CN101872654A - Grout silver paste applied to thick film circuit - Google Patents
Grout silver paste applied to thick film circuit Download PDFInfo
- Publication number
- CN101872654A CN101872654A CN 201010211845 CN201010211845A CN101872654A CN 101872654 A CN101872654 A CN 101872654A CN 201010211845 CN201010211845 CN 201010211845 CN 201010211845 A CN201010211845 A CN 201010211845A CN 101872654 A CN101872654 A CN 101872654A
- Authority
- CN
- China
- Prior art keywords
- frit
- thick film
- film circuit
- powder
- silver paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses grout silver paste applied to a thick film circuit, which consists of 60 to 90 weight percent of conductive powder, 1 to 6 weight percent of frit and 10 to 35 weight percent of organic carrier, wherein the total weight of the conductive powder, the frit and the organic carrier is 100 percent. The conductive powder is the powder of gold, silver, palladium, copper, nickel, tungsten and manganese alloys or the mixed powder of the powder; and the grain diameter of the conductive powder is controlled to be 1 to 10mu m. The grout silver paste applied to the thick film circuit prepared by the invention has the characteristics of high electrical conductivity, low sintering shrinkage rate and good matrix matching performance and the using requirement of a grout process of the thick film circuit is met in the using process.
Description
Technical field
The invention belongs to the electric slurry field, relate to a kind of grout silver paste that is applied to thick film circuit.
Background technology
Thick film circuit is exactly the passive network that adopts technologies such as silk screen printing and sintering to make on substrate, and assembles discrete semiconductor device chip or monolithic integrated circuit or micro element thereon, adds the hybrid integrated circuit that encapsulation forms again.It is a kind of miniature electronic functional part.
In the common thick film circuit, the general mode that is printed on one side that adopts had both formed circuit network and pasting chip and electronic component on a face of matrix.The thick film circuit module of Xing Chenging usually can be bigger like this; therefore in order to reduce the volume of thick film circuit; sometimes can adopt the mode of printed on both sides; this just need use the thick film grout silver paste; use the thick film grout silver paste, with the circuit formation interconnection on matrix two sides, it is low to require grout silver slurry to have resistivity; it is little that sintering shrinks, to characteristics such as the tack of matrix are good.
Summary of the invention
The objective of the invention is to overcome above-mentioned existing slurry poorly conductive, sintering shrinks big, to the shortcoming of the tack difference of matrix, and provides a kind of grout silver paste that is applied to thick film circuit.
The objective of the invention is to solve by the following technical programs:
A kind of grout silver paste that is applied to thick film circuit, this slurry is made up of the conductive powder of 60-90% weight, the frit of 1-6% weight and the organic carrier of 10-35% weight; The total amount of described conductive powder, frit and organic carrier is 100%.
Described conductive powder is selected the powder of gold, silver, palladium, copper, nickel, tungsten manganese alloy or the mixed powder of above-mentioned several powder for use; The particle diameter of described conductive powder is controlled at 1-10 μ m.
Described conductive powder can be selected the powder of silver for use; The particle diameter of described conductive powder is controlled at 3-7 μ m, and the tap density scope is controlled at 4-7g/ml, and optimum condition is 4.5-6g/ml.
The content of described conductive powder in slurry is 75-80%.
Described frit is made of according to the part by weight of 1:1 or 2:1 frit A and frit B; The softening point range of described frit A is 500-650 ℃, and the softening point range of frit B is 650-750 ℃.
The particle diameter of described frit A and frit B all is controlled at 3-8 μ m.
Described organic carrier is that the ratio of 9:1 is formed by solvent and resin according to mass ratio; Described solvent is selected from terpinol, butyl carbitol, isopropyl alcohol or polyethylene glycol, and resin is selected from methylcellulose, ethyl cellulose, hydroxyethylcellulose or hydroxypropyl methylcellulose.
A kind of grout silver paste that is applied to thick film circuit that the present invention makes, this slurry has good conductivity, and sintering shrinkage is little, the characteristics good with the matrix matching performance, the grout technology instructions for use according to thick film circuit in use gets final product.
Embodiment
Below the present invention is done and describes in further detail:
Embodiment 1
It is the ball shape silver powder of 5 μ m that silver powder uses average grain diameter, the bulk density of this silver powder is 5g/ml, frit uses two kinds, the plumbous borosilicate of frit A(is a glass, about 550 ℃ of softening points), frit B(bismuth boron-silicon-aluminum glass, about 730 ℃ of softening points), organic carrier is formulated in the 9:1 ratio by terpinol and ethyl cellulose.Above-mentioned each material is in following ratio weighing:
Silver powder 80%
Frit A 2%
Frit B 2%
Organic carrier 16%
After the material weighing was finished, the manual earlier pasty state that stirs into more than 10 times, was promptly obtaining the slurry that needs according to the blank preparation technics rolling on the three-roll grinder then.
Embodiment 2
Conductive powder uses silver powder and the organic carrier among the embodiment 1, and frit A and frit C(bismuth borosilicate are frit, about 680 ℃ of softening points), in following ratio weighing:
Silver powder 77%
Frit A 3%
Frit B 1.5%
Organic carrier 18.5%
After the material weighing was finished, the manual earlier pasty state that stirs into more than 10 times, was promptly obtaining the slurry that needs according to the blank preparation technics rolling on the three-roll grinder then.
Above content is to further describing that the present invention did in conjunction with concrete preferred implementation; can not assert that the specific embodiment of the present invention only limits to this; for the general technical staff of the technical field of the invention; without departing from the inventive concept of the premise; can also make some simple deduction or replace, all should be considered as belonging to the present invention and determine scope of patent protection by claims of being submitted to.
Claims (7)
1. a grout silver paste that is applied to thick film circuit is characterized in that, this slurry is made up of the conductive powder of 60-90% weight, the frit of 1-6% weight and the organic carrier of 10-35% weight; The total amount of described conductive powder, frit and organic carrier is 100%.
2. a kind of grout silver paste that is applied to thick film circuit according to claim 1 is characterized in that: described conductive powder is selected the powder of gold, silver, palladium, copper, nickel, tungsten manganese alloy or the mixed powder of above-mentioned several powder for use; The particle diameter of described conductive powder is controlled at 1-10 μ m, and tap density is controlled at 4-7g/ml.
3. a kind of grout silver paste that is applied to thick film circuit according to claim 2 is characterized in that: described conductive powder can be selected the powder of silver for use; The particle diameter of described conductive powder is controlled at 3-7 μ m, and tap density should be controlled at 4-7g/ml.
4. a kind of grout silver paste that is applied to thick film circuit according to claim 1 is characterized in that: the weight percentage of described conductive powder in slurry is 75-80%.
5. a kind of grout silver paste that is applied to thick film circuit according to claim 1 is characterized in that: described frit is made of according to the part by weight of 1:1 or 2:1 frit A and frit B; The softening point range of described frit A is 500-650 ℃, and the softening point range of frit B is 650-750 ℃.
6. a kind of grout silver paste that is applied to thick film circuit according to claim 5 is characterized in that: the particle diameter of described frit A and frit B all is controlled at 3-8 μ m.
7. a kind of grout silver paste that is applied to thick film circuit according to claim 1 is characterized in that: described organic carrier is that the ratio of 9:1 is formed by solvent and resin according to mass ratio; Described solvent is selected from terpinol, butyl carbitol, isopropyl alcohol or polyethylene glycol, and resin is selected from methylcellulose, ethyl cellulose, hydroxyethylcellulose or hydroxypropyl methylcellulose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102118457A CN101872654B (en) | 2010-06-29 | 2010-06-29 | Grout silver paste applied to thick film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102118457A CN101872654B (en) | 2010-06-29 | 2010-06-29 | Grout silver paste applied to thick film circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101872654A true CN101872654A (en) | 2010-10-27 |
| CN101872654B CN101872654B (en) | 2011-12-21 |
Family
ID=42997451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102118457A Expired - Fee Related CN101872654B (en) | 2010-06-29 | 2010-06-29 | Grout silver paste applied to thick film circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101872654B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102262918A (en) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | Grout silver paste used in PCB and preparation method thereof |
| CN102280159A (en) * | 2011-07-19 | 2011-12-14 | 彩虹集团公司 | Electrode material applied to chip resistor |
| CN102314957A (en) * | 2011-07-06 | 2012-01-11 | 中国电子科技集团公司第五十五研究所 | Multilayer high-temperature co-fired-ceramic thick-film tungsten conductor paste and preparation method thereof |
| CN102592748A (en) * | 2012-02-13 | 2012-07-18 | 江苏瑞德新能源科技有限公司 | Process for producing silver aluminum slurry for solar energy battery |
| CN104078097A (en) * | 2014-06-04 | 2014-10-01 | 乐凯特科技铜陵有限公司 | Printed circuit board silver paste for filling holes and preparing method thereof |
| CN104575686A (en) * | 2015-01-21 | 2015-04-29 | 华南理工大学 | Low cost copper-doped conductive silver paste and preparation method thereof |
| CN115732120A (en) * | 2022-11-28 | 2023-03-03 | 苏州三环科技有限公司 | Resistance paste and preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001023438A (en) * | 1999-07-08 | 2001-01-26 | Murata Mfg Co Ltd | Conductive paste and ceramic electronic component |
| US20030201427A1 (en) * | 2001-01-24 | 2003-10-30 | Kaken Tech Co., Ltd. | Conductiv powder and conductive composition |
| US20040191690A1 (en) * | 2003-02-14 | 2004-09-30 | Keiichiro Hayakawa | Electrode-forming composition for field emission type of display device, and method using such a composition |
| CN101304050A (en) * | 2007-05-09 | 2008-11-12 | 东进世美肯株式会社 | Paste for electrode forming of solar cell |
| CN101599349A (en) * | 2009-04-14 | 2009-12-09 | 贵阳晶华电子材料有限公司 | Silver paste of inner electrode for chip inductor and preparation method thereof |
-
2010
- 2010-06-29 CN CN2010102118457A patent/CN101872654B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001023438A (en) * | 1999-07-08 | 2001-01-26 | Murata Mfg Co Ltd | Conductive paste and ceramic electronic component |
| US20030201427A1 (en) * | 2001-01-24 | 2003-10-30 | Kaken Tech Co., Ltd. | Conductiv powder and conductive composition |
| US20040191690A1 (en) * | 2003-02-14 | 2004-09-30 | Keiichiro Hayakawa | Electrode-forming composition for field emission type of display device, and method using such a composition |
| CN101304050A (en) * | 2007-05-09 | 2008-11-12 | 东进世美肯株式会社 | Paste for electrode forming of solar cell |
| CN101599349A (en) * | 2009-04-14 | 2009-12-09 | 贵阳晶华电子材料有限公司 | Silver paste of inner electrode for chip inductor and preparation method thereof |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314957A (en) * | 2011-07-06 | 2012-01-11 | 中国电子科技集团公司第五十五研究所 | Multilayer high-temperature co-fired-ceramic thick-film tungsten conductor paste and preparation method thereof |
| CN102314957B (en) * | 2011-07-06 | 2013-07-03 | 中国电子科技集团公司第五十五研究所 | Multilayer high-temperature co-fired-ceramic thick-film tungsten conductor paste and preparation method thereof |
| CN102262918A (en) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | Grout silver paste used in PCB and preparation method thereof |
| CN102280159A (en) * | 2011-07-19 | 2011-12-14 | 彩虹集团公司 | Electrode material applied to chip resistor |
| CN102262918B (en) * | 2011-07-19 | 2013-03-13 | 彩虹集团公司 | Grout silver paste used in PCB and preparation method thereof |
| CN102592748A (en) * | 2012-02-13 | 2012-07-18 | 江苏瑞德新能源科技有限公司 | Process for producing silver aluminum slurry for solar energy battery |
| CN104078097A (en) * | 2014-06-04 | 2014-10-01 | 乐凯特科技铜陵有限公司 | Printed circuit board silver paste for filling holes and preparing method thereof |
| CN104078097B (en) * | 2014-06-04 | 2016-09-21 | 乐凯特科技铜陵有限公司 | A kind of grout printed circuit board (PCB) silver slurry and preparation method thereof |
| CN104575686A (en) * | 2015-01-21 | 2015-04-29 | 华南理工大学 | Low cost copper-doped conductive silver paste and preparation method thereof |
| CN115732120A (en) * | 2022-11-28 | 2023-03-03 | 苏州三环科技有限公司 | Resistance paste and preparation method and application thereof |
| CN115732120B (en) * | 2022-11-28 | 2023-11-07 | 苏州三环科技有限公司 | Resistance paste and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101872654B (en) | 2011-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101872654B (en) | Grout silver paste applied to thick film circuit | |
| CN101271929B (en) | Leadless solar battery silver paste and method for producing the same | |
| US9054391B2 (en) | Lithium ion secondary battery and method for producing same | |
| EP2363864B1 (en) | Conductive aluminum paste and the fabrication method thereof, the solar cell and the module thereof | |
| CN105873248B (en) | A kind of heating film low-temperature sintering slurry and preparation method thereof | |
| CN102592703B (en) | Silver conductor slurry for back electrodes of solar energy battery | |
| CN107274965A (en) | Electric slurry and its manufacture method based on low-melting-point metal micro-nano powder | |
| KR20120007008A (en) | Solar cell module and method for manufacturing same | |
| TW201216421A (en) | Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation | |
| EP2701160A1 (en) | Conductive paste | |
| CN101118932A (en) | Conductive slurry for front electrode of solar battery | |
| EP3032547B2 (en) | A conductive paste containing lead-free glass frit | |
| US9362017B2 (en) | Paste composition for front electrode of solar cell, and solar cell including the same | |
| JP6247059B2 (en) | Conductive adhesive, solar cell module, and method for manufacturing solar cell module | |
| CN113257457A (en) | Silver-aluminum paste for high-performance N-type solar cell front surface fine grid and preparation method thereof | |
| CN113257455B (en) | Low-temperature-sintered lead-free conductive silver paste | |
| CN103165217A (en) | Electric conduction silver paste for mica plate capacitor and preparation method thereof | |
| CN101727997A (en) | YBCO thick film resistor slurry | |
| CN109967747A (en) | A kind of metal multilayer film and preparation method thereof | |
| TW201634638A (en) | Use of an electrically conductive composition as an electrically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells | |
| CN101944398A (en) | Preparation method of conducting paste by using oxides as adhesive | |
| US20120103410A1 (en) | Conductive paste composite | |
| CN104575667B (en) | Crystal silicon solar energy battery front conductive silver paste | |
| CN105655416A (en) | Electrode slurry for silicon solar cell | |
| CN110246605B (en) | Anti-oxidation conductive paste composition, conductive coating and preparation method of conductive coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20150629 |
|
| EXPY | Termination of patent right or utility model |