CN104425253A - Manufacturing method of reverse conduction FS IGBT (field stop insulated gate bipolar transistor) - Google Patents
Manufacturing method of reverse conduction FS IGBT (field stop insulated gate bipolar transistor) Download PDFInfo
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- CN104425253A CN104425253A CN201310389832.2A CN201310389832A CN104425253A CN 104425253 A CN104425253 A CN 104425253A CN 201310389832 A CN201310389832 A CN 201310389832A CN 104425253 A CN104425253 A CN 104425253A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000010703 silicon Substances 0.000 claims abstract description 80
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 54
- 239000002210 silicon-based material Substances 0.000 claims description 10
- 238000001039 wet etching Methods 0.000 claims description 9
- 238000002513 implantation Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 claims description 3
- 230000008025 crystallization Effects 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 abstract description 13
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000001259 photo etching Methods 0.000 abstract description 4
- 230000001590 oxidative effect Effects 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 44
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000011888 foil Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Electrodes Of Semiconductors (AREA)
Abstract
The invention discloses a manufacturing method of a reverse conduction FS IGBT (field stop insulated gate bipolar transistor). The manufacturing method comprises the following steps of providing an N type silicon wafer, and preparing a field stop layer at the surface of the N type silicon wafer; injecting a first doping type ions into the field stop layer; performing photoetching and corrosion on the surface of the N type silicon wafer to form a plurality of grooves; filling a second doping type of silicon into the grooves, and forming a back PN alternating structure at the surface of the N type silicon wafer; forming an oxidizing layer at the surface of the back PN alternating structure; providing a substrate, and bonding the substrate and the N type silicon wafer together; adopting an IGBT face technology to prepare an IGBT face structure; thinning the substrate of the bonding silicon wafer after the face technology to the oxidizing layer; adopting the wet type corrosion technology to remove the oxidizing layer; forming a back metal electrode at the surface of the back PN alternating structure. The manufacturing method has the advantages that the N type silicon wafer is bonded with the substrate together to obtain a wafer which has the same thickness as the conventional circulating wafer, so the requirement on the special wafer circulating equipment is reduced, and the cost is reduced.
Description
Technical field
The present invention relates to the manufacture method of semiconductor device, particularly relate to the manufacture method of a kind of reverse-conducting field cut-off insulated gate bipolar transistor.
Background technology
Insulated gate bipolar transistor (IGBT) generally adopts the mode of reverse parallel connection fly-wheel diode to use.But this mode wastes package area on the one hand, on the other hand due to the existence of the ghost effects such as stray inductance, parallel connection adds additional power consumption.Therefore, technology IGBT and diode being integrated in same chip comes into one's own day by day.
Reverse-conducting field cut-off (Field Stop, FS) IGBT is a kind of switching device being usually used in the power consumption equipments such as electromagnetic oven, and owing to improving the passage of non equilibrium carrier, its tail currents is optimized, device does not need fly-wheel diode in parallel again simultaneously, reduces cost.
The preparation difficult point of reverse-conducting FS IGBT is that back side N+buffer layer (i.e. Field Stop layer) and back side P/N hand over the preparation every structure, a kind of traditional preparation method first utilizes injection (or pre-expansion)+high temperature to push away after trap prepares back side N+buffer layer to hand over every structure by dual surface lithography overleaf structure being produced P/N, structure does Facad structure technique after completing again overleaf, for below low pressure IGBT(1700V) Facad structure preparation before just need Wafer Thinning to less than 200 μm, this will ask production line to have thin slice to lead to line ability, therefore special thin slice flow-through device and double-sided exposure equipment is needed.
Summary of the invention
Based on this, special thin slice circulation, process equipment is needed in order to solve traditional reverse-conducting field cut-off insulated gate bipolar transistor, cause needing additionally to buy more production equipment, improve the problem of production cost, be necessary a kind of and existing conventional production equipment compatibility to be provided, to reduce the manufacture method of the reverse-conducting field of the dependence of thin slice flow-through device being ended to insulated gate bipolar transistor.
A manufacture method for reverse-conducting field cut-off insulated gate bipolar transistor, comprise the following steps: to provide N-type silicon chip, and prepare N+ layer on N-type silicon chip surface, cutoff layer of must showing up after pushing away trap, the part of N-type silicon chip except the cutoff layer of field is as drift region; The ion of the first doping type is injected to described field cutoff layer; Be injected with the photomask surface of the first doping type ion in described N-type silicon chip and erode away multiple groove, clearing up described N-type silicon chip surface and complete and remove photoresist; In described groove, fill the silicon materials of the second doping type, form back side PN on described N-type silicon chip surface and hand over every structure; Described second doping type is electrical contrary with the first doping type; Hand at described back side PN and form oxide layer every body structure surface; Substrate is provided, and described substrate and described N-type silicon chip is formed together with surface bond that back side PN hands over every structure, obtain one piece and to circulate the consistent bonding silicon chip of silicon wafer thickness with routine; Insulated gate bipolar transistor front technique is adopted to prepare insulated gate bipolar transistor Facad structure in described drift region He on drift region; The described substrate of the bonding silicon chip completing front technique is carried out being thinned to described oxide layer; Wet etching removes described oxide layer; The surface formation back metal electrode deviating from described field cutoff layer every structure is handed at described back side PN.
Wherein in an embodiment, described in provide the thickness of silicon chip in the step of N-type silicon chip to be 10 ~ 650 microns, the resistivity of silicon chip is 5 ~ 500 ohm of * centimetre; The described thickness of substrate in the step of substrate that provides is 50 ~ 650 microns; The thickness of described field cutoff layer is 2 ~ 100 microns, and the doping content of described field cutoff layer is 4*10
13~ 1*10
16/ cubic centimetre.
Wherein in an embodiment, be describedly injected with the photomask surface of the first doping type ion in N-type silicon chip and erode away in the step of multiple groove, the degree of depth of groove is 0.5 ~ 50 micron.
Wherein in an embodiment, described first doping type is P type, and described second doping type is N-type.。
Wherein in an embodiment, the described step injecting the ion of the first doping type to field cutoff layer, implantation dosage is 1*10
13~ 1*10
20/ square centimeter, Implantation Energy is 30 kiloelectron-volts ~ 200 kiloelectron-volts.
Wherein in an embodiment, describedly fill in the step of the silicon materials of the second doping type in groove, the silicon material resistivity of filling is 0.001 ~ 50 ohm of * centimetre.
Wherein in an embodiment, described PN overleaf handed over before body structure surface forms the step of oxide layer, and the silicon materials of temperature to described second doping type of filling also comprising employing more than 800 degrees Celsius carry out the step of single crystallization process.
Wherein in an embodiment, before carrying out described front technique, also comprise and carry out thinning to the drift region of described bonding silicon chip and the one side that drift region is thinned carried out to the step of planarization.
Wherein in an embodiment, described cutoff layer surface on the scene forms the step of oxide layer, and be adopt the technique of thermal oxidation or chemical vapor deposition to be formed, the thickness of described oxide layer is 0.01 ~ 5 micron.
Wherein in an embodiment, the described described substrate by the bonding silicon chip completing front technique carries out the step being thinned to described oxide layer, is the remaining substrate of a first polishing part described substrate, again wet etching.
The manufacture method of above-mentioned reverse-conducting field cut-off insulated gate bipolar transistor, the buffer layer (on the spot cutoff layer) preparing IGBT with the ion implantation (or diffusion) of the common process compatibility mode that high temperature pushes away trap was again adopted before the technique of front, the mode of being filled by photoetching injection+grooving is afterwards produced back side PN and is handed over every structure, without the need to the energetic ion injection device using sided exposure machine and Implantation Energy can reach more than 1 million electro-volt.Then the bonding silicon chip that the silicon wafer thickness that silicon chip and substrate bonding together obtained circulating with routine is consistent, common process is adopted to make the Facad structure of IGBT, only need to do thinning and back face metalization step after Facad structure completes, particular/special requirement is not had to thin slice negotiability, does not more need the special equipment such as high energy implanters and sided exposure machine.Therefore compatible with existing common process, technique is simple, decrease demand to dedicated foil flow-through device, greatly reduces process costs.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field in an embodiment;
Fig. 2 A ~ Fig. 2 K is that reverse-conducting field is ended in an embodiment of the manufacture method of insulated gate bipolar transistor, the generalized section of reverse-conducting FS IGBT in preparation process.
Embodiment
For enabling object of the present invention, feature and advantage more become apparent, and are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Fig. 1 is the flow chart of the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field in an embodiment, comprises the following steps:
S110, provides N-type silicon chip, and prepares N+ layer at silicon chip surface, cutoff layer of must showing up after pushing away trap.
Please refer to Fig. 2 A, in the present embodiment, prepare the N-type silicon chip 20 that one piece of resistivity is 5 ~ 500 Ω * cm, prepare N+ layer 21 by ion implantation or diffusion technology on N-type silicon chip 20 surface, the ion injecting (or diffusion) is the N-type ions such as phosphorus, arsenic, hydrogen.Afterwards, then high temperature push away trap after obtain buffer layer as field cut-off (FS) layer 22, as shown in Figure 2 B.In the present embodiment, the doping content of field cutoff layer 22 is 4*10
13~ 1*10
16/ cm
3, thickness is 2 ~ 100 microns.The part of N-type silicon chip 20 except field cutoff layer 22, as the drift region of FS IGBT, therefore has corresponding requirement to its resistivity.
S120, injects the ion of the first doping type to field cutoff layer.
In the present embodiment, the first doping type is P type, and the second doping type is N-type.Also can be the first doping type be in other embodiments N-type, the second doping type be P type.
In the present embodiment, P type ion implantation dosage is 1*10
13~ 1*10
20/ square centimeter, Implantation Energy is 30 kiloelectron-volts ~ 200 kiloelectron-volts, the region of formation after subsequent treatment as the back side emitter district 11 of IGBT, as shown in Figure 2 C.
S130, is injected with the photomask surface of the first doping type ion in N-type silicon chip and erodes away multiple groove.
Please refer to Fig. 2 D, photoetching goes out groove 13 in back side emitter district 11 surface corrosion after forming corrosion window under the sheltering of photoresist.In the present embodiment, adopt anisotropic etch, the degree of depth of the groove 13 eroded away is 0.5 ~ 50 micron.Etch rear removal photoresist and cleaning silicon chip is surperficial.
S140, fills the silicon materials of the second doping type in groove, forms back side PN hand over every structure on N-type silicon chip surface.
Please refer to Fig. 2 E, the N-type silicon of filling forms back side N-type conductive channel 12, multiple N-type conductive channel 12 and back side emitter district 11 with together with form back side PN and hand over every structure.In the present embodiment, the resistivity of the N-type silicon of filling is 0.01 ~ 50 Ω * cm.
Adopt the mode that grooving is filled, the overcompensation between the dissimilar impurity that can prevent conventional injection mode from causing, is more conducive to the control to device back side injection efficiency.
Understandable, be the mode that after adopting implanting p-type ion, N-type silicon is filled in grooving in the present embodiment, the mode that grooving after injecting N-type ion also can be adopted in other embodiments to fill P-type silicon is handed over every structure to form back side PN.
S150, PN hands over and forms oxide layer every body structure surface overleaf.
PN hands over and forms layer of oxide layer 14, as the protective layer of structure every body structure surface overleaf.Thermal oxidation or chemical vapor deposition method can be adopted to generate oxide layer 14.Oxide layer 14 in follow-up reduction steps as etch end point.
In the present embodiment, the thickness of oxide layer 14 is 0.01 ~ 5 micron.Fig. 2 F is the generalized section of cut-off insulated gate bipolar transistor in reverse-conducting field after step S150 completes.
S160, provides substrate, and substrate and N-type silicon chip is bonded together.
Upset N-type silicon chip 20, is formed with back side PN and hands over and be bonded together with substrate 10 every the one side of structure, obtains one piece of bonding silicon chip consistent with the conventional silicon wafer thickness that circulates.In the present embodiment, substrate 10 is silicon substrate, both can be P type substrate, also can for N-type substrate.The mode of Direct Bonding (SDB) is adopted N-type silicon chip 20 and substrate 10 to be bonded together.The thickness of conventional circulation silicon chip is known silicon chip (wafer) the common thickness in manufacture, transmission of those skilled in the art, and being 625 microns for 6 inches of wafer, is 725 microns for 8 inches of wafer.
That is, should choose the thickness of substrate 10 and N-type silicon chip 20, after step S160 is completed, the thickness of bonding silicon chip is conventional circulation silicon wafer thickness.In the present embodiment, the thickness of the substrate 10 provided in step S160 is 100 ~ 650 microns, and the thickness of the N-type silicon chip 20 provided in step S110 is 10 ~ 650 microns.Fig. 2 G is the generalized section of cut-off insulated gate bipolar transistor in reverse-conducting field after step S160 completes.
S170, adopts insulated gate bipolar transistor front technique to prepare insulated gate bipolar transistor Facad structure in drift region He on drift region.
In the present embodiment, reverse-conducting FS IGBT is planar gate (Planar) IGBT, can prepare its Facad structure, repeat no more herein by the front technique of the known planar gate IGBT of those skilled in the art.With reference to Fig. 2 H, after step S170 completes, device comprises the P type tagma 24 in the drift region of N-type silicon chip 20, the emitter 25 of the N-type in P type tagma 24, the gate oxide 26 on surface, drift region, the polysilicon gate 27 on gate oxide 26 surface, the medium of oxides layer 28 of covering gate oxide layer 26 and polysilicon gate 27, and respectively from pad (pad) the E(emitter that emitter 25 and polysilicon gate 27 are drawn) and pad G(grid).
Understandable, in other embodiments, reverse-conducting FS IGBT also can be trench-gate (Trench) IGBT, can prepare its Facad structure by the front technique of the known trench-gate IGBT of those skilled in the art.
S180, is undertaken being thinned to oxide layer by the substrate of the bonding silicon chip completing front technique.
Carry out thinning to substrate 10.Be polished substrate 10 in the present embodiment to after still remaining certain thickness, remove the silicon materials of clean substrate 10 further with wet etching, using the oxide layer 14 at the back side as natural terminal.Understandable, what the wet etching in this step adopted is corrosive liquid silicon/silicon dioxide being had to high corrosion ratio.Fig. 2 I is the generalized section of cut-off insulated gate bipolar transistor in reverse-conducting field after step S180 completes.
S190, wet etching removes oxide layer.
After thinning completing, adopt wet etching to remove the oxide layer 14 at the IGBT back side.Understandable, what the wet etching in this step adopted is corrosive liquid silica/silicon being had to high corrosion ratio.Fig. 2 J is the generalized section of cut-off insulated gate bipolar transistor in reverse-conducting field after step S190 completes.
S200, PN hands over the surface formation back metal electrode deviating from a cutoff layer every structure overleaf.
PN hands over after structure has been cleared up, and adopts the mode of sputtering or evaporation to prepare the back metal electrode 19 of IGBT, finally obtains reverse-conducting field cut-off insulated gate bipolar transistor, as shown in figure 2k.
The manufacture method of above-mentioned reverse-conducting field cut-off insulated gate bipolar transistor, the buffer layer (on the spot cutoff layer 22) preparing IGBT with the ion implantation (or diffusion) of the common process compatibility mode that high temperature pushes away trap was again adopted before the technique of front, the mode of being filled by photoetching injection+grooving is afterwards produced back side PN and is handed over every structure, without the need to the energetic ion injection device using sided exposure machine and Implantation Energy can reach more than 1 million electro-volt.Then the bonding silicon chip that the silicon wafer thickness that silicon chip and substrate bonding together obtained circulating with routine is consistent, common process is adopted to make the Facad structure of IGBT, only need to do thinning and back face metalization step after Facad structure completes, particular/special requirement is not had to thin slice negotiability, does not more need the special equipment such as high energy implanters and sided exposure machine.Therefore compatible with existing common process, technique is simple, decrease demand to dedicated foil flow-through device, greatly reduces process costs.
In step s 110, if the drift region of design is thinner, can first by the N-type silicon chip 20 of a piece thicker (thickness is greater than drift region design thickness), again before front technique (step S170), the drift region of bonding silicon chip is carried out thinning, and planarization (CMP) is carried out to this one side be thinned.
The N-type silicon of filling in step S140 can be monocrystalline silicon, polysilicon or amorphous silicon.Wherein in an embodiment, also comprise the step of with the high temperature of more than 800 degrees Celsius, the N-type silicon of filling being carried out to single crystallization process.
Wherein in an embodiment, also comprise after filling N-type silicon in step S140 and the step that chemical-mechanical planarization (CMP) processes is carried out to the surface being filled with N-type silicon.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a manufacture method for reverse-conducting field cut-off insulated gate bipolar transistor, comprises the following steps:
There is provided N-type silicon chip, and prepare N+ layer on N-type silicon chip surface, cutoff layer of must showing up after pushing away trap, the part of N-type silicon chip except the cutoff layer of field is as drift region;
The ion of the first doping type is injected to described field cutoff layer;
Be injected with the photomask surface of the first doping type ion in described N-type silicon chip and erode away multiple groove, clearing up described N-type silicon chip surface and complete and remove photoresist;
In described groove, fill the silicon materials of the second doping type, form back side PN on described N-type silicon chip surface and hand over every structure; Described second doping type is electrical contrary with the first doping type;
Hand at described back side PN and form oxide layer every body structure surface;
Substrate is provided, and described substrate and described N-type silicon chip is formed together with surface bond that back side PN hands over every structure, obtain one piece and to circulate the consistent bonding silicon chip of silicon wafer thickness with routine;
Insulated gate bipolar transistor front technique is adopted to prepare insulated gate bipolar transistor Facad structure in described drift region He on drift region;
The described substrate of the bonding silicon chip completing front technique is carried out being thinned to described oxide layer;
Wet etching removes described oxide layer;
The surface formation back metal electrode deviating from described field cutoff layer every structure is handed at described back side PN.
2. the manufacture method of reverse-conducting field according to claim 1 cut-off insulated gate bipolar transistor, is characterized in that, described in provide the thickness of silicon chip in the step of N-type silicon chip to be 10 ~ 650 microns, the resistivity of silicon chip is 5 ~ 500 ohm of * centimetre; The described thickness of substrate in the step of substrate that provides is 50 ~ 650 microns; The thickness of described field cutoff layer is 2 ~ 100 microns, and the doping content of described field cutoff layer is 4*10
13~ 1*10
16/ cubic centimetre.
3. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 1, it is characterized in that, describedly be injected with the photomask surface of the first doping type ion in N-type silicon chip and erode away in the step of multiple groove, the degree of depth of groove is 0.5 ~ 50 micron.
4. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 1, it is characterized in that, described first doping type is P type, and described second doping type is N-type.
5. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 4, it is characterized in that, the described step injecting the ion of the first doping type to field cutoff layer, implantation dosage is 1*10
13~ 1*10
20/ square centimeter, Implantation Energy is 30 kiloelectron-volts ~ 200 kiloelectron-volts.
6. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 4, it is characterized in that, describedly fill in the step of the silicon materials of the second doping type in groove, the silicon material resistivity of filling is 0.001 ~ 50 ohm of * centimetre.
7. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 1, it is characterized in that, described PN overleaf handed over before body structure surface forms the step of oxide layer, and the silicon materials of temperature to described second doping type of filling also comprising employing more than 800 degrees Celsius carry out the step of single crystallization process.
8. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 1, it is characterized in that, before carrying out described front technique, also comprise and carry out thinning to the drift region of described bonding silicon chip and the one side that drift region is thinned carried out to the step of planarization.
9. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 1, it is characterized in that, described cutoff layer surface on the scene forms the step of oxide layer, is to adopt the technique of thermal oxidation or chemical vapor deposition to be formed, and the thickness of described oxide layer is 0.01 ~ 5 micron.
10. the manufacture method of cut-off insulated gate bipolar transistor in reverse-conducting field according to claim 1, it is characterized in that, the described described substrate by the bonding silicon chip completing front technique carries out the step being thinned to described oxide layer, is the remaining substrate of a first polishing part described substrate, again wet etching.
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| CN107180758A (en) * | 2017-07-21 | 2017-09-19 | 电子科技大学 | A kind of inverse preparation method for leading FS IGBT |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107180758A (en) * | 2017-07-21 | 2017-09-19 | 电子科技大学 | A kind of inverse preparation method for leading FS IGBT |
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