frequency acquisition elements 3 is microphone, and exports sound absorption controller 2 according to the noise frequency obtained in the mode of voltage signal.For converting tones into the microphone of electric signal, technology relative maturity, on the basis meeting signals collecting function, deployment cost is relatively low.Microphone is preferably arranged on the front side of plate body 1, is also sound source side.
Wherein, voltage modulation circuit is adopted to apply driving voltage, this circuit can be configured to and comprises: memory module and multilevel iudge module, this memory module is for first relation table in the aperture and driving voltage threshold value that store sound-absorbing hole on default piezoelectric membrane, and second relation table in the aperture of noise frequency and sound-absorbing hole; This multilevel iudge module can search the first relation table and the second relation table successively according to noise frequency, obtains the required driving voltage applied.That is, the noise frequency that voltage modulation circuit can receive according to microphone, determines the best micropunch aperture absorbed needed for this noise; Then the optimum aperture needed for the piezoelectric effect Changing Pattern of piezoelectric membrane self and this noise of absorption of obtaining, the driving voltage needed for generation, and apply excitation electrical field by lead-in wire to piezoelectric membrane.
In addition, piezoelectric membrane 11 and piezoelectric membrane 12 can be multipolymer piezoelectric membrane, crosslinked polypropylene piezoelectric membrane or PVDF piezoelectric film.In this programme, the sound-absorbing hole 111 on piezoelectric membrane 11 all misplaces with the sound-absorbing hole 121 on piezoelectric membrane 12 and is communicated with, and certainly, the sound-absorbing hole partial transposition on two-layer piezoelectric membrane is communicated with, and also can meet the function needs of basic power consumption sound absorption.
The sound absorbing mechanism of compound sound-absorption structural of the present invention is as follows:
When sound wave arrives plate body 1 surface of sound-absorbing composite board, sound enters the sound-absorbing hole 111 of piezoelectric membrane 11, behind the noise elimination gap 13 that dislocation is communicated with, enters the sound-absorbing hole 121 of piezoelectric membrane 12.Therefore, when sound is by acoustic board, sound, except having except energy loss when flowing through noise elimination gap, also has energy loss when flowing through sound-absorbing hole, improves the sound absorption efficiency of acoustic board.Meanwhile, the size of sound-absorbing hole and noise elimination gap xsect, be subject to the control of sound absorption controller 2, the frequency of sound wave that can detect according to microphone regulates in real time, and then can change the sound sucting band of composite sound damping structure, regulates sound absorbing capabilities.
It should be noted that, in figure sound-absorbing hole be 3*5 line-column matrix arrangement, only for carrying out exemplary illustration, and the restriction to technical scheme can not be interpreted as, as long as meet aforementioned sound absorption community function needs all the application's request protect scope in.
The present invention has the following advantages:
(1) acoustic board of the present invention adopts the laminating of two-layer lamination electroporation film to form, the noise elimination gap that sound-absorbing hole between adj acent piezoelectric film is communicated with in the dislocation of binding face place, namely noise elimination gap is equivalent to micropore or the slit of prior art, what make acoustic board of the present invention is adding man-hour, do not need to process tiny micropore or slit structure, only need to process larger hole on daughter board, arrange that namely daughter board can form sound absorption gap by dislocation, solve the problem that prior art processes micropore or slit difficulty on acoustic board, reduce production cost.
(2) acoustic board of the present invention is lamination layer structure, and except having except acoustically effective in sound absorption gap, the sound-absorbing hole of every laminate also has acoustical absorptivity, thus improves acoustically effective.
(3) size of sound-absorbing hole of the present invention and noise elimination gap xsect, be subject to the control of sound absorption controller, the frequency of sound wave that can detect according to microphone regulates in real time, and then the sound sucting band of composite sound damping structure can be changed, reach Active Absorption requirement, meet the sound absorption requirement of different occasion, be widely used.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (9)
1. a controlled sound-absorbing composite board, is characterized in that, comprising:
Plate body, comprise the multi-layer piezoelectric film that laminating is arranged, every layer of described piezoelectric membrane is provided with multiple through sound-absorbing hole, and at least part of described sound-absorbing hole dislocation on piezoelectric membrane described in adjacent two layers is communicated with, and forms noise elimination gap;
Noise frequency acquisition elements, for obtaining neighbourhood noise frequency; With
Sound absorption controller, its receiver port is connected with the signal output port of described noise frequency acquisition elements, and described sound absorption controller is electrically connected with described pressure film by lead-in wire, to apply driving voltage to described piezoelectric membrane.
2. controlled sound-absorbing composite board according to claim 1, is characterized in that, described noise frequency acquisition elements is microphone, and exports described sound absorption controller according to the noise frequency obtained in the mode of voltage signal.
3. controlled sound-absorbing composite board according to claim 1 and 2, is characterized in that, described sound absorption controller is voltage modulation circuit.
4. controlled sound-absorbing composite board according to claim 3, is characterized in that, described voltage modulation circuit is configured with:
Memory module, stores the aperture of described sound-absorbing hole and the first relation table of driving voltage threshold value on default piezoelectric membrane, and second relation table in the aperture of noise frequency and described sound-absorbing hole;
Multilevel iudge module, searches described first relation table and described second relation table successively according to described noise frequency, obtains the required driving voltage applied.
5. controlled sound-absorbing composite board according to claim 4, is characterized in that, described in adjacent two layers, the relative position of piezoelectric membrane is adjustable, to adjust the size in described noise elimination gap.
6. controlled sound-absorbing composite board according to claim 5, is characterized in that, it is characterized in that, the perforation shape on every layer of described piezoelectric membrane, size are identical with arrangement mode.
7. controlled sound-absorbing composite board according to claim 5, is characterized in that, it is characterized in that, perforation shape, size and arrangement mode on every layer of described piezoelectric membrane are different.
8. controlled sound-absorbing composite board according to claim 1, is characterized in that, described piezoelectric membrane is multipolymer piezoelectric membrane, crosslinked polypropylene piezoelectric membrane or PVDF piezoelectric film.
9. controlled sound-absorbing composite board according to claim 1, is characterized in that, all sound-absorbing hole described in adjacent two layers between piezoelectric membrane all misplace connection.
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| CN107316632A (en) * | 2017-06-14 | 2017-11-03 | 中国农业大学 | A kind of sound absorber and sound absorption method |
| IT201700010342A1 (en) * | 2017-01-31 | 2018-07-31 | St Microelectronics Srl | MEMS DEVICE INCLUDING A PIEZOELECTRIC ACTUATOR WITH A REDUCED VOLUME |
| CN108417195A (en) * | 2018-06-13 | 2018-08-17 | 山东理工大学 | A kind of middle low frequency absorption metamaterial structure based on resonant cavity |
| CN112053674A (en) * | 2020-09-15 | 2020-12-08 | 中国科学院合肥物质科学研究院 | Combined micro-perforated plate sound absorber structure based on piezoelectric material and preparation method thereof |
| CN113012673A (en) * | 2021-03-16 | 2021-06-22 | 合肥工业大学 | Sound absorption frequency band adjustable sound absorber |
| US11818957B2 (en) | 2019-01-21 | 2023-11-14 | Stmicroelectronics S.R.L. | Piezoelectrically actuated MEMS optical device having a protected chamber and manufacturing process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| IT201700010342A1 (en) * | 2017-01-31 | 2018-07-31 | St Microelectronics Srl | MEMS DEVICE INCLUDING A PIEZOELECTRIC ACTUATOR WITH A REDUCED VOLUME |
| US10513428B2 (en) | 2017-01-31 | 2019-12-24 | Stmicroelectronics S.R.L. | MEMS device including a piezoelectric actuator with a reduced volume |
| CN107316632A (en) * | 2017-06-14 | 2017-11-03 | 中国农业大学 | A kind of sound absorber and sound absorption method |
| CN108417195A (en) * | 2018-06-13 | 2018-08-17 | 山东理工大学 | A kind of middle low frequency absorption metamaterial structure based on resonant cavity |
| CN108417195B (en) * | 2018-06-13 | 2023-11-10 | 山东理工大学 | Medium-low frequency sound absorption metamaterial structure based on resonant cavity |
| US11818957B2 (en) | 2019-01-21 | 2023-11-14 | Stmicroelectronics S.R.L. | Piezoelectrically actuated MEMS optical device having a protected chamber and manufacturing process thereof |
| CN112053674A (en) * | 2020-09-15 | 2020-12-08 | 中国科学院合肥物质科学研究院 | Combined micro-perforated plate sound absorber structure based on piezoelectric material and preparation method thereof |
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| CN113012673A (en) * | 2021-03-16 | 2021-06-22 | 合肥工业大学 | Sound absorption frequency band adjustable sound absorber |
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