CN104559663A - Powder coating for electronic element - Google Patents
Powder coating for electronic element Download PDFInfo
- Publication number
- CN104559663A CN104559663A CN201410838255.5A CN201410838255A CN104559663A CN 104559663 A CN104559663 A CN 104559663A CN 201410838255 A CN201410838255 A CN 201410838255A CN 104559663 A CN104559663 A CN 104559663A
- Authority
- CN
- China
- Prior art keywords
- powder coating
- powder
- epoxy resin
- coating
- electronic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/22—Luminous paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
A powder coating for an electronic element mainly comprises ingredients as follows: epoxy resin, modified silicon carbide, silica powder, magnesium oxide, a curing agent, pigment and fluorescent powder. Through scientific matching of raw materials and a reasonable preparation method, the powder coating has superhigh wear resistance, impact resistance and adhesion force.
Description
Technical field
Paint field of the present invention, is specifically related to a kind of electronic component powder coating.
Background technology
Powder coating is a kind of dry state pressed powder not containing organic solvent, it is different with water-borne coatings from the coating of common solvent type, do not need during application with solvent or water as dispersion medium, but using air as dispersion medium, be coated with equably and be contained in workpiece surface, form a kind of new coating of film after heating, this is the remarkable difference part with other coating.Powder coating is a kind of coating variety of high speed development, there is the advantage such as energy-conserving and environment-protective, three-waste free pollution, be used widely at present, but some electronic components are higher to requirement that is wear-resisting, shock-resistance, powder coating in the market cannot meet its requirement.
Summary of the invention
The object of the present invention is to provide a kind of high-strength abrasion-proof electronic component powder coating and preparation method.
The invention provides a kind of electronic component powder coating, be made up of the component of following weight percent:
Epoxy resin 25%-40%
Silicon powder 15%-25%
Solidifying agent 5%-15%
Fluorescent material 3%-5%
Pigment 7%-12%
Carbon modified SiClx 15%-25%
Magnesium oxide 1.5-3%
Preferably, described silicon powder particle diameter is 200 orders.
Preferably, described solidifying agent is organic acid or acid anhydride type curing agent.
Preferably, described epoxy resin epoxy equivalent is 6000-10000g/eq.
One, epoxy resin:
Epoxy resin is the organic compound containing two or more epoxide groups in general reference molecule, and except indivedual, their relative molecular mass is not high.The molecular structure of epoxy resin be with in molecular chain containing active epoxide group for its feature, epoxide group can be positioned at the end of molecular chain, centre or structure circlewise.Due in molecular structure containing active epoxide group, make they can with polytype solidifying agent generation crosslinking reaction and formed and insoluble, not molten there is the cancellated superpolymer of three-dimensional.
Epoxy resin is one of very important thermoset macromolecule material, has cohesive strength high, and electrical insulation capability is good, the advantages such as shrinkability is low, good processability, is widely used in each fields such as electronics, machinery, building.
It is that main raw material prepares powder coating that the present invention selects epoxy equivalent (weight) to be the epoxy resin of 6000-10000g/eq.
Two, silicon powder
Silicon powder is by natural quartz (SiO
2) or fused quartz (natural quartz is through high-temperature fusion, cooled amorphous Si O
2) through the micro mist of the multiple tracks processes such as broken, ball milling (or vibration, airflow milling), flotation, pickling purification, high purity water process.Silicon powder is a kind of nontoxic, tasteless, free of contamination ceramic.Due to it possess that temperature tolerance is good, the excellent performance such as acid-alkali-corrosive-resisting, poor thermal conductivity, high insulation, low bulk, stable chemical performance, hardness are large, be widely used in the fields such as chemical industry, electronics, unicircuit (IC), electrical equipment, plastics, coating, senior paint, rubber, national defence.
Silicon powder is widely used in high-grade high-performance low-cement refractory pouring material and prefabricated component, and work-ing life is three times of common mould material, and refractoriness improves about 100 DEG C, and hot strength and thermal shock resistance all obviously improve.Be widely used in: the industries such as coke oven, ironmaking, steel-making, steel rolling, non-ferrous metal, glass, pottery and generating.
Three, solidifying agent
Solidifying agent has another name called stiffening agent, ripening agent or set agent, is that a class is promoted or controls material or the mixture of curing reaction.Resin solidification is through the chemical reactions such as condensation, closed loop, addition or catalysis, makes thermosetting resin that irreversible change procedure occur, and solidification has come by adding solidification (being cross-linked) agent.
The present invention selects organic acid or acid anhydride type curing agent.
Embodiment
Embodiment 1
The invention provides a kind of high-strength abrasion-proof electronic component powder coating, be made up of the component of following weight percent:
Epoxy resin 35%
Silicon powder 18%
Solidifying agent 10%
Fluorescent material 4%
Pigment 8%
Carbon modified SiClx 20%
Magnesium oxide 3%
Described solidifying agent is acid anhydride type curing agent.
Described epoxy resin epoxy equivalent is 6000-10000g/eq.
The above; be only the present invention's preferably embodiment; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.
Claims (3)
1. an electronic component powder coating, is characterized in that, is made up of the component of following weight percent:
Epoxy resin 25%-40%
Silicon powder 15%-25%
Solidifying agent 5%-15%
Fluorescent material 3%-5%
Pigment 7%-12%
Carbon modified SiClx 15%-25%
Magnesium oxide 1.5-3%.
2. powder coating as claimed in claim 1, it is characterized in that, described silicon powder particle diameter is 200 orders.
3. powder coating as claimed in claim 1, it is characterized in that, described epoxy resin epoxy equivalent is 6000-10000g/eq.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410838255.5A CN104559663A (en) | 2014-12-30 | 2014-12-30 | Powder coating for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410838255.5A CN104559663A (en) | 2014-12-30 | 2014-12-30 | Powder coating for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104559663A true CN104559663A (en) | 2015-04-29 |
Family
ID=53076763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410838255.5A Pending CN104559663A (en) | 2014-12-30 | 2014-12-30 | Powder coating for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104559663A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105273575A (en) * | 2015-10-30 | 2016-01-27 | 湖州大成纺织有限公司 | High-strength abrasion-resistant electronic component powder coating and preparation method thereof |
| CN105419558A (en) * | 2015-11-25 | 2016-03-23 | 浙江华彩化工有限公司 | Antibacterial electronic component fluorescent powder coating and preparation method thereof |
-
2014
- 2014-12-30 CN CN201410838255.5A patent/CN104559663A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105273575A (en) * | 2015-10-30 | 2016-01-27 | 湖州大成纺织有限公司 | High-strength abrasion-resistant electronic component powder coating and preparation method thereof |
| CN105273575B (en) * | 2015-10-30 | 2018-07-24 | 山东涂亿粉末科技有限公司 | A kind of high-strength abrasion-proof electronic component powdery paints and preparation method thereof |
| CN105419558A (en) * | 2015-11-25 | 2016-03-23 | 浙江华彩化工有限公司 | Antibacterial electronic component fluorescent powder coating and preparation method thereof |
| CN105419558B (en) * | 2015-11-25 | 2019-02-01 | 浙江华彩新材料有限公司 | A kind of antibacterial electronic component fluorescent powder coating and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150429 |
|
| WD01 | Invention patent application deemed withdrawn after publication |