CN104519658A - Circuit board and method for forming jump layer blind holes of same - Google Patents
Circuit board and method for forming jump layer blind holes of same Download PDFInfo
- Publication number
- CN104519658A CN104519658A CN201310461626.8A CN201310461626A CN104519658A CN 104519658 A CN104519658 A CN 104519658A CN 201310461626 A CN201310461626 A CN 201310461626A CN 104519658 A CN104519658 A CN 104519658A
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- Prior art keywords
- conductive pattern
- pattern layer
- layer
- window
- blind hole
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of printed circuit boards and discloses a circuit board and a method for forming jump layer blind holes of the same. The method includes for two first electroconductive graph layers needing to jump over multiple second electroconductive graph layers for breakover, in the process of forming each first electroconductive graph layer, forming first windows at positions corresponding to the jump layer blind holes, and arranging the first windows close to a core board layer in an area where the first windows away from the core board layer are positioned; in the process of forming each second electromagnetic graph layer, forming second windows at positions corresponding to the jump layer blind holes, arranging the first windows on the outermost layer in an area where the second windows are positioned, and enabling profile lines of the first windows on the outermost layer not to be overlapped with profile lines of the second windows. Consequently, only a to-be-connected portion in each first electroconductive graph layer can be exposed by only performing laser punching in the first windows on the outermost layer, so that number of laser punching and electroplating is reduced, production process is shortened, and production cost is lowered.
Description
Technical field
The present invention relates to printed circuit board technology field, particularly relate to a kind of manufacture method and circuit board of circuit board skip floor blind hole.
Background technology
Along with the development of electronic communication, electronic product is towards multi-functional, highly dense future development; Wiring board as electronic devices and components carrier is transformed to high density interconnect (HighDensity Interconnect is called for short " HDI ") from traditional PCB.In order to reduce board area, promoting closeness, often needing the skip floor conducting realizing multiple conductive pattern layer.
Circuit board generally comprises a core layer and pressing is formed in the multiple conductive pattern layer of core layer simultaneously or on two opposite faces.Wherein, conductive pattern layer comprises and is pressed together on insulating barrier in core layer and conductive layer pattern successively, and core layer is the special conductive pattern layer a kind of two opposite faces on a plate body being all formed with conductive layer pattern.
In prior art, the inner skip floor blind hole that usually adopts of circuit board realizes the skip floor conducting of multiple conductive pattern layer.For the manufacture craft of skip floor blind hole, traditional manufacture method first does a laser drilling in core layer to form the first blind hole, and carry out plating to the first blind hole and fill out copper; Through pressing increase layer formed do not need with the conductive pattern layer of core layer conducting after, position same on circuit board again after pressing is done a laser drilling and is formed the second blind hole, then plating is carried out to the second blind hole and fills out copper, the second blind hole after plating not with this conductive pattern layer conducting; Repeat pressing and increase layer, after forming the conductive pattern layer needed with core layer conducting, the making of the 3rd blind hole is carried out in position same on circuit board again after pressing, then plating is carried out to the 3rd blind hole and fill out copper, thus the skip floor blind hole mutual conduction that core layer and outermost conductive pattern layer consist of the first blind hole, the second blind hole and the 3rd blind hole.
As can be seen from above-mentioned technique, when making the skip floor blind hole of the alternate conductive pattern layer of conducting, except the blind hole making of core layer, need twice laser drilling and twice plating to fill out process for copper and form skip floor blind hole, production procedure is long, and production cost is high, it is long to produce the delivery time, and the bad risk of quality is high.
Summary of the invention
The invention provides a kind of manufacture method and circuit board of circuit board skip floor blind hole, in order to solve in the manufacture craft of available circuit plate skip floor blind hole, the above-mentioned technical problem of existence.
For solving the problems of the technologies described above, the invention provides a kind of manufacture method of circuit board skip floor blind hole, comprising:
Formed in the one side of core layer and need two of conducting the first conductive pattern layer and do not need multiple second conductive pattern layer with described first conductive pattern layer conducting, described multiple second conductive pattern layer is between described two the first conductive pattern layer; Wherein, formed in the process of each first conductive pattern layer, form a first window in the position corresponding to the skip floor blind hole needing formation, and the first window of the first conductive pattern layer of close described core layer is positioned at the region at the first window place of the first conductive pattern layer away from described core layer; Formed in the process of each second conductive pattern layer, a Second Window is formed in the position corresponding to the skip floor blind hole needing formation, and the first window of outermost first conductive pattern layer is positioned at the region at described Second Window place, and do not have overlapping between the outline line of the first window of outermost first conductive pattern layer and the outline line of Second Window;
In the first window of outermost first conductive pattern layer, carry out laser drilling operation, form skip floor blind hole, expose the part to be connected needed in the first conductive pattern layer of conducting;
Described skip floor blind hole is electroplated, forms the electrodeposited coating connecting described part to be connected.
Above-mentioned manufacture method, wherein, described first conductive pattern layer comprises the first conductive layer of the first insulating barrier and patterning, and described first insulating barrier is arranged near described core layer;
Form the step of described first window, be specially:
Carry out graphically, forming described first window to described first conductive layer.
Above-mentioned manufacture method, wherein, described second conductive pattern layer and the second conductive pattern layer comprise the second conductive layer of the second insulating barrier and patterning; Described second insulating barrier is arranged near described core layer;
Form the step of described Second Window, be specially:
Carry out graphically, forming described Second Window to described second conductive layer.
Above-mentioned manufacture method, wherein, described skip floor blind hole is a reverse taper hole.
Above-mentioned manufacture method, wherein, described skip floor blind hole is a cylindrical hole.
Above-mentioned manufacture method, wherein, electroplates described skip floor blind hole, after forming the step of the electrodeposited coating connecting described part to be connected, also comprises:
In described skip floor blind hole, form packed layer, fill and lead up described skip floor blind hole.
For solving the problems of the technologies described above, the embodiment of the present invention additionally provides a kind of circuit board made based on said method.
The beneficial effect of technique scheme of the present invention is as follows:
In technique scheme, for needing two the first conductive pattern layer skipping multiple second conductive pattern layer conducting, in the process forming each first conductive pattern layer, corresponding to the position formation first window needing the skip floor blind hole formed, and the first window arranging the first conductive pattern layer of close core layer is positioned at the region at the first window place of the first conductive pattern layer away from core layer.And in the process forming each second conductive pattern layer, corresponding to the position formation Second Window needing the skip floor blind hole formed, and the first window arranging outermost first conductive pattern layer is positioned at the region at Second Window place, and do not have overlapping between the outline line of the first window of outermost first conductive pattern layer and the outline line of Second Window.Thus only need carry out laser drilling in the first window of outermost layer first conductive pattern layer, only can expose the part to be connected needed in the first conductive pattern layer of conducting, skip floor blind hole needed for formation, greatly reduces the number of times forming laser drilling in skip floor blind hole process.And, only need the skip floor blind hole formed once be electroplated, just can realize the conducting of multiple conductive pattern layer, shorten production flow process, reduce the quality risk of production cost and product.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1-Fig. 7 represents the manufacturing process schematic diagram of circuit board skip floor blind hole in the embodiment of the present invention one;
Fig. 8-Figure 11 represents the process schematic forming skip floor blind hole in the embodiment of the present invention two in core layer;
Figure 12 represents the structural representation of circuit board skip floor blind hole in the embodiment of the present invention two.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Embodiment one
A kind of manufacture method of circuit board skip floor blind hole is provided in the embodiment of the present invention, two conductive pattern layer alternate on turning circuit plate, namely need to be formed with multiple conductive pattern layer not needing conducting between two of conducting conductive pattern layer, and reduce to form the laser drilling number of times in skip floor blind hole process and plating number of times, to shorten the production procedure of product, reduce production cost.
The manufacture method of circuit board skip floor blind hole in the embodiment of the present invention, specifically comprises the following steps:
Formed in the one side of core layer and need two of conducting the first conductive pattern layer and do not need multiple second conductive pattern layer with described first conductive pattern layer conducting, described multiple second conductive pattern layer is between described two the first conductive pattern layer; Wherein, formed in the process of each first conductive pattern layer, form a first window in the position corresponding to the skip floor blind hole needing formation, and the first window of the first conductive pattern layer of close described core layer is positioned at the region at the first window place of the first conductive pattern layer away from described core layer; Formed in the process of each second conductive pattern layer, a Second Window is formed in the position corresponding to the skip floor blind hole needing formation, and the first window of outermost first conductive pattern layer is positioned at the region at described Second Window place, and do not have overlapping between the outline line of the first window of outermost first conductive pattern layer and the outline line of Second Window;
In the first window of outermost first conductive pattern layer, carry out laser drilling operation, form skip floor blind hole, expose the part to be connected needed in the first conductive pattern layer of conducting;
Described skip floor blind hole is electroplated, forms the electrodeposited coating connecting described part to be connected.
Wherein, the part to be connected of the first conductive pattern layer is its conductive structure, thus the first conductive pattern layer can realize conducting by the connection of electrodeposited coating and part to be connected.
Meanwhile, the window of described in the present invention is positioned at the region at another window place, comprises following two kinds of situations:
1) outline line of two windows complete matching in vertical direction;
2) window is positioned at another window region, and not overlapping between the outline line of two windows.
In technical scheme of the present invention, for needing two the first conductive pattern layer skipping multiple second conductive pattern layer conducting, in the process forming each first conductive pattern layer, corresponding to the position formation first window needing the skip floor blind hole formed, and the first window arranging the first conductive pattern layer of close core layer is positioned at the region at the first window place of the first conductive pattern layer away from core layer.And in the process forming each second conductive pattern layer, corresponding to the position formation Second Window needing the skip floor blind hole formed, and the first window arranging outermost first conductive pattern layer is positioned at the region at Second Window place, and do not have overlapping between the outline line of the first window of outermost first conductive pattern layer and the outline line of Second Window.Thus only need carry out laser drilling in the first window of outermost layer first conductive pattern layer, only can expose the part to be connected needed in the first conductive pattern layer of conducting, skip floor blind hole needed for formation, greatly reduces the number of times forming laser drilling in skip floor blind hole process.And, only need the skip floor blind hole formed once be electroplated, just can realize the conducting of two alternate the first conductive pattern layer, shorten production flow process, reduce the quality risk of production cost and product.
Below by need to be formed with second conductive pattern layer between two of conducting the first conductive pattern layer, illustrate the manufacturing process of circuit board skip floor blind hole in the embodiment of the present invention:
Step one, as shown in Figure 1, forms in the one side of core layer 1 first the first conductive pattern layer needing conducting.This first conductive pattern layer specifically comprises the first conductive layer 10 of the first insulating barrier 11 and patterning, and wherein, the first insulating barrier 11 is arranged near core layer 1, and is pressed together in core layer 1 by copper coin.First conductive layer 10 is generally the Copper Foil be formed in by chemical-copper-plating process on the first insulating barrier 11.
Step 2, as shown in Figure 2, in first the first conductive pattern layer, corresponds to and needs the position of the skip floor blind hole formed to form first window 101.Be specially, carry out graphically to the first conductive layer 10, form first window 101.As an execution mode, mechanical punching operation can be carried out to the first conductive layer 10, form first window 101.
Before to the first conductive pattern layer punching, roughening treatment can also be carried out to the first conductive pattern layer, to increase the adhesion strength between adjacent conductive graph layer.
Step 3, shown in composition graphs 3 and Fig. 4, first the first conductive pattern layer forms the second conductive pattern layer not needing conducting.And in this second conductive pattern layer, correspond to and need the position of the skip floor blind hole formed to form Second Window 102, detailed process is identical with the process forming first window in first the first conductive pattern layer, does not repeat them here.Wherein, the first window of the first window of first the first conductive pattern layer is positioned at the region at Second Window 102 place, and does not have overlapping between the outline line of the first window of first the first conductive pattern layer and the outline line of Second Window 102.
Concrete, this second conductive pattern layer comprises the second conductive layer 20 of the second insulating barrier 21 and patterning, and wherein, the second insulating barrier 21 is arranged near core layer 1, and is pressed together in core layer 1 by copper coin.Second conductive layer 20 is generally the Copper Foil be formed in by chemical-copper-plating process on the second insulating barrier 21.
Step 4, shown in composition graphs 5 and Fig. 6, the second conductive pattern layer forms second the first conductive pattern layer needing conducting.Corresponding to the position formation first window 101 needing the skip floor blind hole formed equally, detailed process is identical with the process forming first window in first the first conductive pattern layer, does not repeat them here.Wherein, the region at Second Window 102 place being positioned at the second conductive pattern layer of the first window 101 of second the first conductive pattern layer, and do not have overlapping between the outline line of the first window 101 of second the first conductive pattern layer and the outline line of the Second Window 102 of the second conductive pattern layer.
Step 5, as shown in Figure 7, carries out laser drilling operation in the first window 101 of second the first conductive pattern layer, forms skip floor blind hole 100.First window 101 due to second the first conductive pattern layer is positioned at the region at the first window place of first the first conductive pattern layer, thus can ensure that the part to be connected in two the first conductive pattern layer is all exposed.Simultaneously, first window due to second the first conductive pattern layer is positioned at the region at Second Window 102 place of the second conductive pattern layer, and do not have overlapping between the outline line of the first window of second the first conductive pattern layer and the outline line of the Second Window 102 of the second conductive pattern layer, thus can ensure only to expose the part to be connected in two the first conductive pattern layer.
Wherein, the part to be connected of the first conductive pattern layer is the first conductive layer 10.
Step 6, carries out electroplating copper to skip floor blind hole, is formed and connects the electrodeposited coating of described part to be connected, then two the first conductive pattern layer are by the connection conducting of electrodeposited coating and part to be connected.And electrodeposited coating and the second conductive layer 20 are insulated by the insulating barrier in Second Window 102, not conducting, shown in composition graphs 7.
Step 7, forms packed layer in skip floor blind hole, as: epoxy resin, for filling and leading up described skip floor blind hole, guarantee the smooth of circuit board.
When needing to be formed with two or more second conductive pattern layer between two of conducting the first conductive pattern layer, the process forming corresponding skip floor blind hole is same as described above.Only need in the process forming each second conductive pattern layer, ensure that the first window of outermost first conductive pattern layer is in the region at the Second Window place of the second conductive pattern layer, and do not have overlapping between the outline line of the first window of outermost first conductive pattern layer and the outline line of the Second Window of the second conductive pattern layer.
The skip floor blind hole 100 formed by manufacture method in the present embodiment can be the little reverse taper hole in little large the inner, outer end, a large the inner, outer end, as shown in Figure 7.Also can be a cylindrical hole.
Embodiment two
In the application process of reality, there is a kind of special situation, when needing two of conducting the first conductive pattern layer to be positioned at the both sides of core layer 1, in order to realize the conducting of two alternate the first conductive pattern layer, needing the position corresponding to the skip floor blind hole that needs are formed in core layer 1 to form transition connection portion and dividing.Because core layer 1 is a kind of special conductive pattern layer being all formed with the 3rd conductive layer pattern 30 on two opposite faces of a plate body 31, therefore, the concrete manufacturing process that the transition connection portion in core layer 1 is divided is:
Step one, as shown in Figure 8, carries out patterning processes to one of them the 3rd conductive layer 30 of core layer 1, forms the pattern 32 that transition connection portion is divided.Wherein, transition connection portion divides 32 to be specially the 3rd conductive layer 30, and corresponding with needing the position of the skip floor blind hole formed.
Step 2, as shown in Figure 9, corresponds to the position needing the skip floor blind hole formed, divides 32 to carry out mechanical punching to transition connection portion, form the 3rd window 103.
Step 3, as shown in Figure 10, carries out laser drilling operation in the 3rd window 103, forms transition blind hole 200.
Step 3, as shown in figure 11, carries out plating to described transition blind hole and fills out copper, fill and lead up described transition blind hole.
Correspondingly, in two the first conductive pattern layer, correspond to after needing the position of the skip floor blind hole formed to form first window, in two first windows, carry out laser drilling simultaneously, form two blind holes, and blind hole is electroplated, form electrodeposited coating, thus alternate two the first conductive pattern layer divide conducting by the transition connection portion of the electrodeposited coating in described two blind holes and core layer.
The both sides of core layer are positioned at when needing two of conducting the first conductive pattern layer, and be also formed with at least one between them when not needing the second conductive pattern layer of conducting, in conjunction with the scheme recorded in the embodiment of the present invention and in embodiment one, be easy to the making realizing corresponding skip floor blind hole, the final skip floor blind hole 100 formed as shown in figure 12.And in the process forming skip floor blind hole, only need three laser drilling and three electroplating technologies, the production procedure of product can be shortened equally, reduce the quality risk of production cost and product.
Embodiment three
A kind of circuit board made according to said method is also provided in the embodiment of the present invention, owing to decreasing laser drilling number of times in circuit board skip floor blind hole manufacturing process and plating number of times, thus shorten the production procedure of circuit board, reduce production cost and the quality risk of circuit board.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and replacement, these improve and replace and also should be considered as protection scope of the present invention.
Claims (7)
1. a manufacture method for circuit board skip floor blind hole, comprising:
Formed in the one side of core layer and need two of conducting the first conductive pattern layer and do not need multiple second conductive pattern layer with described first conductive pattern layer conducting, described multiple second conductive pattern layer is between described two the first conductive pattern layer; Wherein, formed in the process of each first conductive pattern layer, form a first window in the position corresponding to the skip floor blind hole needing formation, and the first window of the first conductive pattern layer of close described core layer is positioned at the region at the first window place of the first conductive pattern layer away from described core layer; Formed in the process of each second conductive pattern layer, a Second Window is formed in the position corresponding to the skip floor blind hole needing formation, and the first window of outermost first conductive pattern layer is positioned at the region at described Second Window place, and do not have overlapping between the outline line of the first window of outermost first conductive pattern layer and the outline line of Second Window;
In the first window of outermost first conductive pattern layer, carry out laser drilling operation, form skip floor blind hole, expose the part to be connected needed in the first conductive pattern layer of conducting;
Described skip floor blind hole is electroplated, forms the electrodeposited coating connecting described part to be connected.
2. manufacture method according to claim 1, is characterized in that, described first conductive pattern layer comprises the first conductive layer of the first insulating barrier and patterning, and described first insulating barrier is arranged near described core layer;
Form the step of described first window, be specially:
Carry out graphically, forming described first window to described first conductive layer.
3. manufacture method according to claim 1, is characterized in that, described second conductive pattern layer and the second conductive pattern layer comprise the second conductive layer of the second insulating barrier and patterning; Described second insulating barrier is arranged near described core layer;
Form the step of described Second Window, be specially:
Carry out graphically, forming described Second Window to described second conductive layer.
4. the manufacture method according to any one of claim 1-3, is characterized in that, described skip floor blind hole is a reverse taper hole.
5. the manufacture method according to any one of claim 1-3, is characterized in that, described skip floor blind hole is a cylindrical hole.
6. the manufacture method according to any one of claim 1-3, is characterized in that, electroplates described skip floor blind hole, after forming the step of the electrodeposited coating connecting described part to be connected, also comprises:
In described skip floor blind hole, form packed layer, fill and lead up described skip floor blind hole.
7. the circuit board made according to the manufacture method in claim 1-6 described in any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461626.8A CN104519658B (en) | 2013-09-30 | 2013-09-30 | The preparation method and circuit board of a kind of circuit board skip floor blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310461626.8A CN104519658B (en) | 2013-09-30 | 2013-09-30 | The preparation method and circuit board of a kind of circuit board skip floor blind hole |
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| Publication Number | Publication Date |
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| CN104519658A true CN104519658A (en) | 2015-04-15 |
| CN104519658B CN104519658B (en) | 2017-09-29 |
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| CN201310461626.8A Active CN104519658B (en) | 2013-09-30 | 2013-09-30 | The preparation method and circuit board of a kind of circuit board skip floor blind hole |
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Cited By (1)
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| CN114615799A (en) * | 2020-12-07 | 2022-06-10 | 华为技术有限公司 | Circuit board, circuit board manufacturing method and electronic equipment |
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| WO2022121555A1 (en) * | 2020-12-07 | 2022-06-16 | 华为技术有限公司 | Circuit board, method for manufacturing circuit board and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104519658B (en) | 2017-09-29 |
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