CN106217666B - The water cutter device and method of cutting sapphire - Google Patents

The water cutter device and method of cutting sapphire Download PDF

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Publication number
CN106217666B
CN106217666B CN201610777354.6A CN201610777354A CN106217666B CN 106217666 B CN106217666 B CN 106217666B CN 201610777354 A CN201610777354 A CN 201610777354A CN 106217666 B CN106217666 B CN 106217666B
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Prior art keywords
water
acid solution
sapphire
abrasive
jet
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CN106217666A (en
Inventor
常慧
程佳宝
滕斌
王国强
张吉
倪浩然
康森
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Tdg Yinxia New Material Co Ltd
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Tdg Yinxia New Material Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material

Abstract

A kind of water cutter device of cutting sapphire, including:Water knife lathe, computer control system, abrasive water jet streaming system and acid solution spray system, laser locating apparatus;Computer control system is used to control the coordination between water knife lathe each several part, while controls keying and the abrasive water jet streaming system jet pressure of abrasive water jet streaming system and acid solution spray system;Abrasive water jet streaming system is cut sapphire for spraying super-pressure abrasive water-jet;Acid solution spray system is used to apply acid solution in incision, the chemical process for making acid solution be cooperateed with by high speed impact sapphire after the bombardment of super-pressure abrasive water-jet;Laser locating apparatus is used to project hot spot in workpiece cutting point to assist acid solution spray system to position.The present invention by the way that high pressure waterjet is introduced into sapphire manufacture field, so as to solve the problems, such as sapphire be difficult to cut, processing cost it is high, in combination with the unstability of the rapidoprint caused by sapphire characteristic and superhigh pressure water jet, devise chemical secondary process.

Description

The water cutter device and method of cutting sapphire
Technical field:
The present invention relates to processing technique field, more particularly to a kind of water cutter device of cutting sapphire.
Background technology:
The artificial synthesized sapphire industrially used is α-Al2O3, except the glittering and translucent vision with natural sapphire Aesthetic feeling, it also has many excellent physical and chemical performances, such as:High rigidity (being only second to diamond), high-melting-point (2054 DEG C), insulation Property good (resistivity under normal temperature is more than 1011 Ω cm), chemical stability it is good (under normal temperature not with strong acid and alkali reaction, under high temperature Slow reaction) etc., these excellent performances are cheap plus artificial synthesized sapphire cost so that it is more and more employed To every field, including:LED substrate material, Mobile phone screen, watch minute surface, bulletproof glass, camera gun etc..
Because sapphire is extremely hard, damage resistant, it is suitable for semiconductor and LED technology, but glass, ceramics and indigo plant are precious Stone has individual what is common is that it is difficult to processing.They are frangible and are all adamantine materials, challenge the tradition such as milling, brill, mill The limit of manufacturing process, tool wear is fast when processing these materials, and it is good enough to need several processing links just to obtain Crudy.
Cost is low, the electric discharge of efficiency high (electric spark) process technology is successfully used for metallic article processing, but due to blue precious The property of stone insulation, it is this that high rigidity, the process technology of high abrasion resisting material can not be applied on sapphire.It is further, since blue The chemical stability and high temperature resistant of jewel, the approach of chemical process under normal temperature is also blocked, even if at high temperature, processing efficiency It is very low.
What is developed in recent years is applied to laser cutting in sapphire cutting, significant effect, but also some are difficult to what is overcome Problem, such as:For reflective, light transmissive material, laser is difficult to effective ablation, the uneven crack for causing material of heat etc..
The content of the invention:
In consideration of it, it is necessary to design a kind of water cutter device of the cutting sapphire of good cutting effect;Offer one is provided Kind uses the sapphire method of high pressure waterjet.
A kind of water cutter device of cutting sapphire, including:Water knife lathe, computer control system, abrasive water jet streaming system With acid solution spray system, laser locating apparatus;Wherein, computer control system is used to control the association between water knife lathe each several part Transfer and make, computer control system is additionally operable to control keying and keying and the abrasive material of acid solution spray system of abrasive water jet streaming system Water jet system jet pressure;Abrasive water jet streaming system is cut sapphire for spraying super-pressure abrasive water-jet;Acid Liquid spray system is used to apply acid solution in incision, acid solution is entered by high speed impact sapphire after the bombardment of super-pressure abrasive water-jet The chemical process of row collaboration;Laser locating apparatus is used to project hot spot in workpiece cutting point to assist acid solution spray system accurately to spray Leaching, because acid solution spray system use Low-pressure spray, spray that precision is low, it is necessary to which laser positioning is to rectify a deviation;
Water knife lathe includes:Guide rail, column, crossbeam, cutting head, workpiece clamping system;Guide rail is horizontally disposed with, and column is set On guide rail, column can be moved by its stepper motor on guide rail, and beam-end is fixed with column, and crossbeam is vertical with guide rail, Cutting head is arranged on crossbeam, and cutting head can be moved by its stepper motor on crossbeam, the mill being fixed on cutting head base Material nozzle and connected turn for making abrasive jet to carry out ± 90 DEG C of scopes in the plane parallel with cutting head base of rotating mechanism It is dynamic;Workpiece clamping system includes scroll chuck, chuck seat and motor, and scroll chuck is used to fix workpiece, and scroll chuck passes through circle Taper roller bearing is fixed on chuck seat, and exporting scroll chuck by motor can axial rotation;It is frequent in view of sapphire crystal ingot Segment is needed, sapphire wafer is frequently necessary to cut into slices, therefore the most convenient by the way of fixed abrasive nozzle, rotational workpieces, steady It is fixed;
Abrasive water jet streaming system includes:Water system, high-pressure water pumping plant, high pressure water circuit, water spout, abrasive material storage tank, essence Close feeding machine, abrasive jet;Water system provides water for high-pressure water pumping plant, and high-pressure water pumping plant passes through high pressure water circuit and water spray Mouth is connected, and water spout is inserted into abrasive jet, water spout and abrasive jet chamber UNICOM and water spout emission direction and abrasive material The emission direction of nozzle overlaps, and abrasive material storage tank bottom is connected with accurate feeding machine, and accurate feeding machine discharging opening passes through pipeline and mill Expect nozzle chamber UNICOM, high-pressure water pumping plant, accurate feeding machine and computer control system are electrically connected with;
Acid solution spray system includes:Acid solution storage tank, membrane pump, acid solution shower nozzle;Acid solution storage tank, membrane pump, acid solution shower nozzle lead to Cross pipeline to be sequentially connected, acid solution shower nozzle is fixed on cutting head base, and acid solution shower nozzle can be with abrasive jet by its rotating mechanism In coplanar interior ± 100 DEG C of rotations;
Laser locating apparatus includes generating laser and tumbler, and generating laser is fixed on acid solution by tumbler Outside shower nozzle, tumbler makes generating laser can be with acid solution shower nozzle in coplanar interior rotation;
The outlet pressure of water spout is more than 330MPa.Due to sapphire property exceptional stability, therefore can trust using super-pressure Jet impulse, simultaneously as hydraulic pressure has exceeded well over threshold values, pure water and abrasive material can cause the unstability of sapphire surface, make Sapphire surface under normal temperature and pressure not with strong acid reaction becomes to be easy to react with acid, so as to carry out chemical secondary process.
Preferably, the water cutter device of cutting sapphire also includes waste collection groove.
Preferably, the water cutter device of cutting sapphire also includes indicator lamp, to indicate water knife lathe, super-pressure water pump The state stood.
Preferably, the outlet pressure of water spout is 380~420MPa.
Preferably, the hydrochloric acid that it is 10~20% that acid solution storage tank is interior.
One kind uses the sapphire method of high pressure waterjet, comprises the following steps:
(1) sapphire workpiece is fixed on rotating seat, and makes its rotation;
(2) high pressure waterjet position is set, 10~20% hydrochloric acid are sprayed to the position;
(3) start water knife, gaza's cutting is carried out to the position, the outlet pressure of water spout is 380~420MPa.Due to Sapphire property exceptional stability, therefore can trust and be impacted using superhigh pressure water jet, simultaneously as hydraulic pressure has exceeded well over threshold values, it is pure Water and abrasive material can cause the unstability of sapphire surface, make under normal temperature and pressure with the sapphire surface of strong acid reaction not become with Acid is easy to react, so as to carry out chemical secondary process.
The present invention is difficult to cut by the way that high pressure waterjet creatively is introduced into sapphire manufacture field so as to solve sapphire Cut, the problem of processing cost is high, in combination with the unstable of the rapidoprint caused by sapphire characteristic and superhigh pressure water jet Property, chemical secondary process is devised, sapphire process technology is promoted into forward major step again.
Brief description of the drawings:
Accompanying drawing 1 is the dimensional structure diagram of the water cutter device of the cutting sapphire of a width better embodiment.
Accompanying drawing 2 is the schematic diagram of the abrasive water jet streaming system of a width better embodiment.
In figure:Guide rail 11, column 12, crossbeam 13, cutting head 14, workpiece clamping system 15, water system 21, high-pressure water Pumping plant 22, high pressure water circuit 23, water spout 24, abrasive material storage tank 25, accurate feeding machine 26, abrasive jet 27, sapphire workpiece 9, acid Liquid shower nozzle 31, generating laser 41, waste collection groove 16, indicator lamp 17.
Embodiment:
As shown in accompanying drawing 1,2, a kind of water cutter device of cutting sapphire, including:Water knife lathe, computer control system, Abrasive water jet streaming system and acid solution spray system, laser locating apparatus;Wherein, computer control system is used to control water knife lathe Coordination between each several part, computer control system are additionally operable to control keying and the acid solution spray system of abrasive water jet streaming system The keying of system and abrasive water jet streaming system jet pressure;Abrasive water jet streaming system is used to spray super-pressure abrasive water-jet to blue precious Lapicide's part 9 is cut;Acid solution spray system is used to apply acid solution in incision, acid solution is bombarded by super-pressure abrasive water-jet The chemical process that high speed impact sapphire workpiece 9 is cooperateed with afterwards;Laser locating apparatus is used to throw in the cutting point of sapphire workpiece 9 Shadow hot spot assists acid solution spray system accurately to spray because acid solution spray system uses Low-pressure spray, spray precision it is low, it is necessary to Laser positioning is to rectify a deviation;
Water knife lathe includes:Guide rail 11, column 12, crossbeam 13, cutting head 14, workpiece clamping system 15;Guide rail 11 is horizontal Set, column 12 is arranged on guide rail 11, and column 12 can be moved by its stepper motor on guide rail 11, and the end of crossbeam 13 is with standing Post 12 is fixed, and crossbeam 13 is vertical with guide rail 11, and cutting head 14 is arranged on crossbeam 13, and cutting head 14 can pass through its stepper motor Moved on crossbeam 13, the abrasive jet 27 being fixed on the base of cutting head 14 is connected with rotating mechanism makes abrasive jet 27 can be The rotation of ± 90 DEG C of scopes is carried out in the plane parallel with the base of cutting head 14, the rotating mechanism is served only for driving abrasive jet Rotate, be prior art, be not repeated;Workpiece clamping system 15 includes scroll chuck, chuck seat and motor, and scroll chuck is used for Fixed sapphire workpiece 9, scroll chuck is fixed on chuck seat by taper roll bearing, and exporting scroll chuck by motor can Axial rotation;Segment is frequently necessary in view of sapphire crystal ingot, sapphire wafer is frequently necessary to cut into slices, therefore uses fixed abrasive to spray Mouth, the mode of rotational workpieces facilitate, stably the most;
Abrasive water jet streaming system includes:Water system 21, high-pressure water pumping plant 22, high pressure water circuit 23, water spout 24, abrasive material Storage tank 25, accurate feeding machine 26, abrasive jet 27;Water system 21 is that high-pressure water pumping plant 22 provides water, high-pressure water pumping plant 22 are connected by high pressure water circuit 23 with water spout 24, and water spout 24 is inserted into abrasive jet 27, water spout 24 and abrasive jet The 27 chamber UNICOMs and emission direction of water spout 24 overlaps with the emission direction of abrasive jet 27, the bottom of abrasive material storage tank 25 are fed with accurate Material machine 26 is connected, and the accurate discharging opening of feeding machine 26 passes through pipeline and the chamber UNICOM of abrasive jet 27, high-pressure water pumping plant 22, precision Feeding machine 26 is electrically connected with computer control system;
Acid solution spray system includes:Acid solution storage tank, membrane pump, acid solution shower nozzle 31;Acid solution storage tank, membrane pump, acid solution shower nozzle 31 are sequentially connected by pipeline, and acid solution shower nozzle 31 is fixed on the base of cutting head 14, and acid solution shower nozzle 31 can by its rotating mechanism It is served only for driving the rotation of acid solution shower nozzle in coplanar interior ± 100 DEG C of rotations, the rotating mechanism with abrasive jet 27;
Laser locating apparatus includes generating laser 41 and tumbler, and generating laser 41 is fixed on by tumbler Outside acid solution shower nozzle 31, tumbler makes generating laser to be served only for acid solution shower nozzle in coplanar interior rotation, the rotating mechanism Drive the rotation of generating laser 41;
The outlet pressure of water spout 24 is more than 330MPa.Due to sapphire property exceptional stability, therefore can trust using superelevation Jet flow impacts, simultaneously as hydraulic pressure has exceeded well over threshold values, pure water and abrasive material can cause the unstability of sapphire surface, The sapphire surface under normal temperature and pressure not with strong acid reaction is set to become to be easy to react with acid, so as to carry out chemical secondary process.
In the present embodiment, the water cutter device of cutting sapphire also includes waste collection groove 16.
In the present embodiment, the water cutter device of cutting sapphire also includes indicator lamp 17, to indicate water knife lathe, The state of high-pressure water pumping plant 22.
In the present embodiment, the outlet pressure of water spout 24 is 380~420MPa.
In the present embodiment, the hydrochloric acid that it is 10~20% that acid solution storage tank is interior.
One kind uses the sapphire method of high pressure waterjet, comprises the following steps:
(1) sapphire workpiece is fixed on rotating seat, and makes its rotation;
(2) high pressure waterjet position is set, 10~20% hydrochloric acid are sprayed to the position;
(3) start water knife, gaza's cutting is carried out to the position, the outlet pressure of water spout is 380~420MPa.

Claims (6)

  1. A kind of 1. water cutter device of cutting sapphire, it is characterised in that including:Water knife lathe, computer control system, abrasive water Fluidic system and acid solution spray system, laser locating apparatus;Wherein, computer control system is used to control water knife lathe each several part Between coordination, computer control system is additionally operable to control the keying of abrasive water jet streaming system and opening for acid solution spray system Close and abrasive water jet streaming system jet pressure;Abrasive water jet streaming system is used to spray super-pressure abrasive water-jet to sapphire progress Cutting;Acid solution spray system is used to apply acid solution in incision, makes acid solution by high speed impact after the bombardment of super-pressure abrasive water-jet The chemical process that sapphire is cooperateed with;Laser locating apparatus is used to project hot spot in workpiece cutting point to assist acid solution spray system The accurate spray of system;
    Water knife lathe includes:Guide rail, column, crossbeam, cutting head, workpiece clamping system;Guide rail is horizontally disposed with, and column, which is arranged on, leads On rail, column can be moved by its stepper motor on guide rail, and beam-end is fixed with column, and crossbeam is vertical with guide rail, cutting Head is arranged on crossbeam, and cutting head can be moved by its stepper motor on crossbeam, the abrasive material spray being fixed on cutting head base Mouth and the connected rotation for making abrasive jet to carry out ± 90 DEG C of scopes in the plane parallel with cutting head base of rotating mechanism;Work Part grasping system includes scroll chuck, chuck seat and motor, and scroll chuck is used to fix workpiece, and scroll chuck passes through taper roller Bearing is fixed on chuck seat, and exporting scroll chuck by motor can axial rotation;
    Abrasive water jet streaming system includes:Water system, high-pressure water pumping plant, high pressure water circuit, water spout, abrasive material storage tank, precision are fed Material machine, abrasive jet;Water system provides water for high-pressure water pumping plant, and high-pressure water pumping plant passes through high pressure water circuit and water spout phase Even, water spout is inserted into abrasive jet, water spout and abrasive jet chamber UNICOM and water spout emission direction and abrasive jet Emission direction overlap, abrasive material storage tank bottom is connected with accurate feeding machine, and accurate feeding machine discharging opening passes through pipeline and abrasive material spray Mouth chamber UNICOM, high-pressure water pumping plant, accurate feeding machine and computer control system are electrically connected with;
    Acid solution spray system includes:Acid solution storage tank, membrane pump, acid solution shower nozzle;Acid solution storage tank, membrane pump, acid solution shower nozzle pass through pipe Road is sequentially connected, and acid solution shower nozzle is fixed on cutting head base, and acid solution shower nozzle can be with abrasive jet same by its rotating mechanism ± 100 DEG C of rotations in plane;
    Laser locating apparatus includes generating laser and tumbler, and generating laser is fixed on acid solution shower nozzle by tumbler Outside, tumbler makes generating laser can be with acid solution shower nozzle in coplanar interior rotation;
    The outlet pressure of water spout is more than 330MPa.
  2. 2. the water cutter device of cutting sapphire as claimed in claim 1, it is characterised in that the water cutter device of cutting sapphire is also Include waste collection groove.
  3. 3. the water cutter device of cutting sapphire as claimed in claim 1, it is characterised in that the water cutter device of cutting sapphire is also Include indicator lamp.
  4. 4. the water cutter device of cutting sapphire as claimed in claim 1, it is characterised in that the outlet pressure of water spout is 380 ~420MPa.
  5. 5. the water cutter device of cutting sapphire as claimed in claim 1, it is characterised in that be 10~20% in acid solution storage tank Hydrochloric acid.
  6. A kind of 6. method using claim 1 described device cutting sapphire, it is characterised in that comprise the following steps:
    (1) sapphire workpiece is fixed on rotating seat, and makes its rotation;
    (2) high pressure waterjet position is set, 10~20% hydrochloric acid are sprayed to the position;
    (3) start water knife, gaza's cutting is carried out to the position, the outlet pressure of water spout is 380~420MPa.
CN201610777354.6A 2016-08-30 2016-08-30 The water cutter device and method of cutting sapphire Active CN106217666B (en)

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CN107900914A (en) * 2017-12-14 2018-04-13 天通银厦新材料有限公司 Sapphire high pressure waterjet device
US11428641B2 (en) * 2017-12-22 2022-08-30 Sahajanand Technologies Private Limited Gemstone verification
CN108247910A (en) * 2018-03-26 2018-07-06 东莞市秉能橡胶有限公司 A kind of ultra-high pressure water fluid jet injection apparatus
CN108437246A (en) * 2018-04-03 2018-08-24 江阴市瑞尔嘉新能源科技有限公司 A kind of method and apparatus of silicon core flaw-piece cutting finished silicon core
CN110361240B (en) * 2019-07-26 2021-07-27 中国矿业大学 Ultrahigh-speed water flow cylindrical coal sample preparation device and preparation method
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CN112775563B (en) * 2020-12-18 2023-05-05 西安晟光硅研半导体科技有限公司 Unidirectional four-layer bidirectional eight-stage step cutting process for silicon carbide wafer
CN113524043B (en) * 2021-09-08 2021-11-30 南通金硕工程玻璃有限公司 Cutting water jet cutter for processing glass products
CN114179239A (en) * 2021-12-20 2022-03-15 浙江瑞度新材料科技有限公司 Machining device for special cutting line for sapphire
CN115213820A (en) * 2022-08-03 2022-10-21 北华航天工业学院 High-pressure abrasive water jet cutting device under non-submerged state

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2821869A1 (en) * 2013-07-04 2015-01-07 MicroStep spol. s r.o. CNC machine for cutting with plasma, oxy-fuel, and water jet, capable of direct or additional bevel cutting, using autocalibration for self-adjustment, and the method of its adjustment by autocalibration
CN105196184A (en) * 2015-08-21 2015-12-30 安徽理工大学 High-pressure water jet cutting device and control method
CN205255298U (en) * 2015-11-18 2016-05-25 无锡科诺达电子有限公司 Meticulous cutting appearance of sapphire
CN105834840A (en) * 2015-01-15 2016-08-10 深圳市网印巨星机电设备有限公司 Processing method and processing device for sapphire aperture
CN206066726U (en) * 2016-08-30 2017-04-05 天通银厦新材料有限公司 The water cutter device of cutting sapphire

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451300A (en) * 1987-08-21 1989-02-27 Toyota Motor Corp Abnormality detector for water jet robot system
US20030092364A1 (en) * 2001-11-09 2003-05-15 International Business Machines Corporation Abrasive fluid jet cutting composition, method and apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2821869A1 (en) * 2013-07-04 2015-01-07 MicroStep spol. s r.o. CNC machine for cutting with plasma, oxy-fuel, and water jet, capable of direct or additional bevel cutting, using autocalibration for self-adjustment, and the method of its adjustment by autocalibration
CN105834840A (en) * 2015-01-15 2016-08-10 深圳市网印巨星机电设备有限公司 Processing method and processing device for sapphire aperture
CN105196184A (en) * 2015-08-21 2015-12-30 安徽理工大学 High-pressure water jet cutting device and control method
CN205255298U (en) * 2015-11-18 2016-05-25 无锡科诺达电子有限公司 Meticulous cutting appearance of sapphire
CN206066726U (en) * 2016-08-30 2017-04-05 天通银厦新材料有限公司 The water cutter device of cutting sapphire

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