CN104549840B - Device and method for double-sided spraying of boron diffusion source - Google Patents
Device and method for double-sided spraying of boron diffusion source Download PDFInfo
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- CN104549840B CN104549840B CN201410809882.6A CN201410809882A CN104549840B CN 104549840 B CN104549840 B CN 104549840B CN 201410809882 A CN201410809882 A CN 201410809882A CN 104549840 B CN104549840 B CN 104549840B
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- sample
- bearing base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a device for double-sided spraying of a boron diffusion source. The device comprises an ejector and a bearing base, wherein the bearing base is arranged opposite to the ejecting direction of the ejector; the bearing base comprises a positioning hole formed in the bottom of the bearing base and used for fixing the bearing base, a positioning edge for positioning a spraying sample and fixing the sample, and a support step for supporting the spraying sample, so that a gap exists between the spraying sample and the base surface at the bottom of the step. The invention also provides a method for double-sided spraying of the boron diffusion source.
Description
Technical field
The present invention relates to field of semiconductor devices, be specifically related to a kind of boron diffusion source double-face spray painting device and method.
Background technology
In quasiconductor diffusion technique, boron is a kind of common p type impurity source.The boron diffusion source that market is conventional at present
Kind has Boron tribromide, diboron trioxide, boron nitride and boracic organic solvent etc., and these boron diffusion sources finally exist
Effective ingredient in diffusion furnace is all diboron trioxide.Wherein, liquid boron diffusion source generally uses gas to carry
Mode introduces diffusion furnace (such as Boron tribromide and boracic organic solvent), and which uniformity is poor, and waste is relatively big,
And it is bigger on facility environment impact.Part boracic organic solvent can prepare film forming by the way of spin coating, but its material
The cost of material itself is higher.Boron nitride and the diboron trioxide of solid-state are usually pulverulence, can pass through glass fibers
Other substance modulation affecting boron diffusion nothing such as dimension become source lamellar, use boron source sheet to carry out boron diffusion relatively costly
And production capacity is relatively low.Boron nitride crystal hardness is high, and the sheet of making relatively diboron trioxide in source has some superiority, but is used for spraying
During painting mode, boron nitride does not dissolves in common solvents.And diboron trioxide water soluble, alcohol equal solvent.Ethanol is
A kind of common, inexpensive solvent, and high volatility.For spraying diboron trioxide powder, analysis of can comparatively fast volatilizing
Go out crystal, form diboron trioxide powder knoisphere on silicon chip (or other semi-conducting material) surface.
Existing diboron trioxide powder spraying device, when silicon chip is placed on base, by vac sorb on base,
At the uniform velocity rotate with suction nozzle.Diboron trioxide solution by ejector formed spraying uniformly fall rotate silicon chip (or
Other semi-conducting material) on.Along with ethanol volatilizees rapidly, analyse on silicon chip (or other semi-conducting material) surface
Go out uniform metaboric acid and boric acid powder (being affected by the moisture in ethanol solution and air).These metaboric acids and
Boric acid powder is functionally equivalent to diboron trioxide in quasiconductor boron diffusion technique.
When the silicon chip (or other semi-conducting material) of one side spraying diboron trioxide carries out the diffusion of two-sided boron, two sides
There is larger difference in doping content.For improve two-sided boron diffusion two surface uniformities, need to silicon chip (or other
Semi-conducting material) two sides carries out diboron trioxide spraying.After spraying due to diboron trioxide the powder that formed with
The adhesiveness of silicon chip (or other semi-conducting material) is general, and existing diboron trioxide spraying technology is used for two-sided spray
Problems with it is primarily present: when prior art is used for double-face spray painting during painting, upset silicon chip (or other quasiconductor material
Material) carry out second spraying time, base contact with silicon chip understand the powder of first is rubbed, cause first
Powder uniformity is relatively low, and then affects the uniformity of boron diffusion；Prior art, when double-face spray painting, is being carried out
During second spraying, the powder uniformity that pull of vacuum also results in first is relatively low.
Summary of the invention
The invention provides a kind of boron diffusion source double-face spray painting device both methods, apparatus and method of the present invention is from holding
Carry and be designed in the structure put, eliminate lacking when existing boron diffusion source spraying technology carries out double-face spray painting
Point, is a kind of device and method realizing boron diffusion source double-face spray painting.
First embodiment of the present invention relates to a kind of boron diffusion source double-face spray painting device, including:
Ejector；
Bearing base, it is oppositely arranged with the injection direction of ejector, and described bearing base includes:
It is positioned at the hole, location bottom bearing base, is used for fixing bearing base；
For positioning the edge, location of spraying sample, it is used for fixing sample；With
For supporting the support level of described spraying sample so that holding bottom described spraying sample and step
Carry and there is space between the bottom surface of base.
In a preferred embodiment of the present invention, at the bottom of described bearing base is the carrying that can rotate in a circumferential direction
Seat.
In a preferred embodiment of the present invention, described device also includes alignment pin, itself and described location
Hole is equipped with, and is used for positioning described bearing base.
In a preferred embodiment of the present invention, described device also includes vacuum cups, and it is arranged on described
In alignment pin, for fixing described sample by evacuation.
A kind of method carrying out boron diffusion double-face spray painting, including:
I) above-mentioned device is provided；
Ii) sample is placed on described bearing base, makes the inner side at edge, location connect with the outward flange of described sample
Touch, thus fix described sample by clamping；And make the edge of described sample be placed on described support level,
Make to there is space between the bottom surface of the bearing base below the face towards base direction of sample and step；
Iii) by ejector, the one side of sample is sprayed boron-containing solution；After spraying terminates, sample is overturn,
According to above-mentioned same method, the another side of sample is sprayed described boron-containing solution.
In a preferred embodiment of the present invention, use vacuum cups that by evacuation, sample is fixed on institute
State sample.
In a preferred embodiment of the present invention, when to sample spraying boron-containing solution, make at the bottom of described carrying
Seat rotarily drives described rotary sample.
In a preferred embodiment of the present invention, described sample is semi-conducting material, preferably silicon chip.
In a preferred embodiment of the present invention, described boron-containing solution is the ethanol solution of diboron trioxide.
Beneficial effects of the present invention:
The present invention has invented a kind of bearing base for boron diffusion source spraying, and this base possesses advantages below:
The base of assembly of the invention is placed on vertical vacuum cups, is fixed by vacuum during rotation, handling
Simply；During the bearing base carrying silicon chip of the present invention, by location edge locked silicon chip, when preventing silicon slice rotating from
The heart drops, it is to avoid vacuum influence coating；When bearing base places silicon chip, silicon chip edge is placed in the support platform of base
On rank so that silicon chip zone line not with base contacts；Silicon chip radius is circular more than by the base under built on stilts position
Zone radius, takes out silicon chip after facilitating boron source spraying；The boron diffusion source spraying side realized based on this bearing base
Method can realize double-face spray painting.
Accompanying drawing explanation
Fig. 1 is the diboron trioxide powder spraying device schematic diagram in an embodiment of the invention.
Fig. 2 is the bearing base top view in an embodiment of the invention.
Fig. 3 is the bearing base carrying silicon chip in an embodiment of the invention and AA section.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in detail, but protection scope of the present invention does not limit
In following example.
As it is shown in figure 1, the inventive system comprises core component ejector 1, described ejector upper port connects pressure
Contracting air, lower port has been atomizing nozzle, and left port connects diboron trioxide ethanol solution.When compressed air quickly from
Top port, when nozzle flows through, will form the negative pressure relative to left port in pipe, thus by three oxidations two
B solution sucking-off from container, and form spraying through nozzle.Described silicon chip 2 is placed on bearing base 3, institute
The hole 5, location stating bearing base coordinates with the alignment pin 4 with vacuum cups so that described bearing base is consolidated
Fixed.
As in figure 2 it is shown, the bearing base 3 of assembly of the invention can be circular, and existence 4 is symmetrical arranged
Edge 7, location；As it is shown on figure 3, the inner side at edge, each location 7 is provided with support level 6, described support
Step 6 and edge 7, location coordinate and are fixed on described support base 3 by described silicon chip 2, and make described silicon
The lower surface of sheet 2 does not contacts with the bottom surface supporting base 3 bottom described support level 6, thus protection is described
The surface of silicon chip 2 is the most frayed, to ensure that described silicon chip 2 two sides sprays the quality of described B solution.
Embodiment 1
Silicon chip 2 is placed on described bearing base 3, by positioning edge 7 and support level 6 by described silicon chip
It is fixed on described support base 3, so that the face towards base direction of silicon chip 2 and support level 6 times
Space is there is between the bottom surface supporting base 3 of side；And open alignment pin 4 vacuum cups, by sample simultaneously
It is fixed on described sample by evacuation.
Ejector 1 is used to be ejected on described silicon chip 2 by the ethanol solution (3 weight %) of diboron trioxide,
When silicon chip sprays the ethanol solution of diboron trioxide, described bearing base is made to rotate with the rotating speed of 20r/min
Drive described rotary sample.Time about 5s.
After the one side spraying of silicon chip terminates, by silicon wafer turnover so that coat the ethanol solution of diboron trioxide
Time one face down, and the another side that sprays will not carried out upward, thus this another side entered according to the method described above
Row spraying.So, it is achieved the two sides of silicon chip is sprayed.
Embodiment 2
Silicon chip 2 is placed on described bearing base 3, by positioning edge 7 and support level 6 by described silicon chip
It is fixed on described support base 3, so that the face towards base direction of silicon chip 2 and support level 6 times
Space is there is between the bottom surface supporting base 3 of side；And open alignment pin 4 vacuum cups, by sample simultaneously
It is fixed on described sample by evacuation.
Ejector 1 is used to be ejected on described silicon chip 2 by the ethanol solution (15 weight %) of diboron trioxide,
When silicon chip sprays the ethanol solution of diboron trioxide, described bearing base is made to rotate with the rotating speed of 100r/min
Drive described rotary sample.Time about 30s.
After the one side spraying of silicon chip terminates, by silicon wafer turnover so that coat the ethanol solution of diboron trioxide
Time one face down, and the another side that sprays will not carried out upward, thus this another side entered according to the method described above
Row spraying.So, it is achieved the two sides of silicon chip is sprayed.
Embodiment 3
Silicon chip 2 is placed on described bearing base 3, by positioning edge 7 and support level 6 by described silicon chip
It is fixed on described support base 3, so that the face towards base direction of silicon chip 2 and support level 6 times
Space is there is between the bottom surface supporting base 3 of side；And open alignment pin 4 vacuum cups, by sample simultaneously
It is fixed on described sample by evacuation.
Ejector 1 is used to be ejected on described silicon chip 2 by the ethanol solution (10 weight %) of diboron trioxide,
When silicon chip sprays the ethanol solution of diboron trioxide, described bearing base is made to rotate with the rotating speed of 50r/min
Drive described rotary sample.Time about 20s.
After the one side spraying of silicon chip terminates, by silicon wafer turnover so that coat the ethanol solution of diboron trioxide
Time one face down, and the another side that sprays will not carried out upward, thus this another side entered according to the method described above
Row spraying.So, it is achieved the two sides of silicon chip is sprayed.
Claims (6)
1. a boron diffusion source double-face spray painting device, including:
Ejector；
Bearing base, it is oppositely arranged with the injection direction of ejector, and described bearing base includes:
It is positioned at the hole, location bottom bearing base, is used for fixing bearing base；
Four symmetrically arranged and for position spraying sample edge, location, be used for fixing sample；With
For supporting the support level of described spraying sample so that holding bottom described spraying sample and step
Carry and there is space between the bottom surface of base,
Described bearing base is the bearing base that can rotate in a circumferential direction,
Described device also includes alignment pin, and it is equipped with hole, described location, is used for positioning at the bottom of described carrying
Seat,
Described alignment pin is provided with vacuum cups, the hole, location of described bearing base and determining with vacuum cups
Position bearing pin coordinates so that described bearing base is fixed.
2. the method carrying out boron diffusion source double-face spray painting, including:
I) device according to claim 1 is provided；
Ii) sample is placed on described bearing base, makes the inner side at edge, location connect with the outward flange of described sample
Touch, thus fix described sample by clamping；And make the edge of described sample be placed on described support level,
Make to there is space between the bottom surface of the bearing base below the face towards base direction of sample and step；
Iii) by ejector, the one side of sample is sprayed boron-containing solution；After spraying terminates, sample is overturn,
According to above-mentioned same method, the another side of sample is sprayed described boron-containing solution.
Method the most according to claim 2, it is characterised in that when to sample spraying boron-containing solution,
Described bearing base is made to rotarily drive described rotary sample.
The most according to the method in claim 2 or 3, it is characterised in that described sample is semi-conducting material.
Method the most according to claim 4, it is characterised in that described sample is silicon chip.
The most according to the method in claim 2 or 3, it is characterised in that described boron-containing solution is three oxidations
The ethanol solution of two boron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410809882.6A CN104549840B (en) | 2014-12-23 | 2014-12-23 | Device and method for double-sided spraying of boron diffusion source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410809882.6A CN104549840B (en) | 2014-12-23 | 2014-12-23 | Device and method for double-sided spraying of boron diffusion source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104549840A CN104549840A (en) | 2015-04-29 |
| CN104549840B true CN104549840B (en) | 2017-01-11 |
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| CN201410809882.6A Active CN104549840B (en) | 2014-12-23 | 2014-12-23 | Device and method for double-sided spraying of boron diffusion source |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105944875B (en) * | 2016-06-21 | 2018-07-20 | 上海平耐实业有限公司 | A kind of automatic painting device and its lackering method |
| CN108085744A (en) * | 2017-12-27 | 2018-05-29 | 中国科学院半导体研究所 | A kind of method for the indium arsenide monocrystalline for preparing p-type additive Mn |
| CN112466746B (en) * | 2020-04-29 | 2022-04-15 | 山东芯源微电子有限公司 | Membrane diffusion source forming machine |
| CN113976520B (en) * | 2021-11-26 | 2022-12-20 | 强一半导体(上海)有限公司 | 3DMEMS probe belt cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004306191A (en) * | 2003-04-07 | 2004-11-04 | Seiko Epson Corp | Table device, film deposition device, optical element, semiconductor device and electronic equipment |
| KR100698093B1 (en) * | 2005-07-26 | 2007-03-23 | 동부일렉트로닉스 주식회사 | Method for forming of photo resist pattern |
| CN101275283A (en) * | 2008-01-03 | 2008-10-01 | 株洲南车时代电气股份有限公司 | Device for coating diffuse source in diffusion technology |
| CN202725449U (en) * | 2012-06-28 | 2013-02-13 | 中国科学院苏州纳米技术与纳米仿生研究所 | Photoresist spinner for silicon wafer |
| CN202752176U (en) * | 2012-09-12 | 2013-02-27 | 金湖县赛欧电气有限公司 | Ring part high-efficiency spraying fixture |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20201010 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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