CN104464876A - Thick film resistor paste - Google Patents
Thick film resistor paste Download PDFInfo
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- CN104464876A CN104464876A CN201410826248.3A CN201410826248A CN104464876A CN 104464876 A CN104464876 A CN 104464876A CN 201410826248 A CN201410826248 A CN 201410826248A CN 104464876 A CN104464876 A CN 104464876A
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Abstract
The invention discloses a thick film resistor paste. According to the formula, the thick film resistor paste comprises, by mass, 1-5 parts of boron-bearing flame-retardant and temperature-resistant high-molecular polymers, 0.5-2 parts of nanocarbon system conductive filler, 10-15 parts of conductive phase graphite powder, 3-5 parts of superfine base metal alloyed powder conductive filler, 2-3 parts of resin, 0.5-1 part of stearate heat stabilizers, 1-3 parts of high boiling point solvents, 3-6 parts of curing agents, 1-1.5 parts of curing accelerators, 1-3 parts of potassium oxide, 2-3 parts of phosphorus pentoxide, 2-3 parts of carbon powder, 5-10 parts of ceramic powder and 5-10 parts of glass powder, wherein the ceramic powder comprises 75%-85% of barium oxide and 15%-25% of copper oxide; the glass powder comprises 20%-50% of silicon oxide and 50%-80% of aluminum oxide. The thick film resistor paste not only has the combined functions of flame retardance, heat resistance, ageing resistance, heat radiation, environment friendliness and the like, but also improves the stability of a system.
Description
Technical field
The present invention relates to electronic applications, be specifically related to a kind of thick-film resistor paste.
Background technology
A kind of conventional electric component during resistance, application is extensive, such as be used in integrated circuit, chip, but along with developing rapidly of integrated circuit and chip, current resistance also exists shortcomings, can not meet integrated needs, resistance slurry becomes the direction addressed this problem.
As the main component of resistance slurry, be usually made up of glass composition, electric conducting material, organic carrier, comprising glass composition is in order to adjusting resistance value and the cementability increasing slurry.On substrate after printed resistor slurry, by sintering, form thickness and be about the thick-film resistor of 5-20um, and, in this kind of resistance slurry, ruthenium-oxide and plumbous ru oxide usually can be used as electric conducting material, lead oxide class glass etc. can be used as glass.
In recent years, inquire into environmental problem just energetically, just advancing and get rid of the harmful substances such as plumbous from electronic unit.Above-mentioned resistance slurry is no exception, is carrying out unleaded research.
As resistance slurry unleaded in one of problem, particularly in high-resistance resistance slurry, such as there is taking into account of temperature characterisitic and voltage endurance, such as, TCR is being regulated, when former state is applied in without lead composition, owing to comparing with plumbous constituents by by being added on the metal oxide used in existing plumbous quasi-resistance slurry, the resistance value variation caused because voltage applies is comparatively large, so result is just difficult to realize taking into account of TCR and STOL.
Summary of the invention
Goal of the invention: for above-mentioned prior art Problems existing and deficiency, the object of this invention is to provide a kind of thick-film resistor paste.
Technical scheme: the invention discloses a kind of thick-film resistor paste, described formula presses mass fraction: containing the fire-retardant heatproof high molecule polymer 1-5 of boron element; Nanometer carbon conductive filler 0.5-2; Conductive phase graphite powder 10-15; Ultra-fine lowpriced metal alloy powder conductive filler 3-5; Resin 2-3; Stearate stabilizers 0.5-1; High boiling solvent 1-3; Curing agent 3-6; Curing accelerator 1-1.5; Potassium oxide 1-3; Phosphorus pentoxide 2-3; Carbon dust 2-3; Ceramic powder 5-10; Glass dust 5-10;
The component of described ceramic powder comprises 75-85% barium monoxide and 15-25% cupric oxide;
The component of described glass dust comprises 20-50% silica and 50-80% aluminium oxide.
As further optimization of the present invention, formula of the present invention presses mass fraction: containing the fire-retardant heatproof high molecule polymer 1 of boron element; Nanometer carbon conductive filler 0.5; Conductive phase graphite powder 10; Ultra-fine lowpriced metal alloy powder conductive filler 3; Resin 2; Stearate stabilizers 0.5; High boiling solvent 1; Curing agent 3; Curing accelerator 1; Potassium oxide 1; Phosphorus pentoxide 2; Carbon dust 2; Ceramic powder 5; Glass dust 5;
The component of described ceramic powder comprises 75% barium monoxide and 25% cupric oxide;
The component of described glass dust comprises 20% silica and 80% aluminium oxide.
As further optimization of the present invention, formula of the present invention presses mass fraction: containing the fire-retardant heatproof high molecule polymer 5 of boron element; Nanometer carbon conductive filler 2; Conductive phase graphite powder 15; Ultra-fine lowpriced metal alloy powder conductive filler 5; Resin 3; Stearate stabilizers 1; High boiling solvent 3; Curing agent 6; Curing accelerator 1.5; Potassium oxide 3; Phosphorus pentoxide 3; Carbon dust 3; Ceramic powder 10; Glass dust 10;
The component of described ceramic powder comprises 85% barium monoxide and 15% cupric oxide;
The component of described glass dust comprises 50% silica and 50 aluminium oxide.
As further optimization of the present invention, formula of the present invention presses mass fraction: containing the fire-retardant heatproof high molecule polymer 3 of boron element; Nanometer carbon conductive filler 1.5; Conductive phase graphite powder 12; Ultra-fine lowpriced metal alloy powder conductive filler 4; Resin 2.5; Stearate stabilizers 0.7; High boiling solvent 2; Curing agent 4.5; Curing accelerator 1.3; Potassium oxide 2; Phosphorus pentoxide 2.5; Carbon dust 2.5; Ceramic powder 7; Glass dust 8;
The component of described ceramic powder comprises 80% barium monoxide and 20% cupric oxide;
The component of described glass dust comprises 35% silica and 65% aluminium oxide.
Beneficial effect: resistance slurry of the present invention, there is the characteristic of low-temperature setting, applied at elevated temperature, printing and wettability good, with the strong adhesion of base material, the present invention not only achieves the complex functions such as fire-retardant, heat-resisting, anti-aging, thermal radiation, environmental protection, and improves the stability of system, thermal radiation usefulness is excellent, caloric value is large, and heat resistance is good, and energy-saving effect is remarkable.The resistance prepared by the present invention is through test analysis, and display resistive performance is good, and the method technological requirement is simple, low cost of manufacture.
Embodiment
The present invention is illustrated further below in conjunction with embodiment.
Embodiment 1:
The formula of a kind of thick-film resistor paste of the present embodiment presses mass fraction: containing the fire-retardant heatproof high molecule polymer 1 of boron element; Nanometer carbon conductive filler 0.5; Conductive phase graphite powder 10; Ultra-fine lowpriced metal alloy powder conductive filler 3; Resin 2; Stearate stabilizers 0.5; High boiling solvent 1; Curing agent 3; Curing accelerator 1; Potassium oxide 1; Phosphorus pentoxide 2; Carbon dust 2; Ceramic powder 5; Glass dust 5;
The component of the ceramic powder of the present embodiment comprises 75% barium monoxide and 25% cupric oxide; The component of glass dust comprises 20% silica and 80% aluminium oxide.
Resistance prepared by the present embodiment is through test analysis, and display resistive performance is good.
Embodiment 2:
The formula of a kind of thick-film resistor paste of the present embodiment presses mass fraction: containing the fire-retardant heatproof high molecule polymer 5 of boron element; Nanometer carbon conductive filler 2; Conductive phase graphite powder 15; Ultra-fine lowpriced metal alloy powder conductive filler 5; Resin 3; Stearate stabilizers 1; High boiling solvent 3; Curing agent 6; Curing accelerator 1.5; Potassium oxide 3; Phosphorus pentoxide 3; Carbon dust 3; Ceramic powder 10; Glass dust 10;
The component of the ceramic powder of the present embodiment comprises 85% barium monoxide and 15% cupric oxide; The component of glass dust comprises 50% silica and 50 aluminium oxide.
Resistance prepared by the present embodiment is through test analysis, and display resistive performance is good.
Embodiment 3:
The formula of a kind of thick-film resistor paste of the present embodiment presses mass fraction: containing the fire-retardant heatproof high molecule polymer 3 of boron element; Nanometer carbon conductive filler 1.5; Conductive phase graphite powder 12; Ultra-fine lowpriced metal alloy powder conductive filler 4; Resin 2.5; Stearate stabilizers 0.7; High boiling solvent 2; Curing agent 4.5; Curing accelerator 1.3; Potassium oxide 2; Phosphorus pentoxide 2.5; Carbon dust 2.5; Ceramic powder 7; Glass dust 8;
The component of the ceramic powder of the present embodiment comprises 80% barium monoxide and 20% cupric oxide; The component of glass dust comprises 35% silica and 65% aluminium oxide.
Resistance prepared by the present embodiment is through test analysis, and display resistive performance is good.
Claims (4)
1. a thick-film resistor paste, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 1-5 of boron element; Nanometer carbon conductive filler 0.5-2; Conductive phase graphite powder 10-15; Ultra-fine lowpriced metal alloy powder conductive filler 3-5; Resin 2-3; Stearate stabilizers 0.5-1; High boiling solvent 1-3; Curing agent 3-6; Curing accelerator 1-1.5; Potassium oxide 1-3; Phosphorus pentoxide 2-3; Carbon dust 2-3; Ceramic powder 5-10; Glass dust 5-10;
The component of described ceramic powder comprises 75-85% barium monoxide and 15-25% cupric oxide;
The component of described glass dust comprises 20-50% silica and 50-80% aluminium oxide.
2. a kind of thick-film resistor paste according to claim 1, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 1 of boron element; Nanometer carbon conductive filler 0.5; Conductive phase graphite powder 10; Ultra-fine lowpriced metal alloy powder conductive filler 3; Resin 2; Stearate stabilizers 0.5; High boiling solvent 1; Curing agent 3; Curing accelerator 1; Potassium oxide 1; Phosphorus pentoxide 2; Carbon dust 2; Ceramic powder 5; Glass dust 5;
The component of described ceramic powder comprises 75% barium monoxide and 25% cupric oxide;
The component of described glass dust comprises 20% silica and 80% aluminium oxide.
3. a kind of thick-film resistor paste according to claim 1, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 5 of boron element; Nanometer carbon conductive filler 2; Conductive phase graphite powder 15; Ultra-fine lowpriced metal alloy powder conductive filler 5; Resin 3; Stearate stabilizers 1; High boiling solvent 3; Curing agent 6; Curing accelerator 1.5; Potassium oxide 3; Phosphorus pentoxide 3; Carbon dust 3; Ceramic powder 10; Glass dust 10;
The component of described ceramic powder comprises 85% barium monoxide and 15% cupric oxide;
The component of described glass dust comprises 50% silica and 50 aluminium oxide.
4. a kind of thick-film resistor paste according to claim 1, is characterized in that: described formula is by mass fraction: containing the fire-retardant heatproof high molecule polymer 3 of boron element; Nanometer carbon conductive filler 1.5; Conductive phase graphite powder 12; Ultra-fine lowpriced metal alloy powder conductive filler 4; Resin 2.5; Stearate stabilizers 0.7; High boiling solvent 2; Curing agent 4.5; Curing accelerator 1.3; Potassium oxide 2; Phosphorus pentoxide 2.5; Carbon dust 2.5; Ceramic powder 7; Glass dust 8;
The component of described ceramic powder comprises 80% barium monoxide and 20% cupric oxide;
The component of described glass dust comprises 35% silica and 65% aluminium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410826248.3A CN104464876A (en) | 2014-12-26 | 2014-12-26 | Thick film resistor paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410826248.3A CN104464876A (en) | 2014-12-26 | 2014-12-26 | Thick film resistor paste |
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| Publication Number | Publication Date |
|---|---|
| CN104464876A true CN104464876A (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410826248.3A Pending CN104464876A (en) | 2014-12-26 | 2014-12-26 | Thick film resistor paste |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005306677A (en) * | 2004-04-22 | 2005-11-04 | Sumitomo Metal Mining Co Ltd | Ru-M-O FINE POWDER, METHOD OF MANUFACTURING THE SAME AND THICK FILM RESISTOR COMPOSITION USING THE SAME |
| CN101086042A (en) * | 2007-07-19 | 2007-12-12 | 上海交通大学 | Aluminum alloy impurity elemental silicon removing method |
| CN101735561A (en) * | 2008-11-25 | 2010-06-16 | 西安宏星电子浆料科技有限责任公司 | Electrothermal organic power resistance slurry for heater |
| CN103021601A (en) * | 2012-12-27 | 2013-04-03 | 青岛艾德森能源科技有限公司 | Resistance paste |
| CN103688365A (en) * | 2011-07-25 | 2014-03-26 | 日立化成株式会社 | Element and solar cell |
-
2014
- 2014-12-26 CN CN201410826248.3A patent/CN104464876A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005306677A (en) * | 2004-04-22 | 2005-11-04 | Sumitomo Metal Mining Co Ltd | Ru-M-O FINE POWDER, METHOD OF MANUFACTURING THE SAME AND THICK FILM RESISTOR COMPOSITION USING THE SAME |
| CN101086042A (en) * | 2007-07-19 | 2007-12-12 | 上海交通大学 | Aluminum alloy impurity elemental silicon removing method |
| CN101735561A (en) * | 2008-11-25 | 2010-06-16 | 西安宏星电子浆料科技有限责任公司 | Electrothermal organic power resistance slurry for heater |
| CN103688365A (en) * | 2011-07-25 | 2014-03-26 | 日立化成株式会社 | Element and solar cell |
| CN103021601A (en) * | 2012-12-27 | 2013-04-03 | 青岛艾德森能源科技有限公司 | Resistance paste |
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Application publication date: 20150325 |