CN104407735A - Touch screen leading wire conductive circuit, manufacturing method thereof, and touch screen mobile phone - Google Patents

Touch screen leading wire conductive circuit, manufacturing method thereof, and touch screen mobile phone Download PDF

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Publication number
CN104407735A
CN104407735A CN201410630763.4A CN201410630763A CN104407735A CN 104407735 A CN104407735 A CN 104407735A CN 201410630763 A CN201410630763 A CN 201410630763A CN 104407735 A CN104407735 A CN 104407735A
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China
Prior art keywords
touch screen
conductive ink
conducting wire
lead
electrically conductive
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CN201410630763.4A
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CN104407735B (en
Inventor
莫志源
杨顺林
龙集贤
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Changsha City Yushun Display Technology Co Ltd
Shenzhen Success Electronic Co Ltd
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Changsha City Yushun Display Technology Co Ltd
Shenzhen Success Electronic Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The invention provides a manufacturing method of a touch screen leading wire conductive circuit. The manufacturing method comprises the following steps: preparing conductive ink of nano-copper alloy powder and nano-glass powder; coating the conductive ink onto a touch screen substrate to form a conductive ink coating; pre-baking the conductive ink coating; performing sintering processing on the part, which is required to from a leading wire conductive circuit pattern, in the baked conductive ink coating; clearing the unsintered part of the conductive ink coating. By adopting the manufacturing method disclosed by the invention, the touch screen leading wire conductive circuit is formed in a mode of selectively sintering the conductive ink, and the binding effects between the touch screen leading wire conductive circuit and the touch screen substrate as well as the ITO pattern on the touch screen substrate are very good; the overall manufacturing method is simple in process, low in cost and environment-friendly; complex and expensive equipment is not required; the product reliability is improved.

Description

Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone
Technical field
The invention belongs to touch-control display preparing technical field, be specifically related to a kind of lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone.
Background technology
In the process of manufacturing intelligence mobile phone, the making of touch-screen is one of committed step wherein.Wherein, lead of touch screen is the conducting wire between conducting touch chip I/O port and ITO (tin indium oxide) pattern, and it requires that resistivity is low, circuit is meticulous, and on high-end touch-screen mobile phone, require that live width line-spacing is less than 50 microns.At present, a kind of method for making mainly Vacuum Deposition molybdenum/aluminium/molybdenum conducting film of lead of touch screen conducting wire, then form conducting wire by chemical etching; Another kind method is silk-screened conductive silver slurry, is being formed the conducting wire being less than 50 microns of live widths by laser ablation.But these two kinds of equal complex process of method, the wasting of resources, cost are high.
Summary of the invention
The object of the embodiment of the present invention is the above-mentioned deficiency overcoming prior art, solve the method for making of lead of touch screen conducting wire and there is complex process and the high problem of cost, and provide a kind of can be meticulousr and prepare the method for lead of touch screen conducting wire simply.
In order to realize foregoing invention object, the technical scheme of the embodiment of the present invention is as follows:
A method for making for lead of touch screen conducting wire, is characterized in that, comprises the steps:
Preparation contains the electrically conductive ink of Nanometer Copper alloyed powder and nano-glass powder;
Described electrically conductive ink is applied on touch screen base plate and forms electrically conductive ink coating;
Described electrically conductive ink coating is carried out prebake conditions;
By needing the part forming lead-in wire conducting wire pattern in the described electrically conductive ink coating after baking, carry out sintering processes;
That removes described electrically conductive ink coating does not sinter part.
Adopt preparation method of the present invention, form lead of touch screen conducting wire by the mode of selective sintering electrically conductive ink, have very good adhesive effect with the ITO pattern on touch screen base plate, touch screen base plate; Overall preparation method's technique is simple, without the need to the equipment of complex and expensive, with low cost, and environmental protection, and product reliability improves.
The present invention proposes the lead of touch screen conducting wire prepared by said method further.
Lead of touch screen conducting wire of the present invention adopts said method of the present invention to prepare gained, form lead of touch screen conducting wire, more excellent with the adhesive effect of the ITO pattern on touch screen base plate, touch screen base plate, and compare the lead of touch screen conducting wire of conventional preparation, the quality of its lead-in wire conducting wire is meticulousr, greatly reduces the situation of short circuit; Product reliability improves.
The present invention also proposes a kind of touch-screen mobile phone product adopting above-mentioned lead of touch screen conducting wire further.
Touch-screen mobile phone product of the present invention, adopts above-mentioned lead of touch screen conducting wire to make, and the bonding force of the ITO pattern on lead of touch screen conducting wire and touch screen base plate, touch screen base plate is stronger, result of use and quality higher; The fine degree of circuit is higher, uses the problems such as the middle short circuit occurred greatly to reduce, improves the quality of product.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The embodiment of the present invention provides a kind of method for making of lead of touch screen conducting wire, comprises the steps:
S10, preparation contains the electrically conductive ink of Nanometer Copper alloyed powder and nano-glass powder;
S20, is applied to electrically conductive ink on touch screen base plate and forms electrically conductive ink coating;
S30, carries out prebake conditions to electrically conductive ink coating;
S40, sinters needing the position forming lead-in wire conducting wire pattern in electrically conductive ink coating;
S50, that removes electrically conductive ink coating does not sinter part.
Wherein integral vertical is intended to electrically conductive ink first on touch screen base plate, to be prepared into a coating morphology in the present invention, then according to the lead-in wire conducting wire pattern formed required on touch-screen, optionally sinter coating, the part of sintering finally solidify to form conducting wire; The lead-in wire conducting wire pattern at touch screen base plate can be obtained after the part of non-sintered being removed again.Integral production method technique is simple, can form the fine leads conducting wire that live width line-spacing is less than 50 microns, and lead-in wire conducting wire forms very good adhesive effect with the ITO pattern on touch screen base plate, touch screen base plate, product reliability raising.
Meanwhile, the present invention uses aldary to replace fine silver material, and starch the method for laser ablation relative to traditional silk-screen silver, material cost significantly reduces again, and can avoid silver-colored fine-line under hot and humid environment because of short circuit problem that silver ion migration causes; Compared with Vacuum Deposition molybdenum/aluminium/molybdenum again method for chemially etching, method of the present invention is without the need to the equipment of complex and expensive, also do not need a large amount of developer solution, etching solution and remover used in chemical etching process, chemical waste fluid is few, and thus equipment cost is low, technique simple, environmental protection.
Wherein in the present invention in order to enable the method for formation conductive ink coating realize and ensure the quality of products, above-mentionedly prepare in the step S10 of conductive ink of the present invention, wherein adopt molecular weight in 500 ~ 10000 scopes, have the dispersion effect of polymkeric substance as spreading agent improving material of polyether backbone skeleton and Amino End Group, it can adopt following structural formula to represent:
In formula, R 1represent hydrogen atom or methyl, R 2represent hydrogen atom or alkyl, R 3represent the one in alkyl, alkoxy, hydroxyl and aldehyde radical; X and y represents 0 or positive integer, and x+y>=2; N represents the positive integer being greater than 1, and m represents positive integer.
In the usual preparation process of existing conductive ink, by nano raw material solvent and dispersion aids dispersion mixing.Adopt in the present invention and compare the more outstanding polymkeric substance with polyether backbone skeleton and Amino End Group of effect in existing method as spreading agent.Reason is:
The Amino End Group of this polymkeric substance can form firmly anchorage effect with Nanometer Copper alloyed powder and nano-glass powder surface, improves the dispersion stabilization of leading them; Polyether backbone skeleton is made up of ethoxy (EO) and/or propoxyl group (PO) structural unit simultaneously, there is good pliability and be easy to swing, form good sterically hindered effect, be conducive to the reunion stoping Nanometer Copper alloyed powder and nano-glass powder, thus improve their dispersed stability.The improvement of electrically conductive ink dispersion stabilization, is conducive to reducing the defect produced in coating process, final quality and the yield improving product.And more importantly, meta-alkalescence in the group of this spreading agent adopted in the present invention and bulk property, can avoid high acid value spreading agent (being rich in the spreading agent of the acidic-groups such as carboxylic group, phosphate group, sulfonic acid group) equally to have an impact to the resistance of ITO pattern on touch screen base plate.
In reality is implemented, there is the polymeric dispersant that (A) structural formula represents, as the polyetheramine of HUNTSMAN company of the U.S. b-60, B-200, L-100, L-200, L-207, L-300 etc.There is the polymeric dispersant that (B) structural formula represents, as methoxy poly (ethylene glycol) amine, α-aldehyde radical-omega-amino-polyglycol, alpha-amido-ω-hydroxyl polyglycol etc., as:
(methoxy poly (ethylene glycol) amine);
(α-aldehyde radical-omega-amino-polyglycol);
(alpha-amido-ω-hydroxyl polyglycol) etc.
Above-mentioned powder is adopted to carry out the preparation process of electrically conductive ink in the present invention, Nanometer Copper alloyed powder, nano-glass powder, spreading agent and solvent can be mixed to form electrically conductive ink slurry, to be applied on touch-screen glass substrate by electrically conductive ink by coating method.Wherein, Nanometer Copper alloyed powder is the functional material of electrically conductive ink, and nano-glass powder is as the inorganic bond of electrically conductive ink, and spreading agent then forms uniform ink or slurry for Nanometer Copper alloyed powder and nano-glass powder being mixed in a solvent dispersion.Wherein,
Nanometer Copper alloyed powder is nanometer copper-silver alloyed powder, and particle diameter is within the scope of 1 ~ 100nm.Compare nanometer pure copper powder, nanometer copper-silver alloyed powder can realize sintering at a lower energy, is conducive to protecting the ITO pattern on touch-screen glass substrate and touch-screen glass substrate injury-free in sintering process, improving product quality and yield.Copper is effective scavenger of silver ion, and the introducing of silver can not cause silver ion migration problem.
Nano-glass powder, as the inorganic bond of electrically conductive ink, preferably adopts the lead-free glass powder of particle diameter within the scope of 1 ~ 100nm, and hundred scores represent and comprise following component by weight:
Wherein, SiO 2be the important component part forming glass, make glass have excellent physical strength, chemical stability and thermal stability etc.; B 2o 3also be the component forming glass, make glass dust have lower softening point, and repression of swelling coefficient too increase, also there is good fluxibility, improve glass mobility at high temperature; Bi 2o 3there is the effect reducing glass dust softening point, making glass dust have suitable mobility when melting, regulate glass to make it to have suitable thermal expansivity; ZnO can improve the decay resistance of glass; Al 2o 3the tendency towards devitrification of glass can be reduced, improve chemical stability and physical strength, improve thermal stability; X 2o (Li 2o+Na 2o+K 2o) be good cosolvent, promote the fusing of glass dust; YO (MgO+CaO+SrO+BaO) can reduce the high temperature viscosity of glass, promotes the fusing of glass dust.By the particle size of the ratio and nano-glass powder that regulate each component of described nano-glass powder, the expansion coefficient that nano-glass powder has lower fusing point and is applicable to can be made, the adhesion problem to glass substrate that solution electrically conductive ink exists in sintering process and crack problem.
As for the preparation method of nano-glass powder, nano-glass powder can be prepared by high-energy ball milling method, namely first weigh each oxide component, carry out batch mixing, high melt, quenching, high-energy ball milling refinement, drying and processing successively, final obtained nano-glass powder.Also nano-glass powder can be prepared by vaporize-condensation law, namely use plasma-arc the simple substance of the elements such as Si, B, Bi, Zn is heated to high temperature together and evaporates under vacuo, the mixed gas passed into containing inert gas and oxygen is condensed into nano-glass powder by evaporating the gas atom obtained.
The nano-glass powder that the present invention adopts, its advantage is that softening temperature is low, and in the process of sintering electrically conductive ink, nano-glass powder can together with nanometer copper-silver alloyed powder, melting occur and sinter.When touch screen base plate adopts glass substrate the most usually, glass dust and touch-screen glass substrate and ITO belong to similar substance, based on similar dissolve mutually theory, easily interpenetrate in interface, thus glass dust can improve the adhesive effect of Kufil to the ITO pattern on touch-screen glass substrate and touch-screen glass substrate, the reliability of improving product; The expansion coefficient of glass dust and the expansion coefficient similar of touch-screen glass substrate, can avoid interfacial stress that the change of dramatic temperature in sintering process and deformation cause too greatly, crack or breakage, affect product quality.
And the solvent in conductive ink preparation process, in the present invention based on the condition of coating and the technique of selective sintering, the alcohols solvent of boiling point within the scope of 100 ~ 250 DEG C or at least one in alcohol ether solvent under employing normal pressure.
Further, according to purposes needs, can suitably add a small amount of resinous principle, levelling agent, defoamer, reductive agent etc. in electrically conductive ink, only otherwise the quality of the dispersion stabilization of infringement electrically conductive ink and lead-in wire conducting wire.In preparation process, adopt solvent and spreading agent can, with the dispersed process of nanometer copper-silver alloyed powder, can also adopt by hyperacoustic means by nano-glass powder, promote the effect of dispersion.
Above-mentioned electrically conductive ink is adopted the mode of coating further in step S20, form electrically conductive ink coating, the method of coating can be rotary coating, slit coating, scraper for coating, the coating of line rod, spraying coating, print roll coating, silk-screen, gravure, offset printing etc., as long as can form the uniform electrically conductive ink coating of a layer thickness on described touch-screen glass substrate.
After electrically conductive ink coating in forming step S20, further step S30 carries out prebake conditions, to remove the solvent in described electrically conductive ink coating by the air atmosphere of electrically conductive ink coating within the scope of 80 ~ 150 DEG C.Prevent residual solvent from violent gasification occurring in follow-up sintering process and causes lead-in wire conducting wire to form pore or crackle, thus reduce the quality of circuit.
Further, step S40 will have the touch screen base plate of electrically conductive ink coating after presintering, and according to the lead-in wire conducting wire pattern formed required on touch-screen, optionally sinter coating, the part of sintering finally solidify to form conducting wire.The method of selective sintering can adopt selective laser sintering or selectivity UV light sintering.Wherein,
Selective laser sintering be laser beam under control of the computer, set predetermined mobile route by the circuit of conducting wire pattern, the electrically conductive ink coating on touch screen base plate scanned.There is melting in the nanometer copper-silver alloyed powder in electrically conductive ink coating and nano-glass powder, and sintering forms the circuit of continuous print conduction under laser irradiation.By regulating the size of laser facula, the lead-in wire conducting wire that live width and line-spacing are less than 50 microns can be obtained.
Alternatively property sintering method, selectivity UV light sintering be photomask is covered in touch-screen glass substrate electrically conductive ink coating on, then pulse UV light is used to carry out irradiation to electrically conductive ink coating, sintered by the Nanometer Copper alloyed powder of irradiation zone and the melting of nano-glass powder, form lead-in wire conducting wire.By portraying specific leads pattern on photomask board, the lead-in wire conducting wire that live width and line-spacing are less than 50 microns just can be sintered out on touch-screen glass substrate.By the fine-line that selective sintering acquisition live width line-spacing is less than 50 microns, relatively directly the method such as inkjet printing or intaglio printing makes the fine pattern that live width line-spacing is less than 50 microns, technically be easier to control, and the effect of conducting wire formed and quality higher.
The electrically conductive ink not sintering part is removed in final step S50, the mode that cleaning fluid can be adopted in enforcement to clean is carried out, because the electrically conductive ink coating not sintering region cannot be formed effectively bonding with touch-screen glass substrate, thus easily removed by cleaning, thus stay on touch-screen glass substrate and be sintered solidification and the strong lead-in wire conducting wire of touch screen base plate bonding force.The method of cleaning, can use the methods such as drip washing, flushing, Ultrasonic Cleaning, without particular/special requirement.Cleaning fluid selects organic solvent, and is preferably one or more the potpourri in alcohols, ketone, alcohol ethers, ether-ether class or amide solvent.When not damaging lead-in wire conducting wire, surfactant can also be contained in cleaning fluid, promoting cleaning performance.
What the present invention proposed prepared by said method further obtains lead of touch screen conducting wire.Lead of touch screen conducting wire of the present invention adopts said method of the present invention to prepare gained, form lead of touch screen conducting wire, there is very good adhesive effect more excellent with the ITO pattern on touch screen base plate, touch screen base plate, and compare the lead of touch screen conducting wire of conventional preparation, the quality of its silver-colored conducting wire is meticulousr, greatly reduces the situation of short circuit; Product reliability improves.
The present invention also protects a kind of touch-screen mobile phone product by adopting above-mentioned lead of touch screen conducting wire further.Touch-screen mobile phone product of the present invention, adopts above-mentioned lead of touch screen conducting wire to make, and the bonding force of the ITO pattern on lead of touch screen conducting wire and touch screen base plate, touch screen base plate is stronger, result of use and quality higher; The fine degree of circuit is higher, use the problems such as the middle short circuit occurred greatly to reduce, the entrant sound quality of product.
For making clearly complete, the enforcement reference that is easy to those skilled in the art of the implementation detail of said method process of the present invention, and make outstanding progressive effect of the present invention more remarkable, by the following examples concrete example explanation is carried out to the enforcement of said process.
Embodiment 1
The raw material adopted in the present embodiment 1: nanometer copper-silver alloyed powder (mean grain size is 45nm, and silver-colored mass percent is 10%), (mean grain size is 70nm to nano-glass powder, and each constituent mass number percent is SiO 25%, B 2o 312%, Bi 2o 380%, Na 2o 3%), polyetheramine dispersant l-207 (weight-average molecular weight is 2000, HUNTSMAN company of the U.S.), mixed solvent (weight ratio of being pressed 1:2 by 1,2-PD and propylene glycol monobutyl ether is prepared, and both boiling points are respectively 188 DEG C and 171 DEG C).
Prepare lead of touch screen conducting wire in accordance with the following steps:
S10, gets 19.4g nanometer copper-silver alloyed powder, 0.6g nano-glass powder, 1g polyetheramine dispersant l-207 and 79g mixed solvent, uses ultrasound wave to be uniformly dispersed their mechanical mixture, makes the electrically conductive ink that solid content is about 20%;
S20, adopts rotary coating mode to be applied to by electrically conductive ink on touch-screen glass substrate by electrically conductive ink;
S30, moves to the touch-screen glass substrate being coated with electrically conductive ink in baking box and at 100 DEG C, carries out prebake conditions 15 minutes, removing organic solvent;
S40, according to the pattern form of predetermined conducting wire, uses laser to carry out selective sintering process to the electrically conductive ink coating on substrate, forms the lead-in wire conducting wire that live width is 30 microns;
S50, moves to the touch-screen glass substrate forming lead-in wire conducting wire and fills in the container of methyl isobutyl ketone, carry out Ultrasonic Cleaning, and removing touch-screen glass substrate does not sinter the electrically conductive ink coating in region, technical ability prepares lead of touch screen conducting wire.
Embodiment 2
The raw material adopted in the present embodiment 2: nanometer copper-silver alloyed powder (mean grain size is 80nm, and silver-colored mass percent is 20%), (mean grain size is 70nm to nano-glass powder, and each constituent mass number percent is SiO 25%, B 2o 312%, Bi 2o 380%, Na 2o 3%), polyetheramine dispersant l-207 (weight-average molecular weight is 2000, HUNTSMAN company of the U.S.), mixed solvent (weight ratio of being pressed 1:2 by 1,2-PD and propylene glycol monobutyl ether is prepared, and both boiling points are respectively 188 DEG C and 171 DEG C).
Prepare lead of touch screen conducting wire in accordance with the following steps:
S10, gets 19.4g nanometer copper-silver alloyed powder, 0.6g nano-glass powder, 0.8g polyetheramine dispersant l-207 and 79.2g mixed solvent, uses ultrasound wave to be uniformly dispersed their mechanical mixture, makes the electrically conductive ink that solid content is about 20%;
S20, adopts rotary coating mode to be applied to by electrically conductive ink on touch-screen glass substrate;
S30, moves to the touch-screen glass substrate being coated with electrically conductive ink in baking box and at 100 DEG C, carries out prebake conditions 15 minutes, removing organic solvent;
S40, according to the pattern form of predetermined conducting wire, uses laser to carry out selective sintering process to the electrically conductive ink coating on substrate, forms the lead-in wire conducting wire that live width is 30 microns;
S50, moves to the touch-screen glass substrate forming lead-in wire conducting wire and fills in the container of methyl isobutyl ketone, carry out Ultrasonic Cleaning, removing touch-screen glass substrate does not sinter the electrically conductive ink coating in region.
Embodiment 3
The raw material adopted in the present embodiment 3: nanometer copper-silver alloyed powder (mean grain size is 80nm, and silver-colored mass percent is 20%), (mean grain size is 50nm to nano-glass powder, and each constituent mass number percent is SiO 26%, B 2o 37%, ZnO 6%, Bi 2o 380%, BaO 1%), (molecular weight is 2000 to methoxy poly (ethylene glycol) amine, Jiaxing Bo Mei Bioisystech Co., Ltd) and mixed solvent (weight ratio of being pressed 1:2 by 1,2-PD and propylene glycol monobutyl ether is prepared, and both boiling points are respectively 188 DEG C and 171 DEG C).
Prepare lead of touch screen conducting wire in accordance with the following steps:
S10, get 19.4g nanometer copper-silver alloyed powder, 0.6g nano-glass powder, 0.8g methoxy poly (ethylene glycol) amine and 79.2g mixed solvent, uses ultrasound wave to be uniformly dispersed their mechanical mixture, make the electrically conductive ink that solid content is about 20%;
S20, adopts rotary coating mode to be applied to by electrically conductive ink on touch-screen glass substrate;
S30, moves to the touch-screen glass substrate being coated with electrically conductive ink in baking box and at 100 DEG C, carries out prebake conditions 15 minutes, removing organic solvent;
S40, uses laser to carry out selective sintering process to the electrically conductive ink coating on substrate, forms the lead-in wire conducting wire that live width is 30 microns;
S50, moves to the touch-screen glass substrate forming lead-in wire conducting wire and fills in the container of methyl isobutyl ketone, carry out Ultrasonic Cleaning, removing touch-screen glass substrate does not sinter the electrically conductive ink coating in region.
Embodiment 4
The raw material adopted in the present embodiment 4: nanometer copper-silver alloyed powder (mean grain size is 80nm, and silver-colored mass percent is 20%), (mean grain size is 70nm to nano-glass powder, and each constituent mass number percent is SiO 25%, B 2o 312%, Bi 2o 380%, Na 2o 3%), polyetheramine dispersant l-207 (weight-average molecular weight is 2000, HUNTSMAN company of the U.S.) and mixed solvent (weight ratio of being pressed 1:2 by 1,2-PD and propylene glycol monobutyl ether is prepared, and both boiling points are respectively 188 DEG C and 171 DEG C).
Prepare lead of touch screen conducting wire in accordance with the following steps:
S10, gets 19.4g nanometer copper-silver alloyed powder, 0.6g nano-glass powder, 0.8g polyetheramine dispersant l-207 and 79.2g mixed solvent, uses ultrasound wave to be uniformly dispersed their mechanical mixture, makes the electrically conductive ink that solid content is about 20%;
S20, adopts rotary coating mode to be applied to by electrically conductive ink on touch-screen glass substrate;
S30, moves to the touch-screen glass substrate being coated with electrically conductive ink in baking box and at 100 DEG C, carries out prebake conditions 15 minutes, removing organic solvent
S40, then on the electrically conductive ink coating photomask portraying leaded conducting wire pattern being covered in touch-screen glass substrate, use pulse UV light irradiation electrically conductive ink coating, sintered by the nanometer copper-silver alloyed powder of irradiation zone and the melting of nano-glass powder, form the lead-in wire conducting wire that live width is 30 microns;
S50, moves to the touch-screen glass substrate forming lead-in wire conducting wire and fills in the container of methyl isobutyl ketone, carry out Ultrasonic Cleaning, removing touch-screen glass substrate does not sinter the electrically conductive ink coating in region.
Comparative example 1
In this comparative example, the functional component of the synergy of nano-glass powder is deleted, adopt following raw material: nanometer copper-silver alloyed powder (mean grain size is 80nm, and silver-colored mass percent is 20%), polyetheramine dispersant l-207 (weight-average molecular weight is 2000, HUNTSMAN company of the U.S.), mixed solvent (weight ratio of being pressed 1:2 by 1,2-PD and propylene glycol monobutyl ether is prepared, and both boiling points are respectively 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is made by following step:
S10, gets 20g nanometer copper-silver alloyed powder, 0.8g polyetheramine dispersant l-207 and 79.2g mixed solvent, uses ultrasound wave to be uniformly dispersed their mechanical mixture, makes the electrically conductive ink that solid content is about 20%;
S20, adopts rotary coating mode to be applied to by electrically conductive ink on touch-screen glass substrate;
S30, moves to the touch-screen glass substrate being coated with electrically conductive ink in baking box and at 100 DEG C, carries out prebake conditions 15 minutes, removing organic solvent;
S40, then on the electrically conductive ink coating photomask portraying leaded conducting wire pattern being covered in touch-screen glass substrate, use pulse UV light irradiation electrically conductive ink coating, sintered by the nanometer copper-silver alloyed powder of irradiation zone and the melting of nano-glass powder, form the lead-in wire conducting wire that live width is 30 microns;
S50, moves to the touch-screen glass substrate forming lead-in wire conducting wire and fills in the container of methyl isobutyl ketone, carry out Ultrasonic Cleaning, removing touch-screen glass substrate does not sinter the electrically conductive ink coating in region.
The lead of touch screen conducting wire made is low to glass substrate adhesion, easily comes off.Improve the energy of pulse UV light, can promote Kufil and the fusion of glass substrate in interface, promote adhesion, but damage appears in glass substrate, lead-in wire conducting wire cracks, and reduces product quality.
Comparative example 2
Following raw material is adopted: nanometer copper-silver alloyed powder (mean grain size is 80nm, and silver-colored mass percent is 20%), vibrin, polyetheramine dispersant in this comparative example 2 l-207 (weight-average molecular weight is 2000, and HUNTSMAN company of the U.S. manufactures) and mixed solvent (weight ratio of being pressed 1:2 by 1,2-PD and propylene glycol monobutyl ether is prepared, and both boiling points are respectively 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is made by following step:
S10, gets 20g nanometer copper-silver alloyed powder, the vibrin of 1.5g, 0.8g polyetheramine dispersant l-207 and 79.2g mixed solvent, uses ultrasound wave to be uniformly dispersed their mechanical mixture, makes the electrically conductive ink that solid content is about 20%;
S20, adopts rotary coating mode to be applied to by electrically conductive ink on touch-screen glass substrate;
S30, moves to the touch-screen glass substrate being coated with electrically conductive ink in baking box and at 100 DEG C, carries out prebake conditions 15 minutes, removing organic solvent;
S40, then on the electrically conductive ink coating photomask portraying leaded conducting wire pattern being covered in touch-screen glass substrate, use pulse UV light irradiation electrically conductive ink coating, sintered by the nanometer copper-silver alloyed powder of irradiation zone and the melting of nano-glass powder, form the lead-in wire conducting wire that live width is 30 microns;
S50, moves to the touch-screen glass substrate forming lead-in wire conducting wire and fills in the container of methyl isobutyl ketone, carry out Ultrasonic Cleaning, removing touch-screen glass substrate does not sinter the electrically conductive ink coating in region.
Because vibrin just solidifies in pre-bake step, and good adhesive effect is produced to touch-screen glass substrate, make the electrically conductive ink coating not sintering region be difficult to be cleaned up.Simultaneously due to the existence of vibrin, affect the sintering of nanometer copper-silver alloyed powder, the resistivity of lead-in wire conducting wire is higher, reaches 10 -2~ 10 -3the Ω cm order of magnitude.
From the various embodiments described above and the final preparation-obtained product of comparative example, can find out in the present invention by the improvement to electrically conductive ink composition, make the sintering processing with the electrically conductive ink of routine in the quality of the product of selective sintering generation, be significantly improved in final adhesive property, line pattern quality etc.Meanwhile, the recovery conductive oil ink by obtaining after cleaning in the present invention can be carried out process Posterior circle further and be used.And adopt selective laser sintering or selectivity UV light sintering in integrated artistic, simple process is without the need to the equipment of complex and expensive; Adopt Kufil to replace fine silver simultaneously, avoid the defect that fine silver moves and cost is high; Compare the way of existing " printing process forms the circuit under 50 microns ", the inventive method has more significant production effect.
Meanwhile, there is no developer solution, etchant, remover, clean-out system etc. in whole technique yet, compare the preparation method that another Vacuum Deposition molybdenum/aluminium/molybdenum etches again, do not have a large amount of chemical waste fluids to produce, compare environmental protection more; Equipment cost is cheaper.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. a method for making for lead of touch screen conducting wire, is characterized in that, comprises the steps:
Preparation contains the electrically conductive ink of Nanometer Copper alloyed powder and nano-glass powder;
Described electrically conductive ink is applied on touch screen base plate and forms electrically conductive ink coating;
Described electrically conductive ink coating is carried out prebake conditions;
By needing the part forming lead-in wire conducting wire pattern in the described electrically conductive ink coating after baking, carry out sintering processes;
That removes described electrically conductive ink coating does not sinter part.
2. the method for making of lead of touch screen conducting wire as claimed in claim 1, it is characterized in that, preparation is described to be contained in the electrically conductive ink step of Nanometer Copper alloyed powder and nano-glass powder, and described Nanometer Copper alloyed powder, nano-glass powder, spreading agent and solvent are mixed to form described electrically conductive ink; Wherein,
Described spreading agent is the polymkeric substance with polyether backbone skeleton and Amino End Group.
3. the method for making of lead of touch screen conducting wire as claimed in claim 2, is characterized in that, described in there is polyether backbone skeleton and Amino End Group polymkeric substance be
in formula, R 1represent hydrogen atom or methyl, R 2represent hydrogen atom or alkyl, R 3represent the one in alkyl, alkoxy, hydroxyl and aldehyde radical; X and y represents 0 or positive integer, and x+y>=2; N represents the positive integer being greater than 1, and m represents positive integer;
And, described in there is polyether backbone skeleton and Amino End Group polymer molecular weight be 500 ~ 10000.
4. the method for making of the lead of touch screen conducting wire as described in any one of claims 1 to 3, is characterized in that, described nano-glass powder comprises:
Wherein, X is at least one in Li, Na, K, and Y is at least one in Mg, Ca, Sr, Ba.
5. the method for making of the lead of touch screen conducting wire as described in any one of claims 1 to 3, is characterized in that, described nano-glass powder footpath is 1 ~ 100nm.
6. the method for making of the lead of touch screen conducting wire as described in any one of claims 1 to 3, is characterized in that, in described prebake conditions, control temperature condition is 80 ~ 150 DEG C;
And/or described sintering process adopts selective laser sintering or selectivity UV light sintering.
7. the method for making of lead of touch screen conducting wire as claimed in claim 2 or claim 3, it is characterized in that, described solvent is the alcohols solvent of atmospheric boiling point within the scope of 100 ~ 250 DEG C or at least one in alcohol ether solvent.
8. the method for making of the lead of touch screen conducting wire as described in any one of claims 1 to 3, it is characterized in that, that removes described electrically conductive ink coating does not sinter in part steps, and what adopt the mode of cleaning fluid cleaning to remove described electrically conductive ink coating does not sinter part; Wherein,
Described cleaning fluid is one or more the potpourri in alcohols, ketone, alcohol ethers, ether-ether class or amide solvent.
9. a lead of touch screen conducting wire, is characterized in that, the method for making of the lead of touch screen conducting wire according to any one of claim 1 to 8 prepares.
10. one kind comprises the touch-screen mobile phone of lead of touch screen conducting wire according to claim 9.
CN201410630763.4A 2014-11-11 2014-11-11 Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone Active CN104407735B (en)

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CN111142702A (en) * 2019-11-28 2020-05-12 东莞市越丰光电有限公司 Conductive circuit preparation method for touch screen

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