CN104448485A - 一种具备防霉防潮抗菌功能电缆料的制备工艺 - Google Patents
一种具备防霉防潮抗菌功能电缆料的制备工艺 Download PDFInfo
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- CN104448485A CN104448485A CN201410695925.2A CN201410695925A CN104448485A CN 104448485 A CN104448485 A CN 104448485A CN 201410695925 A CN201410695925 A CN 201410695925A CN 104448485 A CN104448485 A CN 104448485A
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- 241000894006 Bacteria Species 0.000 title abstract 2
- 239000002994 raw material Substances 0.000 claims abstract description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 24
- -1 polyethylene Polymers 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
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- 229910021538 borax Inorganic materials 0.000 claims description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 12
- 235000013312 flour Nutrition 0.000 claims description 12
- 239000010445 mica Substances 0.000 claims description 12
- 229910052618 mica group Inorganic materials 0.000 claims description 12
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 12
- 235000010413 sodium alginate Nutrition 0.000 claims description 12
- 239000000661 sodium alginate Substances 0.000 claims description 12
- 229940005550 sodium alginate Drugs 0.000 claims description 12
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 12
- 239000004328 sodium tetraborate Substances 0.000 claims description 12
- 239000004575 stone Substances 0.000 claims description 12
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 8
- 229930185605 Bisphenol Natural products 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 230000000844 anti-bacterial effect Effects 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 239000000194 fatty acid Substances 0.000 claims description 8
- 229930195729 fatty acid Natural products 0.000 claims description 8
- 150000004665 fatty acids Chemical class 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- 229920000573 polyethylene Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract 1
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- 230000000845 anti-microbial effect Effects 0.000 description 2
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- 230000004048 modification Effects 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010017533 Fungal infection Diseases 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 208000031888 Mycoses Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000843 anti-fungal effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ropes Or Cables (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Abstract
Description
性能指标 | 测试标准 | 指标值 | 实施例1 | 实施例2 |
拉伸强度Mpa | GB/T1040.3-2006 | 12.5 | 18.6 | 19.7 |
断裂伸长率% | GB/T1040.3-2006 | 400 | 573 | 569 |
耐环境应力开裂F0(h) | GB/T2951.41-2008 | 500 | 586 | 578 |
氧指数 | GB/T2406-1993 | 26 | 28 | 29 |
抗霉菌试验 | GB/T2403-1999 | 0级 | 0级 | 0级 |
Claims (2)
Priority Applications (1)
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CN201410695925.2A CN104448485B (zh) | 2014-11-27 | 2014-11-27 | 一种具备防霉防潮抗菌功能电缆料的制备工艺 |
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CN201410695925.2A CN104448485B (zh) | 2014-11-27 | 2014-11-27 | 一种具备防霉防潮抗菌功能电缆料的制备工艺 |
Publications (2)
Publication Number | Publication Date |
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CN104448485A true CN104448485A (zh) | 2015-03-25 |
CN104448485B CN104448485B (zh) | 2016-11-09 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105218927A (zh) * | 2015-10-29 | 2016-01-06 | 苏州庄吉模塑科技有限公司 | 一种注塑加工用低密度聚乙烯 |
CN106810173A (zh) * | 2016-12-30 | 2017-06-09 | 安徽远征电缆科技有限公司 | 一种防虫蚁电缆填充料 |
CN107177066A (zh) * | 2017-07-20 | 2017-09-19 | 合肥安力电力工程有限公司 | 一种具有防霉功能的电缆护套料及其制备方法 |
CN110591259A (zh) * | 2019-09-06 | 2019-12-20 | 安徽长远机电股份有限公司 | 一种高效抗菌电缆料及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62243649A (ja) * | 1986-04-15 | 1987-10-24 | Nippon Retsuku Kk | 電気絶縁用樹脂組成物 |
JPH0797489A (ja) * | 1993-09-29 | 1995-04-11 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物 |
CN103965575A (zh) * | 2014-05-15 | 2014-08-06 | 南通普力马弹性体技术有限公司 | 电动汽车用充电电线材料及其制备方法 |
CN104151681A (zh) * | 2014-08-29 | 2014-11-19 | 上海至正道化高分子材料股份有限公司 | 一种高耐电痕adss光缆护套料 |
-
2014
- 2014-11-27 CN CN201410695925.2A patent/CN104448485B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62243649A (ja) * | 1986-04-15 | 1987-10-24 | Nippon Retsuku Kk | 電気絶縁用樹脂組成物 |
JPH0797489A (ja) * | 1993-09-29 | 1995-04-11 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物 |
CN103965575A (zh) * | 2014-05-15 | 2014-08-06 | 南通普力马弹性体技术有限公司 | 电动汽车用充电电线材料及其制备方法 |
CN104151681A (zh) * | 2014-08-29 | 2014-11-19 | 上海至正道化高分子材料股份有限公司 | 一种高耐电痕adss光缆护套料 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105218927A (zh) * | 2015-10-29 | 2016-01-06 | 苏州庄吉模塑科技有限公司 | 一种注塑加工用低密度聚乙烯 |
CN106810173A (zh) * | 2016-12-30 | 2017-06-09 | 安徽远征电缆科技有限公司 | 一种防虫蚁电缆填充料 |
CN107177066A (zh) * | 2017-07-20 | 2017-09-19 | 合肥安力电力工程有限公司 | 一种具有防霉功能的电缆护套料及其制备方法 |
CN110591259A (zh) * | 2019-09-06 | 2019-12-20 | 安徽长远机电股份有限公司 | 一种高效抗菌电缆料及其制备方法 |
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