CN104470259A - Method for repairing ground bonding pad of PCBA - Google Patents
Method for repairing ground bonding pad of PCBA Download PDFInfo
- Publication number
- CN104470259A CN104470259A CN201410816604.3A CN201410816604A CN104470259A CN 104470259 A CN104470259 A CN 104470259A CN 201410816604 A CN201410816604 A CN 201410816604A CN 104470259 A CN104470259 A CN 104470259A
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- pcba
- ground pad
- repairing
- ground bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a method for repairing a ground bonding pad of a PCBA. The method for repairing the ground bonding pad of the PCBA comprises the steps that a substrate exposing part, used for exposing a substrate, on the ground bonding pad is coated with a layer of electrargol firstly, the electrargol layer is made to be flush with a copper surface on the peripheral of the electrargol layer, the whole surface of the ground bonding pad is plated with a layer of copper, a OSP solution is heated to 40 DEG C-50 DEG C, the heated OSP solution is smeared to the copper surface of the ground bonding pad, so that an organic welding protection film is formed, and then the ground bonding pad with the substrate exposed is repaired. By the adoption of the method for repairing the ground bonding pad of the PCBA, the PCBA which is directly scrapped in the prior art is converted into a qualified product, the rejection rate of PCBAs is reduced, and cost is reduced.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, be specifically related to a kind of method reducing PCBA board scrappage.
Background technology
PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is PCB hollow plate part on SMT, then through the whole processing procedure of DIP plug-in unit, is called for short PCBA, PCBA board be just through above-mentioned whole processing procedure after the wiring board that obtains of machining.In PCBA process, collision or friction are can hardly be avoided, therefore the ground pad in PCBA board is sometimes owing to wound or scratch causes ground to expose, cannot normally use, cause whole PCBA board directly to scrap due to the reason of the show-through material of ground pad, also do not have other to make up or method and access that waste product utilizes.
Summary of the invention
In order to solve the problem, the invention provides a kind of PCBA board ground pad method for repairing and mending, this PCBA board ground pad method for repairing and mending by the ground pad reparation of material show-through in PCBA board, can reduce PCBA board scrappage, cost-saving, and structure is simple, easy to implement.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of PCBA board ground pad method for repairing and mending, carries out according to following step:
One, elargol is mended: the show-through material part on the ground pad of show-through material is brushed one deck elargol, elargol layer is flushed with periphery copper face;
Two, brush plating copper: at whole surperficial brush plating one deck copper of ground pad;
Three, form organic guarantor and weld film: OSP liquid medicine is heated to 40-50 DEG C, with brush by the OSP liquid medicine brush after heating on the copper face of ground pad, form one deck organic guarantor and weld film.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
It is preferred that adopt brush plating machine to carry out brush plating in step 2.
It is preferred that OSP liquid medicine is heated to 45 DEG C in step 3.
The invention has the beneficial effects as follows: PCBA board ground pad method for repairing and mending of the present invention mainly adopts to be mended elargol, brush plating copper and form step that organic guarantor welds film by the defective ground pad reparation of the show-through material in the PCBA board of originally directly scrapping, this PCBA board is made to become qualified product, reduce PCBA board scrappage, save cost.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of PCBA board ground pad method for repairing and mending, carry out according to following step:
One, elargol is mended: the show-through material part on the ground pad of show-through material is brushed one deck elargol, elargol layer is flushed with periphery copper face;
Two, brush plating copper: adopt brush plating machine at whole surperficial brush plating one deck copper of ground pad;
Three, form organic guarantor and weld film: OSP liquid medicine is heated to 45 DEG C, with brush by the OSP liquid medicine brush after heating on the copper face of ground pad, form one deck organic guarantor and weld film.
Claims (3)
1. a PCBA board ground pad method for repairing and mending, is characterized in that, carries out according to following step:
One, elargol is mended: the show-through material part on the ground pad of show-through material is brushed one deck elargol, elargol layer is flushed with periphery copper face;
Two, brush plating copper: at whole surperficial brush plating one deck copper of ground pad;
Three, form organic guarantor and weld film: OSP liquid medicine is heated to 40-50 DEG C, with brush by the OSP liquid medicine brush after heating on the copper face of ground pad, form one deck organic guarantor and weld film.
2. PCBA board ground pad method for repairing and mending as claimed in claim 1, is characterized in that: adopt brush plating machine to carry out brush plating in step 2.
3. PCBA board ground pad method for repairing and mending as claimed in claim 1, is characterized in that: in step 3, OSP liquid medicine is heated to 45 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410816604.3A CN104470259A (en) | 2014-12-24 | 2014-12-24 | Method for repairing ground bonding pad of PCBA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410816604.3A CN104470259A (en) | 2014-12-24 | 2014-12-24 | Method for repairing ground bonding pad of PCBA |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470259A true CN104470259A (en) | 2015-03-25 |
Family
ID=52915399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410816604.3A Pending CN104470259A (en) | 2014-12-24 | 2014-12-24 | Method for repairing ground bonding pad of PCBA |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470259A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768331A (en) * | 2015-03-30 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Repair method for open circuit in PCB |
| CN107567200A (en) * | 2017-09-22 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
-
2014
- 2014-12-24 CN CN201410816604.3A patent/CN104470259A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768331A (en) * | 2015-03-30 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Repair method for open circuit in PCB |
| CN107567200A (en) * | 2017-09-22 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
| CN107567200B (en) * | 2017-09-22 | 2019-09-06 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |