CN103996432B - A kind of easily printed circuit board (PCB) silver slurry and preparation method thereof - Google Patents
A kind of easily printed circuit board (PCB) silver slurry and preparation method thereof Download PDFInfo
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- CN103996432B CN103996432B CN201410167208.2A CN201410167208A CN103996432B CN 103996432 B CN103996432 B CN 103996432B CN 201410167208 A CN201410167208 A CN 201410167208A CN 103996432 B CN103996432 B CN 103996432B
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Abstract
A kind of easily printed circuit board (PCB) silver slurry, is prepared by the raw materials in: saturated polyester resin 68, polyurethane resin 35, polytetrafluoroethylwax wax 0.1 0.2, amyl acetate 35, silver bag glass dust 8 12, super fine silver powder 65 70, glass dust 35, Graphene 46, dimethylbenzene 7 10, rosin acid aluminium soap 0.2 0.4, propylene glycol 58, polyisobutylene 12, aminopropyl triethoxysilane 12, dipropylene glycol n-butyl ether 23, capric acid 23, fluorine-containing surfactant 0.2 0.4；The silver slurry of the present invention with the addition of Graphene, adds electric conductivity, and dispersibility, lubricity are good, and printing performance is good, and by adding silver bag glass dust, wettability and the excellent bonding performance of circuit board, circuit board is solid firm；The organic carrier of the present invention is more high temperature resistant, it is possible to before glass powder, holding circuit is intact, and circuit board printing yield rate is high.
Description
Technical field
The invention belongs to electric slurry technical field, particularly relate to a kind of easily printed circuit board (PCB) silver slurry and preparation method thereof.
Background technology
In modern microelectronic industry, electronic devices and components are required more and more higher by people, produce uses procedure, standardization to carry out reducing cost more, printed circuit board (PCB) (PCB) is exactly to be suitable for this demand of microelectronics industry and be born, matching with printed circuit board (PCB) (PCB) with regard to the electric slurry such as the new conductor paste of requirement of demand, electrode slurry, dielectric paste and resistance slurry, grout slurry accordingly, the research carrying out new conductor paste is also the most imperative.
In general, the main component of electric slurry includes function mutually such as metal, noble metal powder etc., inorganic binder such as glass powder, oxide powder etc., organic binder bond, other solvent and additive.Generally, function in electric slurry plays electric action mutually, will have good electric conductivity, typically be served as by metal dust or noble metal powder, conventional metal dust has copper powder, aluminium powder, zinc powder, nikel powder etc., and conventional precious metal powder has bronze, argentum powder, platinum powder, palladium powder etc..Inorganic binder plays the effect to base material of the fixing electric slurry, is typically served as by oxide powder and glass powder, but this composition is relatively low at the proportion ratio of electric slurry, have even without；Organic binder bond acts primarily as and makes slurry have certain shape, be prone to printing or the effect of coating, macromolecule resin, little molecule resin etc. is mainly had to serve as, along with the effect in electric slurry of this part of progress of chemical industry technology is more and more prominent, especially when being applied to silk screen printing, the composition changing organic binder bond just can change the printing of electric slurry, dry, sintering character.
In existing electric slurry field, the features such as it is high that silver system slurry has conductivity, stable performance, big with substrate bond strength, it is widely used in the production of the electronic devices and components such as integrated circuit, multi-chip module, thin film switch.But, silver is precious metal, relatively costly, and the silver powder major part in existing silver paste is micron-sized powder, and the thicknesses of layers of its slurry made, printing performance etc. have significant limitation for present high-end precision instrument；On the other hand, conventional printed circuit board (PCB) uses printing conductive copper paste to make conducting wire, but it is the most oxidized to there is conductive copper paste, reduces the service life of printed circuit board (PCB), and conductive copper paste can not be printed as the circuit that comparison is fine.It is thus desirable to the size of metal dust, shape, kind are to realize reducing cost, improving conductivity, the purpose of raising printing elaboration in research electrocondution slurry.
Binding agent in conductive silver paste has a significant impact for the yield rate of circuit printing, the printing performance of circuit all can be impacted by such as viscosity, caking property, adhesive force, levelability, film property, the volatility etc. of solvent, pore occurs, the phenomenons such as open circuit, there will be glass after Organic substance has volatilized the most sometimes the most not yet to start to melt, causing the phenomenon that conducting wire comes off from stock, make conducting wire scrap, therefore the performance need of organic binder bond improves.
The most a lot of inorganic binders use glass dust, glass dust is made up of the material such as metal-oxide, silicon oxide, if fusing point is too high, also occur Organic substance volatilized after glass the most not yet start mutually to melt, the phenomenon causing the conducting wire obtained by conductive silver paste to come off from stock, makes conducting wire scrap；And a lot of containing harmful substances such as lead, to environmentally undesirable in current glass dust, it is therefore desirable to develop the glass dust that performance is more excellent.
Summary of the invention
It is an object of the invention to provide a kind of easily printed circuit board (PCB) silver slurry and preparation method thereof, this silver slurry dispersibility, lubricity are good, good conductivity, and printing performance is good, and circuit board printing yield rate is high.
Technical scheme is as follows:
A kind of easily printed circuit board (PCB) silver slurry, it is characterised in that be prepared by the raw materials in: saturated polyester resin 6-8, polyurethane resin 3-5, polytetrafluoroethylwax wax 0.1-0.2, amyl acetate 3-5, silver bag glass dust 8-12, super fine silver powder 65-70, glass dust 3-5, Graphene 4-6, dimethylbenzene 7-10, rosin acid aluminium soap 0.2-0.4, propylene glycol 5-8, polyisobutylene 1-2, aminopropyl triethoxysilane 1-2, dipropylene glycol n-butyl ether 2-3, capric acid 2-3, fluorine-containing surfactant 0.2-0.4；
Described glass dust is prepared by the raw materials in: Tellurobismuthite. 15-17, Si02 16-19、Bi203 7-9、BaO5-8、Al203 3-5、B2O3
17-23、V2O54-7、Na2O1-2, nano aluminum nitride powder 1-2；Preparation method is: by Tellurobismuthite., Si02、Bi203、BaO、Al203、B2O3、V2O5、Na2O mixes, put into crucible and be fused into liquid 1100-1400 DEG C of heating, add nano aluminum nitride powder, carrying out vacuum defoamation after stirring, vacuum is 0.10-0.14MPa, and inclined heated plate is 6-9 minute, pour into again in mould and shape, carry out again shrend, feeding ball mill being pulverized, sieving, obtain 9-13 μm powder, to obtain final product.
The preparation method of described easy printed circuit board (PCB) silver slurry, it is characterised in that comprise the following steps:
(1) by amyl acetate, dimethylbenzene, propylene glycol, polyisobutylene, aminopropyl triethoxysilane, dipropylene glycol n-butyl ether, capric acid mixing, add saturated polyester resin, polyurethane resin, it is heated to 78-82 DEG C, stirring to resin all dissolves, add polytetrafluoroethylwax wax to stir, filter with the gauze of 500 mesh, remove impurity and obtain organic carrier；
(2) by silver bag glass dust, glass dust, fluorine-containing surfactant mixing, Graphene is added under 5000-7000 rev/min of stirring, stir 10-20 minute, add super fine silver powder, stir 10-20 minute, then add together with other residual componentss in organic carrier, mixing dispersion 30-40 minute in ball mill, ultrasonic disperse 6-8 minute again, obtains uniform slurry；
(3) slurry that step (2) obtains being carried out vacuum defoamation, vacuum is 0.06-0.09MPa, and inclined heated plate is 6-9 minute, is then ground in three-high mill, rolls, and is 10000-20000 centipoise to silver slurry viscosity, to obtain final product.
Beneficial effects of the present invention
The silver slurry of the present invention with the addition of Graphene, add electric conductivity, and dispersibility, lubricity are good, printing performance is good, by adding silver bag glass dust, wettability and the excellent bonding performance of circuit board, circuit board is solid firm, and this glass dust contains nano aluminum nitride powder, and heat conduction is fast, fusing is fast, it is easy to circuit curing molding；The organic carrier of the present invention is more high temperature resistant, it is possible to before glass powder, holding circuit is intact, and circuit board printing yield rate is high.
Detailed description of the invention
A kind of easily printed circuit board (PCB) silver slurry, is made up of the raw material of following weight portion (kilogram): saturated polyester resin 7, polyurethane resin 4, polytetrafluoroethylwax wax 0.1, amyl acetate 4, silver bag glass dust 10, super fine silver powder 67, glass dust 4, Graphene 5, dimethylbenzene 8, rosin acid aluminium soap 0.3, propylene glycol 7, polyisobutylene 1.5, aminopropyl triethoxysilane 1.5, dipropylene glycol n-butyl ether 2.5, capric acid 2.5, fluorine-containing surfactant 0.3；
Described glass dust is made up of the raw material of following weight portion (kilogram): Tellurobismuthite. 16, Si02 17、Bi2038、BaO7、Al203 4、B2O3
20、V2O56、Na2O1.5, nano aluminum nitride powder 1.5；Preparation method is: by Tellurobismuthite., Si02、Bi203、BaO、Al203、B2O3、V2O5、Na2O mixes, put into crucible and be fused into liquid 1300 DEG C of heating, add nano aluminum nitride powder, carrying out vacuum defoamation after stirring, vacuum is 0.13MPa, and inclined heated plate is 7 minutes, pour into again in mould and shape, carry out again shrend, feeding ball mill being pulverized, sieving, obtain 11 μm powder, to obtain final product.
The preparation method of described easy printed circuit board (PCB) silver slurry, comprises the following steps:
(1) by amyl acetate, dimethylbenzene, propylene glycol, polyisobutylene, aminopropyl triethoxysilane, dipropylene glycol n-butyl ether, capric acid mixing, add saturated polyester resin, polyurethane resin, it is heated to 80 DEG C, stirring to resin all dissolves, add polytetrafluoroethylwax wax to stir, filter with the gauze of 500 mesh, remove impurity and obtain organic carrier；
(2) by silver bag glass dust, glass dust, fluorine-containing surfactant mixing, Graphene is added under 6000 revs/min of stirrings, stir 15 minutes, add super fine silver powder, stir 15 minutes, then add together with other residual componentss in organic carrier, mixing dispersion 35 minutes in ball mill, ultrasonic disperse 7 minutes again, obtain uniform slurry；
(3) slurry that step (2) obtains being carried out vacuum defoamation, vacuum is 0.07MPa, and inclined heated plate is 8 minutes, is then ground in three-high mill, rolls, and is 15000 centipoises to silver slurry viscosity, to obtain final product.
Test data:
The mode of the silver-colored slurry silk screen printing obtained by the present embodiment is printed onto in PCB, then heats to solidify 6 minutes formation conducting wires at 630 DEG C, thus obtains conducting wire plate.The wiring width recording conducting wire is 0.6mm, average film thickness 5 μm, and wire distribution distance is 0.9mm, and resistivity is 4.4 × 10-5Ω·m。
Batch production conducting wire plate in the manner described above
1000 pieces, conducting wire is well combined with PCB, svelteness, continuously, does not has the conducting wire of circuit board to come off from stock, yield rate 100%.
Claims (2)
1. an easy printed circuit board (PCB) silver slurry, it is characterised in that be prepared by the raw materials in: saturated polyester resin 6-8, polyurethane resin 3-5, polytetrafluoroethylwax wax 0.1-0.2, amyl acetate 3-5, silver bag glass dust 8-12, super fine silver powder 65-70, glass dust 3-5, Graphene 4-6, dimethylbenzene 7-10, rosin acid aluminium soap 0.2-0.4, propylene glycol 5-8, polyisobutylene 1-2, aminopropyl triethoxysilane 1-2, dipropylene glycol n-butyl ether 2-3, capric acid 2-3, fluorine-containing surfactant 0.2-0.4；Described glass dust is prepared by the raw materials in: Tellurobismuthite. 15-17, SiO2 16-19、Bi2O3 7-9、BaO 5-8、Al2O3 3-5、B2O3 17-23、V2O5 4-7、Na2O 1-2, nano aluminum nitride powder 1-2；Preparation method is: by Tellurobismuthite., SiO2、Bi2O3、BaO、Al2O3、B2O3、V2O5、Na2O mixes, put into crucible and be fused into liquid 1100-1400 DEG C of heating, add nano aluminum nitride powder, carrying out vacuum defoamation after stirring, vacuum is 0.10-0.14MPa, and inclined heated plate is 6-9 minute, pour into again in mould and shape, carry out again shrend, feeding ball mill being pulverized, sieving, obtain 9-13 μm powder, to obtain final product.
The preparation method of easy printed circuit board (PCB) silver the most according to claim 1 slurry, it is characterised in that comprise the following steps:
(1) by amyl acetate, dimethylbenzene, propylene glycol, polyisobutylene, aminopropyl triethoxysilane, dipropylene glycol n-butyl ether, capric acid mixing, add saturated polyester resin, polyurethane resin, it is heated to 78-82 DEG C, stirring to resin all dissolves, add polytetrafluoroethylwax wax to stir, filter with the gauze of 500 mesh, remove impurity and obtain organic carrier；
(2) by silver bag glass dust, glass dust, fluorine-containing surfactant mixing, Graphene is added under 5000-7000 rev/min of stirring, stir 10-20 minute, add super fine silver powder, stir 10-20 minute, then add together with other residual componentss in organic carrier, mixing dispersion 30-40 minute in ball mill, ultrasonic disperse 6-8 minute again, obtains uniform slurry；
(3) slurry that step (2) obtains being carried out vacuum defoamation, vacuum is 0.06-0.09MPa, and inclined heated plate is 6-9 minute, is then ground in three-high mill, rolls, and is 10000-20000 centipoise to silver slurry viscosity, to obtain final product.
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| CN201410167208.2A CN103996432B (en) | 2014-04-24 | 2014-04-24 | A kind of easily printed circuit board (PCB) silver slurry and preparation method thereof |
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| CN103996432B true CN103996432B (en) | 2016-11-16 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104200875A (en) * | 2014-09-11 | 2014-12-10 | 宁波市加一新材料有限公司 | Low-silver-content graphene composite conductive silver paste and preparation method thereof |
| CN104538085A (en) * | 2015-01-08 | 2015-04-22 | 安徽凤阳德诚科技有限公司 | Environment-friendly conductive silver paste |
| CN104934099A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Printed circuit board silver paste with low silver content and preparation method thereof |
| CN104934093A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Nano silver powder PCB conductive silver paste and preparation method thereof |
| CN105976893A (en) * | 2016-06-22 | 2016-09-28 | 中国科学院宁波材料技术与工程研究所 | Lead-free graphene/nano-silver composite electronic silver paste and preparation method thereof |
| CN106486210A (en) * | 2016-10-17 | 2017-03-08 | 浙江凯盈新材料有限公司 | A kind of method improving the linear depth-width ratio of electrocondution slurry silk screen printing |
| CN107740145B (en) * | 2017-10-16 | 2019-09-24 | 广东天承科技有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN113636869B (en) * | 2021-09-08 | 2022-11-29 | 合肥邦诺科技有限公司 | Screen printing slurry of aluminum nitride ceramic substrate and metallization method |
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| CN101937737B (en) * | 2010-09-27 | 2012-01-04 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN102262918B (en) * | 2011-07-19 | 2013-03-13 | 彩虹集团公司 | Grout silver paste used in PCB and preparation method thereof |
| KR101525652B1 (en) * | 2012-05-04 | 2015-06-03 | 삼성전기주식회사 | Conductive resin composition, multi layer ceramic capacitor having the same and manufacturing method thereof |
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Effective date of registration: 20210525 Address after: No.18-91, Gongye Road, South Taihu high tech Industrial Park, Wuxing District, Huzhou City, Zhejiang Province Patentee after: Zhejiang julibao Textile Technology Co., Ltd Address before: 242800 Matang Industrial Park, Dingqiao Town, Qingyang County, Chizhou City, Anhui Province Patentee before: ANHUI WEIMIN MAGNETIC TECHNOLOGY Co.,Ltd. |
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