CN104393467B - Tin coating method for medium part of connector - Google Patents
Tin coating method for medium part of connector Download PDFInfo
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- CN104393467B CN104393467B CN201410683031.1A CN201410683031A CN104393467B CN 104393467 B CN104393467 B CN 104393467B CN 201410683031 A CN201410683031 A CN 201410683031A CN 104393467 B CN104393467 B CN 104393467B
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- protection glue
- stannum
- board connector
- daughter board
- mother daughter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention discloses a tin coating method for a medium part of a connector. The method comprises the steps of preparing double-component silicone sealant and high-temperature silicone oil based on the mass ratio of 4: 1, wherein the mass ratio of a component A to a component B of the double-component silicone sealant is 1: 1; uniformly mixing to obtain protection glue; dipping an inserting needle of an inter-board connector wrapped with a nonwoven fabric to the protection glue and then drying; dipping the part, without the protection glue, of the inserting needle part to soldering flux; performing gold removal and tin coating operation; finally removing the protection glue. According to the method, an oil film layer is formed on the surface of a gold-plating layer through the high-temperature silicon oil, and thus the mixed glue can be separated from the metal surface; the high-temperature silicone oil is high in viscosity that the flexibility of the glue can be improved; in light of the whole solidifying process of the protection glue, the high-temperature silicone oil doped does not influence the solidifying of the glue so much; therefore, the protection glue can be solidified, is resistant to high temperature, can be separated, and is free of corrosion.
Description
Technical field
The present invention relates to a kind of ward off stannum method and in particular to a kind of adapter mid portion method of warding off stannum.
Background technology
Through exchanging with multiple Technology to the abundant investigation in industry, for adapter root appointed part go gold and
Ward off stannum to process, the stannum method of warding off mainly taken at present has a following two kinds:
(1) design special frock, Plug Division position is protected, special frock wards off that during stannum, frock sealing is poor, patches
Stannum is easily glued at position.
(2) use high warm sleeve, Plug Division position is protected.It is easily soft at high temperature that high warm sleeve wards off sleeve pipe during stannum
Change, connector tip portion easily dips in stannum, simultaneously high temperature casing protection there is a problem of highly inconsistent.
Content of the invention
It is an object of the invention to overcoming above-mentioned deficiency, provide a kind of method that adapter mid portion wards off stannum.With one kind
Connector pin electrical contact portion between curable, high temperature resistant, peelable, non-corrosive Protection glue protection coated plate, to realize
Between coated plate, connector pin mid portion removes gold, wards off the operation of stannum.
In order to achieve the above object, the present invention comprises the following steps:
Step one: 4:1 in mass ratio takes double-component silicone sealant and high-temperature silicon oil, mix homogeneously, obtains Protection glue, its
The mass ratio of a component of middle double-component silicone sealant and b component is 1:1；
Step 2: using the housing of non-woven wraps mother daughter board connector；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, the guarantor on contact pin
Between shield glue and adapter plastic body, there is gap；
Step 4: make the part that mother daughter board connector contact pin position is not moistened with Protection glue dip scaling powder, be more slowly dipped into
In golden stannum pot, mother daughter board connector is carried out with gold and processes, time 2～3s, after going golden process to terminate, the contact pin portion of mother daughter board connector
Position dips scaling powder again, carries out warding off stannum process, time 2～3s warding off Xi Guozhong；
Step 5: mother daughter board connector is immersed in dehydrated alcohol and removes Protection glue, dry and complete after removing non-woven fabrics even
Connect device mid portion and ward off stannum.
In described step one, double-component silicone sealant adopts DOW CORNING 1860, and high-temperature silicon oil adopts sfr100.
In described step one, using stirring mixing, mixing time is 5min for mixing.
In described step 3, in Protection glue, edge and the gap of housing are 1.8mm.
In described step 3, it is placed in during drying in baking oven, dry 30min～35min at a temperature of 50 ± 5 DEG C.
In described step 4, when scaling powder dips, the distance more than 1mm should be left with non-woven fabrics protective layer.
In described step 5, mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, uses banister brush brush
Wash mother daughter board connector contact pin, remove Protection glue.
Compared with prior art, double-component silicone sealant and high-temperature silicon oil are mixed by the present invention, and high-temperature silicon oil exists
Gold-plated layer surface forms one layer of oil film so that mixed colloid can be peeled off from metal surface；High-temperature silicon oil viscosity is higher, increases
The strong pliability of colloid；Can be seen that the incorporation of high-temperature silicon oil from the whole solidification process of Protection glue, the solidification impact on colloid
Less, it is a kind of curable, high temperature resistant, peelable, non-corrosive Protection glue.
Specific embodiment
With reference to embodiment, the present invention will be further described.
A kind of method that adapter mid portion wards off stannum, comprises the following steps:
Step one: 4:1 in mass ratio takes double-component silicone sealant and high-temperature silicon oil, mix homogeneously, obtains Protection glue, its
The mass ratio of a component of middle double-component silicone sealant and b component is 1:1；Double-component silicone sealant adopts DOW CORNING 1860,
High-temperature silicon oil adopts sfr100；
Step 2: using the housing of non-woven wraps mother daughter board connector；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, be placed in during drying
In baking oven, dry 30min～35min at a temperature of 50 ± 5 DEG C, there is between the Protection glue on contact pin and housing 1.8mm gap；
Step 4: make the part that mother daughter board connector contact pin position is not moistened with Protection glue dip scaling powder.When scaling powder dips,
Distance more than 1mm should be left with non-woven fabrics protective layer, more slowly be dipped in golden stannum pot, Jin Chu is carried out to mother daughter board connector
Reason, time 2～3s.After going golden process to terminate, the contact pin position of mother daughter board connector dips scaling powder again, is warded off warding off Xi Guozhong
Stannum is processed, time 2～3s；
Step 5: mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, is scrubbed between plate with banister brush
Connector pin, removes Protection glue, dries and partly ward off stannum between completing in the connectors after removing non-woven fabrics.
Embodiment 1:
Step one: 4:1 in mass ratio takes double-component DOW CORNING 1860 and sfr100, mix and blend 5min makes it uniformly, obtains
To Protection glue, the wherein mass ratio of a component of double-component DOW CORNING 1860 and b group is 1:1；
Step 2: using the housing of non-woven wraps mother daughter board connector；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, be placed in during drying
In baking oven, dry 30min at a temperature of 45 DEG C, there is between the Protection glue on contact pin and housing 1.8mm gap；
Step 4: make the part that mother daughter board connector contact pin position is not moistened with Protection glue dip scaling powder, when scaling powder dips,
Distance more than 1mm should be left with non-woven fabrics protective layer, more slowly be dipped into the contact pin position in golden stannum pot, to mother daughter board connector
Carry out gold process, time 2s, after going golden process to terminate, mother daughter board connector dips scaling powder again, carries out warding off stannum warding off Xi Guozhong
Process, time 2s；
Step 5: mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, is scrubbed between plate with banister brush
Connector pin, removes Protection glue, dries and partly ward off stannum between completing in the connectors after removing non-woven fabrics.
Embodiment 2:
Step one: 4:1 in mass ratio takes double-component DOW CORNING 1860 and sfr100, mix and blend 5min makes it uniformly, obtains
To Protection glue, the wherein mass ratio of a component of double-component DOW CORNING 1860 and b group is 1:1；
Step 2: using the housing of non-woven wraps mother daughter board connector；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, be placed in during drying
In baking oven, dry 35min at a temperature of 55 DEG C, there is between the Protection glue on contact pin and housing 1.8mm gap；
Step 4: make the part that mother daughter board connector contact pin position is not moistened with Protection glue dip scaling powder, when scaling powder dips,
Distance more than 1mm should be left with non-woven fabrics protective layer, more slowly be dipped in golden stannum pot, Jin Chu is carried out to mother daughter board connector
Reason, time 3s, after going golden process to terminate, mother daughter board connector dips scaling powder again, carries out warding off stannum process, time warding off Xi Guozhong
3s；
Step 5: mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, is scrubbed between plate with banister brush
Connector pin, removes Protection glue, dries and partly ward off stannum between completing in the connectors after removing non-woven fabrics.
Embodiment 3:
Step one: 4:1 in mass ratio takes double-component DOW CORNING 1860 and sfr100, mix and blend 5min makes it uniformly, obtains
To Protection glue, the wherein mass ratio of a component of double-component DOW CORNING 1860 and b group is 1:1；
Step 2: using the housing of non-woven wraps mother daughter board connector；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, be placed in during drying
In baking oven, dry 32min at a temperature of 50 DEG C, there is between the Protection glue on contact pin and housing 1.8mm gap；
Step 4: make the part that mother daughter board connector contact pin position is not moistened with Protection glue dip scaling powder, when scaling powder dips,
Distance more than 1mm should be left with non-woven fabrics protective layer, more slowly be dipped into the contact pin position in golden stannum pot, to mother daughter board connector
Carry out gold process, time 2s, after going golden process to terminate, mother daughter board connector dips scaling powder again, carries out warding off stannum warding off Xi Guozhong
Process, time 3s；
Step 5: mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, is scrubbed between plate with banister brush
Connector pin, removes Protection glue, dries and partly ward off stannum between completing in the connectors after removing non-woven fabrics.
Embodiment 4:
Step one: 4:1 in mass ratio takes double-component DOW CORNING 1860 and sfr100, mix and blend 5min makes it uniformly, obtains
To Protection glue, the wherein mass ratio of a component of double-component DOW CORNING 1860 and b group is 1:1；
Step 2: using the housing of non-woven wraps mother daughter board connector；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, be placed in during drying
In baking oven, dry 34min at a temperature of 52 DEG C, there is between the Protection glue on contact pin and housing 1.8mm gap；
Step 4: make the part that mother daughter board connector contact pin position is not moistened with Protection glue dip scaling powder, when scaling powder dips,
Distance more than 1mm should be left with non-woven fabrics protective layer, more slowly be dipped in golden stannum pot, Jin Chu is carried out to mother daughter board connector
Reason, time 3s, after going golden process to terminate, mother daughter board connector dips scaling powder again, carries out warding off stannum process, time warding off Xi Guozhong
2s；
Step 5: mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, is scrubbed between plate with banister brush
Connector pin, removes Protection glue, dries and partly ward off stannum between completing in the connectors after removing non-woven fabrics.
Ward off stannum Partial Height according to practical operation experience mother daughter board connector contact pin and do not dip in glue part than mother daughter board connector contact pin
Highly lack 0.2mm, this 0.2mm is the thickness of the non-woven fabrics of protection contact pin.
There is not the phenomenon of scolding tin adhesion between contact pin in mother daughter board connector mid portion after warding off stannum.During dipping in glue, colloid
Thickness after solidification is not more than 0.2mm, much smaller than the distance between two gold-plated contact pins.Ward off fluxing agent effect during stannum, do not deposit
The phenomenon of adhesion occurs between two pipe lower limbs.
Claims (7)
1. a kind of method that adapter mid portion wards off stannum, comprises the following steps:
Step one: 4:1 in mass ratio takes double-component silicone sealant and high-temperature silicon oil, mix homogeneously, obtains Protection glue, wherein double
The mass ratio of a component of component silicone sealant and b component is 1:1；
Step 2: protect the housing of mother daughter board connector using non-woven fabrics；
Step 3: dip Protection glue post-drying on the contact pin of mother daughter board connector being enclosed with non-woven fabrics, the Protection glue on contact pin
There is and between housing certain interval；
Step 4: the part that the contact pin position of mother daughter board connector is not moistened with Protection glue dips scaling powder, is more slowly dipped into golden stannum
In pot, mother daughter board connector is carried out with gold process, time 2～3s, after going golden process to terminate, the contact pin position of mother daughter board connector is again
Dip scaling powder, carry out warding off stannum process, time 2～3s warding off Xi Guozhong；
Step 5: mother daughter board connector is immersed in dehydrated alcohol and removes Protection glue, dry and complete in adapter after removing non-woven fabrics
Mid portion wards off stannum.
2. a kind of adapter mid portion according to claim 1 ward off stannum method it is characterised in that: described step one
In, double-component silicone sealant adopts DOW CORNING 1860, and high-temperature silicon oil adopts sfr100.
3. a kind of adapter mid portion according to claim 1 ward off stannum method it is characterised in that: described step one
In, using stirring mixing, mixing time is 5min for mixing.
4. a kind of adapter mid portion according to claim 1 ward off stannum method it is characterised in that: described step 3
In, in Protection glue, edge and the gap of housing are 1.8mm.
5. a kind of adapter mid portion according to claim 1 ward off stannum method it is characterised in that: described step 3
In, it is placed in during drying in baking oven, dry 30min～35min at a temperature of 50 ± 5 DEG C.
6. a kind of adapter mid portion according to claim 1 ward off stannum method it is characterised in that: described step 4
In, when scaling powder dips, the distance more than 1mm should be left with non-woven fabrics protective layer.
7. a kind of adapter mid portion according to claim 1 ward off stannum method it is characterised in that: described step 5
In, mother daughter board connector is immersed 5min in dehydrated alcohol, after peptization to be protected is swollen, scrubs mother daughter board connector contact pin with banister brush,
Remove Protection glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410683031.1A CN104393467B (en) | 2014-11-21 | 2014-11-21 | Tin coating method for medium part of connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410683031.1A CN104393467B (en) | 2014-11-21 | 2014-11-21 | Tin coating method for medium part of connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104393467A CN104393467A (en) | 2015-03-04 |
| CN104393467B true CN104393467B (en) | 2017-02-01 |
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| CN201410683031.1A Active CN104393467B (en) | 2014-11-21 | 2014-11-21 | Tin coating method for medium part of connector |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111541123B (en) * | 2020-05-08 | 2021-05-18 | 中国电子科技集团公司第三十八研究所 | Connector bracket and connector tin-coating and gold-removing device |
| CN111876711B (en) * | 2020-08-14 | 2024-05-31 | 云南罗平锌电股份有限公司 | Conductive copper bar tin enameling process method and tooling for anode beam for wet smelting |
| CN113621282A (en) * | 2021-08-18 | 2021-11-09 | 西安微电子技术研究所 | Gold-removing tin-coating method for connector lead wire between gold-plated plates, lead wire tin-coating protective agent and preparation method |
| CN114243414A (en) * | 2021-12-10 | 2022-03-25 | 中国电子科技集团公司第三十八研究所 | Automatic gold-removing tin-coating process method of SMP connector and tool used by same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2476428A1 (en) * | 1980-02-15 | 1981-08-21 | Tech Electro Cie Indle | METHOD FOR FASTENING ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT AND PRODUCT OBTAINED THEREBY |
| GB8425910D0 (en) * | 1984-10-13 | 1984-11-21 | Plessey Co Plc | Electrical connecting arrangements |
| CN101448372B (en) * | 2008-12-17 | 2010-09-08 | 中国航天时代电子公司第七七一研究所 | Hot dip coating tin technology for preventing approach legs of SMT parts from bridging |
| CN103237421B (en) * | 2013-04-26 | 2016-08-10 | 胜宏科技（惠州）股份有限公司 | A kind of PCB segmentation golden finger preparation method |
| CN103286409B (en) * | 2013-06-09 | 2015-04-15 | 浙江天能电池(江苏)有限公司 | Welding method of L-shaped copper sheet terminal |
| CN103706908B (en) * | 2013-12-10 | 2016-05-18 | 中国航天科工集团第二研究院七〇六所 | The low-temperature welding process of a kind of quartz accelerometer binding post and connecting line |
| CN103752970B (en) * | 2013-12-24 | 2017-09-22 | 广州金升阳科技有限公司 | A kind of welding method of lead frame |
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