CN104427772A - 电路板成型方法 - Google Patents
电路板成型方法 Download PDFInfo
- Publication number
- CN104427772A CN104427772A CN201310410452.2A CN201310410452A CN104427772A CN 104427772 A CN104427772 A CN 104427772A CN 201310410452 A CN201310410452 A CN 201310410452A CN 104427772 A CN104427772 A CN 104427772A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- milling
- forming area
- processed
- fluting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310410452.2A CN104427772B (zh) | 2013-09-10 | 2013-09-10 | 电路板成型方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310410452.2A CN104427772B (zh) | 2013-09-10 | 2013-09-10 | 电路板成型方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104427772A true CN104427772A (zh) | 2015-03-18 |
CN104427772B CN104427772B (zh) | 2018-03-23 |
Family
ID=52975379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310410452.2A Active CN104427772B (zh) | 2013-09-10 | 2013-09-10 | 电路板成型方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104427772B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104822229A (zh) * | 2015-04-22 | 2015-08-05 | 上海凯思尔电子有限公司 | 一种使用图钉固定pcb板的作业流程 |
CN106793569A (zh) * | 2016-11-28 | 2017-05-31 | 江门崇达电路技术有限公司 | 一种金属化端子的制作工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347688A (ja) * | 2002-05-23 | 2003-12-05 | Denso Corp | 電気回路装置およびその製造方法 |
CN102196671A (zh) * | 2011-05-16 | 2011-09-21 | 大连太平洋电子有限公司 | 一种线路板的加工方法及外形公差为±0.05mm 的线路板 |
CN102361540A (zh) * | 2011-10-19 | 2012-02-22 | 深圳市五株电路板有限公司 | 电路板加工方法 |
CN102638934A (zh) * | 2011-12-28 | 2012-08-15 | 胜宏科技(惠州)股份有限公司 | 一种灯条线路板成型方法 |
-
2013
- 2013-09-10 CN CN201310410452.2A patent/CN104427772B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347688A (ja) * | 2002-05-23 | 2003-12-05 | Denso Corp | 電気回路装置およびその製造方法 |
CN102196671A (zh) * | 2011-05-16 | 2011-09-21 | 大连太平洋电子有限公司 | 一种线路板的加工方法及外形公差为±0.05mm 的线路板 |
CN102361540A (zh) * | 2011-10-19 | 2012-02-22 | 深圳市五株电路板有限公司 | 电路板加工方法 |
CN102638934A (zh) * | 2011-12-28 | 2012-08-15 | 胜宏科技(惠州)股份有限公司 | 一种灯条线路板成型方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104822229A (zh) * | 2015-04-22 | 2015-08-05 | 上海凯思尔电子有限公司 | 一种使用图钉固定pcb板的作业流程 |
CN106793569A (zh) * | 2016-11-28 | 2017-05-31 | 江门崇达电路技术有限公司 | 一种金属化端子的制作工艺 |
CN106793569B (zh) * | 2016-11-28 | 2019-04-30 | 江门崇达电路技术有限公司 | 一种金属化端子的制作工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN104427772B (zh) | 2018-03-23 |
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CP01 | Change in the name or title of a patent holder |
Address after: 100871, fangzheng building, 298 Fu Cheng Road, Beijing, Haidian District Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, fangzheng building, 298 Fu Cheng Road, Beijing, Haidian District Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220909 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, fangzheng building, 298 Fu Cheng Road, Beijing, Haidian District Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |