CN104532172A - Heat treatment method for eliminating tellurium-rich precipitate-phase defect in tellurium-zinc-cadmium material through two-step process - Google Patents

Heat treatment method for eliminating tellurium-rich precipitate-phase defect in tellurium-zinc-cadmium material through two-step process Download PDF

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CN104532172A
CN104532172A CN201410748540.8A CN201410748540A CN104532172A CN 104532172 A CN104532172 A CN 104532172A CN 201410748540 A CN201410748540 A CN 201410748540A CN 104532172 A CN104532172 A CN 104532172A
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杨建荣
徐超
盛锋锋
孙士文
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Shanghai Institute of Technical Physics of CAS
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Abstract

本发明公开了一种两步法消除碲锌镉材料中富碲沉淀相缺陷的热处理方法,该方法先将碲锌镉材料放置在富碲状态下进行热处理,使富碲沉淀相缺陷中过量的碲原子从样品中排出,然后再用富镉热处理对样品进行处理,使Cd原子进入液态的富碲沉淀相,利用液态的富碲沉淀相发生过饱和外延的过程减小富碲沉淀相缺陷的尺寸。常规的热处理方法在减小富碲沉淀相缺陷的尺寸,同时会在沉淀相缺陷的周边材料中产生大量的失配位错。与之相比,本发明方法中由于富碲沉淀相中的碲原子含量在富碲热处理过程中得到了控制,这一过程将不对周边材料产生应力和失配位错。两步法热处理技术能有效提高材料的质量,满足碲锌镉材料作为光电器件或衬底材料应用的需求。

The invention discloses a two-step heat treatment method for eliminating tellurium-rich precipitate phase defects in cadmium zinc telluride materials. In the method, the cadmium zinc telluride material is placed in a tellurium-rich state for heat treatment, so that excess tellurium in the tellurium-rich precipitate phase defects The atoms are discharged from the sample, and then the sample is treated with cadmium-rich heat treatment, so that the Cd atoms enter the liquid tellurium-rich precipitate phase, and the size of the defect in the tellurium-rich precipitate phase is reduced by using the supersaturated epitaxy process of the liquid tellurium-rich precipitate phase . The conventional heat treatment method reduces the size of the tellurium-rich precipitated phase defect, and at the same time generates a large number of misfit dislocations in the surrounding material of the precipitated phase defect. In contrast, in the method of the present invention, since the content of tellurium atoms in the tellurium-rich precipitation phase is controlled during the tellurium-rich heat treatment process, this process will not cause stress and misfit dislocations to surrounding materials. The two-step heat treatment technology can effectively improve the quality of the material and meet the needs of the application of CdZnTe materials as optoelectronic devices or substrate materials.

Description

两步法消除碲锌镉材料中富碲沉淀相缺陷的热处理方法Two-step heat treatment method for eliminating defects in tellurium-rich precipitated phases in CdZnTe materials

技术领域technical field

本发明涉及一种碲锌镉材料制造工艺技术,具体涉及一种两步法消除碲锌镉材料中富碲沉淀相缺陷的热处理方法。The invention relates to a manufacturing process technology of a cadmium zinc telluride material, in particular to a two-step heat treatment method for eliminating defects of tellurium-rich precipitation phases in the cadmium zinc telluride material.

背景技术Background technique

碲锌镉材料是一种重要的半导体材料,它既可用做碲镉汞外延材料的衬底,制备和生产高性能的红外焦平面探测器,也可直接用于制备和生产感应γ射线的高能射线探测器。红外焦平面探测器和γ射线探测器在航天遥感、医疗设备、安检和军事装备中具有广泛的应用。CdZnTe material is an important semiconductor material. It can be used as the substrate of HgCdTe epitaxial material to prepare and produce high-performance infrared focal plane detectors, and can also be directly used in the preparation and production of high-energy sensors that sense gamma rays. Ray detector. Infrared focal plane detectors and γ-ray detectors are widely used in aerospace remote sensing, medical equipment, security inspection and military equipment.

和广泛应用的Si材料和GaAs材料相比,碲锌镉材料的缺陷形成能非常低,热导率又非常低,生长出的碲锌镉晶锭大都为多晶粒材料,并或多或少含有富碲或富镉沉淀相缺陷,缺陷密度在103~105cm-3,尺寸在一般5~30μm之间。单晶片材是从大的晶粒中切割出来的,材料中的缺陷需要通过热处理工艺来进行调整。Vydyanath[1],Sen[2]和Belas[3]等人的研究结果均表明,利用富镉状态(与其相平衡的晶体处于富镉化学计量比的状态)的热处理工艺可有效减小富碲沉淀相缺陷的尺寸,但是在我们对碲锌镉富碲沉淀相缺陷进行热处理消除的研究过程中发现,富镉热处理在减小碲锌镉材料中富碲沉淀相缺陷的同时,在沉淀相缺陷周围的材料中会伴随产生严重的位错增殖效应(见图1),从图中可以看出,经过在热处理后,富碲沉淀相缺陷显著减小,但在沉淀相缺陷的周围出现了大量的位错,其范围大致是沉淀相缺陷的5到10倍以上,即热处理在减小沉淀相缺陷尺寸的同时,位错增殖区域的出现也给材料质量带来了新的损害,它会导致材料的少数载流子寿命的减小,最终导致探测器性能的下降。Compared with the widely used Si material and GaAs material, the defect formation energy of CdZnTe material is very low, and the thermal conductivity is very low. Most of the grown CdZnTe ingots are multi-grain materials, and more or less Contains tellurium-rich or cadmium-rich precipitate phase defects, the defect density is 10 3 ~ 10 5 cm -3 , and the size is generally between 5 ~ 30 μm. Monocrystalline wafers are cut from large grains, and defects in the material need to be adjusted through a heat treatment process. The research results of Vydyanath [1] , Sen [2] and Belas [3] all show that the heat treatment process using the cadmium-rich state (the crystal in equilibrium with it is in a cadmium-rich stoichiometric state) can effectively reduce the tellurium-rich state. The size of the precipitated phase defects, but in our research on the elimination of the tellurium-rich precipitated phase defects in CdZnTe materials, we found that the cadmium-rich heat treatment can reduce the tellurium-rich precipitated phase defects in the CdZnTe material at the same time, around the precipitated phase defects There will be a serious dislocation propagation effect in the material (see Figure 1). It can be seen from the figure that after heat treatment, the defects in the tellurium-rich precipitate phase are significantly reduced, but a large number of defects appear around the precipitate phase defects. Dislocations, whose range is roughly 5 to 10 times that of precipitated phase defects, that is, while heat treatment reduces the size of precipitated phase defects, the appearance of dislocation proliferation regions also brings new damage to the material quality, which will lead to material The decrease of the minority carrier lifetime eventually leads to the degradation of the detector performance.

参考文献:references:

[1]H.R.Vydyanath,J.Ellsworth,J.J.Kennedy,et al.Recipe to minimize Teprecipitation in CdTe and(Cd,Zn)Te crystals[J].Journal of Vacuum Science&Technology B,1992,10:1476-1484[1] H.R.Vydyanath, J.Ellsworth, J.J.Kennedy, et al.Recipe to minimize Teprecipitation in CdTe and (Cd, Zn)Te crystals[J].Journal of Vacuum Science&Technology B, 1992, 10:1476-1484

[2]S.Sen,C.S.Liang,D.R.Rhiger,et al.Reduction of CdZnTe substrate defectsand relation to epitaxial HgCdTe quality[J].J.Electron.Mater.1996,25:1188-1195[2]S.Sen, C.S.Liang, D.R.Rhiger, et al.Reduction of CdZnTe substrate defects and relation to epitaxial HgCdTe quality[J].J.Electron.Mater.1996,25:1188-1195

[3]E.Belas,M.Bugár,R.Grill,et al.Reduction of inclusions in(CdZn)Te andCdTe:In single crystals by post-growth annealing[J].J.Electron.Mater.2008,37:1212-1218[3]E.Belas, M.Bugár, R.Grill, et al.Reduction of inclusions in(CdZn)Te andCdTe:In single crystals by post-growth annealing[J].J.Electron.Mater.2008, 37: 1212-1218

[4]Everson W J,Ard C K,Sepich J L,et al.Etch pit characterization of CdTe andCdZnTe substrates for use in Mercury Cadmium Telluride epitaxy[J].Journal ofElectronic Materials,1995,24(5):505-510[4]Everson W J, Ard C K, Sepich J L, et al. Etch pit characterization of CdTe and CdZnTe substrates for use in Mercury Cadmium Telluride epitaxy[J].Journal of Electronic Materials,1995,24(5):505-510

[5]J.H.GREENBERG,V.N.GUSKOV,M.FIEDERLE,et.al.,Experimental Studyof Non-Stoichiometry in Cd1-xZnxTe1-δ,Journal of ELECTRONIC MATERIALS,33(6),2004:719-723[5] JHGREENBERG, VNGUSKOV, M.FIEDERLE, et.al., Experimental Study of Non-Stoichiometry in Cd 1-x Zn x Te 1-δ , Journal of ELECTRONIC MATERIALS, 33(6), 2004: 719-723

发明内容Contents of the invention

针对富镉热处理对富碲沉淀相缺陷周边材料产生位错的问题,本发明提出了一种对富碲材料分两步进行热处理的方法,解决了富碲材料在减小沉淀相缺陷尺寸的同时产生位错增值的问题,从而更加有效地提升富碲材料的质量。本方法先用富碲状态对富碲碲锌镉材料进行热处理,将富碲沉淀相中过量的Te原子从材料中排除出去,然后再使用富镉状态对材料进行热处理,使富碲相缺陷在Cd分压的作用下进入过饱和状态,进而在材料内壁(缺陷区域的外侧)发生外延,以达到既减小沉淀相缺陷尺寸又不产生位错增值的目的。本发明提供了以下技术方案:Aiming at the problem that cadmium-rich heat treatment produces dislocations on surrounding materials of tellurium-rich precipitate defects, the present invention proposes a two-step heat treatment method for tellurium-rich materials, which solves the problem of reducing the size of tellurium-rich materials while reducing the size of precipitate phase defects. The problem of dislocation value increase occurs, so that the quality of tellurium-rich materials can be improved more effectively. This method first heat-treats the Teurium-rich CdZnTe material in a tellurium-rich state to remove the excess Te atoms in the tellurium-rich precipitate phase from the material, and then heat-treats the material in a cadmium-rich state to make the defects in the tellurium-rich phase Under the action of Cd partial pressure, it enters a supersaturated state, and then epitaxy occurs on the inner wall of the material (outside the defect region), so as to achieve the purpose of reducing the defect size of the precipitated phase without generating dislocation increment. The invention provides the following technical solutions:

1.富碲热处理工艺1. Tellurium-rich heat treatment process

研究表明,在富镉状态下,Cd原子的进入将使得富碲沉淀相缺陷在高温下形成的富碲液相处于过饱和状态,进而在材料内壁上实现外延,使缺陷区域的尺寸减小。由于富碲沉淀相含有的Te原子数量一般都大于相同体积正常晶体材料中的Te原子数量,随着Cd原子的不断进入,富碲相将充满所有自由空间,但此时仍存在过量的Te原子,因Te原子和Cd原子的结合能非常大,反应会持续下去,缺陷区域的体积将超过自由空间的体积,从而导致缺陷区域产生内应力,缺陷周边材料也将受到内应力的作用,结果造成缺陷周边材料中位错的增值。因此,要避免富镉热处理在富碲沉淀相缺陷周围产生位错增值,就必须先将富碲沉淀相缺陷中过量的碲原子从材料中排除出去。Studies have shown that in the cadmium-rich state, the entry of Cd atoms will make the tellurium-rich liquid phase formed by the tellurium-rich precipitate defects at high temperature be in a supersaturated state, and then achieve epitaxy on the inner wall of the material, reducing the size of the defect region. Since the number of Te atoms contained in the tellurium-rich precipitate phase is generally greater than the number of Te atoms in the normal crystal material of the same volume, with the continuous entry of Cd atoms, the tellurium-rich phase will fill all the free space, but there is still an excess of Te atoms , because the binding energy of Te atoms and Cd atoms is very large, the reaction will continue, and the volume of the defect region will exceed the volume of the free space, resulting in internal stress in the defect region, and the surrounding materials of the defect will also be affected by internal stress, resulting in Addition of dislocations in the material surrounding the defect. Therefore, in order to avoid the dislocation growth around the defects in the Te-rich precipitate phase caused by the cadmium-rich heat treatment, it is necessary to first exclude the excess Tellurium atoms in the Te-rich precipitate phase defects from the material.

热处理工艺为材料中的原子提供了一个能够发生运动的高温环境。在高温下,富碲材料中的富碲沉淀相将使得材料处于富碲状态,即材料的化学计量比处于富碲状态,其对应的平衡蒸气压所对应的气相环境为富碲状态(Te2分压较高,Cd分压较低),如果这时热处理工艺提供的Te2分压低于材料的平衡蒸气压,材料中的Te原子将向气相扩散,同时热处理系统的Cd分压与材料化学计量比对应的平衡蒸气压的差异也将引起Cd原子做相应的运动。由于Cd原子的扩散系数元大于Te原子,热处理提供的Cd分压不能过高,否则Cd原子将很快进入碲锌镉材料中的富碲沉淀相(此时为液相),并使其过饱和而发生外延,过高的Cd压同时会使得碲锌镉的表层很快转入富镉状态,使其Te原子的平衡蒸气压大幅度降低,进而阻碍材料中Te原子向气相扩散。由此可见,为了消除富碲沉淀相缺陷中过量的Te原子,需为富碲材料提供一个较低的气相Cd分压,低的Cd分压将落在碲锌镉材料分压相图的富碲区域,即所谓的富碲热处理。GREENBERG给出了碲锌镉材料处于富镉或富碲状态的相图[5],处于正化学计量比的碲锌镉材料所对应的Cd分压Pcd与材料温度T的关系为,The heat treatment process provides a high-temperature environment in which the atoms in the material can move. At high temperature, the tellurium-rich precipitate phase in the tellurium-rich material will make the material in a tellurium-rich state, that is, the stoichiometric ratio of the material is in a tellurium-rich state, and the gas phase environment corresponding to the equilibrium vapor pressure is a tellurium-rich state (Te 2 Higher partial pressure, lower Cd partial pressure), if the Te 2 partial pressure provided by the heat treatment process is lower than the equilibrium vapor pressure of the material, the Te atoms in the material will diffuse to the gas phase, and the Cd partial pressure of the heat treatment system is related to the material chemical The difference in the equilibrium vapor pressure corresponding to the stoichiometric ratio will also cause the Cd atoms to move accordingly. Since the diffusion coefficient of Cd atoms is greater than that of Te atoms, the Cd partial pressure provided by the heat treatment cannot be too high, otherwise the Cd atoms will quickly enter the tellurium-rich precipitate phase (liquid phase at this time) in the CdZnTe material and make it too Saturation leads to epitaxy, and too high Cd pressure will make the surface layer of CdZnTe quickly turn into a cadmium-rich state, which greatly reduces the equilibrium vapor pressure of Te atoms, thereby hindering the diffusion of Te atoms in the material to the gas phase. It can be seen that in order to eliminate the excess Te atoms in the defects of the tellurium-rich precipitate phase, it is necessary to provide a lower gas-phase Cd partial pressure for the tellurium-rich material, and the low Cd partial pressure will fall in the rich Tellurium regions, the so-called tellurium-rich heat treatment. GREENBERG has given the phase diagram of CdZnTe material in a cadmium-rich or tellurium-rich state [5] , and the relationship between the Cd partial pressure P cd and the material temperature T of the CdZnTe material in a positive stoichiometric ratio is,

log PCd(atm)=-12.255+0.01187T(℃)    (1)Cd分压与Cd源温度TCd的关系则为,log P Cd (atm)=-12.255+0.01187T(°C) (1) The relationship between Cd partial pressure and Cd source temperature T Cd is,

log PCd(atm)=-5317/TCd(K)+5.119,T>594K    (2)log P Cd (atm)=-5317/T Cd (K)+5.119, T>594K (2)

富碲热处理的Cd温度一般选择在明显小于正化学计量比所对应的Cd源温度,此时气相所对应的平衡Te2分压较高,这对排除富碲材料中过量的Te原子是不利的。然而,在实际的富碲热处理工艺中,系统不提供较高的Te2分压,热处理的气相环境与碲锌镉固相之间实际上处于一种不能平衡的非平衡状态。为了减缓这种非平衡状态对材料表层晶体结构的破坏,热处理系统中可放置一定数量的粉末,利用粉末中蒸发出来的Te原子为热处理系统提供一个较低的Te2分压。在此条件下,富碲材料中的过量Te原子将有效地向外扩散,同时,Cd原子的进入又不足以在缺陷区域造成过饱和外延和形成应力。从材料中排出的Te原子数量与热处理温度成正相关性,与Cd源温度成负相关性,通过选择合适的热处理条件,可将富碲沉淀相中的Te原子数量控制到略接近等量空间碲锌镉晶体中Te原子的数量。如果富碲沉淀相中的Te原子数量被过量排出,在经过下一步富镉热处理工艺后,沉淀相区域将留下较大的空洞。The Cd temperature of the tellurium-rich heat treatment is generally chosen to be significantly lower than the Cd source temperature corresponding to the positive stoichiometric ratio. At this time, the equilibrium Te 2 partial pressure corresponding to the gas phase is relatively high, which is unfavorable for the removal of excess Te atoms in the tellurium-rich material. . However, in the actual tellurium-rich heat treatment process, the system does not provide a high Te 2 partial pressure, and the heat treatment gas phase environment and the CdZnTe solid phase are actually in an unbalanced non-equilibrium state. In order to slow down the destruction of the non-equilibrium state on the crystal structure of the material surface, a certain amount of powder can be placed in the heat treatment system, and the Te atoms evaporated from the powder can be used to provide a lower Te 2 partial pressure for the heat treatment system. Under this condition, the excess Te atoms in the Tellurium-rich material will effectively diffuse out, and at the same time, the entry of Cd atoms is not enough to cause supersaturated epitaxy and stress formation in the defect region. The number of Te atoms expelled from the material is positively correlated with the heat treatment temperature, and negatively correlated with the Cd source temperature. By selecting appropriate heat treatment conditions, the number of Te atoms in the tellurium-rich precipitate phase can be controlled to be slightly close to the equivalent space tellurium The number of Te atoms in ZnCd crystals. If the number of Te atoms in the tellurium-rich precipitated phase is excessively discharged, large voids will be left in the precipitated phase region after the next step of cadmium-rich heat treatment process.

2.富镉热处理工艺2. Cadmium-rich heat treatment process

当富碲沉淀相缺陷不再拥有过量的Te原子后,富镉热处理将被用来减小或消除材料中的沉淀相缺陷。富镉热处理为材料提供了一个较高的Cd分压,它与含富碲沉淀相缺陷的材料所对应的较低的Cd平衡蒸气压之间的差值将导致气相Cd原子进入碲锌镉材料,使高温下呈液相的富碲沉淀相中的Cd含量不断逐渐增加,直至过饱和状态,进而导致液态沉淀相在缺陷外部的晶体表面发生外延,使材料中缺陷的空间变小。由于有了第一步的富碲热处理,富碲沉淀相将在缺陷所占据的空间内自由地转化为碲锌镉晶体,这一过程将不再产生内应力,也就不再会在其周边材料中导致位错的大幅度增加。同样,富镉热处理的气相环境相对碲锌镉材料而言,也是一个非平衡状态,为了减缓这种非平衡状态对材料表层晶体结构的破坏,热处理系统中也可放置一定数量的粉末,利用粉末中蒸发出来的Te原子为热处理系统提供一个较低的Te2分压。After the tellurium-rich precipitate defects no longer have an excess of Te atoms, the cadmium-rich heat treatment will be used to reduce or eliminate the precipitate phase defects in the material. The cadmium-rich heat treatment provides the material with a higher Cd partial pressure, and the difference between this and the lower Cd equilibrium vapor pressure corresponding to the material containing the tellurium-rich precipitated phase defects will cause gas-phase Cd atoms to enter the CdZnTe material , so that the Cd content in the tellurium-rich precipitate phase that is in liquid phase at high temperature gradually increases until it is supersaturated, which leads to the epitaxy of the liquid precipitate phase on the crystal surface outside the defect, and makes the defect space in the material smaller. Due to the first step of the tellurium-rich heat treatment, the tellurium-rich precipitate phase will freely transform into CdZnTe crystals in the space occupied by the defect, and this process will no longer generate internal stress, and will no longer be in its surrounding materials. leading to a substantial increase in dislocations. Similarly, the gas-phase environment of cadmium-rich heat treatment is also a non-equilibrium state compared with CdZnTe materials. In order to slow down the damage of this non-equilibrium state to the crystal structure of the material surface, a certain amount of powder can also be placed in the heat treatment system. The evaporated Te atoms provide a lower Te 2 partial pressure for the heat treatment system.

3.热处理工艺的方式3. The way of heat treatment process

热处理将在一个两段温区温度独立可控的高纯腔体中进行,图2是本发明所使用热处理装置的示意图。热处理系统由加热器1、热处理腔体2、样品架3、样品4、粉末5和Cd源6组成。热处理腔体可以是密闭的石英安瓿,也可以是放置在石英管腔体(开管方式的热处理工艺)中相对密闭的石墨腔体。样品放置在双温区炉的高温区,Cd源放置在低温区,Cd源放置的量应保证在热处理工艺中不会全部蒸发为气体,以保证气相的Cd分压受Cd源温度的控制。粉末的量决定着材料表面层损伤区的深度,热处理后材料表面可去除厚度的大小是选择粉末多少的参考依据。The heat treatment will be carried out in a high-purity chamber with two temperature zones whose temperature can be independently controlled. Figure 2 is a schematic diagram of the heat treatment device used in the present invention. The heat treatment system consists of a heater 1 , a heat treatment chamber 2 , a sample holder 3 , a sample 4 , a powder 5 and a Cd source 6 . The heat treatment cavity can be a closed quartz ampoule, or a relatively closed graphite cavity placed in a quartz tube cavity (heat treatment process in an open tube mode). The sample is placed in the high-temperature zone of the dual-temperature zone furnace, and the Cd source is placed in the low-temperature zone. The amount of Cd source placed should ensure that it will not evaporate into gas during the heat treatment process, so as to ensure that the Cd partial pressure in the gas phase is controlled by the temperature of the Cd source. The amount of powder determines the depth of the damaged area on the surface of the material, and the removable thickness of the material surface after heat treatment is the reference for selecting the amount of powder.

两步法热处理工艺可通过切换热处理的温度条件在同一次工艺(即不降至室温,不打开腔体)中完成,也可根据需要分两次热处理工艺完成。The two-step heat treatment process can be completed in the same process (that is, without cooling down to room temperature and without opening the cavity) by switching the temperature conditions of the heat treatment, or can be completed in two heat treatment processes as required.

4.热处理温度的选择4. Selection of heat treatment temperature

热处理温度的选择应使得Cd和Te原子在材料中有较高的迁移速率,实验结果表明,热处理温度需在550℃以上才能使材料中Cd和Te原子在几周时间内的迁移量足以改变碲锌镉材料中沉淀相的成分和体积。当热处理温度超过900℃后,碲锌镉材料的位错密度将开始增加,因此,两步法热处理工艺的热处理温度应选择在550℃到900℃之间。采用这样的热处理温度,我们采用550℃、800℃和900℃样品温度对碲锌镉晶片(厚度为1mm)进行了富碲热处理,并采用700℃样品温度对材料进行第二步富镉处理,结果显示材料中的富镉沉淀相尺寸明显减小,同时在沉淀相缺陷的周边材料中未发生位错增值。The choice of heat treatment temperature should make Cd and Te atoms have a higher migration rate in the material. Experimental results show that the heat treatment temperature needs to be above 550°C to make the migration of Cd and Te atoms in the material enough to change the tellurium density within a few weeks. Composition and volume of precipitated phases in ZnCd materials. When the heat treatment temperature exceeds 900°C, the dislocation density of the CdZnTe material will begin to increase. Therefore, the heat treatment temperature of the two-step heat treatment process should be selected between 550°C and 900°C. Using such heat treatment temperatures, we performed a tellurium-enrichment heat treatment on CdZnTe wafers (thickness 1mm) using sample temperatures of 550°C, 800°C, and 900°C, and performed a second step of cadmium-enrichment treatment on the material using a sample temperature of 700°C. The results show that the size of the cadmium-rich precipitate phase in the material is significantly reduced, and no dislocation growth occurs in the surrounding material of the precipitate phase defect.

两步法消除碲锌镉材料中富碲沉淀相缺陷的热处理技术是专门一项用于减小或消除碲锌镉材料中富碲沉淀相缺陷的技术,和以往技术相比,该技术在减小沉淀相缺陷尺寸的同时能够抑制在缺陷周围伴随产生的位错增殖效应。The two-step heat treatment technology for eliminating the defects of the tellurium-rich precipitate phase in the CdZnTe material is a special technology for reducing or eliminating the defect of the tellurium-rich precipitate phase in the CdZnTe material. At the same time, it can suppress the accompanying dislocation propagation effect around the defect while reducing the size of the defect.

附图说明Description of drawings

图1含富碲沉淀相缺陷的碲锌镉材料经富镉热处理后材料表面缺陷的变化,(a)为热处理前材料的表面形貌,(b)为热处理后的材料表面形貌。热处理工艺的温度条件是650℃/600℃(样品温度/Cd源温度),热处理时间为72小时,材料表面经过Everson腐蚀剂腐蚀[5] Fig. 1 Changes of surface defects of CdZnTe material containing tellurium-rich precipitate phase defects after cadmium-rich heat treatment, (a) is the surface morphology of the material before heat treatment, and (b) is the surface morphology of the material after heat treatment. The temperature condition of the heat treatment process is 650°C/600°C (sample temperature/Cd source temperature), the heat treatment time is 72 hours, and the surface of the material is corroded by Everson etchant [5]

图2两步法消除碲锌镉材料中富碲沉淀相缺陷的热处理系统示意图Figure 2 Schematic diagram of the heat treatment system for eliminating defects in the tellurium-rich precipitate phase in CdZnTe materials by two-step method

具体实施方式:Detailed ways:

1.热处理材料的准备1. Preparation of materials for heat treatment

1)用红外透射显微镜对被处理的碲锌镉材料进行检测,按材料所含沉淀相缺陷的类型(富碲和富镉沉淀相缺陷)和尺寸大小进行分类,每次热处理工艺应选用沉淀相缺陷尺寸大致相同的样品,并对样品进行清洗,清洗方式如下;1) Use an infrared transmission microscope to detect the treated cadmium zinc telluride material, and classify it according to the type of precipitated phase defects contained in the material (tellurium-rich and cadmium-rich precipitated phase defects) and size, and the precipitated phase should be selected for each heat treatment process Samples with approximately the same defect size, and the samples are cleaned as follows;

a)将样品放入三氯乙烯熔液中加热至沸腾,将样品从熔液中取出,更换三氯乙烯熔液后再加热至沸腾,连续3次或3次以上,取出后放入甲醇熔液中清洗3次或3次以上;a) Put the sample into the trichlorethylene melt and heat it to boiling, take the sample out of the melt, replace the trichlorethylene melt and then heat it to boiling, for 3 or more times in a row, take it out and put it into methanol melt Wash in liquid for 3 or more times;

b)配置Br甲醇熔液(浓度为0.5%~1%),将样品放入Br甲醇熔液中腐蚀10秒或10秒以上,快速取出后放入甲醇熔液中清洗3次或3次以上,接着在去离子水中清洗3次或3次以上,取出后用高纯N2气吹干后待用.b) Configure Br methanol melt (concentration is 0.5% ~ 1%), put the sample into Br methanol melt and corrode for 10 seconds or more, take it out quickly and put it into methanol melt to wash 3 times or more , and then washed in deionized water for 3 or more times, and then dried with high-purity N 2 gas before use.

2)取一定数量的碲锌镉多晶料,按上述清洗方式清洗后用洁净的玛瑙器具对块材进行粉粹处理,获取粉末颗粒尺寸小于1mm的粉末;2) Take a certain amount of cadmium zinc telluride polycrystalline material, after cleaning according to the above cleaning method, use a clean agate utensil to pulverize the block material, and obtain a powder whose particle size is less than 1mm;

3)取若干纯度高于6N的Cd条备用。3) Take some Cd strips with a purity higher than 6N for future use.

4)加工热处理工艺用的石英安瓿或制作高纯石墨样品盒,石英安瓿或热处理样品盒使用前需在高于热处理样品温度100℃的温度下进行除气(去除石英管和石墨部件材料表面可能存在的吸附气体)处理。4) Process quartz ampoules for heat treatment or make high-purity graphite sample boxes. Before use, quartz ampoules or heat treatment sample boxes must be degassed at a temperature 100°C higher than the temperature of the heat treatment sample (removing the surface of the quartz tube and graphite parts may The presence of adsorbed gas) treatment.

2.装片2. Load film

1)将样品4和粉末5装入样品架3后装入安瓿或热处理样品盒2,粉末的量由热处理工艺对表面损伤层深度的控制要求而定,放入Cd源6后在真空(真空度小于10-4Pa)下将安瓿入口融化后封闭,或用盖子将热处理样品盒封闭,Cd源的量应保证其在整个热处理过程中不被全部气化;1) Load the sample 4 and the powder 5 into the sample rack 3 and then load the ampoule or the heat treatment sample box 2. The amount of the powder is determined by the control requirements of the heat treatment process for the depth of the surface damage layer. After putting the Cd source 6 into the vacuum (vacuum Temperature is less than 10 -4 Pa) and the ampoule inlet is melted and then closed, or the heat-treated sample box is closed with a lid, and the amount of Cd source should ensure that it is not completely vaporized during the entire heat treatment process;

2)将安瓿或热处理样品盒2放入双温区炉1中,样品4和Cd源6分别位于双温区炉1的高温区和低温区。如采用热处理样品盒的方式,需对热处理腔体7进行抽真空(真空度小于10Pa),抽真空结束后放入流动的N2气,再次抽真空并放入流动的H2气。2) Put the ampoule or heat treatment sample box 2 into the dual temperature zone furnace 1, the sample 4 and the Cd source 6 are respectively located in the high temperature zone and the low temperature zone of the dual temperature zone furnace 1. If the heat treatment sample box is used, it is necessary to vacuumize the heat treatment chamber 7 (vacuum degree is less than 10Pa). After the vacuuming is completed, put flowing N2 gas, and then vacuum again and put flowing H2 gas.

3.热处理3. Heat treatment

1)按富碲热处理的工艺条件设定样品温度和Cd源温度,为了使材料中的原子在热处理工艺能够发生有效的迁移,同时又不给材料表面的晶格完整性不造成严重的破坏,热处理工艺的样品温度一般应大于550℃,但不能超过900℃。富碲热处理选择的Cd源温度要明显低于根据公式(1)和(2)计算得到的Cd源温度(一般要小于50℃以上)。根据选定的热处理温度对两段温区炉的加热装置进行温度设定,升温速率设在3℃/min~5℃/min之间(使样品温度和Cd源温度同时达到设定值),如采用热处理样品盒的开管热处理工艺,样品温度达到设定值后将流动的H2气切换为流动的Ar气;1) Set the sample temperature and Cd source temperature according to the process conditions of tellurium-rich heat treatment, in order to enable the atoms in the material to migrate effectively during the heat treatment process without causing serious damage to the lattice integrity of the material surface, The temperature of the sample in the heat treatment process should generally be greater than 550°C, but not more than 900°C. The Cd source temperature selected for tellurium-rich heat treatment should be significantly lower than the Cd source temperature calculated according to formulas (1) and (2) (generally less than 50°C). Set the temperature of the heating device of the two-stage temperature zone furnace according to the selected heat treatment temperature, and set the heating rate between 3°C/min and 5°C/min (to make the sample temperature and the Cd source temperature reach the set value at the same time), If the open tube heat treatment process of the heat treatment sample box is adopted, the flowing H2 gas is switched to the flowing Ar gas after the sample temperature reaches the set value;

2)当富碲热处理工艺达到富碲热处理时间后,按富镉热处理的工艺条件调整样品温度和Cd源温度。富镉热处理工艺的样品温度的选择范围也在550℃~900℃之间,Cd温度要明显高于根据公式(1)和3)计算得到的Cd源温度(一般也要高出50℃以上);2) When the tellurium-rich heat treatment process reaches the tellurium-rich heat treatment time, adjust the sample temperature and the Cd source temperature according to the process conditions of the cadmium-rich heat treatment. The selection range of the sample temperature for the cadmium-rich heat treatment process is also between 550°C and 900°C, and the Cd temperature is significantly higher than the Cd source temperature calculated according to formulas (1) and 3) (generally higher than 50°C) ;

①当热处理时间达到富镉热处理工艺设定的热处理时间后,切断两段温区炉加热装置的加热电源,使热处理样品4和Cd源6随炉冷却;① When the heat treatment time reaches the heat treatment time set by the cadmium-rich heat treatment process, cut off the heating power supply of the furnace heating device in the two-stage temperature zone, so that the heat-treated sample 4 and the Cd source 6 are cooled with the furnace;

②当热处理炉内的温度降至室温后,取出石英安瓿或热处理样品盒2,并取出被处理的碲锌镉材料。② When the temperature in the heat treatment furnace drops to room temperature, take out the quartz ampoule or the heat treatment sample box 2, and take out the treated CdZnTe material.

4.碲锌镉材料性能的检测和热处理效果的判断4. Detection of CdZnTe material performance and judgment of heat treatment effect

1)采用Everson腐蚀剂对碲锌镉材料表面进行腐蚀[5]。如在材料表面观察到如图1(a)所示的位错腐蚀坑簇团,则表明富碲热处理不够充分,应适当增加热处理时间或增加热处理的样品温度;1) Use Everson etchant to corrode the surface of CdZnTe material [5] . If dislocation corrosion pit clusters as shown in Figure 1(a) are observed on the surface of the material, it indicates that the tellurium-rich heat treatment is not sufficient, and the heat treatment time or the sample temperature of the heat treatment should be increased appropriately;

2)采用红外透射显微镜检测材料中的沉淀相缺陷。如在碲锌镉材料中仍能观察到微米级的体缺陷,且材料已不存在腐蚀坑簇团,则表明富碲热处理过程中从富碲沉淀相缺陷中排除的Te原子已过量。此时富碲热处理的时间应适当缩短(或富碲热处理的样品温度应适当降低);或需要适当增加富镉热处理时间或增加富镉热处理的样品温度。通过调整热处理条件,将富碲沉淀相中的Te原子数量控制到接近等量空间碲锌镉晶体中Te原子的数量;2) Infrared transmission microscopy is used to detect the precipitated phase defects in the material. If micron-scale bulk defects can still be observed in the CdZnTe material, and there are no corrosion pit clusters in the material, it indicates that Te atoms excluded from the Te-rich precipitation phase defects during the Te-rich heat treatment process have been excessive. At this time, the time of tellurium-rich heat treatment should be appropriately shortened (or the temperature of the sample for tellurium-rich heat treatment should be appropriately reduced); or the time for cadmium-rich heat treatment should be appropriately increased or the temperature of the sample for cadmium-rich heat treatment should be increased appropriately. By adjusting the heat treatment conditions, the number of Te atoms in the tellurium-rich precipitate phase is controlled to be close to the number of Te atoms in the CdZnTe crystal;

3)采用X射线衍射仪测量材料表面层的双晶半峰宽,并观察双晶半峰宽随表面层去除深度的变化,双晶半峰宽发生展宽的材料深度即为材料表面损伤层厚度,通过调整热处理的样品温度、Cd源温度和粉末的数量使材料的表面损伤层控制在后续工艺允许的范围内。3) Use an X-ray diffractometer to measure the twin crystal half peak width of the surface layer of the material, and observe the change of the twin crystal half peak width with the removal depth of the surface layer. The material depth at which the twin crystal half peak width broadens is the thickness of the damaged layer on the surface of the material , by adjusting the heat-treated sample temperature, Cd source temperature and the amount of powder to control the surface damage layer of the material within the allowable range of the subsequent process.

Claims (1)

1. two-step approach eliminates a heat treating method for rich tellurium precipitated phase defect in Cdl-x_Znx_Te, it is characterized in that comprising the following steps:
1) first Cdl-x_Znx_Te is heat-treated under rich tellurium state, tellurium atom excessive in rich tellurium precipitated phase defect is discharged sample; Thermal treatment temp is between 550 DEG C to 900 DEG C, and the setting of Cd source temperature makes sample be in the state of rich tellurium, and the selection of heat treatment time is relevant with thickness of sample with the size of tellurium precipitated phase defect rich in treated material;
2) by rich cadmium thermal treatment process, sample is heat-treated again, Cd atom is made to enter liquid rich tellurium precipitated phase, utilize the process of liquid rich tellurium precipitated phase generation supersaturation extension to reduce the size of rich tellurium precipitated phase defect, and accomplish not produce stress and misfit dislocation to periphery material in heat treatment process; Sample temperature controls between 550 DEG C to 900 DEG C, and Cd source temperature is arranged on and makes sample be in rich cadmium state, and the selection of heat treatment time is relevant with thickness of sample with the size of tellurium precipitated phase defect rich in treated material;
3) the thermal treatment heat treatment technics that adopts a kind of Te dividing potential drop under-balanced state controlled, to reduce in heat treatment process gas phase nonequilibrium situations to the destruction of material surface layer crystal body structure; The Cd point of pressure-controlled that heat treated state is provided by Cd source, place powder in sample area simultaneously, by the quantity of control Cd source temperature and powder, make the Te dividing potential drop that heat treated gas phase remains certain, be in the degree of nonequilibrium situations to slow down in thermal treatment process Te atom in material.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106435738A (en) * 2016-09-20 2017-02-22 广东先导稀材股份有限公司 Preparation method of cadmium zinc telluride polycrystals
CN107858545A (en) * 2017-12-06 2018-03-30 清远先导材料有限公司 The minimizing technology of free tellurium in a kind of high-melting-point telluride alloy
CN113410124A (en) * 2020-10-26 2021-09-17 昆明物理研究所 Method for controlling electrical property stability of gold-doped liquid phase epitaxy mercury cadmium telluride material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265582A (en) * 2005-03-22 2006-10-05 Toyota Motor Corp Alloy heat treatment method
CN103196919A (en) * 2013-03-26 2013-07-10 中国科学院上海技术物理研究所 Method for identifying precipitate corrosion pit positioned on surface of tellurium-zinc-cadmium crystal
CN103305918A (en) * 2013-06-21 2013-09-18 中国科学院上海技术物理研究所 N-type heat treatment process method for tellurium-cadmium-mercury gas-phase epitaxial material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265582A (en) * 2005-03-22 2006-10-05 Toyota Motor Corp Alloy heat treatment method
CN103196919A (en) * 2013-03-26 2013-07-10 中国科学院上海技术物理研究所 Method for identifying precipitate corrosion pit positioned on surface of tellurium-zinc-cadmium crystal
CN103305918A (en) * 2013-06-21 2013-09-18 中国科学院上海技术物理研究所 N-type heat treatment process method for tellurium-cadmium-mercury gas-phase epitaxial material

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
F.F. SHENG ET AL.: ""Etch pits of precipitates in CdZnTe crystals on (1 1 1) B surface"", 《JOURNALOFCRYSTALGROWTH》 *
FENGFENG SHENG ET AL.: ""Influence of Cd-rich annealing on defects in Te-rich CdZnTe materials"", 《JOURNAL OF ELECTRONIC MATERIALS》 *
FENGFENG SHENG ET AL.: ""Influences of Te-rich and Cd-rich Precipitates of CdZnTe Substrates on the Surface Defects of HgCdTe Liquid-Phase Epitaxy Materials "", 《JOURNAL OF ELECTRONIC MATERIALS》 *

Cited By (6)

* Cited by examiner, † Cited by third party
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CN106435738A (en) * 2016-09-20 2017-02-22 广东先导稀材股份有限公司 Preparation method of cadmium zinc telluride polycrystals
CN106435738B (en) * 2016-09-20 2019-01-15 广东先导稀贵金属材料有限公司 A kind of cadmium-zinc-teiluride polycrystalline preparation method
CN107858545A (en) * 2017-12-06 2018-03-30 清远先导材料有限公司 The minimizing technology of free tellurium in a kind of high-melting-point telluride alloy
CN107858545B (en) * 2017-12-06 2019-08-30 先导薄膜材料(广东)有限公司 Dissociate the minimizing technology of tellurium in a kind of high-melting-point telluride alloy
CN113410124A (en) * 2020-10-26 2021-09-17 昆明物理研究所 Method for controlling electrical property stability of gold-doped liquid phase epitaxy mercury cadmium telluride material
CN113410124B (en) * 2020-10-26 2022-06-14 昆明物理研究所 Method for controlling electrical property stability of gold-doped liquid phase epitaxy mercury cadmium telluride material

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