CN104464890A - Thick film circuit resistor paste - Google Patents
Thick film circuit resistor paste Download PDFInfo
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- CN104464890A CN104464890A CN201410826251.5A CN201410826251A CN104464890A CN 104464890 A CN104464890 A CN 104464890A CN 201410826251 A CN201410826251 A CN 201410826251A CN 104464890 A CN104464890 A CN 104464890A
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Abstract
The invention discloses thick film circuit resistor paste. According to the formula, the thick film circuit resistor paste comprises, by mass, 1-5 parts of boron-bearing flame-retardant and temperature-resistant high-molecular polymers, 0.5-2 parts of nanocarbon system conductive filler, 10-15 parts of conductive phase graphite powder, 3-5 parts of superfine base metal alloyed powder conductive filler, 2-3 parts of resin, 0.5-1 part of stearate heat stabilizers, 1-3 parts of high boiling point solvents, 3-6 parts of curing agents, 1-1.5 parts of curing accelerators, 1-3 parts of potassium oxide, 2-3 parts of phosphorus pentoxide, 2-3 parts of carbon powder, 10-15 parts of lead-free glass powder, 2-4 parts of titanium-based oxide, 2-3 parts of tin oxide, 0.5-1 part of aluminium powder, and 2-5 parts of organic bonding agents, wherein the organic bonding agents comprise, by weight, 75%-85% of terpilenol and 15%-25% of cellulose nitrate. The thick film circuit resistor paste not only has the combined functions of flame retardance, heat resistance, ageing resistance, heat radiation, environment friendliness and the like, but also improves the stability of a system.
Description
Technical field
The present invention relates to electronic applications, be specifically related to a kind of thick-film circuit resistor paste.
Background technology
A kind of conventional electric component during resistance, application is extensive, such as be used in integrated circuit, chip, but along with developing rapidly of integrated circuit and chip, current resistance also exists shortcomings, can not meet integrated needs, resistance slurry becomes the direction addressed this problem.
As the main component of resistance slurry, be usually made up of glass composition, electric conducting material, organic carrier, comprising glass composition is in order to adjusting resistance value and the cementability increasing slurry.On substrate after printed resistor slurry, by sintering, form thickness and be about the thick-film resistor of 5-20um, and, in this kind of resistance slurry, ruthenium-oxide and plumbous ru oxide usually can be used as electric conducting material, lead oxide class glass etc. can be used as glass.
In recent years, inquire into environmental problem just energetically, just advancing and get rid of the harmful substances such as plumbous from electronic unit.Above-mentioned resistance slurry is no exception, is carrying out unleaded research.
As resistance slurry unleaded in one of problem, particularly in high-resistance resistance slurry, such as there is taking into account of temperature characterisitic and voltage endurance, such as, TCR is being regulated, when former state is applied in without lead composition, owing to comparing with plumbous constituents by by being added on the metal oxide used in existing plumbous quasi-resistance slurry, the resistance value variation caused because voltage applies is comparatively large, so result is just difficult to realize taking into account of TCR and STOL.
Summary of the invention
Goal of the invention: for above-mentioned prior art Problems existing and deficiency, the object of this invention is to provide a kind of thick-film circuit resistor paste.
Technical scheme: the invention discloses a kind of thick-film circuit resistor paste, described formula presses mass fraction: containing the fire-retardant heatproof high molecule polymer 1-5 of boron element; Nanometer carbon conductive filler 0.5-2; Conductive phase graphite powder 10-15; Ultra-fine lowpriced metal alloy powder conductive filler 3-5; Resin 2-3; Stearate stabilizers 0.5-1; High boiling solvent 1-3; Curing agent 3-6; Curing accelerator 1-1.5; Potassium oxide 1-3; Phosphorus pentoxide 2-3; Carbon dust 2-3; Lead-free glass powder 10-15; Titanium oxygen compound 2-4; Tin oxide 2-3; Aluminium powder 0.5-1; Organic bond 2-5; Described organic bond contains by weight: terpinol 75-85%, NC Nitroncellulose 15-25%.
As further optimization of the present invention, formula of the present invention presses mass fraction: containing the fire-retardant heatproof high molecule polymer 1 of boron element; Nanometer carbon conductive filler 0.5; Conductive phase graphite powder 10; Ultra-fine lowpriced metal alloy powder conductive filler 3; Resin 2; Stearate stabilizers 0.5; High boiling solvent 1; Curing agent 3; Curing accelerator 1; Potassium oxide 1; Phosphorus pentoxide 2; Carbon dust 2; Lead-free glass powder 10; Titanium oxygen compound 2; Tin oxide 2; Aluminium powder 0.5; Organic bond 2; Described organic bond contains by weight: terpinol 75%, NC Nitroncellulose 25%.
As further optimization of the present invention, formula of the present invention presses mass fraction: containing the fire-retardant heatproof high molecule polymer 5 of boron element; Nanometer carbon conductive filler 2; Conductive phase graphite powder 15; Ultra-fine lowpriced metal alloy powder conductive filler 5; Resin 3; Stearate stabilizers 1; High boiling solvent 3; Curing agent 6; Curing accelerator 1.5; Potassium oxide 3; Phosphorus pentoxide 3; Carbon dust 3; Lead-free glass powder 15; Titanium oxygen compound 4; Tin oxide 3; Aluminium powder 1; Organic bond 5; Described organic bond contains by weight: terpinol 85%, NC Nitroncellulose 15%.
As further optimization of the present invention, formula of the present invention presses mass fraction: containing the fire-retardant heatproof high molecule polymer 3 of boron element; Nanometer carbon conductive filler 1.5; Conductive phase graphite powder 12; Ultra-fine lowpriced metal alloy powder conductive filler 4; Resin 2.5; Stearate stabilizers 0.6; High boiling solvent 2; Curing agent 4.5; Curing accelerator 1.2; Potassium oxide 2; Phosphorus pentoxide 2.5; Carbon dust 2.5; Lead-free glass powder 12; Titanium oxygen compound 3; Tin oxide 2.5; Aluminium powder 0.6; Organic bond 3.5; Described organic bond contains by weight: terpinol 80%, NC Nitroncellulose 20%.
Beneficial effect: resistance slurry of the present invention, there is the characteristic of low-temperature setting, applied at elevated temperature, printing and wettability good, with the strong adhesion of base material, the present invention not only achieves the complex functions such as fire-retardant, heat-resisting, anti-aging, thermal radiation, environmental protection, and improves the stability of system, thermal radiation usefulness is excellent, caloric value is large, and heat resistance is good, and energy-saving effect is remarkable.The resistance prepared by the present invention is through test analysis, and display resistive performance is good, and the method technological requirement is simple, low cost of manufacture.
Embodiment
The present invention is illustrated further below in conjunction with embodiment.
Embodiment 1:
The formula of a kind of thick-film circuit resistor paste of the present embodiment presses mass fraction: containing the fire-retardant heatproof high molecule polymer 1 of boron element; Nanometer carbon conductive filler 0.5; Conductive phase graphite powder 10; Ultra-fine lowpriced metal alloy powder conductive filler 3; Resin 2; Stearate stabilizers 0.5; High boiling solvent 1; Curing agent 3; Curing accelerator 1; Potassium oxide 1; Phosphorus pentoxide 2; Carbon dust 2; Lead-free glass powder 10; Titanium oxygen compound 2; Tin oxide 2; Aluminium powder 0.5; Organic bond 2; Described organic bond contains by weight: terpinol 75%, NC Nitroncellulose 25%.
Resistance prepared by the present embodiment is through test analysis, and display resistive performance is good.
Embodiment 2:
The formula of a kind of thick-film circuit resistor paste of the present embodiment presses mass fraction: containing the fire-retardant heatproof high molecule polymer 5 of boron element; Nanometer carbon conductive filler 2; Conductive phase graphite powder 15; Ultra-fine lowpriced metal alloy powder conductive filler 5; Resin 3; Stearate stabilizers 1; High boiling solvent 3; Curing agent 6; Curing accelerator 1.5; Potassium oxide 3; Phosphorus pentoxide 3; Carbon dust 3; Lead-free glass powder 15; Titanium oxygen compound 4; Tin oxide 3; Aluminium powder 1; Organic bond 5; Described organic bond contains by weight: terpinol 85%, NC Nitroncellulose 15%.
Resistance prepared by the present embodiment is through test analysis, and display resistive performance is good.
Embodiment 3:
The formula of a kind of thick-film circuit resistor paste of the present embodiment presses mass fraction: containing the fire-retardant heatproof high molecule polymer 3 of boron element; Nanometer carbon conductive filler 1.5; Conductive phase graphite powder 12; Ultra-fine lowpriced metal alloy powder conductive filler 4; Resin 2.5; Stearate stabilizers 0.6; High boiling solvent 2; Curing agent 4.5; Curing accelerator 1.2; Potassium oxide 2; Phosphorus pentoxide 2.5; Carbon dust 2.5; Lead-free glass powder 12; Titanium oxygen compound 3; Tin oxide 2.5; Aluminium powder 0.6; Organic bond 3.5; Described organic bond contains by weight: terpinol 80%, NC Nitroncellulose 20%.
Resistance prepared by the present embodiment is through test analysis, and display resistive performance is good.
Claims (4)
1. a thick-film circuit resistor paste, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 1-5 of boron element; Nanometer carbon conductive filler 0.5-2; Conductive phase graphite powder 10-15; Ultra-fine lowpriced metal alloy powder conductive filler 3-5; Resin 2-3; Stearate stabilizers 0.5-1; High boiling solvent 1-3; Curing agent 3-6; Curing accelerator 1-1.5; Potassium oxide 1-3; Phosphorus pentoxide 2-3; Carbon dust 2-3; Lead-free glass powder 10-15; Titanium oxygen compound 2-4; Tin oxide 2-3; Aluminium powder 0.5-1; Organic bond 2-5; Described organic bond contains by weight: terpinol 75-85%, NC Nitroncellulose 15-25%.
2. a kind of thick-film circuit resistor paste according to claim 1, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 1 of boron element; Nanometer carbon conductive filler 0.5; Conductive phase graphite powder 10; Ultra-fine lowpriced metal alloy powder conductive filler 3; Resin 2; Stearate stabilizers 0.5; High boiling solvent 1; Curing agent 3; Curing accelerator 1; Potassium oxide 1; Phosphorus pentoxide 2; Carbon dust 2; Lead-free glass powder 10; Titanium oxygen compound 2; Tin oxide 2; Aluminium powder 0.5; Organic bond 2; Described organic bond contains by weight: terpinol 75%, NC Nitroncellulose 25%.
3. a kind of thick-film circuit resistor paste according to claim 1, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 5 of boron element; Nanometer carbon conductive filler 2; Conductive phase graphite powder 15; Ultra-fine lowpriced metal alloy powder conductive filler 5; Resin 3; Stearate stabilizers 1; High boiling solvent 3; Curing agent 6; Curing accelerator 1.5; Potassium oxide 3; Phosphorus pentoxide 3; Carbon dust 3; Lead-free glass powder 15; Titanium oxygen compound 4; Tin oxide 3; Aluminium powder 1; Organic bond 5; Described organic bond contains by weight: terpinol 85%, NC Nitroncellulose 15%.
4. a kind of thick-film circuit resistor paste according to claim 1, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 3 of boron element; Nanometer carbon conductive filler 1.5; Conductive phase graphite powder 12; Ultra-fine lowpriced metal alloy powder conductive filler 4; Resin 2.5; Stearate stabilizers 0.6; High boiling solvent 2; Curing agent 4.5; Curing accelerator 1.2; Potassium oxide 2; Phosphorus pentoxide 2.5; Carbon dust 2.5; Lead-free glass powder 12; Titanium oxygen compound 3; Tin oxide 2.5; Aluminium powder 0.6; Organic bond 3.5; Described organic bond contains by weight: terpinol 80%, NC Nitroncellulose 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410826251.5A CN104464890A (en) | 2014-12-26 | 2014-12-26 | Thick film circuit resistor paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410826251.5A CN104464890A (en) | 2014-12-26 | 2014-12-26 | Thick film circuit resistor paste |
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| Publication Number | Publication Date |
|---|---|
| CN104464890A true CN104464890A (en) | 2015-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410826251.5A Pending CN104464890A (en) | 2014-12-26 | 2014-12-26 | Thick film circuit resistor paste |
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| CN (1) | CN104464890A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252272A (en) * | 2016-10-13 | 2016-12-21 | 珠海市华晶微电子有限公司 | The connecting process of laminate patch multilayer thick film circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101058477A (en) * | 2007-03-30 | 2007-10-24 | 东华大学 | Electricity vacuum glass products lead-free seal glass and preparing method thereof |
| CN101735561A (en) * | 2008-11-25 | 2010-06-16 | 西安宏星电子浆料科技有限责任公司 | Electrothermal organic power resistance slurry for heater |
| CN103221355A (en) * | 2010-11-17 | 2013-07-24 | 日本电气硝子株式会社 | Crystalline glass powder |
| US20130255767A1 (en) * | 2010-05-04 | 2013-10-03 | E I Du Pont De Nemours And Company | Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices |
-
2014
- 2014-12-26 CN CN201410826251.5A patent/CN104464890A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101058477A (en) * | 2007-03-30 | 2007-10-24 | 东华大学 | Electricity vacuum glass products lead-free seal glass and preparing method thereof |
| CN101735561A (en) * | 2008-11-25 | 2010-06-16 | 西安宏星电子浆料科技有限责任公司 | Electrothermal organic power resistance slurry for heater |
| US20130255767A1 (en) * | 2010-05-04 | 2013-10-03 | E I Du Pont De Nemours And Company | Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices |
| CN103221355A (en) * | 2010-11-17 | 2013-07-24 | 日本电气硝子株式会社 | Crystalline glass powder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252272A (en) * | 2016-10-13 | 2016-12-21 | 珠海市华晶微电子有限公司 | The connecting process of laminate patch multilayer thick film circuit |
| CN106252272B (en) * | 2016-10-13 | 2019-01-15 | 珠海市华晶微电子有限公司 | The connecting process of laminate patch multilayer thick film circuit |
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Application publication date: 20150325 |