CN104465623A - Flip chip packaging structure - Google Patents
Flip chip packaging structure Download PDFInfo
- Publication number
- CN104465623A CN104465623A CN201410780475.7A CN201410780475A CN104465623A CN 104465623 A CN104465623 A CN 104465623A CN 201410780475 A CN201410780475 A CN 201410780475A CN 104465623 A CN104465623 A CN 104465623A
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- Prior art keywords
- alignment mark
- circuit board
- flexible circuit
- packing structure
- mark part
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Abstract
A flip chip packaging structure comprises a flexible circuit board and a chip fixed to the flexible circuit board. The flexible circuit board has an electric function area and an electric-free function area adjacent to the electric function area. The chip is installed in the electric function area to be electrically connected with the flexible circuit board. The flexible circuit board is provided with an alignment marking part located in the electric-free function area and a supporting part located beside the alignment marking part, and the supporting part is higher than the alignment marking part. Thus, the distinguishing rate of the alignment marking part by a production machine in the production process is increased, and the abnormality rate of products is lowered.
Description
Technical field
The present invention relates to electronic semi-conductor field, particularly a kind of semiconductor composite packing structure.
Background technology
Current panel factory bonding(engages) board need using the alignment mark(alignment mark in chip package flexible circuit board) as contraposition reference point with reach automatic Identification contraposition produce object.And the ability of board identification image has certain restriction.So alignment mark(alignment mark) quality directly affect board identification capability and production efficiency.The upper many alignment mark(alignment marks for board automatic Identification use of current tape (chip package flexible circuit board)) in production process or transportation, cannot avoid with its packaging material or produce board associated components and contact or rub and cause board cannot automatic aligning identification alignment mark(alignment mark), often report to the police because product quality is abnormal in production, increase the frequency that operating personnel manually adjusts board identification, thus reduce the board rate of driving and produce line operating efficiency, consume human resources in a large number.
Therefore, be necessary to improve existing composite packing structure.
Summary of the invention
The object of the present invention is to provide and a kind ofly guarantee alignment mark not by composite packing structure that extraneous mechanism pollutes or damages.
For achieving the above object, the present invention adopts following technical scheme: a kind of composite packing structure, comprise flexible circuit board and be fixed on the chip in flexible circuit board, described flexible circuit board be provided with electrical functionality district and with electrical functionality district adjoin without electrical functionality district, described chip is arranged on described electrical functionality district to be electrically connected with described flexible circuit board, described flexible circuit board is provided with the strutting piece being positioned at the described alignment mark part without electrical functionality district and being positioned near described alignment mark part, the height of described strutting piece is greater than the height of described alignment mark part.
As further improved technical scheme of the present invention, described strutting piece is that enclosed annular is looped around described alignment mark part surrounding.
As further improved technical scheme of the present invention, described strutting piece is that local linking formula structure ring is around described alignment mark part surrounding.
As further improved technical scheme of the present invention, described strutting piece is two projections being located at described alignment mark part both sides.
As further improved technical scheme of the present invention, described strutting piece is that simple layer material is formed or multilayer unlike material composition.
As further improved technical scheme of the present invention, described alignment mark part is located at the edge of described flexible circuit board.
As further improved technical scheme of the present invention, the protective layer that the electrical functionality district of described flexible circuit board comprises basic unit, is arranged on the line layer in basic unit and covers on line layer.
As further improved technical scheme of the present invention, described basic unit is flexible parent metal, and described protective layer is green paint coating layer, and described line layer is Cu layer.
As further improved technical scheme of the present invention, described line layer is also coated with one deck Sn layer.
Compared to prior art, the present invention by the strutting piece of rational height in certain area around alignment mark part higher than alignment mark part, thus avoids the contaminated or damage of alignment mark, improves product quality.
Accompanying drawing explanation
Fig. 1 is the floor map of composite packing structure of the present invention.
Fig. 2 is the partial enlarged drawing of dashed part in Fig. 1.
Fig. 3 be composite packing structure of the present invention in other processing procedures with packaging material or produce the process generalized section that board contacts.
Embodiment
Shown in please refer to the drawing 1, present invention is disclosed a kind of composite packing structure 100, long limit 101 bearing of trend defining described composite packing structure 100 is horizontal direction, and broadside 102 bearing of trend is longitudinal direction.The present invention Figure 1 shows that single described composite packing structure 100, generally, some described composite packing structures 100 transversely direction connect and rolling used by panel factory.
Described composite packing structure 100 comprises the chip 2 in flexible circuit board 1 and fixing described flexible circuit board 1.Described flexible circuit board 1 be provided with electrical functionality district 11 and with described electrical functionality district 11 adjoin without electrical functionality district 12.The protective layer 112 that described electrical functionality district 11 comprises basic unit 110, is arranged on the line layer 111 in basic unit 110 and covers on described line layer 111.Described basic unit 110 is PI layer region, i.e. chip package flexible parent metal, and described line layer 111 is Cu layer, is disposed on this base material, and one deck Sn can be plated in this line layer 111 surface.Described protective layer 112 green paint (SR) coating layer, is used for protecting the circuit of described line layer 111, prevents circuit oxidation scission etc.
Described chip 2 is arranged on described electrical functionality district 11, is electrically connected to reach the electric connection with described flexible circuit board 1 with described line layer 111.
Described flexible circuit board 1 is also provided with the strutting piece 122 being positioned at the described alignment mark part 121 without electrical functionality district 12 and being located near described alignment mark part 121.In illustrative embodiments of the present invention, described composite packing structure 100 is provided with two described alignment mark parts 121 being positioned at its both sides and correspondence along its horizontal direction and is located at two described strutting pieces 122 near described alignment mark 121.Described alignment mark part 121 and described strutting piece 122 are located at the edge of described flexible circuit board.
Shown in please refer to the drawing 2, each described strutting piece 122 for arround semi-circular is looped around described alignment mark part 121 to ensure transversely direction, described strutting piece 122 can be at least part of the both sides being positioned at described alignment mark part 121, and the height of described alignment mark 121 is greater than the height of described alignment mark part 121.Described strutting piece 122 can be formed or multilayer unlike material composition for simple layer material.Setting like this; the described composite packing structure 100 of rolling is in transport or other processing procedure production processes; along its horizontal direction; the i.e. rotating direction of composite packing structure volume; first packaging material or production board touch strutting piece 122; simultaneously because the height of described strutting piece 122 is higher than the height of described alignment mark part 121; make packaging material or produce board associated components directly to contact described alignment mark part 121; avoid or reduce the risk that described alignment mark is contaminated or damage, thus playing a protective role.In other embodiments, described strutting piece 122 also can be the surrounding that enclosed annular is looped around described alignment mark part 121; Or described strutting piece 122 also can be transversely direction and is located at two projections of alignment mark part 121 both sides etc.In the present invention, described strutting piece 122 is highly formed higher than described alignment mark part 121 after utilizing Cu layer etching process, or employing carrys out the strutting piece 122 of height of formation higher than described alignment mark part 121 at the material (such as green paint SR) of described alignment mark part 121 peripheral region sputter unlike material.
Shown in please refer to the drawing 3, described packaging material or produce board 200 with the process of described composite packing structure 100 relative motion in the middle of, the height of described strutting piece 122 is higher than the height of described alignment mark part 121, described strutting piece 122 is in the direction along its relative motion simultaneously, all first can abut to packaging material in described alignment mark part 121 both sides or produce board, thus protect described to being mark part 121, avoid alignment mark part contaminated or damage, reduce product abnormal rate, reduce produce board shut down because product is abnormal caused by minimizing output.
In addition, above embodiment is only for illustration of the present invention and unrestricted technical scheme described in the invention, understanding of this description should based on person of ordinary skill in the field, such as " front and back are run through " refers to and did not run through before installing other parts, again such as to " front ", " afterwards ", " left side ", " right side ", " on ", the description of D score isotropy, although this specification reference the above embodiments are to present invention has been detailed description, but, those of ordinary skill in the art is to be understood that, person of ordinary skill in the field still can modify to the present invention or equivalent replacement, and all do not depart from technical scheme and the improvement thereof of the spirit and scope of the present invention, all should be encompassed in right of the present invention.
Claims (9)
1. a composite packing structure, comprise flexible circuit board and be fixed on the chip in flexible circuit board, described flexible circuit board be provided with electrical functionality district and with electrical functionality district adjoin without electrical functionality district, described chip is arranged on described electrical functionality district to be electrically connected with described flexible circuit board, it is characterized in that: described flexible circuit board is provided with the strutting piece being positioned at the described alignment mark part without electrical functionality district and being positioned near described alignment mark part, the height of described strutting piece is greater than the height of described alignment mark part.
2. composite packing structure as claimed in claim 1, is characterized in that: described strutting piece is that enclosed annular is looped around described alignment mark part surrounding.
3. composite packing structure as claimed in claim 1, is characterized in that: described strutting piece is that local linking formula structure ring is around described alignment mark part surrounding.
4. composite packing structure as claimed in claim 1, is characterized in that: described strutting piece is two projections being located at described alignment mark part both sides.
5. as the composite packing structure in Claims 1-4 as described in any one, it is characterized in that: described strutting piece is that simple layer material is formed or multilayer unlike material composition.
6. composite packing structure as claimed in claim 1, is characterized in that: described alignment mark part is located at the edge of described flexible circuit board.
7. composite packing structure as claimed in claim 1, is characterized in that: the protective layer that the electrical functionality district of described flexible circuit board comprises basic unit, is arranged on the line layer in basic unit and covers on line layer.
8. composite packing structure as claimed in claim 7, it is characterized in that: described basic unit is flexible parent metal, described protective layer is green paint coating layer, and described line layer is Cu layer.
9. composite packing structure as claimed in claim 1, is characterized in that: described line layer is also coated with one deck Sn layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410780475.7A CN104465623B (en) | 2014-12-17 | 2014-12-17 | Composite packing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410780475.7A CN104465623B (en) | 2014-12-17 | 2014-12-17 | Composite packing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104465623A true CN104465623A (en) | 2015-03-25 |
| CN104465623B CN104465623B (en) | 2017-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410780475.7A Active CN104465623B (en) | 2014-12-17 | 2014-12-17 | Composite packing structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN104465623B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060097368A1 (en) * | 2004-11-11 | 2006-05-11 | Toshiharu Seko | Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate |
| CN102163603A (en) * | 2011-01-30 | 2011-08-24 | 南通富士通微电子股份有限公司 | Packaging structure for system level fan-out wafer |
| CN103943651A (en) * | 2013-08-29 | 2014-07-23 | 上海天马微电子有限公司 | OLED display device and corresponding flexible circuit board |
| CN204332948U (en) * | 2014-12-17 | 2015-05-13 | 颀中科技（苏州）有限公司 | Composite packing structure |
-
2014
- 2014-12-17 CN CN201410780475.7A patent/CN104465623B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060097368A1 (en) * | 2004-11-11 | 2006-05-11 | Toshiharu Seko | Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate |
| CN102163603A (en) * | 2011-01-30 | 2011-08-24 | 南通富士通微电子股份有限公司 | Packaging structure for system level fan-out wafer |
| CN103943651A (en) * | 2013-08-29 | 2014-07-23 | 上海天马微电子有限公司 | OLED display device and corresponding flexible circuit board |
| CN204332948U (en) * | 2014-12-17 | 2015-05-13 | 颀中科技（苏州）有限公司 | Composite packing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104465623B (en) | 2017-07-25 |
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