CN205984910U - Source device is scribbled in wafer automation - Google Patents
Source device is scribbled in wafer automation Download PDFInfo
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- CN205984910U CN205984910U CN201620817739.6U CN201620817739U CN205984910U CN 205984910 U CN205984910 U CN 205984910U CN 201620817739 U CN201620817739 U CN 201620817739U CN 205984910 U CN205984910 U CN 205984910U
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Abstract
The utility model relates to a source device is scribbled in wafer automation belongs to the semiconductor wafer manufacturing field. Pass through artifically in wafer surface coating diffuse source to traditional, can't guarantee to scribble the problem of source quality, the utility model discloses a put piece device, conveyer belt, atomizer, drying apparatus and take up device, carry on placing the conveyer belt with the wafer through putting the piece device, spray diffuse source by the atomizer of conveyer belt top on the wafer, dry diffuse source by the drying apparatus that lies in the conveyer belt front upper place again, then carry in the take up device. The utility model discloses an automation equipment spraying source of scribbling, the homogeneity is high, and the uniformity is good, and the reverse recovery time difference of diffusion back device is little, has improved the diffusion quality greatly.
Description
Technical field
This utility model is related to semiconductor crystal wafer and manufactures field, and more particularly, to a kind of wafer automatization applies source device.
Background technology
In semicon industry, fast recovery diode passes through doping platinum/gold element in silicon and reduces minority carrier lifetime, with
Meet the switching frequency demand to device for the circuit.Platinum/gold diffusion source be liquid state diffusion source, traditional using method be diffusion before
Crystal column surface coats diffusion source, and method is that wafer is placed on spin coater suction nozzle, starts to dip expansion with brush pen during rotation
Scattered source, brushes to edge from crystal circle center.This kind of operational approach is affected larger, the diffusion of coating by operator's proficiency, custom
Source film thickness uniformity is poor, and after diffusion, backward recovery time (TRR) difference of device is big, and concordance is poor, may result in product office
Portion's quality abnormal.
Utility model content
For the problem of shortcomings and deficiencies in prior art, the utility model proposes a kind of wafer automatization applies source dress
Put, using automation equipment spraying painting source, uniformity is high, and concordance is good, and after diffusion, the backward recovery time difference of device is little, greatly
Improve greatly diffusion quality.
This utility model solves its technical problem and be employed technical scheme comprise that：
A kind of wafer automatization applies source device, including putting device, conveyer belt, sprayer unit, baker and film-taking in means,
Described putting device is arranged on the input of conveyer belt, is sequentially provided with sprayer unit and drying along conveying direction above conveyer belt
Device, film-taking in means is arranged on the outfan of conveyer belt, equipped with diffusion source in described sprayer unit.
Further, described sprayer unit is provided with row's nozzle, has angle between described nozzle and conveyer belt.
Further, it is spaced 5mm between described nozzle, described angle is 60 degree.
Further, described diffusion source adopts platinum, Jin Yetaikuosanyuan.
Further, described baker is using the infrared baking device with forcing air draft.
This utility model has the advantages that：Nozzle is in 60 degree of angles with conveyer belt, is so sprayed by sprayer unit
Vaporific diffusion source out can uniformly fall on wafer, is not in sputtering bounce-back.This utility model adopts automatization to apply source section
Human-saving, the quality that improve production efficiency and apply source.
Brief description
Fig. 1 is this utility model overall structure diagram.
Fig. 2 is the top view of Fig. 1.
Specific embodiment
With reference to specific embodiment, this utility model is expanded on further.It should be understood that these embodiments are merely to illustrate this
Utility model rather than restriction scope of the present utility model.In addition, it is to be understood that in the content having read this utility model instruction
Afterwards, those skilled in the art can make various changes or modifications to this utility model, and these equivalent form of values equally fall within this Shen
Please appended claims limited range.
As shown in Figure 1 and Figure 2, a kind of wafer automatization applies source device, including putting device 1, conveyer belt 2, sprayer unit 3,
Baker 4 and film-taking in means 5, described putting device 1 is arranged on the input of conveyer belt 2, above conveyer belt 2 along conveying direction according to
Secondary be provided with sprayer unit 3 and baker 4, film-taking in means 5 is arranged on the outfan of conveyer belt 2, equipped with expansion in described sprayer unit 3
Scattered source.
Further, described sprayer unit 3 is provided with row's nozzle 10, has angle between described nozzle 10 and conveyer belt 2.
Further, it is spaced 5mm between described nozzle 10, described angle is 60 degree.
Further, described diffusion source adopts platinum, Jin Yetaikuosanyuan.
Further, described baker 4 is using the infrared baking device with forcing air draft.
Specifically, wafer 20 is placed into conveying on conveyer belt 2 by putting device 1 by this utility model, then by conveyer belt 2
The sprayer unit 3 of top sprays diffusion source on wafer 20, then is dried the diffusion source on wafer 20 top layer by baker 4, then
It is transported in film-taking in means 5.
Source will be spread by air pressure when this utility model uses to spray through sprayer unit, wafer is carried quick by feed belt
By below sprayer unit and baker, you can obtain the higher wafer of coating uniformity, substantially increase painting source efficiency.And
Automatization applies source and substitutes manual work, applies source uniformly, concordance is good, and after diffusion, backward recovery time (TRR) difference of device is little,
Platinum/gold diffusion quality is greatly improved.
Claims (5)
1. a kind of wafer automatization apply source device it is characterised in that：Including putting device, conveyer belt, sprayer unit, baker and
Film-taking in means, described putting device is arranged on the input of conveyer belt, is sequentially provided with spraying dress along conveying direction above conveyer belt
Put and baker, film-taking in means is arranged on the outfan of conveyer belt, equipped with diffusion source in described sprayer unit.
2. a kind of wafer automatization according to claim 1 apply source device it is characterised in that：Described sprayer unit is provided with one
Row's nozzle, has angle between described nozzle and conveyer belt.
3. a kind of wafer automatization according to claim 2 apply source device it is characterised in that：It is spaced between described nozzle
5mm, described angle is 60 degree.
4. a kind of wafer automatization according to claim 1 apply source device it is characterised in that：Described diffusion source adopt platinum,
Jin Yetaikuosanyuan.
5. a kind of wafer automatization according to claim 1 apply source device it is characterised in that：Described baker is strong using band
The infrared baking device of air draft processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620817739.6U CN205984910U (en) | 2016-07-29 | 2016-07-29 | Source device is scribbled in wafer automation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620817739.6U CN205984910U (en) | 2016-07-29 | 2016-07-29 | Source device is scribbled in wafer automation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205984910U true CN205984910U (en) | 2017-02-22 |
Family
ID=58027213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620817739.6U Active CN205984910U (en) | 2016-07-29 | 2016-07-29 | Source device is scribbled in wafer automation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205984910U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110586400A (en) * | 2019-09-20 | 2019-12-20 | 广州佳伲斯防霉抗菌科技有限公司 | Control system of mould-proof spraying machine |
-
2016
- 2016-07-29 CN CN201620817739.6U patent/CN205984910U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110586400A (en) * | 2019-09-20 | 2019-12-20 | 广州佳伲斯防霉抗菌科技有限公司 | Control system of mould-proof spraying machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 247000 Anhui city of Chizhou Province Economic and Technological Development Zone Fu'an Electronic Information Industrial Park No. 10 Patentee after: Anhui Anxin electronic Polytron Technologies Inc Address before: 247000 Anhui city of Chizhou Province Economic and Technological Development Zone Fu'an Electronic Information Industrial Park No. 10 Patentee before: ANHUI ANXIN ELECTRONIC TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |