CN104439710B - Water jet assisted laser chemical etching device and method - Google Patents
Water jet assisted laser chemical etching device and method Download PDFInfo
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- CN104439710B CN104439710B CN201410635562.3A CN201410635562A CN104439710B CN 104439710 B CN104439710 B CN 104439710B CN 201410635562 A CN201410635562 A CN 201410635562A CN 104439710 B CN104439710 B CN 104439710B
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- laser
- water jet
- water
- chemical
- chemical etching
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a water jet assisted laser chemical etching device and method and belongs to the application field of non-traditional machining. The water jet assisted laser chemical etching device consists of three systems including a laser system, a water jet system and a chemical system and is characterized in that the high energy of laser and the washout effect of water jets are firstly utilized to jointly machine material surface, a hand-cranking wheel is turned to enable a material to be completely immersed into chemical liquid through a lifting worktable after primary machining is finished, and molten slag on the machined material surface can be decreased as far as possible and the thickness of a recast layer is decreased under the corrosive effect of the chemical liquid. By means of the water jet assisted laser chemical etching device and method, required grooves can be formed in the machined material surface in an etching mode, obvious molten slag, the recast layer and the like do not exist on the surfaces of the grooves, and according good machining effect is obtained.
Description
Technical field：
The present invention relates to the application of the special process, specially a kind of device of water jet auxiliary laser chemical etching and
Method.
Background technology：
With the development of material engineering, difficult-to-machine material is increasingly becoming the primary study object of field of machining.Section
Learn ground to say, using the cutting ability of material as criterion, hardness ＞ HB250, intensity σ ＞ 1000MPa, percentage elongation ＞ 80%,
Impact value α ＞ 0.98MJ/m2, the material of heat conductivity k ＜ 41.8 be referred to as difficult-to-machine material.Difficult-to-machine material is led in each engineering
Favor is enjoyed, the needs that these fields have carve circular groove in material surface, some needs lose circular hole on its surface in domain.But, by
In the high hard fragility of these materials, the processing mode such as conventional turning, grinding, drilling has that finished surface precision is low, easy fracture
Etc. defect, and when adopting the special processs such as microwave, ultrasound wave, still there is inefficiency.
Laser ablation compared with traditional processing method, it be a kind of contactless, no cutting force, heat affecting be little, cleaning and
The processing method that the processing of special face can be carried out, as conventional one kind in laser processing technology, it makes to swash laser etching techniques
Photoengraving difficult-to-machine material becomes reality, but laser direct etching difficult-to-machine material still can have various asking
Topic, such as can there is ratio more serious recast layer and inevitable residual thermal stress and micro-crack in material surface, directly affects
The suface processing quality of material.
Content of the invention：
Based on various problems present in laser direct etching difficult-to-machine material process, the present invention passes through to introduce water jet skill
Art, and by chemical attack effect, to removing the slag on difficult-to-machine material surface and reducing recast layer thickness, reduce hot shadow
Ring area etc., thus obtaining best machined surface quality.
A kind of device and method of water jet auxiliary laser chemical etching of the present invention, this device include laser system,
Water jet system, chemical system, the laser beam of described laser system is reflected into laser head by reflecting mirror, and described laser head is also
Needs are passed through auxiliary gas oxygen, and described auxiliary gas oxygen and laser beam are mapped on material jointly through laser head；Described water-jet
By motor-driven, described motor is carried by V and connects pump the Water projectile of streaming system, and described pump is sucked in water tank by water pipe
Clear water and be connected with spray gun, the head of described spray gun installs nozzle, and the head of described nozzle installs syringe needle, described syringe needle spray
Go out Water projectile and wash away material；The hand-operated wheel of described chemical system to adjust the height of self-powered platform, described liter by rotating
Fall workbench is sent to corrosion in chemical liquid material.
In the present invention, described laser beam and Water projectile after rapidoprint terminates simultaneously, rotate self-powered platform,
The material of processing can be completely immersed in chemical liquid.
In the present invention, rotate clockwise hand-operated wheel, self-powered platform moves down, rotate counterclockwise hand-operated wheel, lifting
Workbench moves up.
The device have the advantages that：
(1) water jet device is very simple, low cost, and water jet pressure is little, material surface is damaged little；
(2) souring of water jet can reduce the slag of a part of material surface, reduce recast layer thickness；
(3) high-energy of laser is capable of quick etachable material, obtains required groove；
(4) utilize chemical attack to act on, effectively reduce material surface slag；
(5) utilize laser, water jet, chemical liquid three's collective effect, be obtained in that good processing effect.
Brief description：
Fig. 1 is the structure drawing of device needed for processing method of the present invention.
Wherein：1st, stationary work-table；2nd, chemical liquid 3, self-powered platform；4th, material；5th, hand-operated wheel；6th, laser head；7、
Auxiliary gas oxygen；8th, laser beam；9th, reflecting mirror；10th, Water projectile；11st, syringe needle；12nd, nozzle；13rd, spray gun；14th, pump；15、
Water pipe；16th, water tank；17th, V band；18th, motor
A kind of flow chart of water jet auxiliary laser chemical etching that Fig. 2 is implemented for the present invention.
Specific embodiment：
In order that technical scheme can more clearly from show, below in conjunction with the accompanying drawings, the present invention is made
Further illustrate.
Refer to Fig. 1, a kind of device of water jet auxiliary laser chemical etching, including laser system, water jet system, change
System, the laser beam 8 of described laser system is reflected into laser head 6 by reflecting mirror 9, and described laser head 6 also needs to be passed through
Auxiliary gas oxygen 7, described auxiliary gas oxygen 7 is mapped on material 4 through laser head 6 jointly with laser beam 8；Described water jet system
The Water projectile 10 of system is driven by motor 18, and described motor 18 passes through water pipe 15 by V band 17 connection pump 14, described pump 14
Suck the clear water in water tank 16 and be connected with spray gun 13, the head of described spray gun 13 installs nozzle 12, the head of described nozzle 12
Syringe needle 11 is installed in portion, and described syringe needle 11 sprays Water projectile 10 and washes away material 4；The hand-operated wheel 5 of described chemical system passes through to rotate
To adjust the height of self-powered platform 3, described 3 materials 4 of self-powered platform are sent to corrosion in chemical liquid 2.
In actual application, refering to flow chart shown in Fig. 2：With the laser ablation a size of W18Cr4v of 50x50x1mm
As a example high-speed steel plate, labor is carried out to the etch step of the present invention.
Implement step as follows：
(1) scantling and Working position are determined
The W18Cr4v high-speed steel plate of a size of 50x50x1mm is fixed on self-powered platform 3, and Working position is proper
It is well the center of high-speed steel.
(2) water jet auxiliary laser preliminary etachable material surface
Normal startup air switch and laser instrument open the light, and laser instrument is the Nd of 500W3+：YAG laser, the electricity of laser instrument
Intensity of flow is adjusted to 160A, and pulse width is adjusted to 0.6ms, and pulse recurrence frequency is adjusted to 30HZ, and defocusing amount is adjusted to 0.8mm, assists gas
Body oxygen 7 pressure is adjusted to 4MPa.
Open water jet system so that motor 18 runs well, by adjusting the pressure of pump 14, finally water jet stream
Speed is defined as 12m/s, a diameter of 0.6mm of water jet, and Water projectile 10 is 60 ° with the angle of laser beam 8.
The scanning speed determining laser is 1.0mm/s, and laser and water jet scan according to predefined paths simultaneously.
Initial processing terminates
(3) slag in chemical attack cutting
Rotate clockwise hand-operated wheel 5, self-powered platform 3 moves down, until W18Cr4v high-speed steel plate is completely immersed in chemistry
In liquid 2HCL solution, chemical reaction for a period of time after, rotate counterclockwise hand-operated wheel 5, self-powered platform 3 moves up.
The course of processing all terminates.
Required groove can easily be etched by above-mentioned steps, by water jet system and chemical system, both carry
The high speed of etching, in turn ensure that the suface processing quality of product.
The above only have expressed one embodiment of the present invention, and its statement ratio in greater detail, but cannot be interpreted as
Restriction to the scope of the claims of the present invention.It should be noted that for the person of ordinary skill of the art, without departing from this
On the premise of bright design, any type of modification can also be made.Therefore, the protection domain of patent of the present invention should be wanted with appended right
Based on asking.
Claims (3)
1. a kind of device of water jet auxiliary laser chemical etching is it is characterised in that include laser system, water jet system, change
System, the laser beam (8) of described laser system is reflected into laser head (6) by reflecting mirror (9), and described laser head (6) is also
Needs are passed through auxiliary gas oxygen (7), and described auxiliary gas oxygen (7) is mapped to material with laser beam (8) jointly through laser head (6)
(4) on；The Water projectile (10) of described water jet system is driven by motor (18), and described motor (18) carries (17) by V
Connect pump (14), described pump (14) is sucked the clear water in water tank (16) by water pipe (15) and is connected with spray gun (13), described
The head of spray gun (13) installs nozzle (12), and the head of described nozzle (12) installs syringe needle (11), and described syringe needle (11) sprays water
Jet beam (10) washes away material (4)；The hand-operated wheel (5) of described chemical system to adjust the height of self-powered platform (3) by rotating
Degree, described self-powered platform (3) is sent to corrosion in chemical liquid (2) material (4).
2. water jet auxiliary laser chemical etching according to claim 1 device it is characterised in that described laser beam and
Water projectile after rapidoprint terminates simultaneously, rotates self-powered platform, and machined material can be completely immersed in chemical liquid.
3. the device of water jet auxiliary laser chemical etching according to claim 1 is it is characterised in that rotate clockwise handss
Rolled round, self-powered platform moves down, and rotates counterclockwise hand-operated wheel, and self-powered platform moves up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410635562.3A CN104439710B (en) | 2014-11-07 | 2014-11-07 | Water jet assisted laser chemical etching device and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410635562.3A CN104439710B (en) | 2014-11-07 | 2014-11-07 | Water jet assisted laser chemical etching device and method |
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| Publication Number | Publication Date |
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| CN104439710A CN104439710A (en) | 2015-03-25 |
| CN104439710B true CN104439710B (en) | 2017-02-15 |
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| CN201410635562.3A Expired - Fee Related CN104439710B (en) | 2014-11-07 | 2014-11-07 | Water jet assisted laser chemical etching device and method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689900A (en) * | 2016-04-05 | 2016-06-22 | 江南大学 | Machining method and device for water-assisted cooling and laser cutting of CFRP (carbon fiber reinforced plastics) |
| CN106216837A (en) * | 2016-08-25 | 2016-12-14 | 南京先进激光技术研究院 | A kind of method of the multilayer material of separation by laser OCA optical cement laminating |
| CN106271119A (en) * | 2016-09-30 | 2017-01-04 | 广东工业大学 | The ceramic boring method of a kind of liquid auxiliary laser and hole-drilling system |
| CN110202277B (en) * | 2019-04-25 | 2021-04-16 | 青岛理工大学 | Aeroengine blade air film hole machining device and working method |
| CN111167803A (en) * | 2019-12-14 | 2020-05-19 | 上海航翼高新技术发展研究院有限公司 | Laser wet cleaning method and device |
| CN113290386B (en) * | 2021-05-10 | 2022-07-08 | 长春理工大学 | Steady flow area laser/ultrasonic composite low-damage complex microstructure machining device and method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003226551A (en) * | 2002-02-05 | 2003-08-12 | Nippon Sheet Glass Co Ltd | Glass substrate having fine pore and production method therefor |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN102530852A (en) * | 2012-03-06 | 2012-07-04 | 中国科学院上海光学精密机械研究所 | Method for fabricating three-dimensional optical echo wall mode micro-cavity by using femtosecond laser |
| CN103317234A (en) * | 2012-03-22 | 2013-09-25 | 江南大学 | Laser induced low pressure jet flow combined etching processing method and device |
| CN102785025B (en) * | 2012-06-21 | 2015-02-25 | 西安交通大学 | Method for enhancing chemical etching through femtosecond laser to manufacture large-scale micro-lens array |
| CN103831540A (en) * | 2014-02-20 | 2014-06-04 | 江南大学 | Laser composite punching method for ceramics |
| CN204366265U (en) * | 2014-11-07 | 2015-06-03 | 江南大学 | A kind of device of water jet auxiliary laser chemical etching |
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