CN104406076A - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN104406076A CN104406076A CN201410711857.4A CN201410711857A CN104406076A CN 104406076 A CN104406076 A CN 104406076A CN 201410711857 A CN201410711857 A CN 201410711857A CN 104406076 A CN104406076 A CN 104406076A
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- CN
- China
- Prior art keywords
- led lamp
- housing
- heat
- heat abstractor
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED lamp, the LED lamp comprises a radiator and a light-emitting component fixed on the radiator, the radiator comprises a first shell opened at one end and a second shell opened at one end, the opening of the first shell is connected with the opening of the second shell; the first shell and the second shell have barrel structure; the light-emitting component is respectively fixed at the bottoms of the first shell and the second shell at the side being far from the opening. The LED lamp is high in radiation efficiency, simple in structure, light in weight and low in manufacture cost. The LED lamp can radiate automatically via the radiator having shell structure, the radiation efficiency is high and the weight and the manufacture cost of the LED lamp are reduced, the assembly process is simplified and the LED lamp has integrated aesthetics.
Description
Technical field
The present invention relates to a kind of lighting apparatus, particularly relate to a kind of LED lamp.
Background technology
Along with the progressively raising of great power LED light efficiency, LED lamp is widely used in lighting field, wherein adopts LED to have the technical characteristics such as energy-conservation, long-life as the light fixture of light source.But LED is the same with traditional light source, it also can produce heat during operation, and the number producing heat depends on the luminous efficiency of LED entirety.Specifically, LED element working life and operating temperature are inversely proportional to, and thus good heat radiation is the important step of LED lamp design.Current existing LED lamp all adopts centralized for LED lamp bead fixing layout structure, then by means of the LED fin slices radiator being specifically designed to heat radiation LED heat taken away and by fin to air exchange heat to reach the object of heat radiation.The problem of such design is: because LED lamp bead concentrates to be fixed on a relatively little area thick and fast, a large amount of heats due to synergistic effect raised temperature while too increase the difficulty of outside transferring heat, the not smooth bottleneck of heat dissipation channel is caused especially when high-power applications, simultaneously, owing to have employed, volume is large, the fin slices radiator of Heavy Weight also improves light fixture cost, in addition, in order to coordinate the installation of fin slices radiator, overall its aesthetic appearance also needs to design complicated structure and fin slices radiator is fixed and wraps up by shell.
Summary of the invention
In view of this, the invention provides a kind of LED lamp that can solve the problem.
For solving the problem, the invention provides a kind of LED lamp, it comprises heat abstractor and is fixed on the light-emitting component on described heat abstractor, described heat abstractor comprises the first housing of one end open and the second housing of same one end open, the opening of described first housing and the open communication of described second housing; Described first housing and described second housing are barrel-like structure, and described light-emitting component is separately fixed at the one side of bottom away from described opening of described first housing and described second housing.
Preferably, described heat abstractor is for falling " U " type structure.
Preferably, described LED lamp also comprises the circuit board between being arranged on bottom described light-emitting component and described heat abstractor, is provided with thermal interfacial material between bottom described circuit board and described heat abstractor.
Preferably, the surfaces externally and internally of described heat abstractor is smooth surface.
Preferably, described first housing is the first heat dissipation path for dispelling the heat to light-emitting component, and described second housing is the second heat dissipation path for dispelling the heat to light-emitting component.
Preferably, the ratio of described first heat dissipation path and the second heat dissipation path is 1: 1.
A kind of LED lamp, it comprises heat abstractor and is fixed on the light-emitting component on described heat abstractor, described heat abstractor is for falling " U " type structure, comprise two diapires and connect the perisporium of described diapire, described heat abstractor is provided with an opening portion away from one end of described two diapires, and described light-emitting component is separately fixed at the one side of described two diapires away from described opening portion.
Preferably, described heat abstractor comprises the first housing of one end open and the second housing of same one end open, the opening of described first housing and the open communication of described second housing form described opening portion, described first housing and described second housing are barrel-like structure, and described two diapires are respectively the diapire of described first housing and described second housing.
Preferably, described LED lamp also comprises the circuit board between being arranged on bottom described light-emitting component and described heat abstractor, is provided with thermal interfacial material between bottom described circuit board and described heat abstractor.
Preferably, the surfaces externally and internally of described heat abstractor is smooth surface.
Preferably, the part of described two diapires of described perisporium connection forms a through cylindrical wall.
The present invention has following beneficial effect:
Above-mentioned LED lamp is by rational structural design and source layout, the heat that light-emitting component is produced can be undertaken by the heat abstractor being arranged to shell structure conducting and dispelling the heat, thus make LED lamp 100 have excellent heat dispersion and radiating efficiency, can high-power LED lamp be suitable for.Meanwhile, owing to eliminating traditional fin slices radiator, reduce weight and the manufacturing cost of LED lamp, simplify assembly technology, and this LED lamp can be made to have overall aesthetic property.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED lamp in first embodiment of the invention;
Fig. 2 is the structural representation of LED lamp in second embodiment of the invention;
Fig. 3 is the structural representation of LED lamp in third embodiment of the invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.
Refer to Fig. 1, the first embodiment of the present invention provides a kind of LED lamp 100, and it comprises heat abstractor 10 and is fixed on the light-emitting component 20 on described heat abstractor 10.
Described heat abstractor 10 is specifically set to shell structure, and it comprises the first housing 11 of one end open and the second housing 12 of same one end open, and the opening of wherein said first housing 11 and the opening of described second housing 12 are interconnected again; Described first housing 11 and described second housing 12 are barrel-like structure.Be appreciated that described heat abstractor 10 comprises two diapires 13 and connects the perisporium 14 of described diapire 13, described heat abstractor 10 is provided with an opening portion in the one end away from described two diapires 13.Described heat abstractor 10 roughly in one fall " U " type structure, being appreciated that by adopting above-mentioned structure, the surface area of described heat abstractor 10 can be strengthened, that is, further increase the self-radiating efficiency of this heat abstractor 10.In described heat abstractor 10, the surfaces externally and internally of the first housing 11 and the second housing 12 is smooth surface, namely, two diapires 13 of described heat abstractor 10 and the perisporium 14 connecting described two diapires 13 are smooth surface, make this heat abstractor 10 in use, can heat loss through radiation be carried out, that is, the radiating efficiency of this LED lamp 100 can be provided, it also can improve the aesthetics of LED lamp 100 simultaneously, and can reduce manufacturing cost.Further, for improving the heat-sinking capability of heat abstractor 10, described heat abstractor 10 is made up of the good material of heat radiation, as aluminium alloy, and pottery etc.In the present embodiment, preferably, described heat abstractor 10 is made up of aluminium alloy.
Described light-emitting component 20 is separately fixed at the one side of diapire 13 away from described opening of described first housing 11 and described second housing 12.Described light-emitting component 20 is the light source of this LED lamp 100, and preferably, the light source of described LED lamp 100 is high power light source, that is, the power of described LED lamp light source is greater than 40W.Be appreciated that, described light-emitting component 20 is fixed on the diapire 13 of described first housing 11 and the second housing 12, this LED lamp 100 can obtain wider Light distribation like this, thus large area, the vertical or subvertical workplace of working face can be applicable to, this meets the demand that people use LED lamp, and by said structure, light-emitting component 20 is distributed on heat abstractor 10 dispersedly, so that each several part of heat abstractor 10 can carry out Homogeneouslly-radiating to light-emitting component 20.
Carry out normal luminous and heat radiation to reach light-emitting component 20 in the present embodiment, described LED lamp 100 also comprises the circuit board 30 be arranged between described light-emitting component 20 and heat abstractor 10 diapire 13.Further, thermal interfacial material (not shown) is provided with between described circuit board 30 and described heat abstractor 10 diapire 13, fill up the hole of microvoid and the surface irregularity produced when circuit board 30 engages with diapire 13 or contacts, reduce heat transfer contact thermal resistance, improve the heat dispersion of circuit board 30 and diapire 13, so that the heat distributed by light-emitting component 20 is led fast to heat abstractor 10, and dispel the heat by means of described heat abstractor 10.The present embodiment is in the concrete process used, circuit board 30 can adopt this thermal interfacial material of heat-conducting glue to be bonded in the diapire 13 of described heat abstractor 10, the heat that described like this light-emitting component 20 produces when working just can be transmitted on heat abstractor 10 rapidly, and dispels the heat.
In the present embodiment, LED lamp 100 in use, and the first housing 11 and the second housing 12 are the thermal components for dispelling the heat to this light-emitting component 20.Particularly, described first housing 11 is the first heat dissipation path for dispelling the heat to light-emitting component 20; Described second housing 12 is the second heat dissipation path for dispelling the heat to light-emitting component 20.When in the present embodiment during LED lamp 100 luminous operation, the heat that its light-emitting component 20 produces is left by the perisporium 14 of diapire 13 towards its two ends.As from the foregoing, the diapire 13 on described first housing 11 and the diapire 13 on the second housing are all fixed with light-emitting component 20, in order to make this heat abstractor 10 have balanced heat-sinking capability, and then improve the radiating efficiency of LED lamp 100 entirety.Preferably, the ratio of described first heat dissipation path and described second heat dissipation path is 1: 1, that is, described first housing 11 is identical with the planform of the second housing 12.
Can conduct rapidly to improve the heat that in the present embodiment LED lamp 100, light-emitting component 20 produces because of work further, namely this heat abstractor 10 can dispel the heat fast.The present embodiment is provided with a heat radiation inner casing 15 in the position that the first housing 11 diapire 13 is adjacent with the second housing 12 diapire 13, the inner casing 15 that wherein dispels the heat be this heat abstractor 10 from the direction being close to described opening cave inward formation, that is, the inner casing 15 that dispels the heat is set to integral structure with the perisporium 14 of this heat abstractor 10.Be appreciated that, the setting of above-mentioned heat radiation inner casing 15 further increases the surface area of this heat abstractor 10, that is, add contact area between heat abstractor 10 and outside air, and then this heat abstractor 10 can be improved in use, it is to the heat radiation function of light-emitting component 20.
In the present embodiment, LED lamp 100 operationally, and the heat produced when its light-emitting component 20 works conducts to diapire 13 by thermal interfacial material, conducts to perisporium 14 and carry out spreading, dispelling the heat on whole perisporium 14 via described diapire 13.Outwardly dispelled the heat by radiation mode and convection type in the surface of described diapire 13 and perisporium 14 simultaneously.Wherein determine entire thermal resistance that the heat dissipation path of LED lamp 100 radiating efficiency in the present embodiment exists equal heat dissipation path links thermal resistance and.After LED lamp energising work enough time, under certain environment temperature and air velocities, LED lamp entirety can reach a thermal balance, the junction temperature liter of the LED lamp of the temperature difference Δ t meaning now between the temperature of the light-emitting component 20 of LED lamp and air, wherein LED lamp junction temperature rises lower, means that the life expectancy of LED is longer.
The factor risen with regard to affecting LED lamp junction temperature below does following analysis:
By the light-emitting component 20 of the known LED lamp of the above analysis to heat dissipation path to heat-delivery surface for being heat loss through conduction, dispel the heat by having radiation and these two kinds of modes of convection current LED lamp each heat-delivery surface to external environment, because different radiating modes relates to different influence factors and computational methods, discuss respectively below:
1, light-emitting component 20 to each heat-delivery surface of this LED lamp be to heat loss through conduction process in, affect the thermal conductivity factor, the sectional area of heat carrier, the length of heat-transfer path etc. four because have various heat sink material in the dissipated power of LED, heat dissipation path that junction temperature rises Δ t.So the temperature difference of this section of heat-transfer path can use following equation expression:
Δt1＝L·Q1/K·A；
Wherein, Q1 represents the dissipated power of LED lamp, and unit is W; K represents thermal conductivity factor, and unit is W/m DEG C; A represents the sectional area of heat carrier, and unit is m
2; Δ t1 represents this section of heat-transfer path two ends temperature difference, and unit is DEG C; L represents heat-transfer path length, and unit is m.
The present embodiment have employed the placement scheme of dispersed placement of being tried one's best by light-emitting component 20, equivalence on the unit heat sink material wasted work rate Q1 that falls apart significantly is reduced, add the heat carrier sectional area of equivalence simultaneously, also making full use of structural design in addition makes the loose heat consumption of LED conduct heat, to reach better radiating effect to the first housing 11 and the second housing 12 with as far as possible equal distance.
2, by each heat-delivery surface of LED lamp in the link of function of environment heat emission, its convection type carries out affecting junction temperature in heat transfer and rises three factors such as the temperature difference because have the coefficient of heat transfer, effective heat exchange area, heat exchange surface and fluid of Δ t.Specifically can be as follows with following equation expression:
Δt2＝Q2/hc·A；
Wherein, Q2 represents heat loss through convection amount, and unit is W; Hc represents the coefficient of heat transfer, and unit is W/m
2a; A represents effective heat exchange area, and unit is m
2; Δ t2 represents heat exchange surface and fluid temperature difference, and unit is DEG C.
This enforcement is using the surfaces externally and internally of whole LED lamp as effective heat exchange area, and its area has been greater than traditional fin radiating structure, and therefore this structure has good heat loss through convection effect.The very effect considering heat loss through radiation of simultaneously traditional fin radiating structure not more, in fact, not far owing to being separated by between fin, the effect of heat loss through radiation is almost offset completely by the absorption of adjacent fin and inoperative, but in the LED lamp 100 of the present embodiment, surfaces externally and internally due to whole LED lamp is smooth structure, and described light-emitting component 20 is fixed on diapire 13, namely, described light-emitting component is exposed in outside, therefore, heat loss through radiation also plays a significant role, and This further reduces junction temperature and rises Δ t.
In sum, in the present embodiment, LED lamp 100 takes full advantage of radiating principle and the layout of reasonable Arrangement LED and utilize the efficient radiator structure of member designs of the intrinsic LED lamp such as outer cover, also reduces light fixture cost, simplifies assembly technology, maintains the aesthetic property that this LED lamp 100 has entirety effectively reducing while LED junction temperature rises Δ t.
Please refer to Fig. 2, the second embodiment of the present invention provides a kind of LED lamp 200, and it comprises heat abstractor 210 and is fixed on the light-emitting component 220 on described heat abstractor 210.
Relative to the LED lamp 100 that first embodiment of the invention provides, the LED lamp 200 that second embodiment of the invention provides, its structure & working mechanism is roughly the same, the main distinction is: dispel the heat in this LED lamp 200 between inner casing 215 and the diapire 213 of this heat abstractor 210 and be separated setting, wherein said heat abstractor 210 is snugly resisted against on the outer surface of described diapire 213, while described heat radiation inner casing 215 is fixed on described diapire 213, described heat radiation inner casing 215 can be made again maximum with the contact area of diapire 213, so that when this heat abstractor 210 can work light-emitting component 220 the part produced in heat can be transferred to heat radiation inner casing 215, and dispelled the heat by heat radiation inner casing 215.Between wherein said heat radiation inner casing 215 and diapire 213, connected mode is preferably, and the mode of being welded by interference fit fire realizes being connected and fixed between inner casing 215 and diapire 213 of dispelling the heat.Be appreciated that LED lamp 200 that second embodiment of the invention provides is the same with the LED lamp 100 that first embodiment of the invention provides and there is good thermal diffusivity, be suitable for high-power LED lamp.
Please refer to Fig. 3, the third embodiment of the present invention provides a kind of LED lamp 300, and it comprises heat abstractor 310 and is fixed on the light-emitting component 320 on described heat abstractor 310.
The LED lamp 200 that the LED lamp 100 provided relative to first embodiment of the invention and second embodiment of the invention provide, the LED lamp 300 that third embodiment of the invention provides, its structure & working mechanism is roughly the same, the main distinction to be in this LED lamp 300 for the diapire 313 of fixing light-emitting component 320 and perisporium 314 and to dispel the heat between inner casing 315 be all that the mode of being fitted by surface carries out being connected and fixed, and the LED lamp 200 that its mode that is connected and fixed between the two and second embodiment of the invention provide roughly the same.Be appreciated that the LED lamp 300 that third embodiment of the invention provides also has good thermal diffusivity, be suitable for high-power LED lamp.
The foregoing is only preferred embodiment of the present invention, be not limited to the present invention, within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (11)
1. a LED lamp, it comprises heat abstractor and is fixed on the light-emitting component on described heat abstractor, it is characterized in that, described heat abstractor comprises the first housing of one end open and the second housing of same one end open, the opening of described first housing and the open communication of described second housing; Described first housing and described second housing are barrel-like structure, and described light-emitting component is separately fixed at the one side of bottom away from described opening of described first housing and described second housing.
2. a LED lamp as claimed in claim 1, is characterized in that, described heat abstractor is for falling " U " type structure.
3. a LED lamp as claimed in claim 1, is characterized in that, described LED lamp also comprises the circuit board between being arranged on bottom described light-emitting component and described heat abstractor, is provided with thermal interfacial material between bottom described circuit board and described heat abstractor.
4. a LED lamp as claimed in claim 1, is characterized in that, the surfaces externally and internally of described heat abstractor is smooth surface.
5. a LED lamp as claimed in claim 1, is characterized in that, described first housing is the first heat dissipation path for dispelling the heat to light-emitting component, and described second housing is the second heat dissipation path for dispelling the heat to light-emitting component.
6. a LED lamp as claimed in claim 5, is characterized in that, the ratio of described first heat dissipation path and the second heat dissipation path is 1: 1.
7. a LED lamp, it comprises heat abstractor and is fixed on the light-emitting component on described heat abstractor, it is characterized in that, described heat abstractor is for falling " U " type structure, comprise two diapires and connect the perisporium of described diapire, described heat abstractor is provided with an opening portion away from one end of described two diapires, and described light-emitting component is separately fixed at the one side of described two diapires away from described opening portion.
8. a LED lamp as claimed in claim 7, it is characterized in that, described heat abstractor comprises the first housing of one end open and the second housing of same one end open, the opening of described first housing and the open communication of described second housing form described opening portion, described first housing and described second housing are barrel-like structure, and described two diapires are respectively the diapire of described first housing and described second housing.
9. a LED lamp as claimed in claim 7, is characterized in that, described LED lamp also comprises the circuit board between being arranged on bottom described light-emitting component and described heat abstractor, is provided with thermal interfacial material between bottom described circuit board and described heat abstractor.
10. a LED lamp as claimed in claim 7, is characterized in that, the surfaces externally and internally of described heat abstractor is smooth surface.
11. 1 kinds of LED lamp as claimed in claim 7, is characterized in that, the part that described perisporium connects described two diapires forms a through cylindrical wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711857.4A CN104406076A (en) | 2014-12-01 | 2014-12-01 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711857.4A CN104406076A (en) | 2014-12-01 | 2014-12-01 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104406076A true CN104406076A (en) | 2015-03-11 |
Family
ID=52643725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410711857.4A Pending CN104406076A (en) | 2014-12-01 | 2014-12-01 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104406076A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101649965A (en) * | 2009-08-20 | 2010-02-17 | 艾迪光电（杭州）有限公司 | Liquid-cooled light distribution hollow type LED lamp |
| CN202371669U (en) * | 2011-11-11 | 2012-08-08 | 深圳市瑞丰光电子股份有限公司 | Radiator and lamp with radiator |
| CN203147699U (en) * | 2013-01-31 | 2013-08-21 | 硕英股份有限公司 | Tubular light-emitting diode (LED) lamp casing structure |
| CN103939771A (en) * | 2014-03-28 | 2014-07-23 | 王海军 | LED lamp |
| CN204358466U (en) * | 2014-12-01 | 2015-05-27 | 方恒 | A kind of LED lamp |
-
2014
- 2014-12-01 CN CN201410711857.4A patent/CN104406076A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101649965A (en) * | 2009-08-20 | 2010-02-17 | 艾迪光电（杭州）有限公司 | Liquid-cooled light distribution hollow type LED lamp |
| CN202371669U (en) * | 2011-11-11 | 2012-08-08 | 深圳市瑞丰光电子股份有限公司 | Radiator and lamp with radiator |
| CN203147699U (en) * | 2013-01-31 | 2013-08-21 | 硕英股份有限公司 | Tubular light-emitting diode (LED) lamp casing structure |
| CN103939771A (en) * | 2014-03-28 | 2014-07-23 | 王海军 | LED lamp |
| CN204358466U (en) * | 2014-12-01 | 2015-05-27 | 方恒 | A kind of LED lamp |
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Application publication date: 20150311 |