CN104518268A - Planar multi-stage power divider - Google Patents
Planar multi-stage power divider Download PDFInfo
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- CN104518268A CN104518268A CN201410816738.5A CN201410816738A CN104518268A CN 104518268 A CN104518268 A CN 104518268A CN 201410816738 A CN201410816738 A CN 201410816738A CN 104518268 A CN104518268 A CN 104518268A
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- input port
- ring belt
- power levels
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Abstract
A planar multi-stage power divider comprises multiple radio frequency transmission lines composed of a metal strap line and a metal plate, wherein the metal strap line of each radio frequency transmission line comprises a lumped input port and K layers of ring strap lines surrounding the lumped input port, the connection between each lumped input port and the corresponding innermost-layer ring strap line and the connection between the ring strap lines are achieved through Y connection strap lines, the outermost-layer ring strap line of each radio frequency transmission line is connected with X output ports through X output strap lines extending outwards, and an isolation resistor is connected between every two adjacent output strap liens through a resistor connection strap line, wherein X is larger than or equal to 3, Y is larger than or equal to 5 and K is larger than or equal to 2. A plane of the power divider has multiple ports and is miniaturized, the flexibility of the X output ports is high, the bandwidth of the power divider is obviously increased through arrangement of the K layers of ring strap lines around each lumped input port, the isolation degree between the ports is good, and the power divider is easy to process and obtain and has good engineering practical value.
Description
Technical field
The invention belongs to radio frequency passive device and manufacture field, be specifically related to a kind of plane multiple power levels distributor that can be applied on various array of shapes antenna.
Background technology
Power divider, as the term suggests be exactly to multiple output port radio frequency passive device by the power division of input port.The power divider be applied in aerial array mainly contains two kinds of implementations, the first scheme adopts power divider cascade system, such as four cellular array antennas, its feeding network can adopt an one-to-two power divider to realize, an i.e. each output port of one-to-two power divider but also connect an one-to-two power divider, and then realize the object of a point four.First scheme adopts power divider non-cascaded mode, namely directly adopts one one point four power dividers to realize.For the aerial array that array number is many, if adopt concatenated schemes, then the size of feeding network is often larger, and therefore a lot of occasion adopts non-cascaded multiport power divider to realize.
Mainly there are two large classes in existing non-cascaded multiport power divider: 1) energy passes through a big disk after input port feed-in, this big disk presents low-resistance, outside disk, directly add N number of band line afterwards realize the output of N road, see document [1] (Sushim Mukul Roy, Isaac Balbin, and Nemai ChandraKarmakar, Novel N-way Power Divider and Array Configuration for RFID, 2008IEEE Int RFID, 2008,89-96. is shown in Fig. 1).This type of power divider is except isolation is bad, because disk size determines its characteristic impedance and equivalent electric length, therefore want to obtain desirable matching effect, the number of N is selected often to be subject to certain restrictions, need the size increasing power divider, or need the equivalent input impedance converting output port.2) directly from input port by N number of band line parallel more external N number of matching strip line realize output port 50ohm, its isolation is increased by contact resistance between two, the band line of N number of parallel connection, see document [2]: (Yung-Jinn Chen, and Ruey-Beei Wu, A wide-bandmultiport planar power-divider design using matched sectorial components in radialarrangement, IEEE Tran.Microw Theory Tech, 46, (1998), 1072-1078. is shown in Fig. 2).This scheme mainly improves the isolation between port, but along with the increase of port number N, realize impedance matching, the N number of and characteristic impedance of associated line can increase, cause microstrip line more and more thinner, existing technique be difficult to processing or mismachining tolerance very large to performance impact.This makes the output port number N of the program be subject to certain restrictions, and affects the further lifting of isolation.
Summary of the invention
The object of the invention is to for above-mentioned defect of the prior art, provide a kind of output port number to control flexibly, size is little, bandwidth, the plane multiple power levels distributor that interport isolation significantly promotes.
To achieve these goals, the present invention includes some the radio-frequency transmission lines be made up of metal tape line and metallic plate; The K layer ring belt line that described metal tape line comprises a total input port and arranges around total input port, total input port is connected by Y bar connecting band line with between innermost circle endless belt line and each layer ring belt line, outermost layer ring belt line connects X output port by X bar outward extending output band line, isolation resistance is connected with by resistance connecting band line between adjacent output band line, wherein X >=3, Y >=5, K >=2.
Connecting band line quantity between described total input port and innermost circle endless belt line and each layer ring belt line increases from the inside to the outside successively, and the output band number of lines on outermost layer ring belt line excircle is greater than the connecting band number of lines on its inner periphery.
Described connecting band line is uniformly distributed along the inner periphery of ring belt line, exports and is with line to be uniformly distributed along the excircle of outermost layer ring belt line.
Described K layer ring belt line is arranged with one heart, and total input port is arranged on the center of circle of ring belt line.
Described connecting band line length is 0.05 λ
g~ 0.45 λ
g, wherein λ
gfor guide wavelength.
Described total input port and the impedance of X output port are 50ohm.
Plane multiple power levels distributor is realized by microstrip line construction, and microstrip line construction comprises medium substrate, metal tape line and metal floor three part, and metal tape line and metal floor lay respectively at the both sides up and down of medium substrate; Described metal tape line comprises the microstrip line connecting X output port, and K layer annulus microstrip line and Y bar connect the microstrip line of total input port.
Plane multiple power levels distributor is realized by suspension strip line structure, and suspension strip line structure comprises metal tape line, upper and lower metal floor and the medium be filled between upper and lower metal floor, and metal tape line is between upper and lower metal floor; Described metal tape line comprises the suspension band line connecting X output port, and K layer annulus suspension band line and Y bar connect the suspension band line of total input port.
Compared with prior art, present invention achieves power divider plane multiport miniaturized, the flexibility of output port X is large, by arranging K layer ring belt line around total input port, total input port is connected by Y bar connecting band line with between innermost circle endless belt line and each layer ring belt line, considerably enhance the bandwidth of power divider, ring belt line not only has the effect connecting total input port and X output port, also there is the effect of impedance matching simultaneously, the radius of ring belt line, connecting band line and ring belt line width foundation impedance matching requirements and determine.The present invention is greater than the power divider of 10 for output port number X, and performance enhancing effects is more outstanding, and compared with traditional concatenated power distributor, the volume of power divider effectively reduces.In addition isolation resistance is connected with by resistance connecting band line between adjacent output port, isolation resistance can promote the isolation between port, apply the aerial array of this power divider, the mutual coupling between bay can be reduced, improve the radiance of antenna.The present invention, compared to the power divider of traditional type non-cascaded array antenna, has the advantages that size is little, by reducing size, reduce the Insertion Loss of power divider, and the present invention is realized by pure-surface structure, be easy to processing and realize, have fabulous engineering practical value.
Further, connecting band line quantity between the total input port of the present invention and innermost circle endless belt line and each layer ring belt line increases from the inside to the outside successively, and the output band number of lines on outermost layer ring belt line excircle is greater than the connecting band number of lines on its inner periphery, which decrease the impact of mismachining tolerance for power divider performance, improve the flexibility of power splitter design.
Further, ring belt line of the present invention is arranged with one heart, and total input port is arranged on the center of circle of ring belt line, and connecting band line is uniformly distributed along the inner periphery of ring belt line, export band line to be uniformly distributed along the excircle of outermost layer ring belt line, uniform high-efficiency more when making power division like this.
Further, connecting band line length of the present invention is the guide wavelength of 0.05 ~ 0.45 times, because the connecting band line length connecting total input port is relevant to the operating frequency of power divider, the therefore power divider power division best results of the connecting band line composition of length within the scope of this.
Accompanying drawing explanation
The structural representation of Fig. 1 document 1 power divider;
The structural representation of Fig. 2 document 2 power divider;
The structural representation of Fig. 3 power divider of the present invention;
The structural representation of Fig. 4 two stage power distributor of the present invention;
Wherein, the total input port of 1-; 2-connecting band line; 3-ring belt line; 4-resistance connecting band line; 5-isolation resistance; 6-exports band line; 7-output port.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
See Fig. 1, operationally, energy passes through a big disk by after the feed-in of total input port 1 to existing non-cascaded multiport power divider, and this big disk presents low resistive state, outside big disk, directly add some strip line afterwards connect output port 7, realize multiport and export.Because big disk size determines its characteristic impedance and equivalent electric length, therefore want to obtain desirable matching effect, the number of output port is selected often to be restricted, and needing increases the size of power divider or the equivalent input impedance of conversion output port.
See Fig. 2, the existing non-cascaded multiport power divider for improving interport isolation, at input port by multiple band line parallel, then several matching strip lines external to realize output port impedance be 50ohm.Isolation is increased by contact resistance between two, band line in parallel.When output port increases, impedance matching be realized, and the characteristic impedance of associated line can increase, cause microstrip line more and more thinner, existing technique be difficult to processing or mismachining tolerance very large for the impact of performance.
See Fig. 3, metal tape line of the present invention comprises a total input port 1 and arranges with one heart around K layer ring belt line 3, the K layer ring belt line 3 that total input port 1 is arranged, and total input port 1 is arranged on the center of circle of ring belt line 3.Total input port 1 is connected by Y bar connecting band line 2 with between innermost circle endless belt line 3 and each layer ring belt line 3, and connecting band line 2 to be uniformly distributed and quantity from the inside to the outside increases successively along the inner periphery of ring belt line 3, and the length of connecting band line 2 is 0.05 λ
g~ 0.45 λ
g, wherein λ
gfor guide wavelength.Outermost layer ring belt line 3 by X bar stretch out arrange output band line 6 connect X output port 7, and output is with line 6 to be uniformly distributed along the excircle of outermost layer ring belt line 3, output band line 6 number on outermost layer ring belt line 3 excircle is greater than connecting band line 2 number on its inner periphery, isolation resistance 5 is connected with by resistance connecting band line 4 between adjacent output band line 6, wherein X >=3, Y >=5, K >=2.
Total input port 1 is 50ohm with the impedance of X output port 7.
Plane multiple power levels distributor of the present invention can be realized by microstrip line construction, and microstrip line construction comprises medium substrate, metal tape line and metal floor three part, and metal tape line and metal floor lay respectively at the both sides up and down of medium substrate; Metal tape line comprises the microstrip line connecting X output port 7, and K layer annulus microstrip line and Y bar connect the microstrip line of total input port 1.
Plane multiple power levels distributor of the present invention also can be realized by suspension strip line structure, and suspension strip line structure comprises metal tape line, upper and lower metal floor and the medium be filled between upper and lower metal floor, and metal tape line is between upper and lower metal floor; Metal tape line comprises the suspension band line connecting X output port 7, and K layer annulus suspension band line and Y bar connect the suspension band line of total input port 1.
See Fig. 4, two-stage of the present invention one point of 13 power divider, energy is by input 1 feed-in, then three connecting band lines 2 are extended, the length of connecting band line 2 and width are determined with impedance matching theory, be connected by first order ring belt line 3 between three connecting band lines 2 of the first order and seven connecting band lines 2 of the second level, ring belt line 3 not only has the effect connecting two-stage connecting band line 2, has the effect of impedance matching simultaneously.Seven connecting band lines 2 of the second level are exported by second level ring belt line 3 be with line 6 to be connected with 13, export band line 6 by 13 and connect 13 output ports 7, article 13, export between adjacent two strip line of band line 6 and add isolation resistance 5, and isolation resistance 5 is with line 6 to be connected by resistance connecting band line 4 with output, isolation resistance 5 can promote isolation between port.
Present invention achieves power divider plane multiport miniaturized, the flexibility of output port X is large, by arranging K layer ring belt line around total input port, total input port is connected by Y bar connecting band line with between innermost circle endless belt line and each layer ring belt line, considerably enhance the bandwidth of power divider, compared to the power divider of traditional non-cascaded array antenna, there is undersized feature, by reducing size, reduce the Insertion Loss of power divider, and the present invention is realized by pure-surface structure, be easy to processing realize, there is fabulous engineering practical value.
Claims (8)
1. a plane multiple power levels distributor, is characterized in that: comprise some the radio-frequency transmission lines be made up of metal tape line and metallic plate, K layer ring belt line (3) that described metal tape line comprises a total input port (1) and arranges around total input port (1), total input port (1) is connected by Y bar connecting band line (2) with between innermost circle endless belt line (3) and each layer ring belt line (3), outermost layer ring belt line (3) connects X output port (7) by outward extending output band line (6) of X bar, isolation resistance (5) is connected with by resistance connecting band line (4) between adjacent output band line (6), wherein X >=3, Y >=5, K >=2.
2. plane multiple power levels distributor according to claim 1, it is characterized in that: connecting band line (2) quantity between described total input port (1) and innermost circle endless belt line (3) and each layer ring belt line (3) increases from the inside to the outside successively, and output band line (6) number on outermost layer ring belt line (3) excircle is greater than connecting band line (2) number on its inner periphery.
3. plane multiple power levels distributor according to claim 1 and 2, it is characterized in that: described connecting band line (2) is uniformly distributed along the inner periphery of ring belt line (3), export and be with line (6) to be uniformly distributed along the excircle of outermost layer ring belt line (3).
4. plane multiple power levels distributor according to claim 3, is characterized in that: described K layer ring belt line (3) is arranged with one heart, and total input port (1) is arranged on the center of circle of ring belt line (3).
5. plane multiple power levels distributor according to claim 3, is characterized in that: described connecting band line (2) length is 0.05 λ
g~ 0.45 λ
g, wherein λ
gfor guide wavelength.
6. plane multiple power levels distributor according to claim 1, is characterized in that: described total input port (1) is 50ohm with the impedance of X output port (7).
7. plane multiple power levels distributor according to claim 1, it is characterized in that: plane multiple power levels distributor is realized by microstrip line construction, microstrip line construction comprises medium substrate, metal tape line and metal floor three part, metal tape line and metal floor lay respectively at the both sides up and down of medium substrate; Described metal tape line comprises the microstrip line connecting X output port (7), and K layer annulus microstrip line and Y bar connect the microstrip line of total input port (1).
8. plane multiple power levels distributor according to claim 1, it is characterized in that: plane multiple power levels distributor is realized by suspension strip line structure, suspension strip line structure comprises metal tape line, upper and lower metal floor and the medium be filled between upper and lower metal floor, metal tape line is between upper and lower metal floor; Described metal tape line comprises the suspension band line connecting X output port (7), and K layer annulus suspension band line and Y bar connect the suspension band line of total input port (1).
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| CN201410816738.5A CN104518268B (en) | 2014-12-24 | 2014-12-24 | Planar multi-stage power divider |
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| CN201410816738.5A CN104518268B (en) | 2014-12-24 | 2014-12-24 | Planar multi-stage power divider |
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| CN104518268B CN104518268B (en) | 2017-05-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107799859A (en) * | 2017-09-18 | 2018-03-13 | 西安空间无线电技术研究所 | A kind of non-cascaded any odd number road microstrip power divider |
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| CN101728619A (en) * | 2010-01-25 | 2010-06-09 | 北京邮电大学 | Dual-frequency-band planar microstrip multi-path power divider |
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2014
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| CN101621149A (en) * | 2008-07-01 | 2010-01-06 | 电子科技大学 | Method for designing microwave and millimeter-wave spatial power synthesis amplifier |
| CN101728619A (en) * | 2010-01-25 | 2010-06-09 | 北京邮电大学 | Dual-frequency-band planar microstrip multi-path power divider |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799859A (en) * | 2017-09-18 | 2018-03-13 | 西安空间无线电技术研究所 | A kind of non-cascaded any odd number road microstrip power divider |
| CN107799859B (en) * | 2017-09-18 | 2020-04-10 | 西安空间无线电技术研究所 | Non-cascaded arbitrary odd-path microstrip power divider |
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| CN104518268B (en) | 2017-05-17 |
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