CN104465623B - Composite packing structure - Google Patents
Composite packing structure Download PDFInfo
- Publication number
- CN104465623B CN104465623B CN201410780475.7A CN201410780475A CN104465623B CN 104465623 B CN104465623 B CN 104465623B CN 201410780475 A CN201410780475 A CN 201410780475A CN 104465623 B CN104465623 B CN 104465623B
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- China
- Prior art keywords
- alignment mark
- packing structure
- mark part
- composite packing
- support member
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Abstract
A kind of composite packing structure, including FPC and the chip being fixed on FPC, the FPC provided with electrical functionality area and with electrical functionality area adjoin without electrical functionality area, the chip is arranged on the electrical functionality area to be electrically connected with the FPC, the FPC, which is provided with, is located at the alignment mark part without in electrical functionality area and the support member near the alignment mark part, and the height of the support member is more than the height of the alignment mark part.It is arranged such, improves in production process, production board reduces product abnormal rate to the discrimination rate of alignment mark part.
Description
Technical field
The present invention relates to electronic semi-conductor field, more particularly to a kind of semiconductor composite packing structure.
Background technology
Current panel factory bonding（Engagement）Board is needed with the alignment mark on chip package FPC
（Alignment mark）The purpose for aligning production is recognized automatically to reach as contraposition reference point.And the ability of board identification image has one
Fixed limitation.So alignment mark（Alignment mark）Quality directly affect board identification capability and production efficiency.Mesh
On preceding tape (chip package FPC) it is many for board recognize automatically with alignment mark（Alignment mark）
In production process or transportation, it is impossible to avoid contacting or rubbing and lead with its packaging material or production board associated components
Cause board can not automatic aligning identification alignment mark（Alignment mark）, because of the abnormal often report of product quality in production
Alert, increase operating personnel manually adjusts the frequency of board identification, so as to reduce the board rate of driving and producing line operating efficiency, largely
Consume human resources.
Therefore, it is necessary to be improved to existing composite packing structure.
The content of the invention
Ensure the chip package that alignment mark is not polluted or damaged by extraneous mechanism it is an object of the invention to provide a kind of
Structure.
To achieve the above object, the present invention is adopted the following technical scheme that：A kind of composite packing structure, including FPC
And it is fixed on the chip on FPC, the FPC adjoins provided with electrical functionality area and with electrical functionality area
Without electrical functionality area, the chip is arranged on the electrical functionality area to be electrically connected with the FPC, the flexibility
Wiring board, which is provided with, is located at the alignment mark part without in electrical functionality area and the support near the alignment mark part
Part, the height of the support member is more than the height of the alignment mark part.
As further improved technical scheme of the present invention, the support member is looped around the register guide in enclosed annular
Remember part surrounding.
As further improved technical scheme of the present invention, it is described right that the support member is wound on for local circulating type structure ring
Position mark part surrounding.
As further improved technical scheme of the present invention, the support member is located at the two of the alignment mark part both sides
Projection.
As further improved technical scheme of the present invention, the support member is that simple layer material is constituted or multilayer is different
Material is constituted.
As further improved technical scheme of the present invention, the alignment mark part is located at the corner of the FPC
Place.
As further improved technical scheme of the present invention, the electrical functionality area of the FPC includes basic unit, set
Put the line layer in basic unit and the protective layer being covered on line layer.
As further improved technical scheme of the present invention, the basic unit is flexible parent metal, and the protective layer applies for green paint
Layer of cloth, the line layer is Cu layers.
One layer Sn layers are also coated with as further improved technical scheme of the present invention, on the line layer.
Compared to prior art, the present invention by set in the certain area around alignment mark part height higher than pair
The support member of position mark part, is contaminated or damages so as to avoid alignment mark, improve product quality.
Brief description of the drawings
Fig. 1 is the floor map of composite packing structure of the present invention.
Fig. 2 is the partial enlarged drawing of dashed part in Fig. 1.
Fig. 3 is that the process that composite packing structure of the present invention is contacted in other processing procedures with packaging material or production board is cutd open
Face schematic diagram.
Embodiment
It please join shown in Fig. 1, present invention is disclosed a kind of composite packing structure 100, define the composite packing structure 100
The bearing of trend of long side 101 be horizontal direction, the bearing of trend of broadside 102 be longitudinal direction.Fig. 1 of the present invention show single described
Composite packing structure 100, generally, some composite packing structures 100 are connected and in rolls by panel in transverse direction
Factory uses.
The composite packing structure 100 includes the chip 2 on FPC 1 and the fixed FPC 1.It is described
FPC 1 provided with electrical functionality area 11 and with the electrical functionality area 11 adjoin without electrical functionality area 12.The electricity
Sexual function area 11 includes basic unit 110, the line layer 111 being arranged in basic unit 110 and the guarantor being covered on the line layer 111
Sheath 112.The basic unit 110 is PI layers of region, i.e. chip package flexible parent metal, and the line layer 111 is Cu layers, is disposed in
On this base material, and this surface of line layer 111 can plate one layer of Sn.The green paint of protective layer 112（SR）Coating layer, for protecting
The circuit of line layer 111 is stated, circuit oxidation scission etc. is prevented.
The chip 2 be arranged on the electrical functionality area 11, be electrically connected with the line layer 111 with reach with it is described soft
The electric connection of property wiring board 1.
The FPC 1 is additionally provided with positioned at the alignment mark part 121 without in electrical functionality area 12 and is located at
Support member 122 near the alignment mark part 121.In illustrative embodiments of the present invention, the composite packing structure 100
Along its horizontal direction be provided with positioned at its both sides two alignment mark parts 121 and to be correspondingly arranged at the alignment mark 121 attached
Two near support members 122.The alignment mark part 121 and the support member 122 are located at the FPC
Edge.
Please join shown in Fig. 2, each support member 122 be semi-circular be looped around arround the alignment mark part 121 with
Ensure in transverse direction, the support member 122 can at least part of both sides positioned at the alignment mark part 121, it is and described
The height of alignment mark 121 is more than the height of the alignment mark part 121.The support member 122 can be simple layer material structure
Into or multilayer unlike material composition.It is arranged such, the coiled composite packing structure 100 is in transport or the life of other processing procedures
During production, along the rotating direction of its horizontal direction, i.e. composite packing structure volume, packaging material or production board are contacted first
To support member 122, simultaneously as the height of the support member 122 is higher than the height of the alignment mark part 121 so that packing timber
Material or production board associated components can not directly contact the alignment mark part 121, it is to avoid or reduce the alignment mark quilt
Pollution or the risk of damage, so as to play a protective role.In other embodiments, the support member 122 is alternatively closed
Annular is looped around the surrounding of the alignment mark part 121；Or the support member 122 is alternatively and is located at register guide in transverse direction
Remember two projections of the both sides of part 121 etc..In the present invention, the support member 122 after Cu layers of etching process by using being highly higher than
The alignment mark part 121 and formed, or be utilized in the thing of the peripheral region sputter unlike material of alignment mark part 121
Matter（Such as green paint SR）To form the support member 122 that height is higher than the alignment mark part 121.
It please join shown in Fig. 3, the packaging material or production board 200 are transported relative with the composite packing structure 100
Among dynamic process, the height of the support member 122 is higher than the height of the alignment mark part 121, while the support member 122
In the direction along its relative motion, packaging material or manufacturing machine can be first abutted in the both sides of alignment mark part 121
Platform, so that it is mark part 121 to protect described pair, it is to avoid alignment mark part is contaminated or damages, and reduces product abnormal rate,
Reduce the reduction output caused by production board is shut down because of product exception.
In addition, above example is merely to illustrate the present invention and not limits technical scheme described in the invention, to this
The understanding of specification should be based on person of ordinary skill in the field, and such as " front and rear to run through " refers to not installing it
What he was through before part, then for example to "front", "rear", "left", "right", " on ", " under " isotropy description, although this
Specification is with reference to the above embodiments to present invention has been detailed description, still, one of ordinary skill in the art should
Work as understanding, person of ordinary skill in the field still can modify or equivalent substitution to the present invention, and all do not take off
Technical scheme and its improvement from the spirit and scope of the present invention, all should cover in scope of the presently claimed invention.
Claims (9)
1. a kind of composite packing structure, including FPC and the chip that is fixed on FPC, the flexible circuitry
Plate provided with electrical functionality area and with electrical functionality area adjoin without electrical functionality area, the chip is arranged on the electrical functionality
FPC described in Qu Yiyu is electrically connected with, it is characterised in that：The FPC is provided with positioned at described without electrical functionality
Alignment mark part in area and the support member near the alignment mark part, the height of the support member is more than described right
The height of position mark part.
2. composite packing structure as claimed in claim 1, it is characterised in that：The support member is looped around institute in enclosed annular
State alignment mark part surrounding.
3. composite packing structure as claimed in claim 1, it is characterised in that：The support member be local circulating type structure ring around
In the alignment mark part surrounding.
4. composite packing structure as claimed in claim 1, it is characterised in that：The support member is located at the alignment mark part
Two projections of both sides.
5. the composite packing structure as described in any one in Claims 1-4, it is characterised in that：The support member is single
Layer material is constituted or multilayer unlike material composition.
6. composite packing structure as claimed in claim 1, it is characterised in that：The alignment mark part is located at the flexible circuitry
The edge of plate.
7. composite packing structure as claimed in claim 1, it is characterised in that：The electrical functionality area of the FPC includes
Basic unit, the line layer being arranged in basic unit and the protective layer being covered on line layer.
8. composite packing structure as claimed in claim 7, it is characterised in that：The basic unit is flexible parent metal, the protective layer
For green paint coating layer, the line layer is Cu layers.
9. composite packing structure as claimed in claim 1, it is characterised in that：One layer Sn layers are also coated with the line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410780475.7A CN104465623B (en) | 2014-12-17 | 2014-12-17 | Composite packing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410780475.7A CN104465623B (en) | 2014-12-17 | 2014-12-17 | Composite packing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104465623A CN104465623A (en) | 2015-03-25 |
| CN104465623B true CN104465623B (en) | 2017-07-25 |
Family
ID=52911427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410780475.7A Active CN104465623B (en) | 2014-12-17 | 2014-12-17 | Composite packing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465623B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163603A (en) * | 2011-01-30 | 2011-08-24 | 南通富士通微电子股份有限公司 | Packaging structure for system level fan-out wafer |
| CN103943651A (en) * | 2013-08-29 | 2014-07-23 | 上海天马微电子有限公司 | OLED display device and corresponding flexible circuit board |
| CN204332948U (en) * | 2014-12-17 | 2015-05-13 | 颀中科技（苏州）有限公司 | Composite packing structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165517A (en) * | 2004-11-11 | 2006-06-22 | Sharp Corp | Flexible wiring board, manufacturing method therof semiconductor device and electronic apparatus using it |
-
2014
- 2014-12-17 CN CN201410780475.7A patent/CN104465623B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163603A (en) * | 2011-01-30 | 2011-08-24 | 南通富士通微电子股份有限公司 | Packaging structure for system level fan-out wafer |
| CN103943651A (en) * | 2013-08-29 | 2014-07-23 | 上海天马微电子有限公司 | OLED display device and corresponding flexible circuit board |
| CN204332948U (en) * | 2014-12-17 | 2015-05-13 | 颀中科技（苏州）有限公司 | Composite packing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104465623A (en) | 2015-03-25 |
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| GR01 | Patent grant |