CN104470200A - High-radiating LED circuit board - Google Patents
High-radiating LED circuit board Download PDFInfo
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- CN104470200A CN104470200A CN201410734343.0A CN201410734343A CN104470200A CN 104470200 A CN104470200 A CN 104470200A CN 201410734343 A CN201410734343 A CN 201410734343A CN 104470200 A CN104470200 A CN 104470200A
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- parts
- base layer
- radiating base
- layer
- radiating
- Prior art date
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- 238000009413 insulation Methods 0.000 claims abstract description 30
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 19
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 18
- 239000004743 Polypropylene Substances 0.000 claims description 14
- -1 polypropylene Polymers 0.000 claims description 14
- 229920001155 polypropylene Polymers 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000003063 flame retardant Substances 0.000 claims description 10
- 239000004408 titanium dioxide Substances 0.000 claims description 10
- MKJXYGKVIBWPFZ-UHFFFAOYSA-L calcium lactate Chemical compound [Ca+2].CC(O)C([O-])=O.CC(O)C([O-])=O MKJXYGKVIBWPFZ-UHFFFAOYSA-L 0.000 claims description 9
- 229960002401 calcium lactate Drugs 0.000 claims description 9
- 239000001527 calcium lactate Substances 0.000 claims description 9
- 235000011086 calcium lactate Nutrition 0.000 claims description 9
- 239000008187 granular material Substances 0.000 claims description 9
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 9
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 235000001508 sulfur Nutrition 0.000 claims description 8
- 230000005611 electricity Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 64
- 230000000052 comparative effect Effects 0.000 description 23
- 230000004888 barrier function Effects 0.000 description 7
- 238000005485 electric heating Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000011529 conductive interlayer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a high-radiating LED circuit board which is provided with a radiating base layer, an insulation heat conduction layer and a circuit layer from bottom to top in sequence. The radiating base layer is a metal plate, and a plurality of taper lugs are arranged on the upper surface of the metal plate, and two crossed heat conduction bars are arranged on the top of each taper lug. The contact area of the radiating base layer and the insulation heat conduction layer is increased through the taper lugs stretching into the insulation heat conduction layer, and thus the heat conduction efficiency between the radiating base layer and the insulation heat conduction layer is improved. In addition, the area of the tops of the taper lugs is small, and thus the insulation heat conduction layer can be prevented from being broken through by high tension electricity.
Description
Technical field
The present invention relates to a kind of LED circuit board, be specifically related to a kind of high-heat-dispersion LED wiring board.
Background technology
LED (light-emitting diode) installs in the circuit board usually, luminous by wiring board controls.LED operationally will produce large calorimetric, need the temperature of control LED to ensure the stable of its operating state.The existing wiring board for installing LED generally includes the radiating base layer of line layer and aluminium matter, and the insulating barrier that the resin between the radiating base layer being arranged on line layer and aluminium matter is made.There is serious obstruct problem, the LED product that, power little for area is low in the heat radiation of insulating barrier to LED that thermal transmission coefficient is lower, the way of prior art reduces thickness of insulating layer to strengthen the heat transfer efficiency between line layer and radiating base layer.But for high-power, large-area LED illumination lamp, LED display, reduce thickness of insulating layer and can not meet heat transfer between line layer and radiating base layer, radiating requirements, especially cannot by heat cross conduction more for local transfer.Final then cause LED to produce light decay because temperature is too high, occur aberration, affect the useful life of LED product.In addition, its insulation effect of excessively thin insulating barrier can not be guaranteed, and especially after hot environment is aging, changes insulating barrier very easily broken and lose insulation effect, finally makes product rejection.
Summary of the invention
In view of this, the present invention disclose a kind of can the LED circuit board of effective control LED temperature.
Object of the present invention is achieved through the following technical solutions: a kind of high-heat-dispersion LED wiring board, is provided with radiating base layer, thermal insulation layer and line layer from the bottom to top successively, and described radiating base layer is metallic plate, and its upper surface is provided with multiple taper projection; The top of described taper projection is provided with two heat transfer bars intersected.
In the present invention, described thermal insulation layer covers in described radiating base layer, and described taper projection, heat transfer bar are all embedded in radiating base layer.Heat transfer bar is wire, as stainless steel wire.Heat transfer bar forms the heat conduction network of a transverse direction in thermal insulation layer, contributes to the cross conduction of heat, prevents wiring board local temperature too high.Described taper projection is that radiating base layer punching press is made.Stretch into the taper projection in thermal insulation layer, add the contact area of radiating base layer and thermal insulation layer, and then improve the heat transfer efficiency of Sa Reji layer and insulating heat-conductive interlayer.And the topside area of taper projection is less, thermal insulation layer can be avoided to be punctured by high-tension electricity.
The position that described radiating base layer lower surface is corresponding with described taper projection is provided with lower concave curved surface; Described lower concave curved surface is vertically provided with multiple radiating fin; Described radiating fin surface is provided with the radiating groove perpendicular to described radiating base layer; The cross section of described radiating groove is triangle.
The lowest part of lower concave curved surface and the end of described taper projection tangent.Because the thickness of taper projection is higher, affect the radiating efficiency of radiating base layer to a certain extent.Therefore the present invention is provided with lower concave curved surface in the position that radiating base layer lower surface is corresponding with described taper projection, to shorten the distance between radiating fin and taper projection, strengthens radiating effect.
Described taper lug surface is provided with the annular ring of multiple tracks projection.
Annular ring and taper projection one-body molded, the contact area of taper projection and described thermal insulation layer can be increased.
The nano-Ag particles of described radiating base layer to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper, 0.01 part of titanium dioxide, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 60-70 parts, 1-5 parts of silica dioxide granules, 3-4 parts of Merlon and 0.02-0.05 part of fire retardant, 0.01-0.15 part of calcium lactate and 1-3 parts of elemental sulfurs by weight.
Designer finds, the heat conduction efficiency of radiating base layer and insulating heat-conductive interlayer, has larger relation with the composition of the two, and therefore the raw material of the present invention to the two adjusts.After the alloy of 96 parts of aluminium, 3.2 parts of copper adds the magnesium sulfate of trace, titanium dioxide and Nano Silver, and the heat conduction efficiency between polypropylene material obtains higher lifting.The polypropylene adding silica dioxide granule then promotes the generation of above-mentioned phenomenon further.And Merlon is conducive to improving silicon dioxide and polyacrylic bond strength, enable to mix with polypropylene fully.Described fire retardant can be any one Flame Retardant Agent of Polypropylene of prior art, as commercially available according to ammonium phosphate or halogen flame.Calcium lactate and elemental sulfur synergistic, can the ageing-resistant performance of effective RPP material, and at high temperature long-term work still can keep its performance.Described radiating base layer can select any one aluminium alloy producing shaped technique existing to prepare.Described thermal insulation layer can select any one blending method and the preparation of resin forming technology.
Accompanying drawing explanation
Fig. 1 is profile of the present invention.
Fig. 2 is the partial enlarged drawing of taper projection of the present invention.
Fig. 3 is the partial enlarged drawing of radiating fin of the present invention.
Embodiment
The present invention to be described in further detail below in conjunction with embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
The present embodiment provides a kind of high-heat-dispersion LED wiring board, and as Fig. 1 and Fig. 2, be provided with the thick thermal insulation layer 2 of the thick radiating base layer of 0.8mm 1,0.65mm and line layer 3 from the bottom to top successively, described radiating base layer is metallic plate, and its upper surface is provided with multiple taper projection 4; The top of described taper projection is provided with two heat transfer bars 41 intersected.
The position that described radiating base layer lower surface is corresponding with described taper projection is provided with lower concave curved surface 5; Described lower concave curved surface is vertically provided with 3 radiating fins 6; Radiating fin surface is provided with the radiating groove 61 perpendicular to described radiating base layer as described in Figure 3; The cross section of described radiating groove is triangle.
Described taper lug surface is provided with the annular ring 42 of 2 road projections.
The nano-Ag particles of described radiating base layer to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 63 parts, 4.3 parts of silica dioxide granules, 3.5 parts of Merlon and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs by weight.
Embodiment 2
The present embodiment provides a kind of high-heat-dispersion LED wiring board, its structure is consistent with embodiment 1, particularly preferred, the nano-Ag particles of to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper and the 0.01 part of titanium dioxide of radiating base layer described in the present embodiment, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 70 parts, 1 part of silica dioxide granule, 4 parts of Merlon and 0.02 part of fire retardant, 0.15 part of calcium lactate and 1 part of elemental sulfur by weight.
Embodiment 3
The present embodiment provides a kind of high-heat-dispersion LED wiring board, its structure is consistent with embodiment 1, particularly preferred, the nano-Ag particles of to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper and the 0.01 part of titanium dioxide of radiating base layer described in the present embodiment, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 60 parts, 5 parts of silica dioxide granules, 3 parts of Merlon and 0.05 part of fire retardant, 0.01 part of calcium lactate and 3 parts of elemental sulfurs by weight.
Comparative example 1
This comparative example provides a kind of LED circuit board, and it comprises the thick insulating barrier of line layer, 0.5mm and the thick radiating base layer of 0.8mm.Described insulating barrier is that polypropylene material is made, and described radiating base layer is aluminium sheet.
Comparative example 2
This comparative example provides a kind of high-heat-dispersion LED wiring board, and its structure is consistent with embodiment 1, particularly preferred, and radiating base layer described in this comparative example is its raw material is 96 parts of aluminium, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of magnesium sulfate by weight; Described thermal insulation layer raw material comprises the polypropylene of 63 parts, 4.3 parts of silica dioxide granules, 3.5 parts of Merlon and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs by weight.
Comparative example 3
This comparative example provides a kind of high-heat-dispersion LED wiring board, and its structure is consistent with embodiment 1, particularly preferred, to be its raw material be the by weight 96 parts of aluminium of radiating base layer described in this comparative example, 3.2 parts of copper and 0.01 part of titanium dioxide, the nano-Ag particles of 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 63 parts, 4.3 parts of silica dioxide granules, 3.5 parts of Merlon and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs by weight.
Comparative example 4
This comparative example provides a kind of high-heat-dispersion LED wiring board, its structure is consistent with embodiment 1, particularly preferred, the nano-Ag particles of to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper and the 0.01 part of titanium dioxide of radiating base layer described in this comparative example, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 63 parts, 4.3 parts of silica dioxide granules, 3.5 parts of Merlon and 0.04 part of fire retardant, 1.5 parts of elemental sulfurs by weight.
Comparative example 5
This comparative example provides a kind of high-heat-dispersion LED wiring board, its structure is consistent with embodiment 1, particularly preferred, the nano-Ag particles of to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper and the 0.01 part of titanium dioxide of radiating base layer described in this comparative example, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 63 parts, 3.5 parts of Merlon and 0.04 part of fire retardant, 0.08 part of calcium lactate and 1.5 parts of elemental sulfurs by weight.
Heat cross conduction efficiency test.
It is that the border circular areas of 10cm makes its initial temperature be 25 DEG C of room temperature that the wiring board choosing embodiment 1-3 and comparative example 1 chooses a wherein diameter.Be the center that the electric heating piece of constant 80 DEG C is placed on this border circular areas by temperature, electric heating piece is prior art, and its contact area is 1cm
2.In the borderline thermal insulation layer of border circular areas, on average choose 5 test points, the variations in temperature of each test point of test 10min, and obtain temperature averages.The temperature averages of each experimental group is as shown in table 1.
Table 1
| Experimental group | 2min(℃) | 4min(℃) | 6min(℃) | 8min(℃) | 10min(℃) |
| Embodiment 1 | 37.53 | 45.95 | 58.38 | 63.22 | 64.27 |
| Embodiment 2 | 35.22 | 42.31 | 56.74 | 59.61 | 61.55 |
| Embodiment 3 | 36.49 | 44.86 | 53.29 | 60.02 | 66.87 |
| Comparative example 1 | 25.05 | 28.11 | 32.54 | 33.72 | 33.98 |
Heat transfer efficiency test between thermal insulation layer and radiating base layer.
Choose the wiring board of embodiment 1-3 and comparative example, choose the border circular areas that one of them diameter is 3cm.Divesting its line layer makes thermal insulation layer exposed.Be that the electric heating piece of constant 100 DEG C is placed on this border circular areas by temperature, electric heating piece area is consistent with border circular areas.Test the change in the temperature 5min of radiating base layer corresponding to this border circular areas (initial temperature is 25 DEG C, and room temperature is consistent) bottom, its result is as shown in table 2.
Table 2
| Experimental group | 1min(℃) | 2min(℃) | 3min(℃) | 4min(℃) | 5min(℃) |
| Embodiment 1 | 39.23 | 62.39 | 77.46 | 89.21 | 92.05 |
| Embodiment 2 | 38.77 | 68.25 | 78.37 | 90.70 | 92.11 |
| Embodiment 3 | 39.71 | 63.97 | 77.26 | 88.29 | 92.00 |
| Comparative example 1 | 25.08 | 25.60 | 28.19 | 30.20. | 30.85 |
| Comparative example 2 | 25.50 | 27.21 | 30.90 | 34.31 | 35.09 |
| Comparative example 3 | 26.01 | 29.33 | 30.02 | 30.12 | 30.98 |
| Comparative example 4 | 36.12 | 59.97 | 73.22 | 87.66 | 91.22 |
| Comparative example 5 | 25.01 | 25.70 | 28.24 | 30.50 | 31.01 |
Ageing-resistant test.
Choose the wiring board of embodiment 1-3 and comparative example 4, make it to irradiate 3000 hours with the xenon lamp of 3KW in xenon are weatherometer in 70 DEG C.Recycling ASTM265 international standard carries out shock resistance test to thermal insulation layer.Observe insulating barrier cosmetic variation again, its result is as table 3.
Table 3
Be more than wherein specific implementation of the present invention, it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (4)
1. a high-heat-dispersion LED wiring board, is provided with radiating base layer, thermal insulation layer and line layer successively from the bottom to top, it is characterized in that: described radiating base layer is metallic plate, and its upper surface is provided with multiple taper projection; The top of described taper projection is provided with two heat transfer bars intersected.
2. LED circuit board according to claim 1, is characterized in that: the position that described radiating base layer lower surface is corresponding with described taper projection is provided with lower concave curved surface; Described lower concave curved surface is vertically provided with multiple radiating fin; Described radiating fin surface is provided with the radiating groove perpendicular to described radiating base layer; The cross section of described radiating groove is triangle.
3. LED circuit board according to claim 1 and 2, is characterized in that: described taper lug surface is provided with the annular ring of multiple tracks projection.
4. LED circuit board described according to claim 1 or 2, is characterized in that: the nano-Ag particles of described radiating base layer to be its raw material be by weight 96 parts of aluminium, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 part of magnesium sulfate and 0.002 part; Described thermal insulation layer raw material comprises the polypropylene of 60-70 parts, 1-5 parts of silica dioxide granules, 3-4 parts of Merlon and 0.02-0.05 part of fire retardant, 0.01-0.15 part of calcium lactate and 1-3 parts of elemental sulfurs by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410734343.0A CN104470200B (en) | 2014-12-04 | 2014-12-04 | A kind of high-heat-dispersion LED wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410734343.0A CN104470200B (en) | 2014-12-04 | 2014-12-04 | A kind of high-heat-dispersion LED wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104470200A true CN104470200A (en) | 2015-03-25 |
| CN104470200B CN104470200B (en) | 2019-02-15 |
Family
ID=52915342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410734343.0A Active CN104470200B (en) | 2014-12-04 | 2014-12-04 | A kind of high-heat-dispersion LED wiring board |
Country Status (1)
| Country | Link |
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| CN (1) | CN104470200B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070261882A1 (en) * | 2006-05-12 | 2007-11-15 | Tse-Hsine Laio | Printed Circuit Board and Heat Dissipating Metal Surface Layout thereof |
| CN101672462A (en) * | 2009-09-29 | 2010-03-17 | 李峰 | LED radiator |
| CN102448251A (en) * | 2011-09-29 | 2012-05-09 | 秦会斌 | Multilayer single-face aluminum-based circuit board and manufacturing method thereof |
| CN204217206U (en) * | 2014-12-04 | 2015-03-18 | 深圳市博敏电子有限公司 | A kind of high-heat-dispersion LED wiring board |
-
2014
- 2014-12-04 CN CN201410734343.0A patent/CN104470200B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070261882A1 (en) * | 2006-05-12 | 2007-11-15 | Tse-Hsine Laio | Printed Circuit Board and Heat Dissipating Metal Surface Layout thereof |
| CN101672462A (en) * | 2009-09-29 | 2010-03-17 | 李峰 | LED radiator |
| CN102448251A (en) * | 2011-09-29 | 2012-05-09 | 秦会斌 | Multilayer single-face aluminum-based circuit board and manufacturing method thereof |
| CN204217206U (en) * | 2014-12-04 | 2015-03-18 | 深圳市博敏电子有限公司 | A kind of high-heat-dispersion LED wiring board |
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| Publication number | Publication date |
|---|---|
| CN104470200B (en) | 2019-02-15 |
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Denomination of invention: A high heat dissipation LED circuit board Effective date of registration: 20211213 Granted publication date: 20190215 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BOMIN ELECTRONIC Co.,Ltd. Registration number: Y2021980014873 |
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Date of cancellation: 20231229 Granted publication date: 20190215 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BOMIN ELECTRONIC Co.,Ltd. Registration number: Y2021980014873 |