CN104538558A - OLED device and method thereof - Google Patents
OLED device and method thereof Download PDFInfo
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- CN104538558A CN104538558A CN201410822046.1A CN201410822046A CN104538558A CN 104538558 A CN104538558 A CN 104538558A CN 201410822046 A CN201410822046 A CN 201410822046A CN 104538558 A CN104538558 A CN 104538558A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention relates to an OLED device and a method of the OLED device. The OLED device comprises a substrate, a light emitting element on the substrate and a packaging cover, the light emitting element comprises a first electrode layer, a second electrode layer and a light emitting layer between the first electrode layer and the second electrode layer, and an inorganic pixel limiting layer used for sealing the light emitting element between the first electrode layer and the second electrode layer is arranged around the light emitting element. The inorganic pixel limiting layer is closely attached to the first electrode layer and the second electrode layer. Through the arrangement, the light emitting layer is surrounded in internal inorganic layer closed space, the capacity of blocking moisture and oxygen can be improved, and therefore the packaging effect is improved, and the structure is simple.
Description
Technical field
The present invention relates to encapsulation technology field, a kind of OLED of specific design and method thereof.
Background technology
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED), has excellent properties and extensive use, but because material character, very easily rotten after being subject to steam and oxygen invasion and attack, therefore require very high to encapsulation performance.Traditional glass cover or crown cap encapsulation have realized good effect, but are not exclusively applicable to some important or potential application scenarios, such as top emitting OLED Display Technique, flexible OLED Display Technique or flexible OPV etc.Industry develops thin film encapsulation technology for this reason, and with one deck or the vacuum-deposited thin-film barrier steam of some layers and oxygen, the path of not shading light outgoing or incidence, does not affect the flexible of substrate yet.
In the Technology Ways of various thin-film package, steam and oxygen are easily from edge penetration.Therefore, the encapsulating structure of a kind of OLED and method thereof is necessary to design to overcome above-mentioned defect.
Summary of the invention
The object of the present invention is to provide a kind of OLED and the method thereof that can prevent steam and oxygen infiltration better.
For realizing aforementioned object, the present invention adopts following technical scheme: a kind of OLED, comprise substrate, be arranged at light-emitting component on substrate and cap, described light-emitting component comprises the first electrode layer, the second electrode lay and the luminescent layer between described first electrode layer, the second electrode lay, and described light-emitting component surrounding is provided with in order to by the inorganic pixel confining layers of encapsulating luminescent element between the first electrode layer and the second electrode lay; Described inorganic pixel confining layers fits tightly with described first electrode layer, described the second electrode lay respectively.
As a further improvement on the present invention, described inorganic pixel confining layers is made up of one or more layers silicon nitride, silica or alumina medium layer.
As a further improvement on the present invention, described inorganic pixel confining layers comprises organic support cylinder and the coated inorganic thin film be deposited on above organic support cylinder, described inorganic thin film extension fits in light-emitting component surrounding, and described inorganic thin film and described first electrode layer, the second electrode lay fit tightly.
As a further improvement on the present invention, rough enclosure wall is also arranged with outside described inorganic pixel confining layers; Described inorganic thin film extends to above described enclosure wall;
Inorganic thin film above described enclosure wall and the disposed thereon of light-emitting component have encapsulation medium layer;
Inorganic thin film above described enclosure wall, encapsulation medium layer and first, second electrode layer fit tightly.
As a further improvement on the present invention, described encapsulation medium layer comprises inorganic dielectric layer and is deposited on the organic dielectric layer above inorganic dielectric layer, described inorganic dielectric layer and organic dielectric layer form a pair inorganic-organic film and encapsulate system, described encapsulation medium layer comprises N to described inorganic-organic film encapsulation system, wherein the size of logarithm N is the integral multiple of 0.5, and N >=0.5.
As a further improvement on the present invention, described inorganic pixel confining layers is inorganic support cylinder.
As a further improvement on the present invention, be provided with organic support column above described inorganic pixel confining layers, described the second electrode lay is positioned at above described luminescent layer, and described the second electrode lay extends the top being covered in inorganic pixel confining layers and organic support column further.
The present invention also can adopt following technical scheme:
A kind of OLED encapsulation method, comprising:
Step one: deposition of first electrode layer on substrate;
Step 2: deposit in order to by the inorganic pixel confining layers of encapsulating luminescent element between the first electrode layer and the second electrode lay in described first electrode layer surrounding;
Step 3: enclose evaporation luminescent layer above the first electrode layer in region in described inorganic pixel confining layers;
Step 4: cover the second electrode lay at luminescent layer disposed thereon, described inorganic pixel confining layers and the first electrode layer and the second electrode lay fit tightly;
Step 5: encapsulate with cap above described light-emitting component.
As a further improvement on the present invention, described step 2 is specially:
The first step: form organic support cylinder in described first electrode layer surrounding;
Second step: cover inorganic thin film at described organic support cylinder disposed thereon, then evaporation luminescent layer on the first electrode layer between machine support cylinder, inorganic thin film on described organic support cylinder fits in the surrounding of luminescent layer, and described inorganic thin film and the first electrode layer and the second electrode lay fit tightly.
As a further improvement on the present invention, described step 2 is specially: form inorganic support cylinder in described first electrode layer surrounding, described inorganic support cylinder and first, second electrode layer fit tightly.
The present invention is by doing pixel confining layers by inorganic dielectric layer, and inner inorganic layer hermetically-sealed construction is formed after combining closely with first, second electrode layer, so, luminescent layer is enclosed in described inner inorganic layer confined space, structure is simple, without the need to other depositing inorganic films encapsulating structure outside light-emitting component, the ability stopping steam, oxygen can be improved, and then improve packaging effect.
Accompanying drawing explanation
Fig. 1 is the part-structure schematic diagram in OLED first execution mode of the present invention;
Fig. 2 is lift-off technology (Lift-off) schematic diagram in OLED first execution mode of the present invention;
Fig. 3 is the structural representation in OLED first execution mode of the present invention;
Fig. 4 is the embodiment structural representation in OLED first execution mode of the present invention;
Fig. 5 is the structural representation of OLED second execution mode of the present invention;
Fig. 6 is the structural representation of OLED of the present invention 3rd execution mode.
Main element symbol description:
OLED 100,100 ', 100 ' ' substrate 1
Inorganic thin film 101 anode layer 5
Encapsulation medium layer 3 cathode layer 6
First inorganic dielectric layer 301 luminescent layer 7
First organic dielectric layer 302 enclosure wall 8
Second inorganic dielectric layer 303 cap 91
Support cylinder 2 photoresist 10
Organic support column 20 fluid sealant 93
Embodiment
Describe the present invention below with reference to specific embodiment shown in the drawings.What deserves to be explained is, hereafter described embodiment does not limit the present invention, and the structure that those of ordinary skill in the art makes according to these embodiments, method or conversion functionally are all included in protection scope of the present invention.
Shown in please refer to the drawing 1 to Fig. 6, for the OLED 100 of the present invention's three kinds of execution modes, 100 ', 100 ", comprise substrate 1, be arranged at the light-emitting component on substrate 1 and cap 91, described light-emitting component comprises the first electrode layer, the second electrode lay and be positioned at first, luminescent layer 7 between the second electrode lay, in said embodiment, described first electrode layer is anode layer 5 and is positioned at below luminescent layer 7, described the second electrode lay is cathode layer 6 and is positioned at above luminescent layer 7, in other embodiments, first electrode layer, the second electrode lay can also upper-lower position exchange.Described light-emitting component surrounding is provided with the inorganic pixel confining layers of convex; Described inorganic pixel confining layers and the first electrode layer, the second electrode lay fit tightly, and form inner inorganic layer sealing system and luminescent layer 7 is enclosed in wherein.Setting like this, described OLED 100,100 ', 100 " inside that the inorganic pixel confining layers of first, second electrode layer of light-emitting component itself and light-emitting component surrounding can be utilized to be combined in light-emitting component forms stereoscopic and omnibearing and seals; and structure is simple, can improve the obstructing capacity to steam and oxygen without the need to depositing inorganic films encapsulating structure other outside light-emitting component.In other embodiments, the second electrode lay above described luminescent layer 7 also can comprise cover layer (Capping layer; CPL).
Described inorganic pixel confining layers is made up of one or more layers silicon nitride, silica or alumina medium layer, can by etch or open mask plate (Open mask) is produced pattern or is prepared from by lift-off technology (Lift-off) technique.Shown in please refer to the drawing 2, described lift-off technology processing step is specially: on described anode layer 5, apply the thicker photoresist of one deck 10, photoetching forms figure, then sputter thereon or vapor deposition inorganic thin film 101, subsequently the inorganic thin film 101 above photoresist 10 and photoresist 10 is peeled off together, the inorganic thin film 101 only outside surplus former photoresist 10 position.If multilayer, similar thin-film package hermetically-sealed construction can be produced by etching or mask plate.Setting like this, closely knit can be good at of described inorganic pixel confining layers quality prevents steam and oxygen infiltration invasion.
Shown in please refer to the drawing 3 to Fig. 4, in the first embodiment, described inorganic pixel confining layers comprises organic support cylinder 2 and the coated inorganic thin film 101 be deposited on above organic support cylinder 2, described inorganic thin film 101 extension fits in light-emitting component surrounding, described inorganic thin film 101, cathode layer 6 and anode layer 5 fit tightly, and form inner inorganic layer sealing system and luminescent layer 7 is enclosed in wherein.Concrete, described support cylinder 2 is in luminescent layer 7 surrounding and be located between described anode layer 5 and cathode layer 6, and described support cylinder 2 upwardly and exceed luminescent layer 7, is provided with anode layer 5 below described support cylinder 2.Namely, in the present embodiment, after organic support cylinder 2 has been manufactured, depositing inorganic films 101 is covered above organic support cylinder 2, inorganic thin film 101 above described organic support cylinder 2 to downward-extension with anode layer 5 in the middle part of periphery fit tightly and expose in the middle part of anode layer 5, thus form one by the bottom bowl-shape anti-steam that be anode layer 5 and surrounding to be the inorganic thin film 101 tilting upward extension formed and the recess that oxygen permeates, described light-emitting component surrounding and below fit tightly with the surrounding of described recess and bottom respectively, described cathode layer 6 covers the top being deposited on inorganic thin film 101 and luminescent layer 7 further, the top of the recess that described bowl-shape anti-steam and oxygen are permeated by cathode layer 6 seals, thus make the complete sealed packet of luminescent layer 7 be overlying on by described inorganic thin film 101, cathode layer 6 and anode layer 5 fit tightly in the inner inorganic layer sealing system of formation.In present embodiment, described organic support cylinder 2 still can make according to existing program, and only after organic support cylinder 2 has been manufactured, need cover depositing inorganic films 101 above organic support cylinder 2, technique is simple.
Described substrate 1 is provided with the rough enclosure wall 8 around described pixel confining layers surrounding; Described inorganic thin film 101 extends to above described substrate 1 and enclosure wall 8; Inorganic thin film 101 above described enclosure wall 8 and the disposed thereon of light-emitting component have encapsulation medium layer 3; Inorganic thin film 101 above described enclosure wall 8, encapsulation medium layer 3 and cathode layer 6 and anode layer 5 fit tightly, and so arrange, and can form middle part inorganic layer sealing system and inner inorganic layer sealing system is enclosed in wherein.
Described encapsulation medium layer 3 comprises the inorganic dielectric layer be deposited on above inorganic thin film 101 and pixel cell, described encapsulation medium layer 3 also comprises the organic dielectric layer be deposited on above inorganic dielectric layer, described inorganic dielectric layer and organic dielectric layer form a pair inorganic-organic film and encapsulate system, described encapsulation medium layer 3 comprises N to described inorganic-organic film encapsulation system, wherein the size of logarithm N is the integral multiple of 0.5, and N >=0.5.Setting like this, described middle part inorganic layer sealing system is sealed in the outside of above-mentioned inner inorganic layer sealing system, thus the sealing effectiveness of the luminescent layer 7 in described inner inorganic layer sealing system can be improved further, better improve the obstructing capacity to steam and oxygen.Specifically, described middle part inorganic layer sealing system can form complete inorganic layer dykes and dams in light-emitting component surrounding, and can form longer water vapor permeable path between encapsulation medium layer 3 and inorganic thin film 101 contact, thus realizes the effect better stopping steam.Described inorganic thin film 101 is inorganic matter material with the first inorganic dielectric layer 301 material of top, because the deposition between inorganic matter material and inorganic matter material is more closely knit compared to the deposition between inorganic matter material and organic substance material, described inorganic thin film 101 can be made more tight with the deposition of the first inorganic dielectric layer 301 above enclosure wall 8 of top, improve sealing effectiveness; Moreover what the seal cavity that described inorganic thin film 101 and the first inorganic dielectric layer 301 are formed formed seal cavity compared to organic substance material has the effect better intercepting steam and oxygen; On the other hand, the inorganic-organic film that described first inorganic dielectric layer 301 and the first organic dielectric layer 302 are formed encapsulate system can make depositional fabric more smooth, be reduced to membrane stress.Described inorganic dielectric layer can be the materials such as silicon nitride, silica or aluminium oxide.
The cross section of the enclosure wall 8 of described light-emitting component surrounding can be circular arc, triangle, trapezoidal, other polygons or irregular concaveconvex shape.In the present embodiment, described enclosure wall 8 is overshooting shape, and cross section is trapezoidal, and described enclosure wall 8 is two, setting like this, rough enclosure wall 8 can be formed in light-emitting component surrounding thus stop entering of steam and oxygen preferably, and forming longer water vapor permeable path at the edge of OLED 100.In other embodiments, described enclosure wall 8 can also combine with depression for recess or projection, and described cross section can also be other shapes, and the quantity of described enclosure wall 8 can be one or more, can achieve the above object equally.
Concrete, when N >=1.5, described two neighbouring inorganic dielectric layer are gluing, sealing contact above enclosure wall 8, described in the organic dielectric layer be held between two inorganic dielectric layer be positioned at enclosure wall 8 in the horizontal direction and enclose region.Shown in ginseng Fig. 3 to Fig. 5, in the first execution mode and the second execution mode, the logarithm N=1.5 of described inorganic-organic film encapsulation system, the second inorganic dielectric layer 303 namely comprising the first inorganic dielectric layer 301, be deposited on the first organic dielectric layer 302 above the first inorganic dielectric layer 301 and be deposited on above the first organic dielectric layer 302.Wherein the first inorganic dielectric layer 301 contacts with the second inorganic dielectric layer 303 gluing, sealing above enclosure wall 8, and the first organic dielectric layer 302 be held between the first inorganic dielectric layer 301 and the second inorganic dielectric layer 303 is positioned at enclosure wall 8 encloses region, setting like this, first inorganic dielectric layer 301 and the second inorganic dielectric layer 303, inorganic thin film 101 mutually can fit tightly, thus realize better obturation effect above enclosure wall 8.And from another angle, if described first organic dielectric layer 302 extends between the first inorganic dielectric layer 301 above enclosure wall 8 and the second inorganic dielectric layer 303, because the first organic dielectric layer 302 is made up of organic material, its anti-permeability is not as inorganic, and steam penetrates into easily via the first organic dielectric layer 302 between described first inorganic dielectric layer 301 and the second inorganic dielectric layer 303 and makes described encapsulation medium layer 3 cannot realize good anti-steam effect.In other embodiments, described encapsulation medium layer 3 comprises N and encapsulates system to inorganic-organic film, and outermost layer can be N inorganic dielectric layer or N organic dielectric layer, if outermost layer is N organic dielectric layer, described N organic dielectric layer can extend to the anti-steam effect not affecting described encapsulation medium layer 3 inside above enclosure wall 8.
Encapsulation medium layer 3 above described luminescent layer 7 is by low temperature thin film deposition method, and described low temperature is lower than 100 degrees Celsius, so arranges, and can avoid in the film deposition process of encapsulation medium layer 3, producing high temperature and damaging luminescent layer 7.
Shown in please refer to the drawing 4, for the structural representation of OLED 100 first execution mode specific embodiment of the present invention, described OLED 100 is provided with and is positioned at cap (Coverglass) 91 above substrate 1 and light-emitting component and the peripheral and fluid sealant (Dam sealant) 93 in order to seal described cap 91 and substrate 1 be held between cap 91 and substrate 1 at enclosure wall 8.Setting like this, described OLED 100 outer wrap can be got up to be formed to be sealed in the outside seal system outside the inorganic layer sealing system of middle part by described cap 91, substrate 1 and fluid sealant 93, and then realize better sealing effectiveness, more effectively prevent steam and oxygen from entering OLED 100.And OLED 100 has good sealing effectiveness to be made described cap 91, does not need between substrate 1 and fluid sealant 93 to fill the filler such as transparent organic or liquid desiccant, in prior art, fluid sealant 93 adds the packaged type of filler, present invention reduces the technology difficulty of encapsulation, breach the bottleneck such as stress problem, sealing effectiveness that prior art packaged type produces, described OLED 100 can be applied more broadly on large scale AMOLED or in flexible screen.
Concrete, also can fill the inert gases such as nitrogen between described cap 91, substrate 1 and fluid sealant 93, so arrange, structure between cap 91, substrate 1 and fluid sealant 93 can be made more stable.Described fluid sealant 93 is epoxide-resin glue or melted glass etc.Setting like this, epoxide-resin glue or melted glass are subject to ultraviolet light or laser irradiation after being positioned over the place to be sealed of cap 91 and substrate 1 can make to realize good sealing effectiveness between cap 91, substrate 1.
Shown in please refer to the drawing 5, be the OLED 100 ' of second embodiment of the invention, described inorganic pixel confining layers is inorganic support cylinder 2.Described inorganic support cylinder 2, cathode layer 6 and anode layer 5 fit tightly formation inner inorganic layer sealing system and luminescent layer 7 are enclosed in wherein.Namely described inorganic pixel confining layers is formed by whole inorganic support cylinder 2, setting like this, described whole inorganic support cylinder 2 has more roomy abundant inorganic structure, more can prevent steam and oxygen from penetrating into luminescent layer 7 from inorganic pixel confining layers, and manufacture craft is simple.
Please refer to the drawing 3 to Fig. 6, no matter which kind of execution mode, all can arrange organic support column (Pillar) 20 above described inorganic pixel confining layers, and described cathode layer 6 deposition is covered in the top of inorganic pixel confining layers and organic support column 20.Setting like this, described organic support column 20 can for the materials such as photoresist in order to support top mask plate and available protecting described in mask plate be not scratched.
The present invention also provides a kind of luminescent layer method for packing, comprising:
Step one: deposition of first electrode layer on substrate 1, described first electrode layer is anode layer 5 in the present embodiment, and in other embodiments, described first electrode layer can be cathode layer (not shown);
Step 2: in the inorganic pixel confining layers of described first electrode layer surrounding deposition convex;
Step 3: enclose in described inorganic pixel confining layers above the electrode layer in region and form luminescent layer 7;
Step 4: cover the second electrode lay in described inorganic pixel confining layers and luminescent layer 7 disposed thereon, described the second electrode lay is that corresponding cathode layer 6 forms in order to make the first electrode layer, luminescent layer 7 and the second electrode lay the light-emitting component be made up of anode layer 5, luminescent layer 7 and cathode layer 6, described inorganic pixel confining layers and first, second electrode layer fit tightly, thus formation inner inorganic layer sealing system is enclosed in luminescent layer 7 wherein.In other embodiments, described the second electrode lay can for the anode layer (not shown) corresponding when the first electrode layer is cathode layer;
Step 5, encapsulates with cap 91 above described light-emitting component.The fluid sealant sealing described cap 91 and substrate 1 is provided with between described cap 91 and substrate 1.In other embodiments, also other packaged types can be adopted.
Setting like this, described inner inorganic layer sealing system can form stereoscopic and omnibearing sealing in the inside of light-emitting component, coordinate the fluid sealant between described substrate 1 and cap 91, can improve the obstructing capacity of light-emitting component to steam and oxygen.
Shown in please refer to the drawing 1, Fig. 3 and Fig. 4, in the first embodiment, described step 2 is specially:
The first step: form organic support cylinder 2 in described first electrode layer surrounding;
Second step: cover inorganic thin film 101 at described organic support cylinder 2 disposed thereon, then evaporation luminescent layer 7 on the first electrode layer between machine support cylinder 2, inorganic thin film 101 on described organic support cylinder 2 fits in the surrounding of luminescent layer 7, and described inorganic thin film 101 and first, second electrode layer fit tightly formation inner inorganic layer sealing system and luminescent layer 7 is enclosed in wherein.Setting like this, described luminescent layer 7 completely sealed packet is overlying on and fits tightly in the inner inorganic layer sealing system that formed by described inorganic thin film 101, cathode layer 6 and anode layer 5, improve the obstructing capacity to steam and oxygen, and described organic support cylinder 2 still can make according to existing program, only after organic support cylinder 2 has been manufactured, need cover depositing inorganic films 101 above organic support cylinder 2, technique is simple.
Shown in please refer to the drawing 5, in this second embodiment, described step 2 is: form inorganic support cylinder 2 in described first electrode layer surrounding, and described inorganic support cylinder 2, first electrode layer and the second electrode lay fit tightly, and forms inner inorganic layer sealing system and luminescent layer 7 is enclosed in wherein.Setting like this, described whole inorganic support cylinder 2 has more roomy abundant inorganic structure, more can prevent steam and oxygen from penetrating into luminescent layer 7 from inorganic pixel confining layers, and manufacture craft is simple.
The present invention is applicable to RGB organic luminous layer and optics supplemental layers and adopts shadow mask plate (Shadowmask) evaporation and shared layer such as hole transmission layer, electron injecting layer, electron transfer layer to adopt the situation of open mask plate (Open mask) evaporation; also be applicable to the situation that all organic layers of luminescent layer 7 all use shadow mask evaporation, namely all sub-pixels are all by situation that inorganic layer seal protection gets up.
In sum, the present invention is that as silicon nitride, silica or aluminium oxide etc., one or more do OLED and the method thereof of pixel confining layers to employing inorganic layer, inorganic sealing system is formed in conjunction with the plural layers encapsulation containing inorganic layer, can be applicable to the luminous and luminous luminescent layer in the end in top, large scale luminescent layer or Flexible Displays or on throwing light on.The present invention is also suitable for and is not limited to LTPS, top grid TFT and bottom gate TFT etc.Wherein, the cap of the luminous luminescent layer in the end can be selected to paste drying sheet; If push up the structure of all right select tape supporter (Spacer) during luminous luminescent layer selection cap.
Shown in please refer to the drawing 5 to Fig. 6, be respectively the OLED 100 ', 100 of second embodiment of the invention, the 3rd execution mode " schematic diagram; described inorganic pixel confining layers is inorganic support cylinder 2, the OLED 100 ', 100 of second, third execution mode described " difference be: in the third embodiment without the need to depositing inorganic films 101; And in this second embodiment, described inorganic thin film 101 and support cylinder 2 are made up of inorganic of the same race, and namely inorganic is deposited on after on substrate and enclosure wall and forms the inorganic thin film 101 be covered on enclosure wall and the support cylinder 2 be connected with inorganic thin film 101 one by etching.
Be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, technical scheme in each execution mode also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
A series of detailed description listed is above only illustrating for feasibility execution mode of the present invention; they are also not used to limit the scope of the invention, all do not depart from the skill of the present invention equivalent implementations done of spirit or change all should be included within protection scope of the present invention.
Claims (10)
1. an OLED, comprise substrate, be arranged at light-emitting component on substrate and cap, described light-emitting component comprises the first electrode layer, the second electrode lay and the luminescent layer between described first electrode layer, the second electrode lay, it is characterized in that: described light-emitting component surrounding is provided with in order to by the inorganic pixel confining layers of encapsulating luminescent element between the first electrode layer and the second electrode lay; Described inorganic pixel confining layers fits tightly with described first electrode layer, described the second electrode lay respectively.
2. OLED according to claim 1, is characterized in that: described inorganic pixel confining layers is made up of one or more layers silicon nitride, silica or alumina medium layer.
3. OLED according to claim 1, it is characterized in that: described inorganic pixel confining layers comprises organic support cylinder and the coated inorganic thin film be deposited on above organic support cylinder, described inorganic thin film extension fits in light-emitting component surrounding, and described inorganic thin film and described first electrode layer, the second electrode lay fit tightly.
4. OLED according to claim 3, is characterized in that:
Rough enclosure wall is also arranged with outside described inorganic pixel confining layers; Described inorganic thin film extends to above described enclosure wall;
Inorganic thin film above described enclosure wall and the disposed thereon of light-emitting component have encapsulation medium layer;
Inorganic thin film above described enclosure wall, encapsulation medium layer and first, second electrode layer fit tightly.
5. OLED according to claim 4, it is characterized in that: described encapsulation medium layer comprises inorganic dielectric layer and is deposited on the organic dielectric layer above inorganic dielectric layer, described inorganic dielectric layer and organic dielectric layer form a pair inorganic-organic film and encapsulate system, described encapsulation medium layer comprises N to described inorganic-organic film encapsulation system, wherein the size of logarithm N is the integral multiple of 0.5, and N >=0.5.
6. OLED according to claim 1, is characterized in that: described inorganic pixel confining layers is inorganic support cylinder.
7. OLED according to claim 1, it is characterized in that: above described inorganic pixel confining layers, be provided with organic support column, described the second electrode lay is positioned at above described luminescent layer, and described the second electrode lay extends the top being covered in inorganic pixel confining layers and organic support column further.
8. an OLED encapsulation method, is characterized in that: comprising:
Step one: deposition of first electrode layer on substrate;
Step 2: deposit in order to by the inorganic pixel confining layers of encapsulating luminescent element between the first electrode layer and the second electrode lay in described first electrode layer surrounding;
Step 3: enclose in described inorganic pixel confining layers above the first electrode layer in region and be provided with luminescent layer;
Step 4: cover the second electrode lay at luminescent layer disposed thereon, described inorganic pixel confining layers and the first electrode layer and the second electrode lay fit tightly;
Step 5: encapsulate with cap above described light-emitting component.
9. OLED encapsulation method according to claim 8, is characterized in that: described step 2 is specially:
The first step: form organic support cylinder in described first electrode layer surrounding;
Second step: cover inorganic thin film at described organic support cylinder disposed thereon, then evaporation luminescent layer on the first electrode layer between machine support cylinder, inorganic thin film on described organic support cylinder fits in the surrounding of luminescent layer, and described inorganic thin film and the first electrode layer and the second electrode lay fit tightly.
10. OLED encapsulation method according to claim 8, is characterized in that: described step 2 is specially: form inorganic support cylinder in described first electrode layer surrounding, described inorganic support cylinder and first, second electrode layer fit tightly.
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| CN105390620A (en) * | 2015-12-21 | 2016-03-09 | 昆山国显光电有限公司 | OLED device, OLED device manufacturing method and display |
| WO2017117982A1 (en) * | 2016-01-04 | 2017-07-13 | 京东方科技集团股份有限公司 | Oled device packaging structure, display device and packaging method |
| CN107068905A (en) * | 2017-04-19 | 2017-08-18 | 京东方科技集团股份有限公司 | OLED encapsulating structures, OLED encapsulation method and display panel |
| CN107221554A (en) * | 2017-06-08 | 2017-09-29 | 深圳市华星光电技术有限公司 | A kind of OLED and manufacture method |
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