CN104515868B - 传感器单元、电子设备以及移动体 - Google Patents

传感器单元、电子设备以及移动体 Download PDF

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Publication number
CN104515868B
CN104515868B CN201410525769.5A CN201410525769A CN104515868B CN 104515868 B CN104515868 B CN 104515868B CN 201410525769 A CN201410525769 A CN 201410525769A CN 104515868 B CN104515868 B CN 104515868B
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China
Prior art keywords
mounting
sensor
sensor unit
wiring
terminal
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CN201410525769.5A
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English (en)
Chinese (zh)
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CN104515868A (zh
Inventor
佐久间正泰
茅野岳人
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN104515868A publication Critical patent/CN104515868A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/006—Details of instruments used for thermal compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201410525769.5A 2013-10-08 2014-10-08 传感器单元、电子设备以及移动体 Active CN104515868B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013210777A JP6398168B2 (ja) 2013-10-08 2013-10-08 実装基板、センサーユニット、電子機器および移動体
JP2013-210777 2013-10-08

Publications (2)

Publication Number Publication Date
CN104515868A CN104515868A (zh) 2015-04-15
CN104515868B true CN104515868B (zh) 2019-12-17

Family

ID=52775860

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CN201410525769.5A Active CN104515868B (zh) 2013-10-08 2014-10-08 传感器单元、电子设备以及移动体

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US (1) US9689885B2 (enExample)
JP (1) JP6398168B2 (enExample)
CN (1) CN104515868B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019045171A (ja) * 2017-08-30 2019-03-22 セイコーエプソン株式会社 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体
JP7013991B2 (ja) * 2018-03-26 2022-02-01 セイコーエプソン株式会社 センサーユニット、移動体測位装置、携帯型電子機器、電子機器、移動体および表示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852320A (en) * 1996-02-19 1998-12-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor sensor with protective cap covering exposed conductive through-holes
US6979873B2 (en) * 2003-03-27 2005-12-27 Denso Corporation Semiconductor device having multiple substrates
CN2768203Y (zh) * 2004-12-23 2006-03-29 力致科技股份有限公司 设置变形抑制结构的可变刚性导热基板
CN101091312A (zh) * 2005-11-02 2007-12-19 松下电器产业株式会社 电子部件组件
US7571647B2 (en) * 2005-08-30 2009-08-11 Oki Semiconductor Co., Ltd. Package structure for an acceleration sensor
CN102066873A (zh) * 2008-04-14 2011-05-18 霍尼韦尔国际公司 用于形成安装有惯性传感器的电子组件的方法和系统
CN102119333A (zh) * 2008-08-06 2011-07-06 罗伯特·博世有限公司 具有装入传感器壳体中的芯片组件的电子传感器或传感器装置、尤其是加速度传感器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19852968C1 (de) * 1998-11-17 2000-03-30 Micronas Intermetall Gmbh Halbleiterbauelement
DE19858621C2 (de) 1998-12-18 2001-02-01 Autoflug Gmbh Verfahren zum Verbessern der Meßwerte eines inertialen Meßsystems
JP4984809B2 (ja) 2005-11-02 2012-07-25 パナソニック株式会社 電子部品パッケージ
JP2007180240A (ja) 2005-12-27 2007-07-12 Sharp Corp 多層配線基板と、それを備えた電子モジュールおよび電子機器
JP2012089803A (ja) * 2010-10-22 2012-05-10 Panasonic Corp 表面実装部品、実装基板および実装構造体
JP5708376B2 (ja) * 2011-08-30 2015-04-30 株式会社デンソー センサ装置
JP6347091B2 (ja) 2013-03-11 2018-06-27 セイコーエプソン株式会社 センサーユニット、電子機器および運動体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852320A (en) * 1996-02-19 1998-12-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor sensor with protective cap covering exposed conductive through-holes
US6979873B2 (en) * 2003-03-27 2005-12-27 Denso Corporation Semiconductor device having multiple substrates
CN2768203Y (zh) * 2004-12-23 2006-03-29 力致科技股份有限公司 设置变形抑制结构的可变刚性导热基板
US7571647B2 (en) * 2005-08-30 2009-08-11 Oki Semiconductor Co., Ltd. Package structure for an acceleration sensor
CN101091312A (zh) * 2005-11-02 2007-12-19 松下电器产业株式会社 电子部件组件
CN102066873A (zh) * 2008-04-14 2011-05-18 霍尼韦尔国际公司 用于形成安装有惯性传感器的电子组件的方法和系统
CN102119333A (zh) * 2008-08-06 2011-07-06 罗伯特·博世有限公司 具有装入传感器壳体中的芯片组件的电子传感器或传感器装置、尤其是加速度传感器

Also Published As

Publication number Publication date
US20150096372A1 (en) 2015-04-09
CN104515868A (zh) 2015-04-15
JP2015076463A (ja) 2015-04-20
JP6398168B2 (ja) 2018-10-03
US9689885B2 (en) 2017-06-27

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