CN104407535A - Sun sensor processing chip determination method possessing various configuration functions - Google Patents
Sun sensor processing chip determination method possessing various configuration functions Download PDFInfo
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- CN104407535A CN104407535A CN201410555275.1A CN201410555275A CN104407535A CN 104407535 A CN104407535 A CN 104407535A CN 201410555275 A CN201410555275 A CN 201410555275A CN 104407535 A CN104407535 A CN 104407535A
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
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- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
Abstract
Provided is a sun sensor processing chip determination method possessing various configuration functions. The method comprises the following steps that function design verification of a sun sensor dedicated processing chip is performed; the input and output port of the sun sensor dedicated processing chip is constrained so that integrated analysis and front end design verification are realized; a 150K anti-radiation reinforcing master slice is processed, physical design is realized by adopting a CMOS0.5 mu m technology, and rear end time sequence verification is performed; and the chip functions, the number of pins and pin driving capacity are analyzed, and the packaging scheme of the sun sensor dedicated processing chip is designed and implemented. The design adopts a UART communication unit with high reliability, adopts a three-mode redundancy technology with respect to important data, and possesses the flexible configuration functions of UART communication protocols, sun sensor probe types and different obits of digital sun sensor view field monitoring code thresholds so that the requirements of different orbit satellites can be met.
Description
Technical field
The present invention relates to a kind of sun sensor process chip defining method, particularly a kind of sun sensor process chip defining method with various configurations function, be applicable in high integration and miniaturization sun sensor circuit; Belong to chip design field.
Background technology
Sun sensor is that the one in space mission commonly uses attitude sensor, for measuring the incident angle of the sun relative to sun sensor on spacecraft.Nearly all spacecraft all needs to install sun sensor, so that the gesture feedback information provided according to sun sensor completes the gesture stability task in each stage of spacecraft.
Digital, analog and " 0-1 " formula three kinds of sun sensor probes are the most generally used in current spacecraft.Wherein, the orientation of digital sun sensor probe for measuring solar azimuth and satellite body coordinate system; Analog sun sensor probe provides the sun relative to the azimuth information of solar array, to realize the closed circuit control of windsurfing from the motion tracking sun; " 0-1 " formula sun sensor probe installs formation 4 π solid angle visual field, for catch and emergency rating provides solar azimuth information.Sun sensor circuit will process the signal that above-mentioned three kinds of sun sensors probe exports, and each sensor information feed back to On board computer.
Wherein, digital sun sensor arranges visual field and monitors that code threshold is that parasitic light can not be used as sunshine process by sun sensor in order to suppress stray light (as: earth surface icy mountain peak reflection of light light) disturbs sun sensor by mistake.Not co-orbital spuious light intensity is not identical yet, and therefore for different track, digital sun sensor arranges different visual fields and monitors that code threshold is in order to suppress interference of stray light, prevents sensor to spacecraft feedback error visual field information.
Along with the fast development of global microelectric technique, high with integrated level, volume is little, quality is light etc. has broad application prospects for the microsatellite of development trend is gathered around.Existing sun sensor all cannot meet the demand for development of current satellite from volume, weight and power consumption, and therefore sun sensor needs towards low in energy consumption, and volume is little to be developed with level of integrated system high.
Summary of the invention
The technical matters that the present invention solves is: overcome the deficiencies in the prior art, propose a kind of sun sensor dedicated processes chip design method with various configurations function, can be used for processing digital, analog and " 0-1 " formula three kinds of sun sensor probe signals, chip has applicability more widely; Monolithic process chip can complete the repertoire such as sun sensor signal and data transmission communication, is conducive to the high integration of sun sensor chip and the development of miniaturization; Because this dedicated processes chip has higher Refresh Data rate and Radiation hardness, can adapt to high, in various satellite rotating speed and all kinds of orbital environment demand such as low and moonlet.
Technical solution of the present invention is: a kind of sun sensor process chip defining method with various configurations function, and step is as follows:
(1) pin positions of sun sensor probe kind of class interface on chip to be determined and probe kind determination methods is determined; Described sun sensor probe kind comprises analog, " 0-1 " formula and digital;
Described probe kind determination methods is specially:
Before sun sensor process chip to be determined powers up, if sun sensor probe is digital probe, the clamping of then sun sensor probe being planted class interface is high level, if sun sensor probe is analog or " 0-1 " probe, then the clamping of sun sensor probe being planted class interface is low level; After chip power-on reset to be determined, probe kind interface level is after twice latch process, if low level, then kind of popping one's head in is analog or " 0-1 " formula probe, analog or " 0-1 " formula probe signal of circle collection; Otherwise probe kind is digital probe, the digital probe signal of circle collection, thus realize identifying sun sensor probe kind, and complete the collection of probe signal, described high level is supply voltage, and low level is 0;
(2) determine that digital sun sensor visual field monitors that code threshold arranges the pin positions of interface on chip to be determined and digital sun sensor visual field monitors code threshold value defining method;
Described digital sun sensor visual field monitors that code threshold value defining method is specially:
Before chip to be determined powers up, if satellite is high orbit satellite, then digital sun sensor visual field is monitored that code threshold arranges interface level and is fixed as high level, if satellite is LEO satellite, then digital sun sensor visual field is monitored that code threshold arranges interface level and is fixed as low level;
After chip power-on reset to be determined, digital sun sensor visual field monitors that code threshold arranges interface level signal after twice latch process, if low level, then satellite is LEO satellite, reads LEO satellite digital sun sensor visual field and monitors code threshold value; Otherwise satellite is high orbit satellite, reads high orbit satellite digital sun sensor visual field and monitor code threshold value; Described high orbit and LEO satellite digital sun sensor visual field monitor that code threshold value is all stored in advance in the register of chip internal;
The process of digital sun sensor angle is carried out after monitoring that code threshold value is determined in digital sun sensor visual field, high orbit or middle low orbit visual field is monitored that code is together packed together with digital sun sensor angle process data, waits for and On board computer communication;
(3) UART Universal Asynchronous Receiver Transmitter functional configuration interface is determined, the i.e. pin positions of UART communication function configuration interface on chip to be determined and serial communication parameter determination method, described UART communication function configuration interface comprises communication baud rate signalization interface, parity check bit signaling interface and position of rest figure place signaling interface, and described serial communication parameter comprises communication baud rate, parity check bit and position of rest figure place;
Described serial communication parameter determination method is specially:
Determine the PORT COM between sun sensor and On board computer, sun sensor utilizes this port and On board computer to carry out communication, and wherein On board computer has the initiative communication initiator all the time; Sun sensor is in passive answer party all the time, and described PORT COM comprises transmit port and receiving port, i.e. RXD port and TXD port;
During chip power-on reset to be determined, reset by miscommunication counter Com_ERR, described miscommunication counter is that chip to be determined is opened up in advance before powering up, for recording the storage space of the error count of miscommunication counter;
After chip power-on reset to be determined completes, respectively twice latch process is carried out to communication baud rate signalization interface level, parity check bit signaling interface level and position of rest figure place signaling interface level;
If communication baud rate signalization interface level and parity check bit signaling interface level are low level, then UART communication interface implementation is: communication baud rate is 115.2Kbps, and parity check bit is even parity check;
If communication baud rate signalization interface level and parity check bit signaling interface level are high level, then UART communication interface implementation is: communication baud rate is 38.4Kbps, and parity check bit is odd;
If communication baud rate signalization interface level and parity check bit signaling interface level inconsistent, then sun sensor and On board computer stop communication;
If position of rest figure place signaling interface level is high level, then UART communication interface implementation is: 2 position of rests; If position of rest figure place signaling interface level is low level, then UART communication interface implementation is: 1 position of rest;
(4) transceiver mode between the serial communication parameter determination sun sensor utilizing step (3) to obtain and On board computer, thus complete process chip function setting;
(5) chip of function setting is completed in simulation steps (4), constraint is implemented to the input/output port of chip, whether the actual output that the rear chip of constraint is implemented in checking is consistent with the output preset, if consistent, then chip Front-end Design is correct, enters step (6), if inconsistent, then chip Front-end Design is incorrect, returns step (1);
(6) correct to Front-end Design in step (5) process chip carries out physical Design, and time series analysis and power consumption test are carried out to the chip after physical Design, if sequential and power consumption all meet the requirement preset, then the physical Design of process chip meets the demands, enter step (7), otherwise the physical Design of process chip does not meet the demands, re-start the physical Design of process chip;
(7) process chip meeting physical Design requirement in step (6) is encapsulated.
The transceiver mode of profit in described step (4), concrete steps are as follows:
I () chip reset to be determined completes after, receiving port between the sun sensor determined in sun sensor waiting step (3) and On board computer, if successively after 2 high level of continuous acquisition RXD port and 2 low levels, namely RXD port level is by high step-down, the State Transferring of chip to be determined is start bit accepting state, start the start bit receiving On board computer transmission, enter step (ii); Otherwise sun sensor continues the level of continuous acquisition RXD port successively; Described start bit is take the low level signal of 1;
(ii) sun sensor starts counting after receiving start bit, 3 samplings are carried out continuously at the 1/2bit place of start bit, and carry out 3 and get 2 votings, if start bit is low level, then the State Transferring of chip to be determined is data receiving state, start the data bit receiving On board computer transmission, enter step (iii); Otherwise miscommunication counter Com_ERR counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer;
(iii) sun sensor receives 8 bit data positions of the 1st byte that On board computer sends successively, and in the 1/2bit place continuous sampling 3 times of each data bit, and carry out 3 and get 2 votings, if 8 bit data receive, then the State Transferring of chip to be determined is parity check bit accepting state, enters step (iv);
(iv) sun sensor receives the parity check bit that On board computer sends successively, in the 1/2bit place continuous sampling 3 times of parity check bit, and carry out 3 and get 2 votings, if the parity check bit state that sun sensor receives is consistent with UART communication interface parity check bit implementation, then the State Transferring of chip to be determined is position of rest accepting state, start the position of rest receiving On board computer transmission, enter step (v); Otherwise miscommunication counter Com_ERR counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer;
V () sun sensor receives the position of rest that On board computer sends, in the 1/2bit place continuous sampling 3 times of position of rest, and carry out 3 and get 2 votings:
(v-1) if position of rest is low level, and UART communication interface implementation is 1 position of rest, then sun sensor starts to receive successively 1 start bit of the 2nd byte that On board computer sends, 8 bit data positions, 1 bit parity check position and 1 position of rest;
(v-2) if position of rest is low level, and UART communication interface implementation is 2 position of rests, then sun sensor receives the 2nd position of rest again, and then sun sensor starts to receive successively 1 start bit of the 2nd byte that On board computer sends, 8 bit data positions, 1 bit parity check position and 2 position of rests;
Then, after repeating step (i) ~ step (iv), if the double byte data received is consistent with the double byte data preset, then step (vi) is entered; Otherwise miscommunication counter Com_ERR counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer;
Wherein, sun sensor starts reception counter interval time after reception the 1st byte position of rest, if before starting to receive the 2nd byte start bit, receive the time of counter records interval time more than 50 μ s, then time of reception time-out, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer; Otherwise receive counter O reset interval time, sun sensor prepares the data starting to receive the 2nd byte that On board computer sends;
(vi) by data packed in step (2) simultaneously stored in transmission working area, the State Transferring of chip to be determined is transmission state, enters step (vii), carries out the transmission of packing data;
(vii) transmit port between the sun sensor determined in step (3) and On board computer, namely TXD port keeps high level, after delay predetermined time, the TXD port of sun sensor sends the low level start bit of 1bit to On board computer, then the State Transferring of chip to be determined is that data send state, enter step (viii), the described schedule time is not more than 200 μ s;
(viii) 8 bit data positions of the 1st byte received in the TXD port forwarding step (iii) of sun sensor, then the State Transferring of chip to be determined is for sending parity check bit state, enters step (ix);
(ix) parity check bit that receives of the TXD port forwarding step (iv) of sun sensor, then the State Transferring of chip to be determined is for sending position of rest state, enters step (x);
X the TXD port of () sun sensor sends data position of rest, then step (vii) ~ step (ix) is repeated, 8 bit data positions of the 2nd byte received in forwarding step (iii) and the packing data of sun sensor, enter step (xi);
(xi) On board computer by front 2 byte datas received with send to 2 of sun sensor byte instruction data to compare, if unanimously, then shake hands successfully, On board computer store sun sensor send packing data; Otherwise shake hands unsuccessfully, On board computer abandons the packing data that sun sensor sends, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer.
The physical Design of process chip comprises in described step (6): the IO arrangement design of process chip, supply network design, topological design and wires design.
Process chip correct to Front-end Design in step (5) in described step (6) carries out physical Design, specifically adopts CMOS 0.5um technique, processes 150K radiation hardening master slice.
In described step (7), encapsulation is carried out to the process chip meeting physical Design requirement in step (6) and adopt QFP64 encapsulation scheme.
The present invention's beneficial effect is compared with prior art:
(1) process chip in the present invention devises probe kind and judges interface, the identification of digital or analog and " 0-1 " formula sun sensor probe and the collection of probe signal can be carried out in real time, go for the sun sensor probe of variety classes and model, there is good compatibility;
(2) the digital sun sensor visual field that the process chip in the present invention devises high low orbit monitors that code threshold judges interface, not co-orbital digital sun sensor visual field can be realized and monitor code threshold flexible configuration function, with the demand of satisfied different orbiter;
(3) process chip in the present invention devise the asynchronous serial bus transceiver with high-reliability there is communication baud rate, communication position of rest and parity check bit can flexible configuration function, with the communications protocol demand of satisfied different satellite;
(4) chip has highly anti-radiation characteristic, effectively improves sun sensor machine life, is applicable to the long life requirement of satellite;
(5) sun sensor dedicated processes chip core adopts CMOS 0.5um technological design and QFP64 packing forms, and chip size is only 18mm × 18mm, and chip size reduces more than 50%, is convenient to the Miniaturization Design of sun sensor;
(7) the present invention has been applied in small-sized integrated sun sensor engineering prototype, and the gordian technique of employing possesses good realizability, and engineering easily realizes, and therefore has good practicality.
Accompanying drawing explanation
Fig. 1 is realization flow figure of the present invention;
Fig. 2 is UART communication module realization flow figure of the present invention;
Fig. 3 is outer casing construction drawing of the present invention.
Embodiment
Specific implementation thought of the present invention is: design a kind of sun sensor dedicated processes chip with various configurations function, carry out with 150K radiation hardening master slice, CMOS 0.5um technique is adopted to realize physical Design, by to chip functions, the assessment of number of pins and pin driving force, this dedicated processes chip adopts the compact package scheme of QFP64.
As shown in Figure 1, concrete steps are specific implementation process of the present invention:
(1) pin positions of sun sensor probe kind of class interface on chip to be determined and probe kind determination methods is determined; Described probe kind comprises analog, " 0-1 " formula and digital.
Described probe kind determination methods is specially:
Before chip to be determined powers up, if sun sensor probe is digital probe, the clamping of then sun sensor probe being planted class interface is high level, if sun sensor probe is analog and " 0-1 " probe, then the clamping of kind of class interface of being popped one's head in by sun sensor is low level; After chip power-on reset to be determined, probe kind interface level is after twice latch process, if low level, then kind of popping one's head in is analog and " 0-1 " formula probe, analog and " 0-1 " formula probe signal of circle collection; Otherwise probe kind is digital probe, the digital probe signal of circle collection, thus realize identifying sun sensor probe kind, and complete the collection of probe signal, described high level is supply voltage, and low level is 0.
(2) determine that digital sun sensor visual field monitors that code threshold arranges the pin positions of interface on chip to be determined and digital sun sensor visual field monitors code threshold value defining method.
Described digital sun sensor visual field monitors that code threshold value defining method is specially:
Before chip to be determined powers up, if satellite is high orbit satellite, then digital sun sensor visual field is monitored that code threshold arranges interface level and is fixed as high level, if satellite is LEO satellite, then digital sun sensor visual field is monitored that code threshold arranges interface level and is fixed as low level.
After chip power-on reset to be determined, digital sun sensor visual field monitors that code threshold arranges interface level signal after twice latch process, if low level, then satellite is LEO satellite, reads LEO satellite digital sun sensor visual field and monitors code threshold value; Otherwise satellite is high orbit satellite, reads high orbit satellite digital sun sensor visual field and monitor code threshold value; Described high orbit and LEO satellite digital sun sensor visual field monitor that code threshold value is all stored in advance in the register of chip internal.
The process of digital sun sensor angle is carried out after monitoring that code threshold value is determined in digital sun sensor visual field, high orbit or middle low orbit visual field is monitored that code is together packed together with digital sun sensor angle process data, waits for and On board computer communication.
Described digital sun sensor angle process specific implementation is:
Digital sun sensor angle disposal system comprises the synchronous and data packing block of thick code angle processing module, thin code angle processing module, thickness code, realizes digital sun sensor angle processing capacity by the data processing of these three modules.
Wherein thick code angle processing module exports address gating signal and the enable signal of analog switch successively, in the address gating signal retention period of each analog switch, start AD converter, complete digital data acquisition, export address gating signal and the chip enable signal of analog switch successively, complete the digital quantity signal collecting work of a road standard-sized sheet code of every platform sun sensor probe, two-way supervision code and the thick code in seven roads, obtain the true form information of above-mentioned ten road signals; Sun sensor visual field distinguishing validity is carried out to ten obtained tunnel true form signals and Gray code is changed to pseudo-offset binary code, obtain pseudo-offset binary code, deliver to the synchronous and data packing block of thickness code; Meanwhile thick code angle processing module gathers four tunnel thin code true form signals of sun sensor successively, delivers to thin code angle processing module.
The CORDIC of thin code angle processing modules implement four tunnel thin code true form signal optimizes computing, obtains thin code angle, delivers to the synchronous and data packing block of thickness code.
Synchronous and the data packing block of thickness code completes pseudo-offset binary code and thin code angle simultaneously match and angle-data packing;
(digital sun sensor angle disposal route derives from national inventing patent " the encoded sun sensor signal processing system based on FPGA ").
(3) UART Universal Asynchronous Receiver Transmitter functional configuration interface is determined, the i.e. pin positions of UART communication function configuration interface on chip to be determined and serial communication parameter determination method, described UART communication function configuration interface comprises communication baud rate signalization interface, parity check bit signaling interface and position of rest figure place signaling interface, and described serial communication parameter comprises communication baud rate, parity check bit and position of rest figure place.
Described serial communication parameter determination method is specially:
Determine the PORT COM between sun sensor and On board computer, sun sensor utilizes this port and On board computer to carry out communication, and wherein On board computer has the initiative communication initiator all the time; Sun sensor is in passive answer party all the time, and described PORT COM comprises transmit port and receiving port, i.e. RXD port and TXD port;
During chip power-on reset to be determined, miscommunication counter " Com_ERR " being reset described miscommunication counter is that chip to be determined is opened up in advance before powering up, for recording the storage space of the error count of miscommunication counter.
After chip power-on reset to be determined completes, twice latch process is carried out to communication baud rate signalization interface level, parity check bit signaling interface level and position of rest figure place signaling interface level respectively simultaneously.
If communication baud rate signalization interface level and parity check bit signaling interface level are low level, then UART communication interface implementation is: communication baud rate is 115.2Kbps, and parity check bit is even parity check.
If communication baud rate signalization interface level and parity check bit signaling interface level are high level, then UART communication interface implementation is: communication baud rate is 38.4Kbps, and parity check bit is odd.
If communication baud rate signalization interface level and parity check bit signaling interface level inconsistent, then sun sensor and On board computer stop communication.
If position of rest figure place signaling interface level is high level, then UART communication interface implementation is: 2 position of rests; If position of rest figure place signaling interface level is low level, then UART communication interface implementation is: 1 position of rest.
(4) transceiver mode between the serial communication parameter determination sun sensor that obtains of described step (3) and On board computer, thus complete process chip function setting, describedly determines transceiver mode, and concrete steps are as follows:
(i) R_idle: after chip reset to be determined completes, receiving port between the sun sensor determined in sun sensor waiting step (3) and On board computer, if successively after 2 high level of continuous acquisition RXD port and 2 low levels, namely RXD port level is by high step-down, the State Transferring of chip to be determined is start bit accepting state, start the start bit receiving On board computer transmission, enter step (ii) R_start; Otherwise sun sensor continues the level of continuous acquisition RXD port successively; Described start bit is take the low level signal of 1.
(ii) R_start: sun sensor starts counting after receiving start bit, 3 samplings are carried out continuously at the 1/2bit place of start bit, and carry out 3 and get 2 votings, if start bit is low level, then the State Transferring of chip to be determined is data receiving state, start the data bit receiving On board computer transmission, enter step (iii) R_data; Otherwise miscommunication counter " Com_ERR " counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer.
(iii) R_data: sun sensor receives 8 bit data positions of the 1st byte that On board computer sends successively, and in the 1/2bit place continuous sampling 3 times of each data bit, and carry out 3 and get 2 votings, if 8 bit data receive, then the State Transferring of chip to be determined is parity check bit accepting state, enters step (iv) R_parity.
(iv) R_parity: sun sensor receives the parity check bit that On board computer sends successively, in the 1/2bit place continuous sampling 3 times of parity check bit, and carry out 3 and get 2 votings, if the parity check bit state that sun sensor receives is consistent with UART communication interface parity check bit implementation, then the State Transferring of chip to be determined is position of rest accepting state, start the position of rest receiving On board computer transmission, enter step (v) R_stop; Otherwise miscommunication counter " Com_ERR " counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer.
V () R_stop: sun sensor receives the position of rest that On board computer sends, in the 1/2bit place continuous sampling 3 times of position of rest, and carries out 3 and gets 2 votings:
(v-1) if position of rest is low level, and UART communication interface implementation is 1 position of rest, then sun sensor starts to receive successively 1 start bit of the 2nd byte that On board computer sends, 8 bit data positions, 1 bit parity check position and 1 position of rest.
(v-2) if position of rest is low level, and UART communication interface implementation is 2 position of rests, then sun sensor receives the 2nd position of rest again, and then sun sensor starts to receive successively 1 start bit of the 2nd byte that On board computer sends, 8 bit data positions, 1 bit parity check position and 2 position of rests.
Then, after repeating step (i) ~ step (iv), if the double byte data received is consistent with the double byte data preset, then step (vi) T_idle is entered; Otherwise miscommunication counter " Com_ERR " counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer.
Wherein, sun sensor starts reception counter interval time after reception the 1st byte position of rest, if before starting to receive the 2nd byte start bit, receive the time of counter records interval time more than 50 μ s, then time of reception time-out, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer; Otherwise receive counter O reset interval time, sun sensor prepares the data starting to receive the 2nd byte that On board computer sends.
(vi) T_idle: by data packed in step (2) simultaneously stored in transmission working area, the State Transferring of chip to be determined is transmission state, enters step (vii) T_start, carries out the transmission of packing data.
(vii) T_start: the transmit port between the sun sensor determined in step (3) and On board computer, namely TXD port keeps high level, after delay predetermined time, the TXD port of sun sensor sends the low level start bit of 1bit to On board computer, then the State Transferring of chip to be determined is that data send state, enter step (viii), the described schedule time is not more than 200 μ s.
(viii) T_data: 8 bit data positions of the 1st byte received in the TXD port forwarding step (iii) of sun sensor, then the State Transferring of chip to be determined is for sending parity check bit state, enters step (ix) T_parity.
(ix) T_parity: the parity check bit that the TXD port forwarding step (iv) of sun sensor receives, then the State Transferring of chip to be determined is for sending position of rest state, enters step (x) T_stop.
(x) T_stop: the TXD port of sun sensor sends data position of rest, then step (vii) ~ step (ix) is repeated, 8 bit data positions of the 2nd byte received in forwarding step (iii) and the packing data of sun sensor, enter step (xi).
(xi) On board computer by front 2 byte datas received with send to 2 of sun sensor byte instruction data to compare, if unanimously, then shake hands successfully, On board computer store sun sensor send packing data; Otherwise, shake hands unsuccessfully, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer.
(5) chip of function setting is completed in simulation steps (4).The clock network of whole design adopts single clock, and rising edge triggers.Constraint is implemented to the input/output port of chip, the minimax time delay of input and output is set to 12ns and 11ns respectively, input port sequential is set, whether the actual output that the rear chip of constraint is implemented in checking is consistent with the output preset: if consistent, then chip Front-end Design is correct, enters step (6); If inconsistent, then chip Front-end Design is incorrect, returns step (1).
(6) CMOS 0.5um technique is adopted, 150K radiation hardening master slice is carried out to the physical Design of process chip, and time series analysis and power consumption test are carried out to the chip after physical Design, if sequential and power consumption all meet the requirement preset, then the physical Design of process chip meets the demands, enter step (7), otherwise, the physical Design of process chip does not meet the demands, re-start the physical Design of process chip, the physical Design of described process chip comprises: the IO arrangement design of process chip, supply network designs, layout, wires design and time series analysis optimization.
Sun sensor process chip adopts CMOS 0.5um technique, and 150K radiation hardening master slice is carried out to the physical Design of process chip, specific design implementation step is:
(6-a) IO arrangement
Consider that chip-scale is 3.5 ten thousand, critical power loss is no more than 1w, and IO exports driving force and is not less than 3mA, and the usage quantity of I/O pin, determines the arrangement that whole chip uses 28 pins and 10 pairs of power supply/ground.In order to make power supply more sufficient, three all be have employed to often pair of power supply/ground and tie up.
(6-b) supply network design
The design that electric power network design is mainly carried out for unit power grid in core, comprises the network done around the power ring of kernel, inner wide metal and the power ground of powering to each standard block.The power ring of master slice and electric power network cloth are good, add longitudinal stripe of a times on this basis, ensure that power supply is sufficient.
(6-c) layout, wiring
Full wafer layout and standard cell placement are carried out to chip.After Clock Tree is set up, carry out wiring process, all repair the foundation/retention time under each pattern for the time series analysis result after wiring, the parasitic parameter file extracted the most at last carries out last sequential inspection and functional verification.
(6-d) time series analysis optimization
Sequential inspection, power consumption test are carried out to the chip after physical Design, if sequential and power consumption all meet the requirement preset, then the physical Design of process chip meets the demands, enter step (7), otherwise, the physical Design of process chip does not meet the demands, and re-starts the physical Design of process chip.
By carrying out power consumption analysis to the chip after physical Design, the upset rate arranging clock is 20%, frequency of operation be 40M, operating voltage be 5.5V time, power consumption analysis result is 0.8W, and the physical Design of process chip meets the demands.
Fig. 3 is wiring and the domain after optimizing.
(7) process chip meeting physical Design requirement in step (6) is encapsulated, carry out encapsulation and adopt QFP64 encapsulation scheme.
After physical Design, the cavity volume 130.83mm of process chip
3, whole chip uses 48 pins altogether, and design adopts QFP64 packing forms, and as shown in Figure 3, wherein Fig. 3 (a) is shell top view to the outer casing construction drawing of chip, and Fig. 3 (b) is shell backplan.
Chip lead bonding adopts Si-Al wire bonding technology, and diameter is 32 μm, and die bonding adopts conducting resinl load technique, and sealing cap adopts sealing by fusing technique, and cover plate is by bonding wire mode ground connection.
The present invention can reach excellent performance index:
At present, on star, sun sensor all adopts with the 80C32 of atmel corp (DIP40 encapsulation) single-chip microcomputer is the treatment circuit of core, this treatment circuit does not possess various configurations function, and this treatment circuit size is comparatively large simultaneously, thus restriction sun sensor complete machine integrated level and body dimension;
And novel sun sensor dedicated processes circuit adopts dedicated processes chip, this dedicated processes circuit has following characteristics:
(1) dedicated processes circuit port has UART communications protocol, sun sensor probe kind and not co-orbital digital sun sensor visual field and monitors that code threshold can flexible configuration function, with the demand of satisfied different orbiter;
(2) dedicated processes circuit has higher Refresh Data rate, is applicable to velocity of rotation spacecraft faster;
(3) dedicated processes circuit has highly anti-radiation characteristic, effectively improves sun sensor machine life, is applicable to the long life requirement of high orbit and LEO satellite.
Novel sun sensor dedicated processes circuit and traditional sun sensor dedicated processes circuit performance index compare of analysis situation see the following form shown in 1.
Table 1
At present, the aerospace level device of novel sun sensor dedicated processes circuit is successfully developed, and this aerospace level device has participated in the ground experiment checking of certain model satellite, and every gordian technique that dedicated processes circuit adopts all possesses good realizability.Follow-up plan is progressively applied to large satellite to microsatellite, LEO satellite to all kinds of satellites such as high orbit satellites, uses this method can improve the high integration of sun sensor circuit, is convenient to the miniaturization of sun sensor.
The content be not described in detail in instructions of the present invention belongs to the known technology of professional and technical personnel in the field.
Claims (5)
1. there is a sun sensor process chip defining method for various configurations function, it is characterized in that step is as follows:
(1) pin positions of sun sensor probe kind of class interface on chip to be determined and probe kind determination methods is determined; Described sun sensor probe kind comprises analog, " 0-1 " formula and digital;
Described probe kind determination methods is specially:
Before sun sensor process chip to be determined powers up, if sun sensor probe is digital probe, the clamping of then sun sensor probe being planted class interface is high level, if sun sensor probe is analog or " 0-1 " probe, then the clamping of sun sensor probe being planted class interface is low level; After chip power-on reset to be determined, probe kind interface level is after twice latch process, if low level, then kind of popping one's head in is analog or " 0-1 " formula probe, analog or " 0-1 " formula probe signal of circle collection; Otherwise probe kind is digital probe, the digital probe signal of circle collection, thus realize identifying sun sensor probe kind, and complete the collection of probe signal, described high level is supply voltage, and low level is 0;
(2) determine that digital sun sensor visual field monitors that code threshold arranges the pin positions of interface on chip to be determined and digital sun sensor visual field monitors code threshold value defining method;
Described digital sun sensor visual field monitors that code threshold value defining method is specially:
Before chip to be determined powers up, if satellite is high orbit satellite, then digital sun sensor visual field is monitored that code threshold arranges interface level and is fixed as high level, if satellite is LEO satellite, then digital sun sensor visual field is monitored that code threshold arranges interface level and is fixed as low level;
After chip power-on reset to be determined, digital sun sensor visual field monitors that code threshold arranges interface level signal after twice latch process, if low level, then satellite is LEO satellite, reads LEO satellite digital sun sensor visual field and monitors code threshold value; Otherwise satellite is high orbit satellite, reads high orbit satellite digital sun sensor visual field and monitor code threshold value; Described high orbit and LEO satellite digital sun sensor visual field monitor that code threshold value is all stored in advance in the register of chip internal;
The process of digital sun sensor angle is carried out after monitoring that code threshold value is determined in digital sun sensor visual field, high orbit or middle low orbit visual field is monitored that code is together packed together with digital sun sensor angle process data, waits for and On board computer communication;
(3) UART Universal Asynchronous Receiver Transmitter functional configuration interface is determined, the i.e. pin positions of UART communication function configuration interface on chip to be determined and serial communication parameter determination method, described UART communication function configuration interface comprises communication baud rate signalization interface, parity check bit signaling interface and position of rest figure place signaling interface, and described serial communication parameter comprises communication baud rate, parity check bit and position of rest figure place;
Described serial communication parameter determination method is specially:
Determine the PORT COM between sun sensor and On board computer, sun sensor utilizes this port and On board computer to carry out communication, and wherein On board computer has the initiative communication initiator all the time; Sun sensor is in passive answer party all the time, and described PORT COM comprises transmit port and receiving port, i.e. RXD port and TXD port;
During chip power-on reset to be determined, reset by miscommunication counter Com_ERR, described miscommunication counter is that chip to be determined is opened up in advance before powering up, for recording the storage space of the error count of miscommunication counter;
After chip power-on reset to be determined completes, respectively twice latch process is carried out to communication baud rate signalization interface level, parity check bit signaling interface level and position of rest figure place signaling interface level;
If communication baud rate signalization interface level and parity check bit signaling interface level are low level, then UART communication interface implementation is: communication baud rate is 115.2Kbps, and parity check bit is even parity check;
If communication baud rate signalization interface level and parity check bit signaling interface level are high level, then UART communication interface implementation is: communication baud rate is 38.4Kbps, and parity check bit is odd;
If communication baud rate signalization interface level and parity check bit signaling interface level inconsistent, then sun sensor and On board computer stop communication;
If position of rest figure place signaling interface level is high level, then UART communication interface implementation is: 2 position of rests; If position of rest figure place signaling interface level is low level, then UART communication interface implementation is: 1 position of rest;
(4) transceiver mode between the serial communication parameter determination sun sensor utilizing step (3) to obtain and On board computer, thus complete process chip function setting;
(5) chip of function setting is completed in simulation steps (4), constraint is implemented to the input/output port of chip, whether the actual output that the rear chip of constraint is implemented in checking is consistent with the output preset, if consistent, then chip Front-end Design is correct, enters step (6), if inconsistent, then chip Front-end Design is incorrect, returns step (1);
(6) correct to Front-end Design in step (5) process chip carries out physical Design, and time series analysis and power consumption test are carried out to the chip after physical Design, if sequential and power consumption all meet the requirement preset, then the physical Design of process chip meets the demands, enter step (7), otherwise the physical Design of process chip does not meet the demands, re-start the physical Design of process chip;
(7) process chip meeting physical Design requirement in step (6) is encapsulated.
2. a kind of sun sensor process chip defining method with various configurations function according to claim 1, is characterized in that: the transceiver mode of profit in described step (4), and concrete steps are as follows:
I () chip reset to be determined completes after, receiving port between the sun sensor determined in sun sensor waiting step (3) and On board computer, if successively after 2 high level of continuous acquisition RXD port and 2 low levels, namely RXD port level is by high step-down, the State Transferring of chip to be determined is start bit accepting state, start the start bit receiving On board computer transmission, enter step (ii); Otherwise sun sensor continues the level of continuous acquisition RXD port successively; Described start bit is take the low level signal of 1;
(ii) sun sensor starts counting after receiving start bit, 3 samplings are carried out continuously at the 1/2bit place of start bit, and carry out 3 and get 2 votings, if start bit is low level, then the State Transferring of chip to be determined is data receiving state, start the data bit receiving On board computer transmission, enter step (iii); Otherwise miscommunication counter Com_ERR counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer;
(iii) sun sensor receives 8 bit data positions of the 1st byte that On board computer sends successively, and in the 1/2bit place continuous sampling 3 times of each data bit, and carry out 3 and get 2 votings, if 8 bit data receive, then the State Transferring of chip to be determined is parity check bit accepting state, enters step (iv);
(iv) sun sensor receives the parity check bit that On board computer sends successively, in the 1/2bit place continuous sampling 3 times of parity check bit, and carry out 3 and get 2 votings, if the parity check bit state that sun sensor receives is consistent with UART communication interface parity check bit implementation, then the State Transferring of chip to be determined is position of rest accepting state, start the position of rest receiving On board computer transmission, enter step (v); Otherwise miscommunication counter Com_ERR counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer;
V () sun sensor receives the position of rest that On board computer sends, in the 1/2bit place continuous sampling 3 times of position of rest, and carry out 3 and get 2 votings:
(v-1) if position of rest is low level, and UART communication interface implementation is 1 position of rest, then sun sensor starts to receive successively 1 start bit of the 2nd byte that On board computer sends, 8 bit data positions, 1 bit parity check position and 1 position of rest;
(v-2) if position of rest is low level, and UART communication interface implementation is 2 position of rests, then sun sensor receives the 2nd position of rest again, and then sun sensor starts to receive successively 1 start bit of the 2nd byte that On board computer sends, 8 bit data positions, 1 bit parity check position and 2 position of rests;
Then, after repeating step (i) ~ step (iv), if the double byte data received is consistent with the double byte data preset, then step (vi) is entered; Otherwise miscommunication counter Com_ERR counts, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer;
Wherein, sun sensor starts reception counter interval time after reception the 1st byte position of rest, if before starting to receive the 2nd byte start bit, receive the time of counter records interval time more than 50 μ s, then time of reception time-out, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer; Otherwise receive counter O reset interval time, sun sensor prepares the data starting to receive the 2nd byte that On board computer sends;
(vi) by data packed in step (2) simultaneously stored in transmission working area, the State Transferring of chip to be determined is transmission state, enters step (vii), carries out the transmission of packing data;
(vii) transmit port between the sun sensor determined in step (3) and On board computer, namely TXD port keeps high level, after delay predetermined time, the TXD port of sun sensor sends the low level start bit of 1bit to On board computer, then the State Transferring of chip to be determined is that data send state, enter step (viii), the described schedule time is not more than 200 μ s;
(viii) 8 bit data positions of the 1st byte received in the TXD port forwarding step (iii) of sun sensor, then the State Transferring of chip to be determined is for sending parity check bit state, enters step (ix);
(ix) parity check bit that receives of the TXD port forwarding step (iv) of sun sensor, then the State Transferring of chip to be determined is for sending position of rest state, enters step (x);
X the TXD port of () sun sensor sends data position of rest, then step (vii) ~ step (ix) is repeated, 8 bit data positions of the 2nd byte received in forwarding step (iii) and the packing data of sun sensor, enter step (xi);
(xi) On board computer by front 2 byte datas received with send to 2 of sun sensor byte instruction data to compare, if unanimously, then shake hands successfully, On board computer store sun sensor send packing data; Otherwise shake hands unsuccessfully, On board computer abandons the packing data that sun sensor sends, the PORT COM between the sun sensor that sun sensor is determined in waiting step (3) again and On board computer.
3. a kind of sun sensor process chip defining method with various configurations function according to claim 1, is characterized in that: the physical Design of process chip comprises in described step (6): the IO arrangement design of process chip, supply network design, topological design and wires design.
4. a kind of sun sensor process chip defining method with various configurations function according to claim 1, it is characterized in that: process chip correct to Front-end Design in step (5) in described step (6) carries out physical Design, specifically adopt CMOS 0.5um technique, 150K radiation hardening master slice is processed.
5. a kind of sun sensor process chip defining method with various configurations function according to claim 1, is characterized in that: carry out encapsulation to the process chip meeting physical Design requirement in step (6) in described step (7) and adopt QFP64 encapsulation scheme.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112800712A (en) * | 2021-02-01 | 2021-05-14 | 上海利正卫星应用技术有限公司 | Design method of commercial satellite control processor chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995015517A1 (en) * | 1993-11-30 | 1995-06-08 | Dorma Gmbh + Co. Kg | Control and regulation of doors driven by an electromechanical motor |
| CN101231170A (en) * | 2008-01-31 | 2008-07-30 | 北京控制工程研究所 | Method for processing information of APS sun sensor |
| US20090132058A1 (en) * | 2006-03-30 | 2009-05-21 | Andreas Drebinger | Control and Communication System Including an Engineering Unit |
| CN103600852A (en) * | 2013-11-25 | 2014-02-26 | 清华大学 | Cluster-flying-supportive basic modular spacecraft |
| CN103983237A (en) * | 2014-06-10 | 2014-08-13 | 北京航空航天大学 | Sun sensor and method for carrying out attitude measurement on sun sensor |
-
2014
- 2014-10-20 CN CN201410555275.1A patent/CN104407535B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995015517A1 (en) * | 1993-11-30 | 1995-06-08 | Dorma Gmbh + Co. Kg | Control and regulation of doors driven by an electromechanical motor |
| US20090132058A1 (en) * | 2006-03-30 | 2009-05-21 | Andreas Drebinger | Control and Communication System Including an Engineering Unit |
| CN101231170A (en) * | 2008-01-31 | 2008-07-30 | 北京控制工程研究所 | Method for processing information of APS sun sensor |
| CN103600852A (en) * | 2013-11-25 | 2014-02-26 | 清华大学 | Cluster-flying-supportive basic modular spacecraft |
| CN103983237A (en) * | 2014-06-10 | 2014-08-13 | 北京航空航天大学 | Sun sensor and method for carrying out attitude measurement on sun sensor |
Non-Patent Citations (2)
| Title |
|---|
| 施蕾等: ""基于FPGA的小型化太阳敏感器"", 《空间控制技术与应用》 * |
| 樊巧云: ""小型CMOS太阳敏感器"", 《光电工程》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112800712A (en) * | 2021-02-01 | 2021-05-14 | 上海利正卫星应用技术有限公司 | Design method of commercial satellite control processor chip |
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