CN104412725A - 焊接间隔件以及包括所述焊接间隔件的电子模块 - Google Patents

焊接间隔件以及包括所述焊接间隔件的电子模块 Download PDF

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CN104412725A
CN104412725A CN201380033742.8A CN201380033742A CN104412725A CN 104412725 A CN104412725 A CN 104412725A CN 201380033742 A CN201380033742 A CN 201380033742A CN 104412725 A CN104412725 A CN 104412725A
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S·科恩
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Sagemcom Broadband SAS
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10803—Tapered leads, i.e. leads having changing width or diameter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Of Plates (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

本发明涉及一种焊接间隔件，它包括细长主体(102)，所述细长主体具有设置有螺纹孔(104)的一端和设置有横向支承表面(106)的另一端，光滑的对中柱(103)从所述横向支承表面伸出，所述对中柱(103)包括纵向外部通道(108)，所述纵向外部通道在其长度的至少一部分上延伸到所述横向支承表面(106)，从而允许熔融焊膏能够通过毛细作用升至所述横向支承表面(106)。本发明也提供一种包括此类间隔件的电子模块(112)。

Description

焊接间隔件以及包括所述焊接间隔件的电子模块
本发明涉及一种用于将两个电子卡或任意类型的两个板组装在一起的焊接的间隔件。本发明也涉及包括此间隔件的电子模块。
背景技术
在包括多个电子卡的电子模块中，经常会使用间隔件来将各个电子卡组装在一起。此类间隔件或者由塑料材料制成，或者它们由金属材料制成，其中，金属间隔件也用以提供电子卡的各电气接地之间的电气连接。
某些间隔件(也称为“间隔柱”)，包括细长本体，该细长本体具有限定螺纹孔的、已攻螺纹的一端以及从细长本体的另一端延伸的螺纹段。
图1是电子模块3的第一电子卡1和第二电子卡2，这些卡藉由至少现有技术的间隔件或间隔柱(standoff)4组装在一起。
间隔件4的主体5定位在卡1和卡2之间，以使得首先螺纹段6从第一卡1通过可选的垫圈7和形成在第一卡1中的开口8突出，然后将螺纹孔9放置成面向形成在第二卡2中的开口10。将螺母11拧到螺纹段6上，并将螺栓12经由开口10拧到间隔件4的螺纹孔9中。
该组装过程需要使用大量的部件(用于各间隔件的螺栓、螺母和垫圈)，由此会增加电子模块的成本，并且使其物料清单、折旧、供应等管理更加复杂。
为了消除螺母和垫圈，可以设想的是，在波焊操作期间，间隔件可以通过紧固到第一卡而被组装，该波焊操作包括将焊料直接施加到间隔件的螺纹部并施加到位于第一卡上的接纳区域上。以此方式进行紧固的第一个缺点是很小的机械强度，因为难以将焊料抓持到螺纹部上，因此限制了可以施加到穿进该螺纹孔的螺栓上的拧紧力矩。此类紧固方式的第二个缺点是在紧固的机械强度方面的较差再现性，此意味着不可能限定用于所有间隔件的单一拧紧力矩，因此很难实现自动组装。
发明目的
本发明目的是提供一种能够使两个电子卡或各种类型的板组装在一起而不具有上述缺点的间隔件。
发明内容
为实现该目的，本发明提供了一种用于焊接的间隔件，其包括细长主体，该细长主体具有设置有螺纹孔的一端和设置有横向支承表面的另一端，该另一端具有从该横向支承表面伸出的光滑的对中柱，该对中柱具有纵向外部通道，该纵向外部通道在其长度的至少一部分上延伸直到横向支承表面，以使得熔融焊料能够通过毛细作用渗透远至该横向支承表面。
由此，当将两个电子卡或各种类型的板组装在一起时，该间隔件通过经由其对中柱执行的焊接操作而紧固到第一卡。因此，此类紧固过程不再需要使用垫圈和螺母。纵向外部通道能够使一定量的焊料朝向支承表面渗透，因此使得该间隔件的相对较大的面积能够接触焊料。紧固强度和与焊料接触的面积成正比。因此，本发明能使紧固操作更有效地实现，由此具有这样的效果：首先增加了可在延伸到主体的螺纹孔中的螺栓上使用的拧紧力矩；并且其次提高了紧固操作的机械强度的可再现性，并因此使得组装过程能够自动实现。
本发明也提供包括此类间隔件的电子模块。
通过对本发明具体的非限制性实施例的以下详细描述可更好地理解本发明。
附图说明
现参照附图，附图中：
图1如上所述；
图2是本发明的用于焊接的间隔件的立体图；
图3是藉由本发明的用于焊接的间隔件而组装在一起的两个电子卡的截面图；以及
图4是藉由本发明的用于焊接的间隔件的对中柱以及电子卡的截面图，该截面是沿图3中的横截面A-A剖切得到的。
具体实施方式
参照图2，本发明的用于焊接的间隔件101包括具有六边形横截面的细长主体和具有大致圆柱形的对中柱103。该细长主体102具有已攻螺纹的端104和相对端105，该相对端105设有横向支承表面106并具有从该相对端105沿细长主体102的轴线伸出的对中柱103。对中柱103经由圆形凹槽107连接到横向支承表面106。对中柱103设置有两个纵向延伸的、对称布置的外平坦部108。
参照图3和图4，本发明的用于焊接的间隔件101在该实例中用于将电子模块112的第一电子卡110和第二电子卡111组装在一起。用于焊接的间隔件101的细长主体102安装在第一卡110的内表面113和第二卡111的内表面114之间，并且该细长主体用于保持两个电子卡110和111间隔开。
间隔件101布置在第一卡110上，以使得横向支承表面106抵靠于第一卡110的内表面113支承，并且以使得对中柱103经由形成在第一卡110中的开口116而伸出超过第一卡110的外表面115。
用以将间隔件101与第一卡110固定在一起的紧固操作通过任一焊接方法(在焊炉中进行回流焊接、波焊、手动焊接等)实现。将该焊料施加到对中柱103的自由端117。熔融焊料(可以例如包含一定比例的锡)通过毛细作用朝向间隔件101内的凹槽107渗透，从而经过位于开口116内并由平坦部108所限定的空间。第一数量的熔融焊料118遍布到接纳区域119上，该接纳区域119在第一卡110的外表面115上围绕第一卡110中的开口116。第二数量的熔融焊料129填充间隔件101中的凹槽107直到横向支承表面106。凹槽107能够使焊料均匀施加在横向支承表面106上，从而形成这样的紧固件，即，该紧固件在适合于任意电子模块的所有相似间隔件中呈现牢固的并可再现的机械强度。
将间隔件和第二卡111彼此固定的紧固操作是通过将螺栓120从第二卡111的外表面121经由形成在第二卡111中的开口123拧入间隔件101的攻螺纹端104中的螺纹孔122而实现的。在第一卡110中形成的开口116和在第二卡111中形成的开口123定位成彼此对准。
对中柱102使间隔件101在第一卡110的开口116中对中，以确保足以使螺栓120容易地拧入螺纹孔122中的组装公差。
紧固到第一卡110的牢固性和可再现性使相当大的拧紧力矩能施加到位于第二卡111旁的螺纹孔122中的螺栓120，并且使得可以为与此类间隔件相关联的任何螺栓定义相同的拧紧力矩，从而使得如上所述更容易使该组装过程实现自动化。
本发明并不限于上述特定实施例，而是相反地，涵盖落入由权利要求书限定的本发明范围内的任何变型。
虽然对中柱设置有对称的平坦部，但是可以设置不同的外部纵向通道，例如包括以使得对中柱可以继续确保间隔件相对于该卡的对中作用的方式进行布置的一个或多个凹槽。
该主体可以具有除了六边形以外的横截面，例如具有多边形、正方形、圆柱形等的横截面。
虽然通过使用本发明的用于焊接的间隔件来将电子模块中的两个电子卡组装在一起而示出了本发明，但是可以使用此类间隔件来将具有平面部的、需要与另一平面部保持分开的任何类型的元件组装在一起。

Claims (5)

1.一种用于焊接的间隔件，所述间隔件包括细长主体(102)，所述细长主体具有设置有螺纹孔(104)的一端和设置有横向支承表面(106)的另一端，所述另一端具有从所述横向支承表面伸出的光滑的对中柱(103)，所述对中柱(103)具有纵向外部通道(108)，所述纵向外部通道在其长度的至少一部分上延伸直到所述横向支承表面(106)，以使得熔融焊料能够通过毛细作用渗透远至所述横向支承表面(106)。
2.如权利要求1所述的用于焊接的间隔件，其特征在于，所述对中柱(103)经由圆形凹槽(107)连接到所述横向支承表面(106)。
3.如权利要求1所述的用于焊接的间隔件，其特征在于，所述纵向外部通道(108)包括至少一个平坦部(108)。
4.如权利要求1所述的用于焊接的间隔件，其特征在于，所述纵向外部通道(108)具有两个对称的平坦部(108)。
5.一种电子模块(112)，所述电子模块具有通过如权利要求1至4中任一项所述的间隔件(101)而保持间隔开的两个电子卡(110、111)，其中，所述间隔件(101)通过螺栓(120)和设有螺纹孔(104)的端部之间的协作而紧固到一个电子卡(111)，并且所述间隔件(101)经由焊料紧固到另一卡(110)，所述焊料将所述对中柱(103)连接所述卡(110)，并沿所述对中柱(103)经由所述纵向外部通道(108)渗透到所述横向支承表面(106)。
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FR1256100A FR2992823B1 (fr) 2012-06-27 2012-06-27 Entretoise a braser et module electronique comportant une telle entretoise
PCT/EP2013/060676 WO2014000999A1 (fr) 2012-06-27 2013-05-23 Entretoise a braser et module electronique comportant une telle entretoise

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CN103810785A (zh) * 2012-11-07 2014-05-21 鸿富锦精密工业（深圳）有限公司 电源固定装置
JP6930094B2 (ja) * 2016-11-29 2021-09-01 富士通株式会社 接合部品及び基板ユニット
JP6881839B2 (ja) * 2017-03-06 2021-06-02 Ｎｅｃプラットフォームズ株式会社 回路基板連結装置および電子部品
US11172574B2 (en) * 2019-03-22 2021-11-09 Samsung Electro-Mechanics Co., Ltd. Printed circuit board assembly

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FR2992823A1 (fr) 2014-01-03
US20150173192A1 (en) 2015-06-18
US9629245B2 (en) 2017-04-18
EP2868171B1 (fr) 2016-09-07
WO2014000999A1 (fr) 2014-01-03
CN104412725B (zh) 2017-06-09
EP2868171A1 (fr) 2015-05-06
FR2992823B1 (fr) 2014-06-20
BR112014029848A2 (pt) 2017-06-27

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