CN104407535B - Sun sensor processing chip determination method possessing various configuration functions - Google Patents
Sun sensor processing chip determination method possessing various configuration functions Download PDFInfo
- Publication number
- CN104407535B CN104407535B CN201410555275.1A CN201410555275A CN104407535B CN 104407535 B CN104407535 B CN 104407535B CN 201410555275 A CN201410555275 A CN 201410555275A CN 104407535 B CN104407535 B CN 104407535B
- Authority
- CN
- China
- Prior art keywords
- sun sensor
- chip
- board computer
- bit
- port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
Provided is a sun sensor processing chip determination method possessing various configuration functions. The method comprises the following steps that function design verification of a sun sensor dedicated processing chip is performed; the input and output port of the sun sensor dedicated processing chip is constrained so that integrated analysis and front end design verification are realized; a 150K anti-radiation reinforcing master slice is processed, physical design is realized by adopting a CMOS0.5 mu m technology, and rear end time sequence verification is performed; and the chip functions, the number of pins and pin driving capacity are analyzed, and the packaging scheme of the sun sensor dedicated processing chip is designed and implemented. The design adopts a UART communication unit with high reliability, adopts a three-mode redundancy technology with respect to important data, and possesses the flexible configuration functions of UART communication protocols, sun sensor probe types and different obits of digital sun sensor view field monitoring code thresholds so that the requirements of different orbit satellites can be met.
Description
Technical field
The present invention relates to a kind of sun sensor process chip determines method, particularly a kind of have various configurations function
Sun sensor process chip determines method it is adaptable in high integration and miniaturization sun sensor circuit；Belong to chip
Design field.
Background technology
Sun sensor is that one of space mission commonly uses attitude sensor, for measuring the sun with respect to spacecraft
The incident angle of sun sensor.Almost all of spacecraft is required for installing sun sensor, so that according to sun sensor
The gesture feedback information providing completes the gesture stability task in each stage of spacecraft.
Commonly use most in spacecraft at present is digital, analog and three kinds of sun sensor probes of " 0-1 " formula.Its
In, digital sun sensor is popped one's head in the orientation for measuring solar azimuth and satellite body coordinate system；The analog sun is sensitive
Device probe provides the azimuth information that the sun is with respect to solar array, to realize the closed circuit control from the motion tracking sun for the windsurfing；“0-1”
Formula sun sensor probe installation composition 4 π solid angular fields, are capture and emergency rating provides solar azimuth information.The sun is quick
Sensor circuit will be processed to the signal of above-mentioned three kinds of sun sensors probe output, and each sensor feedback of the information is given
On board computer.
Wherein, digital sun sensor setting visual field monitors that code threshold is to restrain veiling glare (such as: earth surface ice
Peak reflection of light light) disturb sun sensor, sun sensor will not miss veiling glare as sun optical processing.Not co-orbital spuious
Light intensity also differs, and is therefore directed to different tracks, and the different visual field of digital sun sensor setting monitors code threshold in order to press down
Interference of stray light processed, prevents sensor to spacecraft feedback error field-of-view information.
With the fast development of global microelectric technique, micro- as development trend with integrated level height, small volume, light weight etc.
Moonlet is gathered around and is had broad application prospects.Existing sun sensor all cannot meet from volume, weight and power consumption to be defended at present
The demand for development of star, therefore sun sensor need towards low in energy consumption, development the features such as small volume and level of integrated system are high.
Content of the invention
Present invention solves the technical problem that being: overcome the deficiencies in the prior art it is proposed that one kind has various configurations function
Sun sensor dedicated processes chip design method, can be used for processing digital, analog and three kinds of sun sensitivities of " 0-1 " formula
Device probe signal, chip has more wide applicability；Monolithic process chip can complete sun sensor signal data
The repertoires such as transmission communication, are conducive to the high integration of sun sensor chip and the development of miniaturization；Because of this dedicated processes
Chip has higher Refresh Data rate and Radiation hardness, be suitable for height, in the various satellite rotating speeds such as low and moonlet and
All kinds of orbital environment demands.
The technical solution of the present invention is: a kind of sun sensor process chip determination side with various configurations function
Method, step is as follows:
(1) sun sensor probe pin positions on chip to be determined for the species interface and probe species judgement side are determined
Method；Described sun sensor probe species includes analog, " 0-1 " formula and digital；
Described probe species determination methods particularly as follows:
Before chip to be determined powers up, if sun sensor is popped one's head in as digital probe, sun sensor is popped one's head in species
The clamping of interface be high level, if sun sensor pop one's head in for analog or " 0-1 " probe, sun sensor is popped one's head in
The clamping of species interface is low level；After chip power-on reset to be determined, probe species interface level through latch twice at
After reason, if low level, then probe species is analog or " 0-1 " formula probe, and circle collection is analog or " 0-1 " formula probe is believed
Number；Otherwise, probe species is digital probe, the digital probe signal of circle collection, thus realizing identifying that sun sensor is visited
Head species, and complete the collection of probe signal, described high level is supply voltage, and low level is 0；
(2) determine that digital sun sensor visual field monitors code threshold setting pin positions on chip to be determined for the interface
Monitor that code threshold value determines method with digital sun sensor visual field；
Described digital sun sensor visual field monitor code threshold value determine method particularly as follows:
Before chip to be determined powers up, if satellite is high orbit satellite, digital sun sensor visual field is monitored code door
Sill setting interface level is fixed as high level, if satellite is LEO satellite, digital sun sensor visual field is monitored
Code threshold setting interface level is fixed as low level；
After chip power-on reset to be determined, digital sun sensor visual field monitors code threshold setting interface level signal warp
After latch twice is processed, if low level, then satellite is LEO satellite, reads LEO satellite digital solar sensitive
Device visual field monitors code threshold value；Otherwise satellite is high orbit satellite, reads high orbit satellite digital sun sensor visual field prison
Depending on code threshold value；Described high orbit and LEO satellite digital sun sensor visual field monitor that code threshold value all prestores
In the depositor of chip internal；
After digital sun sensor visual field monitors that code threshold value determines, carry out digital sun sensor angle process,
High orbit or middle low orbit visual field are monitored that code is together packed together with digital sun sensor angle processing data, waits and star
Upper computer communication；
(3) determine UART Universal Asynchronous Receiver Transmitter functional configuration interface, that is, uart communication function configuration interface is in chip to be determined
On pin positions and serial communication parameter determination method, described uart communication function configuration interface includes communication baud rate setting
Signaling interface, parity check bit signaling interface and stop position digit signaling interface, described serial communication parameter includes communicating baud
Rate, parity check bit and stop position digit；
Described serial communication parameter determination method particularly as follows:
Determine the PORT COM between sun sensor and On board computer, sun sensor utilizes to be counted on this port and star
Calculation machine is communicated, and wherein On board computer has the initiative all the time and communicates initiator；Sun sensor is in passive response all the time
Side, described PORT COM includes sending port and receiving port, i.e. rxd port and txd port；
During chip power-on reset to be determined, miscommunication enumerator com_err is reset, described miscommunication enumerator
Chip to be determined is opened up before powering up in advance, and the storage for recording the error count of miscommunication enumerator is empty
Between；
After the completion of chip power-on reset to be determined, respectively to communication baud rate setting signaling interface level, parity check bit
Signaling interface level and stop position digit signaling interface level carry out latch twice and process；
If communication baud rate setting signaling interface level and parity check bit signaling interface level are low level, uart
Communication interface implementation is: communication baud rate is 115.2kbps, and parity check bit is even parity check；
If communication baud rate setting signaling interface level and parity check bit signaling interface level are high level, uart
Communication interface implementation is: communication baud rate is 38.4kbps, and parity check bit is odd；
If communication baud rate setting signaling interface level and parity check bit signaling interface level are inconsistent, the sun is sensitive
Device stops communication with On board computer；
If stop position digit signaling interface level is high level, uart communication interface implementation is: 2 stop positions；
If stop position digit signaling interface level is low level, uart communication interface implementation is: 1 stop position；
(4) transmitting-receiving between the serial communication parameter determination sun sensor being obtained using step (3) and On board computer
Pattern, thus complete process chip function set；
(5) complete the chip of function setting in simulation steps (4), constraint, checking are implemented to the input/output port of chip
After implementing to constrain, whether the reality output of chip is consistent with output set in advance, if unanimously, chip Front-end Design is correct, enters
Enter step (6), if inconsistent, chip Front-end Design is incorrect, return to step (1)；
(6) physical Design is carried out to the correct process chip of Front-end Design in step (5), and to the chip after physical Design
Carry out Time-Series analyses and power consumption test, if sequential and power consumption are satisfied by requirement set in advance, the physical Design of process chip
Meet and require, enter step (7), otherwise, the physical Design of process chip is unsatisfactory for requiring, and re-starts the physics of process chip
Design；
(7) process chip meeting physical Design requirement in step (6) is packaged.
Transceiver mode in described step (4), specifically comprises the following steps that
After the completion of (i) chip reset to be determined, on the sun sensor determining in sun sensor waiting step (3) and star
Receiving port between computer, if successively after 2 high level of continuous acquisition rxd port and 2 low levels, i.e. rxd port
By high step-down, the State Transferring of chip to be determined is start bit reception state to level, starts to receive rising of On board computer transmission
Beginning position, enters step (ii)；Otherwise sun sensor continues the level of continuous acquisition rxd port successively；Described start bit is to account for
With the low level signal of 1；
(ii) sun sensor starts counting up after receiving start bit, is carried out continuously 3 times and adopts at the 1/2bit of start bit
Sample, and carry out 3 and take 2 votings, if start bit is low level, the State Transferring of chip to be determined is data receiving state, starts
Receive the data bit that On board computer sends, enter step (iii)；Otherwise miscommunication enumerator com_err counts, and the sun is quick
Sensor resumes waiting for the PORT COM between the sun sensor determining in step (3) and On board computer；
(iii) sun sensor receives 8 data bit of the 1st byte of On board computer transmission successively, and in every number
According to continuous sampling at the 1/2bit of position 3 times, and carry out 3 and take 2 votings, if 8 data receive, the state of chip to be determined
Be converted to parity check bit reception state, enter step (iv)；
(iv) sun sensor receives the parity check bit of On board computer transmission successively, in the 1/2bit of parity check bit
Locate continuous sampling 3 times, and carry out 3 to take 2 votings, if the parity check bit state that sun sensor receives is strange with uart communication interface
Even parity bit implementation is consistent, then the State Transferring of chip to be determined is stop position reception state, starts to receive calculating on star
The stop position that machine sends, enters step (v)；Otherwise miscommunication enumerator com_err counts, and sun sensor resumes waiting for walking
Suddenly the PORT COM between the sun sensor determining in (3) and On board computer；
V () sun sensor receives the stop position that On board computer sends, continuous sampling 3 at the 1/2bit of stop position
Secondary, and carry out 3 and take 2 votings:
(v-1) if stop position is low level, and uart communication interface implementation is 1 stop position, then the sun is sensitive
Device starts to receive successively 1 start bit of the 2nd byte of On board computer transmission, 8 data bit, 1 bit parity check position and 1
Stop position；
(v-2) if stop position is low level, and uart communication interface implementation is 2 stop positions, then the sun is sensitive
Device receives the 2nd stop position again, and then sun sensor starts to receive successively 1 of the 2nd byte of On board computer transmission
Start bit, 8 data bit, 1 bit parity check position and 2 stop positions；
Then after repeat step (i)～step (iv), if the double byte data receiving and default double byte data one
Cause, then enter step (vi)；Otherwise miscommunication enumerator com_err counts, and sun sensor resumes waiting in step (3) really
PORT COM between fixed sun sensor and On board computer；
Wherein, sun sensor starts reception enumerator interval time after receiving the 1st byte stop position, if starting to connect
Before receiving the 2nd byte start bit, the time receiving counter records interval time more than 50 μ s, then receives time time-out, the sun is quick
Sensor resumes waiting for the PORT COM between the sun sensor determining in step (3) and On board computer；Otherwise, receive interval
Time counter resets, and sun sensor prepares the data starting to receive the 2nd byte that On board computer sends；
(vi) packed data in step (2) is stored in simultaneously transmission working area, the State Transferring of chip to be determined is
Transmission state, enters step (vii), carries out the transmission of packing data；
(vii) sending port between the sun sensor determining in step (3) and On board computer, i.e. txd port guarantor
Hold high level, after delay predetermined time, the low level that the txd port of sun sensor sends 1bit to On board computer initiates
Position, then the State Transferring of chip to be determined is data is activation state, enters step (viii), the described scheduled time is not more than
200μs；
(viii) 8 data bit of the 1st byte receiving in txd port forwarding step (iii) of sun sensor, so
The State Transferring of chip to be determined is to send parity check bit state afterwards, enters step (ix)；
(ix) parity check bit that txd port forwarding step (iv) of sun sensor receives, then chip to be determined
State Transferring be send stop position state, enter step (x)；
X the txd port of () sun sensor sends data stop position, then repeat step (vii)～step (ix), send
8 data bit of the 2nd byte receiving in step (iii) and the packing data of sun sensor, enter step (xi)；
(xi) On board computer is by front 2 byte datas receiving and 2 byte instructions being sent to sun sensor
Data is compared, if unanimously, shakes hands successfully, and On board computer stores the packing data that sun sensor sends；Otherwise, hold
Handss failure, On board computer abandons the packing data that sun sensor sends, and sun sensor resumes waiting for determining in step (3)
Sun sensor and On board computer between PORT COM.
In described step (6), the physical Design of process chip includes: the io arrangement design of process chip, supply network set
Meter, layout designs and wires design.
In described step (6), physical Design is carried out to the correct process chip of Front-end Design in step (5), specifically adopt
Cmos 0.5um technique, is processed to 150k radiation hardening master slice.
In described step (7), the process chip meeting physical Design requirement in step (6) is packaged sealing using qfp64
Dress scheme.
The present invention having the beneficial effect that compared with prior art
(1) process chip in the present invention devise probe species judge interface, digital or mould can be carried out in real time
The identification of plan formula and " 0-1 " formula sun sensor probe and the collection of probe signal, go for variety classes and model
Sun sensor is popped one's head in, and has good compatibility；
(2) process chip in the present invention devise high low orbit digital sun sensor visual field monitor code threshold sentence
Slave interrupt interface, it is possible to achieve not co-orbital digital sun sensor visual field monitors code threshold flexible configuration function, to meet not
Demand with orbiter；
(3) process chip in the present invention devises and has the asynchronous serial bus transceiver of high-reliability and have communication ripple
Special rate, communication stop position and parity check bit flexibly configurable function, to meet the communications protocol demand of different satellites；
(4) chip has highly anti-radiation characteristic, effectively improves sun sensor machine life it is adaptable to the long-life of satellite
Require；
(5) sun sensor dedicated processes chip core adopts cmos 0.5um technological design and qfp64 packing forms, core
Chip size is only 18mm × 18mm, and chip size reduces more than 50%, is easy to the Miniaturization Design of sun sensor；
(7) present invention has been applied in small-sized integrated sun sensor engineering prototype, and the key technology of employing possesses good
Good realizability, engineering technology is easily realized, and therefore has good practicality.
Brief description
Fig. 1 is the flowchart of the present invention；
Fig. 2 is the uart communication module flowchart of the present invention；
Fig. 3 is the outer casing construction drawing of the present invention.
Specific embodiment
The thought that implements of the present invention is: designs a kind of sun sensor dedicated processes core with various configurations function
Piece, is carried out with 150k radiation hardening master slice, realizes physical Design using cmos 0.5um technique, by chip functions, managing
Foot number and the assessment of pin driving force, this dedicated processes chip adopts the compact package scheme of qfp64.
The present invention implements process as shown in figure 1, concretely comprising the following steps:
(1) sun sensor probe pin positions on chip to be determined for the species interface and probe species judgement side are determined
Method；Described probe species includes analog, " 0-1 " formula and digital.
Described probe species determination methods particularly as follows:
Before chip to be determined powers up, if sun sensor is popped one's head in as digital probe, sun sensor is popped one's head in species
The clamping of interface is high level, if sun sensor is popped one's head in popping one's head in " 0-1 " for analog, sun sensor is popped one's head in
The clamping of species interface is low level；After chip power-on reset to be determined, probe species interface level through latch twice at
After reason, if low level, then probe species is analog and " 0-1 " formula probe, and circle collection is analog and " 0-1 " formula probe is believed
Number；Otherwise, probe species is digital probe, the digital probe signal of circle collection, thus realizing identifying that sun sensor is visited
Head species, and complete the collection of probe signal, described high level is supply voltage, and low level is 0.
(2) determine that digital sun sensor visual field monitors code threshold setting pin positions on chip to be determined for the interface
Monitor that code threshold value determines method with digital sun sensor visual field.
Described digital sun sensor visual field monitor code threshold value determine method particularly as follows:
Before chip to be determined powers up, if satellite is high orbit satellite, digital sun sensor visual field is monitored code door
Sill setting interface level is fixed as high level, if satellite is LEO satellite, digital sun sensor visual field is monitored
Code threshold setting interface level is fixed as low level.
After chip power-on reset to be determined, digital sun sensor visual field monitors code threshold setting interface level signal warp
After latch twice is processed, if low level, then satellite is LEO satellite, reads LEO satellite digital solar sensitive
Device visual field monitors code threshold value；Otherwise satellite is high orbit satellite, reads high orbit satellite digital sun sensor visual field prison
Depending on code threshold value；Described high orbit and LEO satellite digital sun sensor visual field monitor that code threshold value all prestores
In the depositor of chip internal.
After digital sun sensor visual field monitors that code threshold value determines, carry out digital sun sensor angle process,
High orbit or middle low orbit visual field are monitored that code is together packed together with digital sun sensor angle processing data, waits and star
Upper computer communication.
Described digital sun sensor angle processes specific implementation:
Digital sun sensor angle processing system includes thick code angle processing module, thin code angle processing module, thick
Thin code synchronization and data packing block, by the data processing of these three modules thus realizing at digital sun sensor angle
Reason function.
Wherein thick code angle processing module is sequentially output the address gating signal of analog switch and enables signal, in each mould
Intend the address gating signal retention period of switch, start ad transducer, complete digital data acquisition, be sequentially output the ground of analog switch
Location gating signal and piece choosing enable signal, complete a road standard-sized sheet code of every sun sensor probe, two-way monitors code and seven
The digital quantity signal collecting work of the thick code in road, obtains the true form information of above-mentioned ten road signals；To the ten tunnel true form signals being obtained
Carry out sun sensor visual field distinguishing validity and Gray code to pseudo- offset binary code conversion, obtain pseudo- offset binary
Code, delivers to thickness code synchronization and data packing block；Meanwhile thick code angle processing module gathers sun sensor successively
Four tunnels thin code true form signal, delivers to thin code angle processing module.
The cordic of the thin code true form signal in thin code angle processing modules implement four tunnel optimizes computing, obtains thin code angle, send
To thickness code synchronization and data packing block.
Thickness code synchronization and data packing block complete pseudo- offset binary code and thin code angle simultaneously match and angle
Data is packed；
(digital sun sensor angle processing method derives from national inventing patent " the coding type sun based on fpga
Sensor signal processing system ").
(3) determine UART Universal Asynchronous Receiver Transmitter functional configuration interface, that is, uart communication function configuration interface is in chip to be determined
On pin positions and serial communication parameter determination method, described uart communication function configuration interface includes communication baud rate setting
Signaling interface, parity check bit signaling interface and stop position digit signaling interface, described serial communication parameter includes communicating baud
Rate, parity check bit and stop position digit.
Described serial communication parameter determination method particularly as follows:
Determine the PORT COM between sun sensor and On board computer, sun sensor utilizes to be counted on this port and star
Calculation machine is communicated, and wherein On board computer has the initiative all the time and communicates initiator；Sun sensor is in passive response all the time
Side, described PORT COM includes sending port and receiving port, i.e. rxd port and txd port；
During chip power-on reset to be determined, miscommunication enumerator " com_err " is reset described miscommunication and counts
Device chip to be determined is opened up before powering up in advance, and the storage for recording the error count of miscommunication enumerator is empty
Between.
After the completion of chip power-on reset to be determined, respectively simultaneously to communication baud rate setting signaling interface level, odd even school
Test a signaling interface level and stop position digit signaling interface level carries out latch twice and processes.
If communication baud rate setting signaling interface level and parity check bit signaling interface level are low level, uart
Communication interface implementation is: communication baud rate is 115.2kbps, and parity check bit is even parity check.
If communication baud rate setting signaling interface level and parity check bit signaling interface level are high level, uart
Communication interface implementation is: communication baud rate is 38.4kbps, and parity check bit is odd.
If communication baud rate setting signaling interface level and parity check bit signaling interface level are inconsistent, the sun is sensitive
Device stops communication with On board computer.
If stop position digit signaling interface level is high level, uart communication interface implementation is: 2 stop positions；
If stop position digit signaling interface level is low level, uart communication interface implementation is: 1 stop position.
(4) transmitting-receiving between described step (3) obtains serial communication parameter determination sun sensor and On board computer
Pattern, thus complete process chip function setting, described determination transceiver mode, specifically comprises the following steps that
(i) r_idle: after the completion of chip reset to be determined, the sun determining in sun sensor waiting step (3) is sensitive
Receiving port between device and On board computer, if successively after 2 high level of continuous acquisition rxd port and 2 low levels, that is,
By high step-down, the State Transferring of chip to be determined is start bit reception state to rxd port level, starts reception On board computer and sends out
The start bit sent, enters step (ii) r_start；Otherwise sun sensor continues the level of continuous acquisition rxd port successively；Institute
State the low level signal that start bit is occupancy 1.
(ii) r_start: sun sensor starts counting up after receiving start bit, continuously enters at the 1/2bit of start bit
Row 3 times sampling, and carry out 3 and take 2 votings, if start bit is low level, the State Transferring of chip to be determined is data receiver shape
State, starts to receive the data bit that On board computer sends, enters step (iii) r_data；Otherwise miscommunication enumerator " com_
Err " counts, and sun sensor resumes waiting for the communication terminal between the sun sensor determining in step (3) and On board computer
Mouthful.
(iii) r_data: sun sensor receives 8 data bit of the 1st byte of On board computer transmission successively, and
Continuous sampling 3 times at the 1/2bit of each data bit, and carry out 3 and take 2 votings, if 8 data receive, chip to be determined
State Transferring be parity check bit reception state, enter step (iv) r_parity.
(iv) r_parity: sun sensor receives the parity check bit of On board computer transmission successively, in even-odd check
1/2bit place's continuous sampling 3 times of position, and carry out 3 and take 2 votings, if the parity check bit state of sun sensor reception and uart
Communication interface parity check bit implementation is consistent, then the State Transferring of chip to be determined is stop position reception state, starts to connect
Receive the stop position that On board computer sends, enter step (v) r_stop；Otherwise miscommunication enumerator " com_err " counts, too
Positive sensor resumes waiting for the PORT COM between the sun sensor determining in step (3) and On board computer.
V () r_stop: sun sensor receives the stop position that On board computer sends, continuous at the 1/2bit of stop position
Sampling 3 times, and carry out 3 and take 2 votings:
(v-1) if stop position is low level, and uart communication interface implementation is 1 stop position, then the sun is sensitive
Device starts to receive successively 1 start bit of the 2nd byte of On board computer transmission, 8 data bit, 1 bit parity check position and 1
Stop position.
(v-2) if stop position is low level, and uart communication interface implementation is 2 stop positions, then the sun is sensitive
Device receives the 2nd stop position again, and then sun sensor starts to receive successively 1 of the 2nd byte of On board computer transmission
Start bit, 8 data bit, 1 bit parity check position and 2 stop positions.
Then after repeat step (i)～step (iv), if the double byte data receiving and default double byte data one
Cause, then enter step (vi) t_idle；Otherwise miscommunication enumerator " com_err " counts, and sun sensor resumes waiting for walking
Suddenly the PORT COM between the sun sensor determining in (3) and On board computer.
Wherein, sun sensor starts reception enumerator interval time after receiving the 1st byte stop position, if starting to connect
Before receiving the 2nd byte start bit, the time receiving counter records interval time exceedes
50 μ s, then receive time time-out, and sun sensor resumes waiting on the sun sensor of determination and star in step (3)
PORT COM between computer；Otherwise, receive counter O reset interval time, sun sensor prepares to start to receive to count on star
The data of the 2nd byte that calculation machine sends.
(vi) t_idle: packed data in step (2) is stored in simultaneously transmission working area, the state of chip to be determined
Be converted to transmission state, enter step (vii) t_start, carry out the transmission of packing data.
(vii) sending port between the sun sensor determining in t_start: step (3) and On board computer, that is,
Txd port keeps high level, and after delay predetermined time, the txd port of sun sensor sends the low of 1bit to On board computer
Level start bit, then the State Transferring of chip to be determined is data is activation state, enters step (viii), the described scheduled time
It is not more than 200 μ s.
(viii) 8 digits of the 1st byte receiving in txd port forwarding step (iii) of t_data: sun sensor
According to position, then the State Transferring of chip to be determined is to send parity check bit state, enters step (ix) t_parity.
(ix) parity check bit that txd port forwarding step (iv) of t_parity: sun sensor receives, then treats
The State Transferring determining chip, for sending stop position state, enters step (x) t_stop.
X the txd port of () t_stop: sun sensor sends data stop position, then repeat step (vii)～step
(ix) 8 data bit of the 2nd byte, receiving in forwarding step (iii) and the packing data of sun sensor, enter step
(xi).
(xi) On board computer is by front 2 byte datas receiving and 2 byte instructions being sent to sun sensor
Data is compared, if unanimously, shakes hands successfully, and On board computer stores the packing data that sun sensor sends；Otherwise, hold
Handss failure, sun sensor resumes waiting for the PORT COM between the sun sensor determining in step (3) and On board computer.
(5) complete the chip of function setting in simulation steps (4).The clock network of whole design adopts single clock, on
Rise along triggering.Constraint is implemented to the input/output port of chip, the minimax time delay of input and output is respectively set to 12ns
And 11ns, input port sequential is set, and after checking enforcement constraint, whether the reality output of chip is consistent with output set in advance:
If consistent, chip Front-end Design is correct, enters step (6)；If inconsistent, chip Front-end Design is incorrect, return to step
(1).
(6) adopt cmos 0.5um technique, 150k radiation hardening master slice is carried out with the physical Design of process chip, and right
Chip after physical Design carries out Time-Series analyses and power consumption test, if sequential and power consumption are satisfied by requirement set in advance, locates
The physical Design of reason chip meets requirement, enters step (7), and otherwise, the physical Design of process chip is unsatisfactory for requiring, and again enters
The physical Design of row process chip, the physical Design of described process chip includes: the io arrangement design of process chip, supply network
Design, layout, wires design and Time-Series analyses optimization.
Sun sensor process chip adopts cmos 0.5um technique, carries out process chip to 150k radiation hardening master slice
Physical Design, specific design implementation steps are:
(6-a) io arrangement
It is 3.5 ten thousand in view of chip-scale, critical power loss is less than 1w, io output driving ability is not less than 3ma, and
The usage quantity of io pin is it is determined that whole chip uses the arrangement on 28 pins and 10 pairs of power supply/ground.In order to allow power supply more
Abundance, all employs three to each pair power supply/ground and ties up.
(6-b) supply network design
Electric power network is mainly designed to carry out the design for unit power grid in core, including the power supply around kernel
Network and the power ground powered to each standard block that ring, internal width metal do.The power ring of master slice and electric power network
Cloth is good, increased one times of longitudinal stripe on this basis it is ensured that power supply is sufficient.
(6-c) layout, wiring
Full wafer layout and standard cell placement are carried out to chip.Carry out wiring process after clock trees are set up, for cloth
Time-Series analyses result after line was all repaired to the foundation/retention time under each pattern, the parasitic ginseng extracted the most at last
Number file carries out last sequential inspection and functional verification.
(6-d) Time-Series analyses optimization
Sequential inspection, power consumption test are carried out to the chip after physical Design, if sequential and power consumption be satisfied by set in advance
Require, then the physical Design of process chip meets and requires, and enters step (7), otherwise, the physical Design of process chip is unsatisfactory for will
Ask, re-start the physical Design of process chip.
Chip after to physical Design carries out power consumption analysis, and the upset rate of setting clock is 20%, in operating frequency
During for 40m, running voltage for 5.5v, power consumption analysis result is 0.8w, and the physical Design of process chip meets requirement.
Fig. 3 is the domain after wiring and optimization.
(7) process chip meeting physical Design requirement in step (6) is packaged, is packaged sealing using qfp64
Dress scheme.
After physical Design, cavity volume 130.83mm of process chip3, whole chip altogether using 48 pins, if
Meter adopts qfp64 packing forms, as shown in figure 3, wherein Fig. 3 (a) is shell top view, Fig. 3 (b) is the outer casing construction drawing of chip
Shell bottom view.
Chip lead bonding adopts Si-Al wire bonding technology, and a diameter of 32 μm, die bonding adopts conducting resinl load technique,
Sealing cap adopts sealing by fusing technique, and cover plate is grounded by bonding wire mode.
The present invention can reach excellent performance indications:
At present, on star, sun sensor all adopts with the 80c32 of atmel company (dip40 encapsulation) single-chip microcomputer as core
Process circuit, this process circuit does not possess various configurations function, and this process circuit size is larger simultaneously, thus it is sensitive to limit the sun
Device whole machine integrated level and body dimension；
And new sun sensor dedicated processes circuit adopts dedicated processes chip, this dedicated processes circuit has following spy
Point:
(1) dedicated processes circuit port has uart communications protocol, sun sensor probe species and not co-orbital
Digital sun sensor visual field monitors code threshold flexibly configurable function, to meet the demand of different orbiters；
(2) dedicated processes circuit has higher Refresh Data rate, is applicable to the faster spacecraft of velocity of rotation；
(3) dedicated processes circuit has highly anti-radiation characteristic, effectively improves sun sensor machine life it is adaptable to high rail
Road and the long life requirement of LEO satellite.
New sun sensor dedicated processes circuit and traditional sun sensor dedicated processes circuit performance index compare point
Analysis situation see table shown in 1.
Table 1
At present, the aerospace level device of new sun sensor dedicated processes circuit is successfully developed, and this aerospace level device is
Participate in the ground experiment checking of certain model satellite, every key technology that dedicated processes circuit adopts is provided with good can achieve
Property.Follow-up plan is progressively applied to large satellite to all kinds of satellites such as microsatellite, LEO satellite to high orbit satellite, using this
Method can improve the high integration of sun sensor circuit, is easy to the miniaturization of sun sensor.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (5)
1. a kind of sun sensor process chip with various configurations function determines method it is characterised in that step is as follows:
(1) sun sensor probe pin positions on chip to be determined for the species interface and probe species determination methods are determined；
Described sun sensor probe species includes analog, " 0-1 " formula and digital；
Described probe species determination methods particularly as follows:
Before chip to be determined powers up, if sun sensor is popped one's head in as digital probe, sun sensor is popped one's head in species interface
Clamping be high level, if sun sensor is popped one's head in as analog or " 0-1 " probe, sun sensor is popped one's head in species
The clamping of interface is low level；After chip power-on reset to be determined, after probe species interface level is processed through latch twice,
If low level, then probe species is analog or " 0-1 " formula probe, and circle collection is analog or " 0-1 " formula probe signal；No
Then, probe species is digital probe, the digital probe signal of circle collection, thus realizing identifying sun sensor probe kind
Class, and complete the collection of probe signal, described high level is supply voltage, and low level is 0；
(2) determine that digital sun sensor visual field monitors code threshold setting pin positions sum on chip to be determined for the interface
Word formula sun sensor visual field monitors that code threshold value determines method；
Described digital sun sensor visual field monitor code threshold value determine method particularly as follows:
Before chip to be determined powers up, if satellite is high orbit satellite, digital sun sensor visual field supervision code threshold is set
Put interface level and be fixed as high level, if satellite is LEO satellite, digital sun sensor visual field is monitored code door
Sill setting interface level is fixed as low level；
After chip power-on reset to be determined, digital sun sensor visual field monitors code threshold setting interface level signal through twice
After latch is processed, if low level, then satellite is LEO satellite, reads LEO satellite digital sun sensor and regards
Field monitors code threshold value；Otherwise satellite is high orbit satellite, reads high orbit satellite digital sun sensor visual field and monitors code
Threshold value；Described high orbit and LEO satellite digital sun sensor visual field monitor that code threshold value is all stored in advance in core
In depositor within piece；
After digital sun sensor visual field monitors that code threshold value determines, carry out digital sun sensor angle process, by height
Track or middle low orbit visual field monitor that code is together packed together with digital sun sensor angle processing data, wait and meter on star
Calculation machine communicates；
(3) determine UART Universal Asynchronous Receiver Transmitter functional configuration interface, that is, uart communication function configuration interface is on chip to be determined
Pin positions and serial communication parameter determination method, described uart communication function configuration interface includes communication baud rate setting signal
Interface, parity check bit signaling interface and stop position digit signaling interface, described serial communication parameter includes communication baud rate, strange
Even parity bit and stop position digit；
Described serial communication parameter determination method particularly as follows:
Determine the PORT COM between sun sensor and On board computer, sun sensor utilizes this port and On board computer
Communicated, wherein On board computer has the initiative all the time and communicates initiator；Sun sensor is in passive answer party, institute all the time
State PORT COM and include sending port and receiving port, be i.e. rxd port and txd port；
During chip power-on reset to be determined, miscommunication enumerator com_err is reset, described miscommunication enumerator is to treat
Determine what chip had been opened up before powering up in advance, for recording the memory space of the error count of miscommunication enumerator；
After the completion of chip power-on reset to be determined, respectively to communication baud rate setting signaling interface level, parity check bit signal
Interface level and stop position digit signaling interface level carry out latch twice and process；
If communication baud rate setting signaling interface level and parity check bit signaling interface level are low level, uart communicates
Interface implemer is: communication baud rate is 115.2kbps, and parity check bit is even parity check；
If communication baud rate setting signaling interface level and parity check bit signaling interface level are high level, uart communicates
Interface implemer is: communication baud rate is 38.4kbps, and parity check bit is odd；
If communication baud rate setting signaling interface level and parity check bit signaling interface level inconsistent, sun sensor with
On board computer stops communication；
If stop position digit signaling interface level is high level, uart communication interface implementation is: 2 stop positions；If stopping
Stop bit digit signaling interface level is low level, then uart communication interface implementation is: 1 stop position；
(4) transceiver mode between the serial communication parameter determination sun sensor being obtained using step (3) and On board computer,
Thus complete process chip function setting；
(5) complete the chip of function setting in simulation steps (4), constraint is implemented to the input/output port of chip, checking is implemented
After constraint, whether the reality output of chip is consistent with output set in advance, if unanimously, chip Front-end Design is correct, enters step
Suddenly (6), if inconsistent, chip Front-end Design is incorrect, return to step (1)；
(6) physical Design is carried out to the correct process chip of Front-end Design in step (5), and the chip after physical Design is carried out
Time-Series analyses and power consumption test, if sequential and power consumption are satisfied by requirement set in advance, the physical Design of process chip meets
Require, enter step (7), otherwise, the physical Design of process chip is unsatisfactory for requiring, and the physics re-starting process chip sets
Meter；
(7) process chip meeting physical Design requirement in step (6) is packaged.
2. a kind of sun sensor process chip with various configurations function according to claim 1 determines method, its
It is characterised by: transceiver mode in described step (4), specifically comprise the following steps that
After the completion of (i) chip reset to be determined, the sun sensor and the calculating on star that determine in sun sensor waiting step (3)
Receiving port between machine, if successively after 2 high level of continuous acquisition rxd port and 2 low levels, i.e. rxd port level
By high step-down, the State Transferring of chip to be determined is start bit reception state, starts to receive the start bit that On board computer sends,
Enter step (ii)；Otherwise sun sensor continues the level of continuous acquisition rxd port successively；Described start bit is to take 1
Low level signal；
(ii) sun sensor starts counting up after receiving start bit, is carried out continuously 3 samplings at the 1/2bit of start bit, and
Carry out 3 and take 2 votings, if start bit is low level, the State Transferring of chip to be determined is data receiving state, starts to receive star
The data bit that upper computer sends, enters step (iii)；Otherwise miscommunication enumerator com_err counts, sun sensor weight
PORT COM between the sun sensor determining in new waiting step (3) and On board computer；
(iii) sun sensor receives 8 data bit of the 1st byte of On board computer transmission successively, and in each data bit
1/2bit at continuous sampling 3 times, and carry out 3 and take 2 votings, if 8 data receive, the State Transferring of chip to be determined
For parity check bit reception state, enter step (iv)；
(iv) sun sensor receives the parity check bit of On board computer transmission successively, at the 1/2bit of parity check bit even
Continue sampling 3 times, and carry out 3 and take 2 votings, if the parity check bit state of sun sensor reception and uart communication interface odd even school
Test an implementation consistent, then the State Transferring of chip to be determined is stop position reception state, start reception On board computer and send out
The stop position sent, enters step (v)；Otherwise miscommunication enumerator com_err counts, and sun sensor resumes waiting for step
(3) PORT COM between the sun sensor determining in and On board computer；
V stop position that () sun sensor reception On board computer sends, continuous sampling 3 times at the 1/2bit of stop position, and
Carry out 3 and take 2 votings:
(v-1) if stop position is low level, and uart communication interface implementation is 1 stop position, then sun sensor is opened
Begin to receive 1 start bit of the 2nd byte, 8 data bit, 1 bit parity check position and 1 stopping that On board computer sends successively
Position；
(v-2) if stop position is low level, and uart communication interface implementation is 2 stop positions, then sun sensor is again
The 2nd stop position of secondary reception, then sun sensor start to receive successively 1 of the 2nd byte of On board computer transmission and initiate
Position, 8 data bit, 1 bit parity check position and 2 stop positions；
Then after repeat step (i)～step (iv), if the double byte data receiving is consistent with default double byte data,
Enter step (vi)；Otherwise miscommunication enumerator com_err counts, and sun sensor resumes waiting for determination in step (3)
PORT COM between sun sensor and On board computer；
Wherein, sun sensor starts after receiving the 1st byte stop position and receives enumerator interval time, if starting to receive the
Before 2 byte start bits, the time receiving counter records interval time more than 50 μ s, then receives time time-out, sun sensor
Resume waiting for the PORT COM between the sun sensor of determination and On board computer in step (3)；Otherwise, receive interval time
Counter O reset, sun sensor prepares the data starting to receive the 2nd byte that On board computer sends；
(vi) packed data in step (2) is stored in simultaneously transmission working area, the State Transferring of chip to be determined is to send
State, enters step (vii), carries out the transmission of packing data；
(vii) sending port between the sun sensor determining in step (3) and On board computer, that is, the holding of txd port is high
Level, after delay predetermined time, the txd port of sun sensor sends the low level start bit of 1bit to On board computer, so
The State Transferring of chip to be determined is data is activation state afterwards, enters step (viii), and the described scheduled time is not more than 200 μ s；
(viii) 8 data bit of the 1st byte receiving in txd port forwarding step (iii) of sun sensor, then treat
The State Transferring determining chip, for sending parity check bit state, enters step (ix)；
(ix) parity check bit that txd port forwarding step (iv) of sun sensor receives, the then shape of chip to be determined
State is converted to transmission stop position state, enters step (x)；
X the txd port of () sun sensor sends data stop position, then repeat step (vii)～step (ix), forwarding step
(iii) 8 data bit of the 2nd byte receiving in and the packing data of sun sensor, enter step (xi)；
(xi) On board computer is by front 2 byte datas receiving and 2 byte instruction data being sent to sun sensor
It is compared, if unanimously, shakes hands successfully, On board computer stores the packing data that sun sensor sends；Otherwise, shake hands mistake
Lose, On board computer abandons the packing data that sun sensor sends, sun sensor resumes waiting for determining too in step (3)
PORT COM between positive sensor and On board computer.
3. a kind of sun sensor process chip with various configurations function according to claim 1 determines method, its
It is characterised by: in described step (6), the physical Design of process chip includes: the io arrangement design of process chip, supply network set
Meter, layout designs and wires design.
4. a kind of sun sensor process chip with various configurations function according to claim 1 determines method, its
It is characterised by: in described step (6), physical Design is carried out to the correct process chip of Front-end Design in step (5), specifically adopt
With cmos 0.5um technique, 150k radiation hardening master slice is processed.
5. a kind of sun sensor process chip with various configurations function according to claim 1 determines method, its
It is characterised by: in described step (7), the process chip meeting physical Design requirement in step (6) is packaged adopting qfp64
Encapsulation scheme.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555275.1A CN104407535B (en) | 2014-10-20 | 2014-10-20 | Sun sensor processing chip determination method possessing various configuration functions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555275.1A CN104407535B (en) | 2014-10-20 | 2014-10-20 | Sun sensor processing chip determination method possessing various configuration functions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104407535A CN104407535A (en) | 2015-03-11 |
| CN104407535B true CN104407535B (en) | 2017-02-01 |
Family
ID=52645173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410555275.1A Active CN104407535B (en) | 2014-10-20 | 2014-10-20 | Sun sensor processing chip determination method possessing various configuration functions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104407535B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112800712A (en) * | 2021-02-01 | 2021-05-14 | 上海利正卫星应用技术有限公司 | Design method of commercial satellite control processor chip |
| CN114295120A (en) * | 2021-11-24 | 2022-04-08 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Star sensor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4345232C2 (en) * | 1993-11-30 | 1996-01-11 | Dorma Gmbh & Co Kg | Control and regulation for a door driven by an electromechanical motor |
| EP1999522B1 (en) * | 2006-03-30 | 2012-05-02 | Siemens Aktiengesellschaft | Control and communication system including an engineering unit |
| CN100565112C (en) * | 2008-01-31 | 2009-12-02 | 北京控制工程研究所 | The information processing method of APS sun sensor |
| CN103600852B (en) * | 2013-11-25 | 2015-10-07 | 清华大学 | Support the basic module spacecraft of cluster flight |
| CN103983237B (en) * | 2014-06-10 | 2019-02-19 | 北京航空航天大学 | A kind of sun sensor and its method for carrying out attitude measurement |
-
2014
- 2014-10-20 CN CN201410555275.1A patent/CN104407535B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104407535A (en) | 2015-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107092574B (en) | A kind of Multi-serial port caching multiplexing method suitable for electronic equipment on satellite | |
| CN106895982A (en) | Traction braking integrated test system for performance | |
| CN103777529A (en) | Fast varying signal collector | |
| CN103941312A (en) | Remote rainfall monitoring system | |
| CN109491276A (en) | A kind of oil-gas pipeline internal detector data receiver and storage device | |
| CN106774038A (en) | Environmental monitoring or Monitoring Data collection transmission instrument | |
| CN104407535B (en) | Sun sensor processing chip determination method possessing various configuration functions | |
| CN204461477U (en) | Based on the high-rise structures condition monitoring system of intelligent mobile phone platform | |
| CN106843069A (en) | One kind is based on the multi-functional mine search and rescue robot of cell-phone customer terminal | |
| CN107959523A (en) | Electric power Beidou communication system and communication means based on Beidou communication technology | |
| CN107422254B (en) | A kind of built-in chip health status towards integrated micro-system is from monitoring method | |
| CN206684533U (en) | Wechat remote control chip | |
| CN104833954A (en) | Mine personnel security positioning system | |
| CN104090506A (en) | Digital input module for adjusting show value of electronic instrument | |
| CN207676165U (en) | A kind of fault data recorder device based on Aerial Electronic Equipment | |
| CN104572515B (en) | Tracking module, method, system and on-chip system chip | |
| CN103324589A (en) | SD (secure digital memory card) control system | |
| CN203732737U (en) | Integrated microclimate monitoring and time service device | |
| CN112836455B (en) | SOC simulation method and system | |
| CN109830095B (en) | Data concentrator | |
| Panic et al. | Low power sensor node processor architecture | |
| CN208012754U (en) | A kind of data collecting card suitable for optical fiber vibration sensing | |
| CN207099119U (en) | 1553B Communications Processor Modules based on DSP | |
| CN208224763U (en) | Based on monolithic processor controlled voltage check device | |
| CN102032000B (en) | Turbine status data acquisition device based on personal computer 104 (PC104) bus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |