CN102262918B - Grout silver paste used in PCB and preparation method thereof - Google Patents
Grout silver paste used in PCB and preparation method thereof Download PDFInfo
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- CN102262918B CN102262918B CN 201110201760 CN201110201760A CN102262918B CN 102262918 B CN102262918 B CN 102262918B CN 201110201760 CN201110201760 CN 201110201760 CN 201110201760 A CN201110201760 A CN 201110201760A CN 102262918 B CN102262918 B CN 102262918B
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Abstract
The invention discloses a grout silver paste used in PCB and a preparation method thereof. The grout silver paste comprises, by weight, 5-30% of a silver powder, 30-50% of a silver-coated glass powder, 15-30% of an organic binder, 2-10% of a lead-free glass powder and 6-11% of an additive. In the grout silver paste used in PCB, the silver powder and the silver-coated glass powder are taken as a functional phase; after the lead-free glass powder is added, wettability, surface smoothness and intermiscibility of the paste and bonding strength of the paste with the PCB can be greatly improved. Solvents with different boiling points and different volatilizing speeds are mixed to prepare the organic binder so that the grout silver paste can be successively volatilized during processes of printing, smoothing, drying and the like. Defects, such as a pore, a crack and the like, are not easy to be formed. Therefore, the grout silver paste can be firmly connected with the PCB and joint strength can be raised.
Description
Technical field
The invention belongs to the electric slurry technical field, relate to a kind of grout silver paste used in PCB and preparation method thereof.
Background technology
In modern microelectronics industry, people require more and more higher to electronic devices and components, produce and adopt procedures, standardization to carry out reducing cost more, printed circuit board (PCB) (PCB) is exactly that this demand that is fit to microelectronics industry is born, be complementary with regard to the electric slurry such as conductor paste, electrode slurry, dielectric paste and the resistance slurry of demand Secretary, grout slurry and printed circuit board (PCB) (PCB) accordingly, the research of carrying out new conductor paste is also just imperative.
In general, the main component of electric slurry includes function mutually such as metal, noble metal powder etc., inorganic binder such as glass powder, oxide powder etc., organic binder bond, other solvent and additive.Usually, function in the electric slurry plays electric action mutually, have good electric conductivity, is generally served as by metal dust or noble metal powder, metal dust commonly used has copper powder, aluminium powder, zinc powder, nickel powder etc., and precious metal powder commonly used has bronze, silver powder, platinum powder, palladium powder etc.Inorganic binder plays fixedly that electric slurry is generally served as by oxide powder and glass powder to base material, but this composition is lower at the proportion of electric slurry, have in addition do not have; Organic binder bond mainly plays a part to make slurry to have certain shape, be easy to print or apply, mainly containing macromolecule resin, little molecule resin etc. serves as, along with this part effect in electric slurry of progress of chemical industry technology is more and more outstanding, especially when being applied to silk screen printing, the composition that changes organic binder bond just can change printing, drying, the sintering character of electric slurry.
In existing electric slurry field, silver is that slurry has the conductance height, and stable performance with characteristics such as the substrate bond strength are large, is widely used in the production of the electronic devices and components such as integrated circuit, multi-chip module, thin film switch.But the silver powder major part in the existing silver paste is micron-sized powder, and the thicknesses of layers of the slurry that it is made, printing performance etc. have significant limitation for present high-end precision instrument, and this has just limited the range of application of silver conductive paste; On the other hand, printed circuit board (PCB) adopted printing conductive copper slurry to make the conducting wire more in the past, but it is easily oxidized to exist conductive copper paste, and in the useful life of having reduced printed circuit board (PCB), conductive copper paste can not be printed as meticulousr circuit.
Summary of the invention
The problem that the present invention solves is to provide a kind of grout silver paste used in PCB and preparation method thereof, and this slurry conducts electricity very well, strong adhesion, be difficult for oxidation, with printed circuit board (PCB) good wetability and compatibility is arranged.
The present invention is achieved through the following technical solutions:
A kind of grout silver paste used in PCB in mass fraction, comprises 5～30 parts silver powder, 30～50 parts silver bag glass dust, 15～30 parts organic binder bond, 2～10 parts leadless glass powder and 6～11 parts additive.
Described silver powder is that particle diameter is 0.5～5 μ m, and the particle diameter of silver bag glass dust is 0.1～8 μ m; The quality percentage composition of silver is 50～60% in the middle of the silver bag glass dust.
Described organic binder bond is ethyl cellulose terpinol binding agent, wherein ethyl cellulose: the mass ratio of terpinol is 1: 4～19;
Described leadless glass powder is boron manosil AS zinc powder, wherein boron: aluminium: silicon: the element mass ratio of zinc is (5～6): (2～4): (7～9): (3～5).
Described additive is 1.5～4 parts dispersant, 2～3 parts defoamer and 2.5～5 parts surfactant;
Described dispersant is one or more in tributyl phosphate, benzene sulfonic acid three phosphides, lactic acid three phosphatide; Defoamer is one or more in organic siliconresin, carbonic acid glyceryl ester, the paraffin oil; Surfactant is one or more among dodecyl sodium sulfate, methyl silicon hydrogen oil, the Span-80.
A kind of preparation method of grout silver paste used in PCB may further comprise the steps:
1) in mass fraction, 5～30 parts silver powder, 30～50 parts silver bag glass dust mix with 2～10 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
2) organic binder bond of the mixture of dried silver powder, silver bag glass dust and leadless glass powder and 15～30 parts, 1～4 part dispersant, 2～6 parts defoamer, 1～5 part surfactant are fully mixed after, obtain preliminary slurry;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 200～400 eye mesh screens obtain grout silver paste used in PCB after filtering.
The preparation method of described grout silver paste used in PCB may further comprise the steps:
1) in mass fraction, being 50% silver bag glass dust with 25 parts silver powder, 50 parts silver content mixes with 2 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 15 parts, 2.5 parts dispersant, 2.5 parts defoamer, 3 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is benzene sulfonic acid three phosphides; Defoamer is organic siliconresin; Surfactant is Span-80;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 400 eye mesh screens obtain grout silver paste used in PCB after filtering.
The preparation method of described grout silver paste used in PCB may further comprise the steps:
1) in mass fraction, being 55% silver bag glass dust with 5 parts silver powder, 45.5 parts silver content mixes with 10 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 30 parts, 2.5 parts dispersant, 5.5 parts defoamer, 2.5 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is tributyl phosphate; Defoamer is the carbonic acid glyceryl ester; Surfactant is methyl silicon hydrogen oil;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 300 eye mesh screens obtain grout silver paste used in PCB after filtering.
The preparation method of described grout silver paste used in PCB may further comprise the steps:
1) in mass fraction, being 60% silver bag glass dust with 15 parts silver powder, 42 parts silver content mixes with 8 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 24 parts, 4 parts dispersant, 2 parts defoamer, 5 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is that lactic acid three phosphatide and tributyl phosphate are 1: 1 mixture in mass ratio; Defoamer is that carbonic acid glyceryl ester river paraffin oil is 3: 1 mixture according to mass ratio; Surfactant is dodecyl sodium sulfate;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 400 eye mesh screens obtain grout silver paste used in PCB after filtering.
The preparation method of described grout silver paste used in PCB may further comprise the steps:
1) in mass fraction, being 50% silver bag glass dust with 30 parts silver powder, 30 parts silver content mixes with 5.5 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 27 parts, 2.4 parts dispersant, 3.9 parts defoamer, 1.2 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is lactic acid three phosphatide; Defoamer is organic siliconresin; Surfactant is dodecyl sodium sulfate: methyl silicon hydrogen oil: Span-80=1: the mixture of 2: 1 mass ratio;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 300 eye mesh screens obtain grout silver paste used in PCB after filtering.
Compared with prior art, the present invention has following useful technique effect:
1, grout silver paste used in PCB provided by the invention, mainly with silver powder and Yin Bao glass dust as function mutually, because silver bag glass dust is a kind of relatively more novel composite metal powder on the one hand, price comparison is cheap, easily accepted by people, especially using in environmental requirements such as civil electronic components and parts, highly sophisticated devices is not very harsh occasion; Silver bag glass dust has good performance on the other hand, has both reduced the cost of silver powder, has protected again silver powder to be difficult for by empty G﹠W oxidation, and the grout of making silver slurry electric conductivity is good, and strong adhesion can connect the various assemblies on the printed circuit board (PCB) preferably; At last, both at home and abroad to the research of silver bag glass dust carry out more positive, domestic also have ripe satisfactory silver bag glass dust to introduce to the market in succession.
2, grout silver paste used in PCB provided by the invention after adding lead-free glass powder, the wetability of slurry, surface smoothness, intermiscibility, all has greatly improved with the performances such as bond strength of printed circuit board (PCB).
3, grout silver paste used in PCB provided by the invention, organic bond is that the solvent with different boiling and evaporation rate proportionally fits together, make the one by one volatilization in the processes such as printing, smooth and level, oven dry of grout silver slurry, should not form the defectives such as pore, crack, it is firm that grout silver slurry is connected with printed circuit board (PCB), improves bonding strength.
4, grout silver paste used in PCB provided by the invention, its electric conductivity, contact performance, switching performance are good; Adjust the content of inorganic constituents and organic principle, adapt with printed circuit board (PCB), reach the effect that makes properties of product better, guaranteed the steady quality of product.
Embodiment
The present invention is described in further detail below in conjunction with specific embodiment, and the explanation of the invention is not limited.
Embodiment 1
A kind of grout silver paste used in PCB, concrete preparation are to finish according to following processing step:
At first prepare following raw material according to mass percent:
Silver powder 25%, silver bag glass dust 50%, organic binder bond 15%, leadless glass powder 2% and additive 8%;
Wherein silver powder is that particle diameter is the super fine silver powder of 0.5～5 μ m, and silver bag glass dust is that silver content is 50%, particle diameter is the silver bag glass dust of 0.1～8 μ m; Organic binder bond is ethyl cellulose terpinol system, and wherein the mass ratio of ethyl cellulose and terpinol is 1: 4; Leadless glass powder is boron manosil AS zinc powder, wherein boron: aluminium: silicon: the element mass ratio of zinc is 5: 2: 9: 3, become glass by its oxidesintering, and form after again glass being pulverized and mixed; Described additive is dispersant (2.5%), defoamer (2.5%) and surfactant (3%), and wherein dispersant is selected benzene sulfonic acid three phosphides; Defoamer selector silicones; Surfactant is selected Span-80.
Prepare slurry according to following technical process:
1) mix: the weighing particle diameter is that silver powder (super fine silver powder), the silver content of 0.5～5 μ m are that 50% particle diameter is the silver bag glass dust of 0.1～8 μ m at first in mass ratio, and then load weighted silver powder, silver bag glass dust and leadless glass powder mixed, make carrier with absolute ethyl alcohol, mixed 5 hours with ball mill or ball grinder;
2) drying: the silver powder that mixes, silver bag glass dust and leadless glass powder were dried 1.5 hours then room temperature cooling under 100 ℃ of conditions;
3) add organic binder bond: the organic binder bond of weighing and additive are joined in the mixture of above-mentioned silver powder, silver bag glass dust and leadless glass powder according to aforementioned mass ratio, fully stir with planetary stirring machine, until mix, then obtain after filtration preliminary slurry;
4) rolling: preliminary slurry obtained above is carried out rolling 7 times with three-high mill, be checked through till the fineness of 0～5 μ m, then obtain the slurry finished product through 400 purpose screen filtrations.
Embodiment 2:
A kind of grout silver paste used in PCB, specifically finish according to following processing step:
At first prepare following raw material according to mass percent:
Silver powder 5%, silver-coated copper powder 45%, organic binder bond 30%, leadless glass powder 10.5% and additive 9.5%;
Wherein silver powder is that particle diameter is the super fine silver powder of 0.5～5 μ m, and silver bag glass dust is that silver content is 50%, particle diameter is the silver bag glass dust of 0.1～8 μ m; Organic binder bond is ethyl cellulose terpinol system, ethyl cellulose: the mass ratio of terpinol is 1: 10; Leadless glass powder is boron manosil AS zinc powder, wherein boron: aluminium: silicon: the element mass ratio of zinc is 6: 4: 8: 5, become glass by its oxidesintering, and form after again glass being pulverized and mixed; Described additive is dispersant (2.5%), defoamer (5.5%) and surfactant (2.5%), and wherein dispersant is selected tributyl phosphate; Defoamer is selected the carbonic acid glyceryl ester; Surfactant is selected methyl silicon hydrogen oil.
Prepare slurry according to following technical process:
1) mix: weighing silver powder, silver wrap glass dust at first in mass ratio, and then load weighted silver powder, silver bag glass dust and leadless glass powder are mixed, and make carrier with absolute ethyl alcohol, mix 4 hours with ball mill or ball grinder;
2) drying: the silver powder that mixes, silver bag glass dust and leadless glass powder were dried 3 hours then room temperature cooling under 80 ℃ of conditions;
3) add organic binder bond: the organic binder bond of weighing and additive are joined in the mixture of above-mentioned silver powder and leadless glass powder according to aforementioned mass percent, fully stir with planetary stirring machine, until mix, then obtain after filtration preliminary slurry;
4) rolling: preliminary slurry obtained above is carried out rolling 10 times with three-high mill, be checked through till the fineness of 0～5 μ m, then obtain the slurry finished product through 400 purpose screen filtrations.
Embodiment 3:
A kind of grout silver paste used in PCB, specifically finish according to following processing step:
At first prepare following raw material according to mass percent:
Silver powder 15%, silver-coated copper powder 42%, organic binder bond 24%, leadless glass powder 8% and additive 11%
Wherein silver powder is that particle diameter is the super fine silver powder of 0.5～5 μ m, and silver bag glass dust is that silver content is 60%, particle diameter is the silver bag glass dust of 0.1～8 μ m; Above-mentioned organic carrier is ethyl cellulose terpinol system, ethyl cellulose: the mass ratio of terpinol is 1: 19; Leadless glass powder is boron manosil AS zinc, wherein boron: aluminium: silicon: the element mass ratio of zinc is 5.5: 3: 9: 4, become glass by its oxidesintering, and form after again glass being pulverized and mixed; Described additive is dispersant (4%), defoamer (2%) and surfactant (5%), and wherein dispersant selection phosphate and lactic acid three phosphatide are 1: 1 mixture according to mass ratio; Defoamer is selected organic siliconresin; Surfactant is selected dodecyl sodium sulfate.
Prepare slurry according to following technical process:
1) mix: weighing silver powder, silver wrap glass dust at first by mass percentage, and then load weighted silver powder, silver bag glass frit powder are mixed, and make carrier with absolute ethyl alcohol, mix 3 hours with ball mill or ball grinder;
2) drying: the silver powder that mixes, silver bag glass dust and leadless glass powder were dried 2 hours then room temperature cooling under 90 ℃ of conditions;
3) add organic binder bond: the organic binder bond of weighing and additive are joined in the mixture of above-mentioned silver powder and leadless glass powder according to aforementioned mass percent, fully stir with planetary stirring machine, until mix, then obtain after filtration preliminary slurry;
4) rolling: preliminary slurry obtained above is carried out rolling 5 times with three-high mill, be checked through till the fineness of 0～5 μ m, then obtain the slurry finished product through 400 purpose screen filtrations.
Embodiment 4:
A kind of grout silver paste used in PCB, specifically finish according to following processing step:
At first prepare following raw material according to mass percent:
Silver powder 20%, silver-coated copper powder 44%, organic carrier 20%, leadless glass powder 9.5% and additive 6.5%;
Wherein silver powder is that particle diameter is the super fine silver powder of 0.5～5 μ m, and silver bag glass dust is that silver content is 55%, particle diameter is the silver bag glass dust of 0.1～8 μ m; Above-mentioned organic carrier is ethyl cellulose terpinol system, ethyl cellulose: the mass ratio of terpinol is 1: 8; Leadless glass powder is boron manosil AS zinc, wherein boron: aluminium: silicon: the element mass ratio of zinc is 5: 3.5: 7.5: 4.5, become glass by its oxidesintering, and form after again glass being pulverized and mixed; Described additive is dispersant, defoamer and surfactant, and three's mass ratio is 2: 2: 3, and wherein dispersant selection benzene sulfonic acid three phosphides and lactic acid three phosphatide are 1: 2 mixture according to mass ratio; Defoamer selection carbonic acid glyceryl ester river paraffin oil is 3: 1 mixture according to mass ratio; Surfactant is selected dodecyl sodium sulfate.
Prepare slurry according to following technical process:
1) mix: weighing silver-coated copper powder at first by mass percentage, and then load weighted silver-coated copper powder and leadless glass powder mixed, make carrier with absolute ethyl alcohol, with ball mill or ball grinder mixing 2 hours;
2) drying: the silver-coated copper powder that mixes and leadless glass powder were dried 2.5 hours then room temperature cooling under 60 ℃ of conditions;
3) add organic binder bond: the organic binder bond of weighing and additive are joined in the mixture of above-mentioned silver powder and leadless glass powder according to aforementioned mass percent, fully stir with planetary stirring machine, until mix, then obtain after filtration preliminary slurry;
4) rolling: preliminary slurry obtained above is carried out rolling 8 times with three-high mill, be checked through till the fineness of 0～5 μ m, then obtain the slurry finished product through 400 purpose screen filtrations.
Embodiment 5:
A kind of grout silver paste used in PCB, specifically finish according to following processing step:
At first prepare following raw material according to mass percent:
Silver powder 30%, silver bag glass dust 30%, organic carrier 27%, leadless glass powder 5.5% and additive 7.5%;
Wherein silver powder is that particle diameter is the super fine silver powder of 0.5～5 μ m, and silver bag glass dust is that silver content is 55%, particle diameter is the silver bag glass dust of 0.1～8 μ m; Above-mentioned organic carrier is ethyl cellulose terpinol system, ethyl cellulose: the mass ratio of terpinol is 1: 5; Leadless glass powder is boron manosil AS zinc, wherein boron: aluminium: silicon: the element mass ratio of zinc is 5.2: 3.6: 8.5: 4, become glass by its oxidesintering, and form after again glass being pulverized and mixed; Described additive is dispersant, defoamer and surfactant, and three's ratio is 2: 3: 1, and wherein dispersant is selected lactic acid three phosphatide; Defoamer is selected organic siliconresin; Surfactant selection dodecyl sodium sulfate and methyl silicon hydrogen oil river Span-80 are 1: 2: 1 mixture according to mass ratio.
Prepare slurry according to following technical process:
1) mix: weighing silver-coated copper powder at first by mass percentage, and then load weighted silver-coated copper powder and leadless glass powder mixed, make carrier with absolute ethyl alcohol, with ball mill or ball grinder mixing 4 hours;
2) drying: the silver-coated copper powder that mixes and leadless glass powder were dried 2 hours then room temperature cooling under 70 ℃ of conditions;
3) add organic binder bond: the organic binder bond of weighing and additive are joined in the mixture of above-mentioned silver powder and leadless glass powder according to aforementioned mass percent, fully stir with planetary stirring machine, until mix, then obtain after filtration preliminary slurry;
4) rolling: preliminary slurry obtained above is carried out rolling 2 times with three-high mill, be checked through till the fineness of 0～5 μ m, then obtain the slurry finished product through 400 purpose screen filtrations.
Claims (9)
1. a grout silver paste used in PCB is characterized in that, in mass fraction, comprises 5～30 parts silver powder, 30～50 parts silver bag glass dust, 15～30 parts organic binder bond, 2～10 parts leadless glass powder and 6～11 parts additive;
Described silver powder is that particle diameter is 0.5～5 μ m, and the particle diameter of silver bag glass dust is 0.1～8 μ m; The quality percentage composition of silver is 50～60% in the middle of the silver bag glass dust.
2. grout silver paste used in PCB as claimed in claim 1 is characterized in that, described organic binder bond is ethyl cellulose terpinol binding agent, wherein ethyl cellulose: the mass ratio of terpinol is 1:4～19.
3. grout silver paste used in PCB as claimed in claim 1 is characterized in that, described leadless glass powder is boron manosil AS zinc powder, wherein boron: aluminium: silicon: the element mass ratio of zinc is (5～6): (2～4): (7～9): (3～5).
4. grout silver paste used in PCB as claimed in claim 1 is characterized in that, described additive is 1.5～4 parts dispersant, 2～3 parts defoamer and 2.5～5 parts surfactant;
Described dispersant is one or more in tributyl phosphate, benzene sulfonic acid three phosphides, lactic acid three phosphatide; Defoamer is one or more in organic siliconresin, carbonic acid glyceryl ester, the paraffin oil; Surfactant is one or more among dodecyl sodium sulfate, methyl silicon hydrogen oil, the Span-80.
5. the preparation method of a grout silver paste used in PCB is characterized in that, may further comprise the steps:
1) in mass fraction, 5～30 parts silver powder, 30～50 parts silver bag glass dust mix with 2～10 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
2) organic binder bond of the mixture of dried silver powder, silver bag glass dust and leadless glass powder and 15～30 parts, 1～4 part dispersant, 2～6 parts defoamer, 1～5 part surfactant are fully mixed after, obtain preliminary slurry;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 200～400 eye mesh screens obtain grout silver paste used in PCB after filtering.
6. the preparation method of grout silver paste used in PCB as claimed in claim 5 is characterized in that, may further comprise the steps:
1) in mass fraction, being 50% silver bag glass dust with 25 parts silver powder, 50 parts silver content mixes with 2 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 15 parts, 2.5 parts dispersant, 2.5 parts defoamer, 3 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is benzene sulfonic acid three phosphides; Defoamer is organic siliconresin; Surfactant is Span-80;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 400 eye mesh screens obtain grout silver paste used in PCB after filtering.
7. the preparation method of grout silver paste used in PCB as claimed in claim 5 is characterized in that, may further comprise the steps:
1) in mass fraction, being 55% silver bag glass dust with 5 parts silver powder, 45.5 parts silver content mixes with 10 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 30 parts, 2.5 parts dispersant, 5.5 parts defoamer, 2.5 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is tributyl phosphate; Defoamer is the carbonic acid glyceryl ester; Surfactant is methyl silicon hydrogen oil;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 300 eye mesh screens obtain grout silver paste used in PCB after filtering.
8. the preparation method of grout silver paste used in PCB as claimed in claim 5 is characterized in that, may further comprise the steps:
1) in mass fraction, being 60% silver bag glass dust with 15 parts silver powder, 42 parts silver content mixes with 8 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 24 parts, 4 parts dispersant, 2 parts defoamer, 5 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is that lactic acid three phosphatide and tributyl phosphate are the mixture of 1:1 in mass ratio; Defoamer is that carbonic acid glyceryl ester and paraffin oil are the mixture of 3:1 according to mass ratio; Surfactant is dodecyl sodium sulfate;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 400 eye mesh screens obtain grout silver paste used in PCB after filtering.
9. the preparation method of grout silver paste used in PCB as claimed in claim 5 is characterized in that, may further comprise the steps:
1) in mass fraction, being 50% silver bag glass dust with 30 parts silver powder, 30 parts silver content mixes with 5.5 parts leadless glass powder, and with ethanol as carrier, ball milling mixes 2～5h; Then with its dry 1～3h under 60～100 ℃, room temperature cooling;
Described leadless glass powder is boron manosil AS zinc powder;
2) organic binder bond of dried silver powder, silver bag glass dust and leadless glass powder mixture and 27 parts, 2.4 parts dispersant, 3.9 parts defoamer, 1.2 parts surfactant are fully mixed after, obtain preliminary slurry;
Described organic binder bond is ethyl cellulose terpinol binding agent; Described dispersant is lactic acid three phosphatide; Defoamer is organic siliconresin; Surfactant is dodecyl sodium sulfate: methyl silicon hydrogen oil: the mixture of the mass ratio of Span-80=1:2:1;
The abundant rolling of preliminary slurry that 3) will obtain makes its fineness reach 1～5 μ m, and 300 eye mesh screens obtain grout silver paste used in PCB after filtering.
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| CN 201110201760 CN102262918B (en) | 2011-07-19 | 2011-07-19 | Grout silver paste used in PCB and preparation method thereof |
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| CN 201110201760 CN102262918B (en) | 2011-07-19 | 2011-07-19 | Grout silver paste used in PCB and preparation method thereof |
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| CN102262918B true CN102262918B (en) | 2013-03-13 |
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| CN110545617B (en) * | 2019-09-11 | 2023-06-30 | 杭州华光焊接新材料股份有限公司 | Electrode silver paste for ceramic circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006397A (en) * | 1987-02-06 | 1991-04-09 | Key-Tech, Inc. | Printed circuit board |
| CN101728001A (en) * | 2009-11-12 | 2010-06-09 | 东南大学 | Lead-free and low-silver photosensitive silver paste and preparation method thereof |
| CN101872654A (en) * | 2010-06-29 | 2010-10-27 | 彩虹集团公司 | Grout silver paste applied to thick film circuit |
| CN101950598A (en) * | 2010-09-29 | 2011-01-19 | 彩虹集团公司 | Conductor pulp for printed circuit board and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335402A (en) * | 1994-06-06 | 1995-12-22 | Sumitomo Metal Mining Co Ltd | Paste for forming electrode on chip resistor |
-
2011
- 2011-07-19 CN CN 201110201760 patent/CN102262918B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006397A (en) * | 1987-02-06 | 1991-04-09 | Key-Tech, Inc. | Printed circuit board |
| CN101728001A (en) * | 2009-11-12 | 2010-06-09 | 东南大学 | Lead-free and low-silver photosensitive silver paste and preparation method thereof |
| CN101872654A (en) * | 2010-06-29 | 2010-10-27 | 彩虹集团公司 | Grout silver paste applied to thick film circuit |
| CN101950598A (en) * | 2010-09-29 | 2011-01-19 | 彩虹集团公司 | Conductor pulp for printed circuit board and preparation method thereof |
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| CN102262918A (en) | 2011-11-30 |
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