CN104411099A - 厚铜电路板电路图形的转移方法 - Google Patents
厚铜电路板电路图形的转移方法 Download PDFInfo
- Publication number
- CN104411099A CN104411099A CN201410725751.XA CN201410725751A CN104411099A CN 104411099 A CN104411099 A CN 104411099A CN 201410725751 A CN201410725751 A CN 201410725751A CN 104411099 A CN104411099 A CN 104411099A
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- CN
- China
- Prior art keywords
- copper
- thickness
- circuit board
- circuitous pattern
- transfer method
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410725751.XA CN104411099B (zh) | 2014-12-04 | 2014-12-04 | 厚铜电路板电路图形的转移方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410725751.XA CN104411099B (zh) | 2014-12-04 | 2014-12-04 | 厚铜电路板电路图形的转移方法 |
Publications (2)
Publication Number | Publication Date |
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CN104411099A true CN104411099A (zh) | 2015-03-11 |
CN104411099B CN104411099B (zh) | 2017-04-12 |
Family
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Family Applications (1)
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CN201410725751.XA Active CN104411099B (zh) | 2014-12-04 | 2014-12-04 | 厚铜电路板电路图形的转移方法 |
Country Status (1)
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CN (1) | CN104411099B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107624001A (zh) * | 2017-09-27 | 2018-01-23 | 广州兴森快捷电路科技有限公司 | 电路板电镀方法 |
CN109195330A (zh) * | 2018-09-03 | 2019-01-11 | 江门荣信电路板有限公司 | 一种pcb板的无铜光学点制造方法及其无铜光学点结构 |
CN110430676A (zh) * | 2019-07-12 | 2019-11-08 | 苏州赛提发精密科技有限公司 | 一种线路板的成型方法 |
CN111328203A (zh) * | 2020-03-16 | 2020-06-23 | 深圳市实锐泰科技有限公司 | 一种厚铜镂空的金手指插头线路制作方法 |
CN112153824A (zh) * | 2019-06-27 | 2020-12-29 | 广州力及热管理科技有限公司 | 一种具有厚铜结构的陶瓷电路板及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1798481A (zh) * | 2004-12-27 | 2006-07-05 | 三之星机带株式会社 | 在聚酰亚胺树脂上形成无机薄膜图案的方法 |
CN102893709A (zh) * | 2010-05-26 | 2013-01-23 | 住友电木株式会社 | 附有镀金金属微细图案的基材的制造方法、附有镀金金属微细图案的基材、印刷配线板、内插板及半导体装置 |
US20140083748A1 (en) * | 2007-06-21 | 2014-03-27 | Sri International | Conductive pattern formation |
US20140151095A1 (en) * | 2012-12-05 | 2014-06-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
US20140345916A1 (en) * | 2013-05-23 | 2014-11-27 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
-
2014
- 2014-12-04 CN CN201410725751.XA patent/CN104411099B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1798481A (zh) * | 2004-12-27 | 2006-07-05 | 三之星机带株式会社 | 在聚酰亚胺树脂上形成无机薄膜图案的方法 |
US20140083748A1 (en) * | 2007-06-21 | 2014-03-27 | Sri International | Conductive pattern formation |
CN102893709A (zh) * | 2010-05-26 | 2013-01-23 | 住友电木株式会社 | 附有镀金金属微细图案的基材的制造方法、附有镀金金属微细图案的基材、印刷配线板、内插板及半导体装置 |
US20140151095A1 (en) * | 2012-12-05 | 2014-06-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
US20140345916A1 (en) * | 2013-05-23 | 2014-11-27 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107624001A (zh) * | 2017-09-27 | 2018-01-23 | 广州兴森快捷电路科技有限公司 | 电路板电镀方法 |
CN107624001B (zh) * | 2017-09-27 | 2020-05-05 | 广州兴森快捷电路科技有限公司 | 电路板电镀方法 |
CN109195330A (zh) * | 2018-09-03 | 2019-01-11 | 江门荣信电路板有限公司 | 一种pcb板的无铜光学点制造方法及其无铜光学点结构 |
CN112153824A (zh) * | 2019-06-27 | 2020-12-29 | 广州力及热管理科技有限公司 | 一种具有厚铜结构的陶瓷电路板及其制作方法 |
CN110430676A (zh) * | 2019-07-12 | 2019-11-08 | 苏州赛提发精密科技有限公司 | 一种线路板的成型方法 |
CN111328203A (zh) * | 2020-03-16 | 2020-06-23 | 深圳市实锐泰科技有限公司 | 一种厚铜镂空的金手指插头线路制作方法 |
CN111328203B (zh) * | 2020-03-16 | 2023-11-03 | 深圳市实锐泰科技有限公司 | 一种厚铜镂空的金手指插头线路制作方法 |
Also Published As
Publication number | Publication date |
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CN104411099B (zh) | 2017-04-12 |
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Address after: 413001 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee after: AOSHIKANG TECHNOLOGY Co.,Ltd. Address before: 413001 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee before: Hunan aoshikang Polytron Technologies Inc. Address after: 413001 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee after: Hunan aoshikang Polytron Technologies Inc. Address before: 413001 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee before: AOSHIKANG TECHNOLOGY (YIYANG) Co.,Ltd. |