CN104408513A - Intelligent card carrier band with extensible bonding pads - Google Patents
Intelligent card carrier band with extensible bonding pads Download PDFInfo
- Publication number
- CN104408513A CN104408513A CN201410427546.5A CN201410427546A CN104408513A CN 104408513 A CN104408513 A CN 104408513A CN 201410427546 A CN201410427546 A CN 201410427546A CN 104408513 A CN104408513 A CN 104408513A
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- CN
- China
- Prior art keywords
- carrier band
- contact
- pad
- easily extensible
- intelligent card
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Battery Mounting, Suspending (AREA)
Abstract
The invention provides an intelligent card carrier band with extensible bonding pads. The carrier ban can realize the expansion of various application circuits inside a conventional intelligent card. Firstly, the carrier band provides eight contacts (including eight encapsulation welding pads) supported by the specification ISO7816, so that the connection of the carrier band and an intelligent card external circuit (such as a card reader) can be realized; and secondly, besides the contacts specified by the ISO7816, a wrapping surface is also provided with a plurality of special welding pads used for expanding intelligent card applications. Through the extensible bonding pads, the expansion of various application circuits inside a card body of the conventional intelligent card, such as addition of connection circuits including electrically displayed windows, press keys and batteries onto the card body, can be realized.
Description
Technical field
The present invention relates to smart card to produce and application.
Background technology
Contact intelligent card, according to ISO7816 agreement, the surface of contact of carrier band comprises 8 contacts, or 6 contacts (C4 and C8 not containing the definition of ISO7816 agreement).
Double-interface smart card, has also drawn two radio frequency interface contacts in envelope surfaces.No matter be contact intelligent card, or double-interface smart card, all carry out communication by contact with the communication in the external world.Along with the increase of the application scenarios of smart card, these contacts can not meet various application demand.Therefore have on the basis, contact that ISO7816 agreement specifies, have devised the carrier band realizing smart card expanded application, newly-designed carrier band can at smartcard internal expanded application circuit.
Summary of the invention
The present invention provides some easily extensible pads for realizing expanded application in the envelope surfaces of carrier band, and this carrier band at smartcard internal expanded application circuit, can show the application circuits such as window, button, battery as electricity; Take into account production practices simultaneously, effectively can meet different process and the large-scale production demand of smart card processing.
This carrier band comprises surface of contact and envelope surfaces, and the contact of surface of contact meets ISO7816 agreement, and envelope surfaces contains easily extensible pad.The envelope surfaces of tradition carrier band is used for packaging smart card chip.The present invention is by while packaged chip, realizing the expansion of application circuit at the easily extensible pad of envelope surfaces design in smartcard internal by easily extensible pad.Simultaneously because the existence of easily extensible pad, also traditional die can be packaged in the application circuit of expansion, and realize the connection of the contact that easily extensible pad and ISO7816 agreement specify by smart card production run.
A kind of belt for smart card with easily extensible pad, comprise carrier band surface of contact and carrier band envelope surfaces, the contact of carrier band surface of contact meets ISO7816 agreement, it is characterized in that the envelope surfaces of this carrier band by base material, the corresponding pad in ISO7816 contact, cover copper connecting line, easily extensible pad, intelligent card chip Chip Area, carrier band transmission hole form, wherein:
Base material realizes the connection of carrier band surface of contact and carrier band envelope surfaces and plays insulating effect;
When carrying out smart card module encapsulation, by binding technique, corresponding to the respective pins of intelligent card chip and ISO7816 contact pad is connected, thus realizes the connection of chip pin or easily extensible pad and carrier band surface of contact contact;
The application circuit that easily extensible pad is expanded with belt for smart card connects, and also can connect by the pad corresponding with ISO7816 contact, or is connected with intelligent card chip respective pins; By meeting different smart card production and processing technologies to the size of easily extensible pad and Position Design.
Fig. 1, Fig. 2 are two designs of band easily extensible pad carrier band, two width figure are the vertical view that this carrier band is seen from surface of contact, the contact (and pad of correspondence) that figure comprises easily extensible pad, ISO7816 specification is supported, cover copper connecting line, die attach region etc.Wherein Fig. 1 is designed to the easily extensible pad carrier band of large-size, Fig. 3 is the envelope surfaces schematic diagram of this carrier band, and 6 easily extensible pads are positioned at envelope surfaces, and the left and right sides is symmetrical, wherein 4 easily extensible pad size 2mm*3.2mm, other 2 easily extensible pad sizes are 2.0mm*1.9mm; Fig. 2 design be the easily extensible pad of reduced size, Fig. 4 is the envelope surfaces schematic diagram of this carrier band, and 3 easily extensible pads are positioned at envelope surfaces, and are distributed in the same side, and its size is 1.0mm*0.5mm.These two kinds of designs can adapt to different smart card production and processing technologies and large-scale production demand respectively.
Accompanying drawing explanation
The vertical view of Fig. 1 band easily extensible pad carrier band
The vertical view of Fig. 2 band easily extensible pad carrier band
The easily extensible pad of Fig. 3 large-size
The undersized easily extensible pad of Fig. 4
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Fig. 3 (Fig. 4), it is the envelope surfaces schematic diagram of carrier band.
The carrier band envelope surfaces that Fig. 3 (Fig. 4) illustrates by base material A100 (B100), corresponding pad A104 (B105) in ISO7816 contact, cover copper connecting line A102 (B101), easily extensible pad A101 (B102, B104), A103 (B103), A105 (B104), intelligent card chip Chip Area A106 (B106), carrier band transmission hole A107 (B107) etc. and form.
A100 (B100) is connection in order to realize carrier band surface of contact and carrier band envelope surfaces and plays insulating effect.
The corresponding pad of the contact that A104 (B105) specifies for ISO7816 agreement.When carrying out smart card module encapsulation, by metal wire (as spun gold), the respective pins of intelligent card chip is connected with A104 (B105), or (also can) realizes the connection of easily extensible pad A103 (B103), A105 and A104 (B105) simultaneously by metal wire, thus realizes the connection of chip pin or easily extensible pad and carrier band surface of contact contact.
Easily extensible pad is divided into A101 (B102, B104) and A103 (B103), A105.Wherein A101 (B102, B104) is for the connection of the application circuit with expansion.A103 (B103), A105 are used for and the connection of A104 (B105), or and the connection of intelligent card chip respective pins.A101 (B102, B104) realizes being connected by A102 with A103 (B103), A105.
A107 is the transmission hole for transmitting in process of manufacture.
Obviously, those skilled in the art can carry out various change and distortion to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and distortion belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these changes and distortion.
Claims (2)
1. the belt for smart card with easily extensible pad, comprise carrier band surface of contact and carrier band envelope surfaces, the contact of carrier band surface of contact meets ISO7816 agreement, it is characterized in that the envelope surfaces of this carrier band by base material, the corresponding pad in ISO7816 contact, cover copper connecting line, easily extensible pad, intelligent card chip Chip Area, carrier band transmission hole form, wherein:
Base material realizes the connection of carrier band surface of contact and carrier band envelope surfaces and plays insulating effect;
When carrying out smart card module encapsulation, by binding technique, corresponding to the respective pins of intelligent card chip and ISO7816 contact pad is connected, thus realizes the connection of chip pin or easily extensible pad and carrier band surface of contact contact;
The application circuit that easily extensible pad is expanded with belt for smart card connects, and also can connect by the pad corresponding with ISO7816 contact, or is connected with intelligent card chip respective pins; By meeting different smart card production and processing technologies to the size of easily extensible pad and Position Design.
2. as claimed in claim 1, the feature of carrier band is embodied in the position of the easily extensible pad of envelope surfaces, size and distributed quantity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410427546.5A CN104408513A (en) | 2014-08-27 | 2014-08-27 | Intelligent card carrier band with extensible bonding pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410427546.5A CN104408513A (en) | 2014-08-27 | 2014-08-27 | Intelligent card carrier band with extensible bonding pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104408513A true CN104408513A (en) | 2015-03-11 |
Family
ID=52646142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410427546.5A Pending CN104408513A (en) | 2014-08-27 | 2014-08-27 | Intelligent card carrier band with extensible bonding pads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104408513A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435982A (en) * | 2020-11-18 | 2021-03-02 | 深圳源明杰科技股份有限公司 | Intelligent device, intelligent card assembly and carrier tape |
Citations (7)
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| CN101420069A (en) * | 2008-11-20 | 2009-04-29 | 北京握奇数据系统有限公司 | Connection method for antenna and intelligent card and double interface smart card |
| CN101431062A (en) * | 2007-09-20 | 2009-05-13 | 三星电子株式会社 | Carrier band substrate for smart card and semiconductor module for smart card |
| CN201302726Y (en) * | 2008-11-20 | 2009-09-02 | 北京握奇数据系统有限公司 | A dual-interface smart card |
| CN102509149A (en) * | 2011-11-01 | 2012-06-20 | 上海祯显电子科技有限公司 | Novel double-interface smart card module |
| CN202339562U (en) * | 2011-11-01 | 2012-07-18 | 上海祯显电子科技有限公司 | Novel dual-interface smart card module |
| CN202749367U (en) * | 2012-07-04 | 2013-02-20 | 北京中电华大电子设计有限责任公司 | Multi-contact smart card carrier tape with golden fingers |
| CN202996825U (en) * | 2012-12-19 | 2013-06-12 | 上海长丰智能卡有限公司 | Mini moulding packaging handset card |
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2014
- 2014-08-27 CN CN201410427546.5A patent/CN104408513A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431062A (en) * | 2007-09-20 | 2009-05-13 | 三星电子株式会社 | Carrier band substrate for smart card and semiconductor module for smart card |
| CN101420069A (en) * | 2008-11-20 | 2009-04-29 | 北京握奇数据系统有限公司 | Connection method for antenna and intelligent card and double interface smart card |
| CN201302726Y (en) * | 2008-11-20 | 2009-09-02 | 北京握奇数据系统有限公司 | A dual-interface smart card |
| CN102509149A (en) * | 2011-11-01 | 2012-06-20 | 上海祯显电子科技有限公司 | Novel double-interface smart card module |
| CN202339562U (en) * | 2011-11-01 | 2012-07-18 | 上海祯显电子科技有限公司 | Novel dual-interface smart card module |
| CN202749367U (en) * | 2012-07-04 | 2013-02-20 | 北京中电华大电子设计有限责任公司 | Multi-contact smart card carrier tape with golden fingers |
| CN202996825U (en) * | 2012-12-19 | 2013-06-12 | 上海长丰智能卡有限公司 | Mini moulding packaging handset card |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435982A (en) * | 2020-11-18 | 2021-03-02 | 深圳源明杰科技股份有限公司 | Intelligent device, intelligent card assembly and carrier tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 102209 Beijing, Beiqijia, the future of science and technology in the south area of China electronic network security and information technology industry base C building, Applicant after: Beijing CEC Huada Electronic Design Co., Ltd. Address before: 100102 Beijing City, Chaoyang District Lize two Road No. 2, Wangjing science and Technology Park A block five layer Applicant before: Beijing CEC Huada Electronic Design Co., Ltd. |
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| COR | Change of bibliographic data | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150311 |