CN104470200B - A kind of high-heat-dispersion LED wiring board - Google Patents
A kind of high-heat-dispersion LED wiring board Download PDFInfo
- Publication number
- CN104470200B CN104470200B CN201410734343.0A CN201410734343A CN104470200B CN 104470200 B CN104470200 B CN 104470200B CN 201410734343 A CN201410734343 A CN 201410734343A CN 104470200 B CN104470200 B CN 104470200B
- Authority
- CN
- China
- Prior art keywords
- parts
- base layer
- radiating
- cone cell
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000006185 dispersion Substances 0.000 title claims abstract description 13
- 238000009413 insulation Methods 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims description 19
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 18
- -1 Polypropylene Polymers 0.000 claims description 15
- 239000004743 Polypropylene Substances 0.000 claims description 15
- 229920001155 polypropylene Polymers 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 239000004411 aluminium Substances 0.000 claims description 11
- 239000003063 flame retardant Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000004408 titanium dioxide Substances 0.000 claims description 9
- 239000004417 polycarbonate Substances 0.000 claims description 8
- 229920000515 polycarbonate Polymers 0.000 claims description 8
- 235000001508 sulfur Nutrition 0.000 claims description 8
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 6
- 239000008187 granular material Substances 0.000 claims description 6
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 3
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 79
- 239000011529 conductive interlayer Substances 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 19
- MKJXYGKVIBWPFZ-UHFFFAOYSA-L calcium lactate Chemical compound [Ca+2].CC(O)C([O-])=O.CC(O)C([O-])=O MKJXYGKVIBWPFZ-UHFFFAOYSA-L 0.000 description 8
- 229960002401 calcium lactate Drugs 0.000 description 8
- 239000001527 calcium lactate Substances 0.000 description 8
- 235000011086 calcium lactate Nutrition 0.000 description 8
- ZGBSOTLWHZQNLH-UHFFFAOYSA-N [Mg].S(O)(O)(=O)=O Chemical compound [Mg].S(O)(O)(=O)=O ZGBSOTLWHZQNLH-UHFFFAOYSA-N 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000790917 Dioxys <bee> Species 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention discloses a kind of high-heat-dispersion LED wiring board, is successively arranged radiating base layer, thermal insulation layer and line layer from the bottom to top, and the radiating base layer is metal plate, and upper surface is equipped with multiple cone cell convex blocks；The top of the cone cell convex block is equipped with the heat transfer item of two intersections.The cone cell convex block in thermal insulation layer is protruded into, increases the contact area of radiating base layer and thermal insulation layer, and then improve the heat transfer efficiency for spreading hot radical layer Yu insulating heat-conductive interlayer.And the topside area of cone cell convex block is smaller, can avoid thermal insulation layer and is punctured by high-voltage electricity.
Description
Technical field
The present invention relates to a kind of LED circuit boards, and in particular to a kind of high-heat-dispersion LED wiring board.
Background technique
LED (light emitting diode) is commonly installed in assist side, is controlled and is shone by wiring board.LED will be produced at work
Raw big calorimetric, need to control the temperature of LED to ensure the stabilization of its working condition.The existing wiring board for installing LED is usual
Radiating base layer including line layer and aluminum, and insulation made of the resin that is arranged between line layer and the radiating base layer of aluminum
Layer.There is serious barrier to the heat dissipation of LED in the lower insulating layer of heat transfer coefficient, the LED small for area, power is low is produced
Product, the way of the prior art are to reduce thickness of insulating layer with the heat transfer efficiency between enhancement line layer and radiating base layer.But for big
Power, the LED illumination lamp of large area, LED display reduce thickness of insulating layer and are not able to satisfy between line layer and radiating base layer
Heat transfer, radiating requirements can not especially shift the more heat cross conduction in part.It is final then cause LED excessively high because of temperature
And generate light decay, color difference occur, influence the service life of LED product.In addition, its insulation effect of excessively thin insulating layer can not obtain
To guarantee, especially after hot environment aging, changes insulating layer and be easily crushed and lose insulation effect, finally make scrap of the product.
Summary of the invention
In view of this, the present invention discloses a kind of LED circuit board that can effectively control LED temperature.
The purpose of the present invention is achieved through the following technical solutions: a kind of high-heat-dispersion LED wiring board is successively arranged from the bottom to top
Radiating base layer, thermal insulation layer and line layer, the radiating base layer are metal plate, and upper surface is equipped with multiple cone cell convex blocks；Institute
The top for stating cone cell convex block is equipped with the heat transfer item of two intersections.
In the present invention, the thermal insulation layer is covered in the radiating base layer, and the cone cell convex block, heat transfer item embed
In radiating base layer.Heat transfer item is wire, such as stainless steel wire.Heat transfer item forms the thermally conductive of a transverse direction in thermal insulation layer
Network facilitates the cross conduction of heat, prevents wiring board local temperature excessively high.The cone cell convex block is radiating base layer punching press system
At.The cone cell convex block in thermal insulation layer is protruded into, increases the contact area of radiating base layer and thermal insulation layer, and then improve and spread
The heat transfer efficiency of hot radical layer and insulating heat-conductive interlayer.And the topside area of cone cell convex block is smaller, and it is high to can avoid thermal insulation layer
Piezoelectricity breakdown.
Radiating base layer lower surface position corresponding with the cone cell convex block is equipped with lower concave curved surface；On the lower concave curved surface
Vertically it is equipped with multiple radiating fins；The radiating fin surface is equipped with the radiating groove perpendicular to the radiating base layer；The heat dissipation
The section of slot is triangle.
The lowest point of lower concave curved surface and the bottom of the cone cell convex block are tangent.Since the thickness of cone cell convex block is higher, certain
The radiating efficiency of radiating base layer is influenced in degree.Therefore the present invention is in radiating base layer lower surface position corresponding with the cone cell convex block
Installed lower concave curved surface, with shorten radiating fin between cone cell convex block at a distance from, enhance heat dissipation effect.
The cone cell lug surface is equipped with the annular ring of multiple tracks protrusion.
Annular ring and cone cell convex block are integrally formed, and can increase the contact area of cone cell convex block Yu the thermal insulation layer.
The radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper, 0.01 part of titanium dioxide, 0.005 part of sulphur
Sour magnesium and 0.002 part of nano-Ag particles；The thermal insulation layer raw material include by weight 60-70 parts polypropylene,
1-5 parts of silica dioxide granules, 3-4 parts of polycarbonate and 0.02-0.05 part of fire retardant, 0.01-0.15 part of calcium lactate and
1-3 parts of elemental sulfurs.
Designer's discovery, the heat conduction efficiency of radiating base layer and insulating heat-conductive interlayer have biggish pass with the ingredient of the two
System, therefore the present invention adjusts the raw material of the two.96 parts of aluminium, 3.2 parts of copper alloy add micro magnesium sulfate, dioxy
After changing titanium and nano silver, the heat conduction efficiency between polypropylene material obtains higher promotion.And add silica dioxide granule
Polypropylene then further promote the generation of above-mentioned phenomenon.And polycarbonate is conducive to improve silica and polyacrylic combination
Intensity enables fully to mix with polypropylene.The fire retardant can be any Flame Retardant Agent of Polypropylene of the prior art,
As commercially available according to ammonium phosphate or halogen flame.Calcium lactate and elemental sulfur synergistic, can effective reinforced polypropylene material it is resistance to old
Change performance, long-term work is still able to maintain its performance at high temperature.It is raw that existing any aluminium alloy can be selected in the radiating base layer
Produce moulding process preparation.Any blending method and the preparation of resin forming technology can be selected in the thermal insulation layer.
Detailed description of the invention
Fig. 1 is sectional view of the invention.
Fig. 2 is the partial enlarged view of cone cell convex block of the present invention.
Fig. 3 is the partial enlarged view of radiating fin of the present invention.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, present invention is further described in detail:
Embodiment 1
The present embodiment provides a kind of high-heat-dispersion LED wiring boards to be successively arranged 0.8mm thickness such as Fig. 1 and Fig. 2 from the bottom to top
The thermal insulation layer 2 and line layer 3 of radiating base layer 1,0.65mm thickness, the radiating base layer are metal plate, and upper surface is equipped with more
A cone cell convex block 4；The top of the cone cell convex block is equipped with the heat transfer item 41 of two intersections.
Radiating base layer lower surface position corresponding with the cone cell convex block is equipped with lower concave curved surface 5；The lower concave curved surface
It is upper to be vertically equipped with 3 radiating fins 6；Radiating fin surface as described in Figure 3 is equipped with the radiating groove 61 perpendicular to the radiating base layer；
The section of the radiating groove is triangle.
The cone cell lug surface is equipped with the annular ring 42 of 2 protrusions.
The radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005
Part magnesium sulfate and 0.002 part of nano-Ag particles；The thermal insulation layer raw material include by weight 63 parts polypropylene,
4.3 parts of silica dioxide granules, 3.5 parts of polycarbonate and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs.
Embodiment 2
The present embodiment provides a kind of high-heat-dispersion LED wiring board, structure and embodiment 1 are consistent, particularly preferred, this implementation
The example radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of sulfuric acid
Magnesium and 0.002 part of nano-Ag particles；The thermal insulation layer raw material include by weight 70 parts polypropylene, 1 part of dioxy
Silicon carbide particle, 4 parts of polycarbonate and 0.02 part of fire retardant, 0.15 part of calcium lactate and 1 part of elemental sulfur.
Embodiment 3
The present embodiment provides a kind of high-heat-dispersion LED wiring board, structure and embodiment 1 are consistent, particularly preferred, this implementation
The example radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of sulfuric acid
Magnesium and 0.002 part of nano-Ag particles；The thermal insulation layer raw material include by weight 60 parts polypropylene, 5 parts of dioxies
Silicon carbide particle, 3 parts of polycarbonate and 0.05 part of fire retardant, 0.01 part of calcium lactate and 3 parts of elemental sulfurs.
Comparative example 1
This comparative example provides a kind of LED circuit board comprising the heat dissipation of line layer, the insulating layer of 0.5mm thickness and 0.8mm thickness
Base.The insulating layer is made of polypropylene material, and the radiating base layer is aluminium sheet.
Comparative example 2
This comparative example provides a kind of high-heat-dispersion LED wiring board, and structure and embodiment 1 are consistent, particularly preferred, this comparison
The example radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of sulfuric acid
Magnesium；The thermal insulation layer raw material includes 63 parts of polypropylene, 4.3 parts of silica dioxide granules, 3.5 parts of polycarbonate by weight
And 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs.
Comparative example 3
This comparative example provides a kind of high-heat-dispersion LED wiring board, and structure and embodiment 1 are consistent, particularly preferred, this comparison
The example radiating base layer be its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.002 part receive
Rice Argent grain；The thermal insulation layer raw material include by weight 63 parts polypropylene, 4.3 parts of silica dioxide granules, 3.5 parts it is poly-
Carbonic ester and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs.
Comparative example 4
This comparative example provides a kind of high-heat-dispersion LED wiring board, and structure and embodiment 1 are consistent, particularly preferred, this comparison
The example radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of sulfuric acid
Magnesium and 0.002 part of nano-Ag particles；The thermal insulation layer raw material include by weight 63 parts polypropylene, 4.3 part two
Silicon oxide particle, 3.5 parts of polycarbonate and 0.04 part of fire retardant, 1.5 parts of elemental sulfurs.
Comparative example 5
This comparative example provides a kind of high-heat-dispersion LED wiring board, and structure and embodiment 1 are consistent, particularly preferred, this comparison
The example radiating base layer is its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of sulfuric acid
Magnesium and 0.002 part of nano-Ag particles；The thermal insulation layer raw material include by weight 63 parts polypropylene, 3.5 parts it is poly-
Carbonic ester and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs.
Heat cross conduction efficiency test.
The wiring board selection border circular areas that wherein a diameter is 10cm for choosing embodiment 1-3 and comparative example 1 keeps it initial
Temperature is 25 DEG C of room temperature.It is that constant 80 DEG C of electric heating piece is placed at the center of the border circular areas by temperature, electric heating piece is existing
There are technology, contact area 1cm2.5 test points are averagely chosen in the borderline thermal insulation layer of border circular areas, are surveyed
The temperature change of each test point of 10min is tried, and obtains temperature averages.The temperature averages of each experimental group are as shown in table 1.
Table 1
| Experimental group | 2min(℃) | 4min(℃) | 6min(℃) | 8min(℃) | 10min(℃) |
| Embodiment 1 | 37.53 | 45.95 | 58.38 | 63.22 | 64.27 |
| Embodiment 2 | 35.22 | 42.31 | 56.74 | 59.61 | 61.55 |
| Embodiment 3 | 36.49 | 44.86 | 53.29 | 60.02 | 66.87 |
| Comparative example 1 | 25.05 | 28.11 | 32.54 | 33.72 | 33.98 |
Heat transfer efficiency test between thermal insulation layer and radiating base layer.
The wiring board for choosing embodiment 1-3 and comparative example chooses the border circular areas that one of diameter is 3cm.It strips
Its line layer keeps thermal insulation layer exposed.It is that constant 100 DEG C of electric heating piece is placed on the border circular areas, electric heating piece area by temperature
It is consistent with border circular areas.Test the temperature of the corresponding radiating base layer of the border circular areas (initial temperature is 25 DEG C, and room temperature is consistent) bottom
The variation in 5min is spent, the results are shown in Table 2.
Table 2
| Experimental group | 1min(℃) | 2min(℃) | 3min(℃) | 4min(℃) | 5min(℃) |
| Embodiment 1 | 39.23 | 62.39 | 77.46 | 89.21 | 92.05 |
| Embodiment 2 | 38.77 | 68.25 | 78.37 | 90.70 | 92.11 |
| Embodiment 3 | 39.71 | 63.97 | 77.26 | 88.29 | 92.00 |
| Comparative example 1 | 25.08 | 25.60 | 28.19 | 30.20. | 30.85 |
| Comparative example 2 | 25.50 | 27.21 | 30.90 | 34.31 | 35.09 |
| Comparative example 3 | 26.01 | 29.33 | 30.02 | 30.12 | 30.98 |
| Comparative example 4 | 36.12 | 59.97 | 73.22 | 87.66 | 91.22 |
| Comparative example 5 | 25.01 | 25.70 | 28.24 | 30.50 | 31.01 |
Ageing-resistant test.
The wiring board for choosing embodiment 1-3 and comparative example 4 is allowed in 70 DEG C shine in xenon lamp aging machine with the xenon lamp of 3KW
It penetrates 3000 hours.ASTM265 international standard is recycled to carry out shock resistance test to thermal insulation layer.It observes outside insulating layer again
See variation, result such as table 3.
Table 3
The above are wherein specific implementations of the invention, and the description thereof is more specific and detailed, but can not therefore manage
Solution is limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not departing from
Under the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection scope.
Claims (3)
1. a kind of high-heat-dispersion LED wiring board, is successively arranged radiating base layer, thermal insulation layer and line layer, feature from the bottom to top
Be: the radiating base layer is metal plate, and upper surface is equipped with multiple cone cell convex blocks；The top of the cone cell convex block is equipped with two
The heat transfer item of intersection；The radiating base layer be its raw material 96 parts of aluminium by weight, 3.2 parts of copper and 0.01 part of titanium dioxide,
0.005 part of magnesium sulfate and 0.002 part of nano-Ag particles；The thermal insulation layer raw material includes 60-70 parts by weight
Polypropylene, 1-5 parts of silica dioxide granules, 3-4 parts of polycarbonate and 0.02-0.05 part of fire retardant, 0.01-0.15 part of cream
Sour calcium and 1-3 parts of elemental sulfurs.
2. LED circuit board according to claim 1, it is characterised in that: the radiating base layer lower surface and the cone cell are convex
The corresponding position of block is equipped with lower concave curved surface；Multiple radiating fins are vertically equipped on the lower concave curved surface；The radiating fin surface
Equipped with the radiating groove perpendicular to the radiating base layer；The section of the radiating groove is triangle.
3. according to claim 1 or 2 described in any item LED circuit boards, it is characterised in that: the cone cell lug surface is equipped with more
The annular ring of road protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410734343.0A CN104470200B (en) | 2014-12-04 | 2014-12-04 | A kind of high-heat-dispersion LED wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410734343.0A CN104470200B (en) | 2014-12-04 | 2014-12-04 | A kind of high-heat-dispersion LED wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104470200A CN104470200A (en) | 2015-03-25 |
| CN104470200B true CN104470200B (en) | 2019-02-15 |
Family
ID=52915342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410734343.0A Active CN104470200B (en) | 2014-12-04 | 2014-12-04 | A kind of high-heat-dispersion LED wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470200B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101672462A (en) * | 2009-09-29 | 2010-03-17 | 李峰 | LED radiator |
| CN102448251A (en) * | 2011-09-29 | 2012-05-09 | 秦会斌 | Multilayer single-sided aluminum-based circuit board and manufacturing method thereof |
| CN204217206U (en) * | 2014-12-04 | 2015-03-18 | 深圳市博敏电子有限公司 | A kind of high-heat-dispersion LED wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7474541B2 (en) * | 2006-05-12 | 2009-01-06 | Giga-Byte Technology Co., Ltd. | Printed circuit board and heat dissipating metal surface layout thereof |
-
2014
- 2014-12-04 CN CN201410734343.0A patent/CN104470200B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101672462A (en) * | 2009-09-29 | 2010-03-17 | 李峰 | LED radiator |
| CN102448251A (en) * | 2011-09-29 | 2012-05-09 | 秦会斌 | Multilayer single-sided aluminum-based circuit board and manufacturing method thereof |
| CN204217206U (en) * | 2014-12-04 | 2015-03-18 | 深圳市博敏电子有限公司 | A kind of high-heat-dispersion LED wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104470200A (en) | 2015-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206410032U (en) | New automobile LED lamp component | |
| CN104470200B (en) | A kind of high-heat-dispersion LED wiring board | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN201476667U (en) | Thermal pipe type radiation fin capable of enlarging radiation areas | |
| CN204217206U (en) | A kind of high-heat-dispersion LED wiring board | |
| CN106764519A (en) | A kind of high-power LED bulb | |
| CN203478154U (en) | LED radiator | |
| CN102095180B (en) | Sheared and drawn plate type LED (light-emitting diode) lamp radiator | |
| CN202361324U (en) | Laminated bulb lamp radiator | |
| CN205351258U (en) | A high -efficient heat abstractor for LED lamps and lanterns | |
| CN202141015U (en) | Radiating structure and lighting device with same | |
| CN206338612U (en) | A kind of high-power LED bulb | |
| CN201992605U (en) | Heat sink for high-power LED (light-emitting diode) lamps | |
| CN201599757U (en) | Radiator of LED bulb | |
| CN105423255A (en) | Efficient heat dissipation device for LED lamps | |
| CN205824665U (en) | Eliminate the LEDbulb lamp of tropical island effect | |
| CN212929615U (en) | Lamp area that heat dissipation function is good | |
| CN215073643U (en) | Heat radiation structure and industrial controller with same | |
| CN204853633U (en) | Heat pipe formula bathroom heater | |
| CN202979567U (en) | High-efficiency radiator | |
| CN204084663U (en) | Electric-controlled box assembly and there is its automatically controlled radiating subassembly, air-conditioner | |
| CN203560751U (en) | LED (light-emitting diode) lamp panel capable of dissipating heat through copper sheets | |
| CN201973686U (en) | Shorn and drawn plate type radiator for LED (light-emitting diode) lamp | |
| CN202629693U (en) | High-power illuminating lamp with integrated semiconductor luminous sources | |
| CN202812995U (en) | Light emitting diode (LED) lamp with improved heat dissipation performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A high heat dissipation LED circuit board Effective date of registration: 20211213 Granted publication date: 20190215 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BOMIN ELECTRONIC Co.,Ltd. Registration number: Y2021980014873 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231229 Granted publication date: 20190215 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BOMIN ELECTRONIC Co.,Ltd. Registration number: Y2021980014873 |