CN104470248B - 一种优化钢网的方法 - Google Patents
一种优化钢网的方法 Download PDFInfo
- Publication number
- CN104470248B CN104470248B CN201410770527.2A CN201410770527A CN104470248B CN 104470248 B CN104470248 B CN 104470248B CN 201410770527 A CN201410770527 A CN 201410770527A CN 104470248 B CN104470248 B CN 104470248B
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- Prior art keywords
- pad
- sub
- steel mesh
- main weldering
- weldering disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 43
- 239000010959 steel Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 15
- 238000005457 optimization Methods 0.000 abstract description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000006071 cream Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Arc Welding In General (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410770527.2A CN104470248B (zh) | 2014-12-12 | 2014-12-12 | 一种优化钢网的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410770527.2A CN104470248B (zh) | 2014-12-12 | 2014-12-12 | 一种优化钢网的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104470248A CN104470248A (zh) | 2015-03-25 |
CN104470248B true CN104470248B (zh) | 2017-09-01 |
Family
ID=52915388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410770527.2A Active CN104470248B (zh) | 2014-12-12 | 2014-12-12 | 一种优化钢网的方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104470248B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105430893A (zh) * | 2015-12-22 | 2016-03-23 | 北京握奇智能科技有限公司 | 一种基板、网板、射频支付模块及可穿戴设备 |
CN105430894A (zh) * | 2015-12-22 | 2016-03-23 | 北京握奇智能科技有限公司 | 一种基板、网板、射频支付模块及可穿戴设备 |
CN106231789A (zh) * | 2016-07-26 | 2016-12-14 | 努比亚技术有限公司 | 印刷电路板和移动终端 |
CN108829907A (zh) * | 2018-04-11 | 2018-11-16 | 上海望友信息科技有限公司 | 基于eda封装库创建钢网库的方法及系统、存储介质及终端 |
CN109165227B (zh) * | 2018-07-25 | 2022-02-11 | 上海望友信息科技有限公司 | Eda焊盘封装库的更新/应用方法、系统、介质及终端 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN200944702Y (zh) * | 2006-09-14 | 2007-09-05 | 华为技术有限公司 | 柔性印刷电路结构 |
CN101252815A (zh) * | 2008-03-31 | 2008-08-27 | 广州金升阳科技有限公司 | 一种电路基板上焊盘局部镀锡方法 |
CN102543765A (zh) * | 2012-01-13 | 2012-07-04 | 迈普通信技术股份有限公司 | 一种贴片元器件焊盘设计方法、焊盘结构及印刷电路板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001257304A (ja) * | 2000-03-10 | 2001-09-21 | Matsushita Electric Ind Co Ltd | 半導体装置およびその実装方法 |
JP2006147723A (ja) * | 2004-11-17 | 2006-06-08 | Sharp Corp | 半導体素子用の電気回路基板 |
-
2014
- 2014-12-12 CN CN201410770527.2A patent/CN104470248B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN200944702Y (zh) * | 2006-09-14 | 2007-09-05 | 华为技术有限公司 | 柔性印刷电路结构 |
CN101252815A (zh) * | 2008-03-31 | 2008-08-27 | 广州金升阳科技有限公司 | 一种电路基板上焊盘局部镀锡方法 |
CN102543765A (zh) * | 2012-01-13 | 2012-07-04 | 迈普通信技术股份有限公司 | 一种贴片元器件焊盘设计方法、焊盘结构及印刷电路板 |
Also Published As
Publication number | Publication date |
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CN104470248A (zh) | 2015-03-25 |
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Effective date of registration: 20201103 Address after: 318015 no.2-3167, zone a, Nonggang City, no.2388, Donghuan Avenue, Hongjia street, Jiaojiang District, Taizhou City, Zhejiang Province Patentee after: Taizhou Jiji Intellectual Property Operation Co.,Ltd. Address before: 201616 Shanghai city Songjiang District Guangfulin road 4855 Lane 20 Patentee before: Phicomm (Shanghai) Co.,Ltd. |
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Effective date of registration: 20220318 Address after: 100000 floor 2, building 1, North erpozi village, Huilongguan town, Changping District, Beijing Patentee after: BEIJING BANNER ELECTRIC MANUFACTURING Corp. Address before: 318015 no.2-3167, area a, nonggangcheng, 2388 Donghuan Avenue, Hongjia street, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: Taizhou Jiji Intellectual Property Operation Co.,Ltd. |
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Effective date of registration: 20231122 Address after: Room 405, 4th Floor, Building 1, North Erpozi Village, Huilongguan Town, Changping District, Beijing 102200, China Patentee after: Beijing Zhengxiangrui Technology Co.,Ltd. Address before: 100000 floor 2, building 1, North erpozi village, Huilongguan town, Changping District, Beijing Patentee before: BEIJING BANNER ELECTRIC MANUFACTURING Corp. |
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Effective date of registration: 20240403 Address after: 102201 2nd Floor, Building 1, North Erpuzi Village, Huilongguan Town, Changping District, Beijing Patentee after: BEIJING BANNER ELECTRIC MANUFACTURING Corp. Country or region after: China Address before: Room 405, 4th Floor, Building 1, North Erpozi Village, Huilongguan Town, Changping District, Beijing 102200, China Patentee before: Beijing Zhengxiangrui Technology Co.,Ltd. Country or region before: China |