CN104425540A - 发光器件封装及包括该封装的用于车辆的照明装置 - Google Patents
发光器件封装及包括该封装的用于车辆的照明装置 Download PDFInfo
- Publication number
- CN104425540A CN104425540A CN201410437156.6A CN201410437156A CN104425540A CN 104425540 A CN104425540 A CN 104425540A CN 201410437156 A CN201410437156 A CN 201410437156A CN 104425540 A CN104425540 A CN 104425540A
- Authority
- CN
- China
- Prior art keywords
- light emitting
- luminescence unit
- light
- ray structure
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/26—Refractors, transparent cover plates, light guides or filters not provided in groups F21S43/235 - F21S43/255
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0103831 | 2013-08-30 | ||
| KR20130103830A KR20150025797A (ko) | 2013-08-30 | 2013-08-30 | 발광소자 패키지 및 이를 포함하는 차량용 조명 장치 |
| KR10-2013-0103830 | 2013-08-30 | ||
| KR1020130103831A KR102080776B1 (ko) | 2013-08-30 | 2013-08-30 | 발광소자 패키지 및 이를 포함하는 차량용 조명 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104425540A true CN104425540A (zh) | 2015-03-18 |
Family
ID=51417223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410437156.6A Pending CN104425540A (zh) | 2013-08-30 | 2014-08-29 | 发光器件封装及包括该封装的用于车辆的照明装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9269861B2 (https=) |
| EP (1) | EP2843705B1 (https=) |
| JP (1) | JP6713720B2 (https=) |
| CN (1) | CN104425540A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220285329A1 (en) * | 2019-02-08 | 2022-09-08 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111509111A (zh) | 2014-11-18 | 2020-08-07 | 首尔半导体株式会社 | 发光装置及包括该发光装置的车灯 |
| US10170455B2 (en) * | 2015-09-04 | 2019-01-01 | PlayNitride Inc. | Light emitting device with buffer pads |
| TWI646706B (zh) | 2015-09-21 | 2019-01-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
| US10219345B2 (en) * | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
| KR102563894B1 (ko) | 2017-02-08 | 2023-08-10 | 서울반도체 주식회사 | 발광 다이오드 및 이를 포함하는 발광 모듈 |
| CN110707189B (zh) | 2017-02-08 | 2023-09-01 | 首尔半导体株式会社 | 发光模块 |
| JP6986697B2 (ja) * | 2017-06-28 | 2021-12-22 | パナソニックIpマネジメント株式会社 | 紫外線発光素子 |
| US10340308B1 (en) * | 2017-12-22 | 2019-07-02 | X Development Llc | Device with multiple vertically separated terminals and methods for making the same |
| KR102642606B1 (ko) | 2019-05-30 | 2024-03-05 | 삼성디스플레이 주식회사 | 윈도우 및 윈도우의 제조 방법 |
| US12604561B2 (en) * | 2020-12-04 | 2026-04-14 | Seoul Viosys Co., Ltd. | Mixed color light emitting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1167894A (zh) * | 1996-06-06 | 1997-12-17 | 株式会社小糸制作所 | 车辆用信号灯 |
| JPH11204832A (ja) * | 1998-01-14 | 1999-07-30 | Toshiba Electronic Engineering Corp | 窒化ガリウム系化合物半導体発光素子 |
| CN101740600A (zh) * | 2008-11-18 | 2010-06-16 | Lg伊诺特有限公司 | 发光器件以及具有该发光器件的发光器件封装 |
| US20110108869A1 (en) * | 2009-11-06 | 2011-05-12 | Sung Min Hwang | Light emitting device, light emitting device package and lighting system |
| US20110233575A1 (en) * | 2010-03-26 | 2011-09-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Single phosphor layer photonic device for generating white light or color lights |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6404125B1 (en) * | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
| US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
| JP2004055742A (ja) * | 2002-07-18 | 2004-02-19 | Sanyo Electric Co Ltd | 発光素子及びそれを備えた発光素子アレイ |
| US7675075B2 (en) * | 2003-08-28 | 2010-03-09 | Panasonic Corporation | Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device |
| EP2280430B1 (en) * | 2005-03-11 | 2020-01-01 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| JP2009224431A (ja) * | 2008-03-14 | 2009-10-01 | Nichia Corp | 半導体装置 |
| WO2010020068A1 (en) | 2008-08-19 | 2010-02-25 | Lattice Power (Jiangxi) Corporation | Semiconductor light-emitting devices for generating arbitrary color |
| KR101562774B1 (ko) | 2009-02-24 | 2015-10-22 | 서울반도체 주식회사 | 발광모듈 |
| TWI381556B (zh) * | 2009-03-20 | 2013-01-01 | 億光電子工業股份有限公司 | 發光二極體封裝結構及其製作方法 |
| TW201044568A (en) * | 2009-04-20 | 2010-12-16 | 3M Innovative Properties Co | Non-radiatively pumped wavelength converter |
| EP2367203A1 (en) * | 2010-02-26 | 2011-09-21 | Samsung LED Co., Ltd. | Semiconductor light emitting device having multi-cell array and method for manufacturing the same |
| JP2012019104A (ja) | 2010-07-08 | 2012-01-26 | Mitsubishi Chemicals Corp | 発光装置 |
| JP2013541220A (ja) * | 2010-10-27 | 2013-11-07 | コーニンクレッカ フィリップス エヌ ヴェ | 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法 |
| JP5786868B2 (ja) * | 2010-12-28 | 2015-09-30 | 日亜化学工業株式会社 | 半導体発光装置 |
| KR101748334B1 (ko) * | 2011-01-17 | 2017-06-16 | 삼성전자 주식회사 | 백색 발광 소자의 제조 방법 및 제조 장치 |
| JP2012216712A (ja) * | 2011-03-28 | 2012-11-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法および発光ダイオード素子 |
| US20130075769A1 (en) | 2011-09-22 | 2013-03-28 | Ledengin, Inc. | Selection of phosphors and leds in a multi-chip emitter for a single white color bin |
| TW201320406A (zh) * | 2011-11-11 | 2013-05-16 | 東貝光電科技股份有限公司 | 提升混光效果之白光二極體封裝改良結構 |
| KR102003001B1 (ko) | 2013-03-13 | 2019-07-23 | 엘지이노텍 주식회사 | 발광 모듈 |
-
2014
- 2014-08-28 JP JP2014173374A patent/JP6713720B2/ja active Active
- 2014-08-29 CN CN201410437156.6A patent/CN104425540A/zh active Pending
- 2014-08-29 US US14/472,514 patent/US9269861B2/en active Active
- 2014-08-29 EP EP14182912.7A patent/EP2843705B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1167894A (zh) * | 1996-06-06 | 1997-12-17 | 株式会社小糸制作所 | 车辆用信号灯 |
| JPH11204832A (ja) * | 1998-01-14 | 1999-07-30 | Toshiba Electronic Engineering Corp | 窒化ガリウム系化合物半導体発光素子 |
| CN101740600A (zh) * | 2008-11-18 | 2010-06-16 | Lg伊诺特有限公司 | 发光器件以及具有该发光器件的发光器件封装 |
| US20110108869A1 (en) * | 2009-11-06 | 2011-05-12 | Sung Min Hwang | Light emitting device, light emitting device package and lighting system |
| US20110233575A1 (en) * | 2010-03-26 | 2011-09-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Single phosphor layer photonic device for generating white light or color lights |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220285329A1 (en) * | 2019-02-08 | 2022-09-08 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
| US12334483B2 (en) * | 2019-02-08 | 2025-06-17 | Seoul Viosys Co., Ltd. | Light emitting device for display having LED stacks |
| US12355016B2 (en) | 2019-02-08 | 2025-07-08 | Seoul Viosys Co., Ltd. | Light emitting device including electrode pads with lower surfaces at different elevations or having different thicknesses |
Also Published As
| Publication number | Publication date |
|---|---|
| US9269861B2 (en) | 2016-02-23 |
| JP6713720B2 (ja) | 2020-06-24 |
| EP2843705B1 (en) | 2020-03-11 |
| US20150062949A1 (en) | 2015-03-05 |
| JP2015050461A (ja) | 2015-03-16 |
| EP2843705A1 (en) | 2015-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150318 |