CN103614754A - Treatment method of sliced ferrite product before being electroplated - Google Patents
Treatment method of sliced ferrite product before being electroplated Download PDFInfo
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- CN103614754A CN103614754A CN201310650383.2A CN201310650383A CN103614754A CN 103614754 A CN103614754 A CN 103614754A CN 201310650383 A CN201310650383 A CN 201310650383A CN 103614754 A CN103614754 A CN 103614754A
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Abstract
The invention relates to a treatment method of a sliced ferrite product, and in particular relates to a treatment method of a sliced ferrite product before being electroplated. The method comprises the following steps: 1) burning the sliced ferrite product at 880 DEG C to 900 DEG C, sintering under the condition of performing heat preservation for 300 to 400 minutes, chamfering after the sintering, and cleaning; 2) soaking the cleaned sliced ferrite product in the step 1) and a film plating solution of 60 DEG C to 70 DEG C in a mixing manner for 50 to 70 minutes according to the volume ratio of the sliced ferrite product to the plating solution being 1:2, and plating; 3) cleaning the sliced ferrite product subjected to film plating with water twice to thrice, and drying for 60 to 90 minutes at 150 DEG C to 180 DEG C; and 4) sintering the sliced ferrite product in the step 3) at 780 DEG C to 800 DEG C and performing the heat preservation for 10 to 15 minutes.
Description
Technical field
The present invention relates to a kind for the treatment of process of chip ferrite product, particularly the treatment process of a kind of chip ferrite product before plating.
Background technology
Chip ferrite product, the phenomenon that exists in appearance two end electrodes to extend to center, is called and climbs plating this type of product appearance defect.Climb that plating produces former because: metal mode of deposition when product itself exists plating, conventionally in magnet surface, can there is the metal ion that does not enter on a small quantity lattice, the H atom of separating out in plating and metal ion generation reduction reaction, the metal ion being reduced becomes the substrate of climbing plating.Traditional method of climbing plating that prevents mainly contains two kinds.The one, increase the operation of melting down before electroplating, by product insulation for a long time at a certain temperature.The shortcoming of this method is that the time cycle is long, increases cost.The 2nd, improving electroplating technology, generally can adopt and reduce electroplating time and thickness of coating, shorten electroplating time and reduce electroplating current.The shortcoming of this method is to cause Product jointing degradation.
Summary of the invention
Object of the present invention is exactly the deficiency for existing technique, provides a kind of anti-creep plating effective, and can not cause the treatment process of the bad chip ferrite product of other performances of product before plating.
To achieve these goals, adopted following technical scheme:
The treatment process of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 880 ℃-900 ℃, be incubated sintering under 300-400 minute condition, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 60 ℃-70 ℃, soak time is 50-70 minute, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 2-3 time, then at 150 ℃-180 ℃, dry 60-90 minute;
4) by 3) in chip ferrite at 780 ℃ of-800 ℃ of sintering, insulation 10-15 minute.
Further, described 2) in, the temperature of coating liquid is 62 ℃-68 ℃, and soak time is 55-65 minute.
Further, described 3) chip ferrite in is to dry 65-85 minute at 155 ℃-170 ℃.
Further, described coating liquid is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, and wherein moisture and organic additive can be dried volatilization at 120 ℃, and macromolecular compound can decomposition combustion at 350 ℃.
Further, in described coating liquid, pure water, organic additive, water-soluble high-molecular compound and glass powder are according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
Adopt beneficial effect of the present invention to be: utilize coating liquid to form ceramic membrane protective layer on ferrite surface, after reduction sintering, the electroconductibility of ferrite Surface Fe ion does not have iron ion to be reduced when electroplating; can not form and climb plating substrate; treatment process is easy and simple to handle, effective, and the time is short.It both can prevent that chip ferrite product output in electroplating work procedure from climbing plating phenomenon, can not cause the bad of coating again.The soldering reliability of the chip ferrite product after plating is protected.
Accompanying drawing explanation
Fig. 1 is work in-process schematic diagram after chip ferrite sintering.
Fig. 2 is the existing chip ferrite product plating phenomenon schematic diagram that swashes.
Fig. 3 is that the present invention processes rear ferrite inductance finished product schematic diagram.
Embodiment
Below in conjunction with concrete embodiment explanation the present invention, the embodiment that this place is enumerated is only preferred embodiment, identical with essence of the present invention all within protection scope of the present invention, also this should not located to embodiment as limitation of the present invention.
The first embodiment, the treatment process of a kind of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 880 ℃, be incubated sintering under 300 minutes conditions, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 60 ℃, soak time is 50 minutes, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 2 times, then at 150 ℃, dry 60 minutes;
4) by 3) in chip ferrite at 780 ℃ of sintering, be incubated 10 minutes.
Wherein, step 2) coating liquid described in is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, macromolecular compound 350 ℃ can decomposition combustion, according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
The second embodiment, the treatment process of a kind of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 900 ℃, be incubated sintering under 400 minutes conditions, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 70 ℃, soak time is 70 minutes, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 3 times, then at 180 ℃, dry 90 minutes;
4) by 3) in chip ferrite at 800 ℃ of sintering, be incubated 15 minutes.
Wherein, step 2) coating liquid described in is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, macromolecular compound 350 ℃ can decomposition combustion, according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
The 3rd embodiment, the treatment process of a kind of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 880 ℃, be incubated sintering under 330 minutes conditions, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 62 ℃, soak time is 55 minutes, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 2 times, then at 155 ℃, dry 65 minutes;
4) by 3) in chip ferrite at 780 ℃ of sintering, be incubated 12 minutes.
Wherein, step 2) coating liquid described in is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, macromolecular compound 350 ℃ can decomposition combustion, according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
The 4th embodiment, the treatment process of a kind of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 900 ℃, be incubated sintering under 400 minutes conditions, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 68 ℃, soak time is 65 minutes, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 3 times, then at 170 ℃, dry 85 minutes;
4) by 3) in chip ferrite at 800 ℃ of sintering, be incubated 15 minutes.
Wherein, step 2) coating liquid described in is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, macromolecular compound 350 ℃ can decomposition combustion, according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
The 5th embodiment, the treatment process of a kind of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 890 ℃, be incubated sintering under 350 minutes conditions, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 65 ℃, soak time is 60 minutes, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 3 times, then at 165 ℃, dry 70 minutes;
4) by 3) in chip ferrite at 790 ℃ of sintering, be incubated 13 minutes.
Wherein, step 2) coating liquid described in is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, macromolecular compound 350 ℃ can decomposition combustion, according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
The 6th embodiment, the treatment process of a kind of chip ferrite product before plating, comprises the steps:
1) chip ferrite is burnt at 895 ℃, be incubated sintering under 380 minutes conditions, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 65 ℃, soak time is 60 minutes, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 3 times, then at 165 ℃, dry 75 minutes;
4) by 3) in chip ferrite at 790 ℃ of sintering, be incubated 13 minutes.
Wherein, step 2) coating liquid described in is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, macromolecular compound 350 ℃ can decomposition combustion, according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
By the chip ferrite of above-mentioned processing 100 times of metallography microscope Microscopic observation product appearances and climb plating length, the soldering reliability of testing product, contrast does not deal with product data result, pass through pre-electroplating treatment, on chip ferrite inductance surface, form ceramic membrane, make product not climb plating phenomenon when electroplating, soldering reliability is qualified.And the product not processing, magnet surface 60% is covered by nickel and tin.
Claims (5)
1. the treatment process of chip ferrite product before plating, is characterized in that:
1) chip ferrite is burnt at 880 ℃-900 ℃, be incubated sintering under 300-400 minute condition, after sintering, carry out chamfering, clean up;
2) by 1) in the chip ferrite that cleans up according to volume ratio 1:2, mix immersion with the coating liquid of 60 ℃-70 ℃, soak time is 50-70 minute, carries out coating film treatment;
3) by 2) in chip ferrite after coating film treatment put into pure water inlet and clean 2-3 time, then at 150 ℃-180 ℃, dry 60-90 minute;
4) by 3) in chip ferrite at 780 ℃ of-800 ℃ of sintering, insulation 10-15 minute.
2. the treatment process of a kind of chip ferrite product according to claim 1 before plating, is characterized in that: described 2), the temperature of coating liquid is 62 ℃-68 ℃, and soak time is 55-65 minute.
3. the treatment process of a kind of chip ferrite product according to claim 1 before plating, is characterized in that: the chip ferrite described 3) is to dry 65-85 minute at 155 ℃-170 ℃.
4. the treatment process of a kind of chip ferrite product according to claim 1 before plating, it is characterized in that: described coating liquid is comprised of pure water, organic additive, water-soluble high-molecular compound and glass powder, wherein moisture and organic additive can be dried volatilization at 120 ℃, and macromolecular compound can decomposition combustion at 350 ℃.
5. the treatment process of a kind of chip ferrite product according to claim 3 before plating, is characterized in that: in described coating liquid, pure water, organic additive, water-soluble high-molecular compound and glass powder are according to pure water: organic additive: macromolecular compound: the ratio that ceramics powder is 10:1:2:10 is made.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104788127A (en) * | 2015-03-31 | 2015-07-22 | 深圳顺络电子股份有限公司 | Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element |
| CN105355410A (en) * | 2015-12-15 | 2016-02-24 | 深圳市麦捷微电子科技股份有限公司 | Deplating treatment method of multilayer chip inductor |
| CN105632672A (en) * | 2015-12-30 | 2016-06-01 | 深圳顺络电子股份有限公司 | Surface treatment method and surface treatment fluid for electronic ceramic element |
| CN110293220A (en) * | 2019-07-26 | 2019-10-01 | 深圳市麦捷微电子科技股份有限公司 | A kind of alloy core metallization treating method |
| CN111472030A (en) * | 2020-06-05 | 2020-07-31 | 麦德美科技（苏州）有限公司 | Manganese zinc ferrite chemical coarsening electroplating process |
| CN113046756A (en) * | 2021-01-29 | 2021-06-29 | 广东风华高新科技股份有限公司 | Solution for improving creeping plating of chip ferrite product and application thereof |
| CN114133231A (en) * | 2021-11-05 | 2022-03-04 | 深圳顺络电子股份有限公司 | Nickel-zinc ferrite material and method for producing same |
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| US20020109575A1 (en) * | 2000-12-11 | 2002-08-15 | Jeong Jun Hwan | Ceramic chip-type device having glass coating film and fabricating method thereof |
| CN1500157A (en) * | 2001-10-29 | 2004-05-26 | ס�����������ʽ���� | Method for forming electroplated coating on surface of article |
| EP2135974A1 (en) * | 2007-03-13 | 2009-12-23 | Tohoku University | Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method |
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Patent Citations (3)
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| US20020109575A1 (en) * | 2000-12-11 | 2002-08-15 | Jeong Jun Hwan | Ceramic chip-type device having glass coating film and fabricating method thereof |
| CN1500157A (en) * | 2001-10-29 | 2004-05-26 | ס�����������ʽ���� | Method for forming electroplated coating on surface of article |
| EP2135974A1 (en) * | 2007-03-13 | 2009-12-23 | Tohoku University | Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104788127A (en) * | 2015-03-31 | 2015-07-22 | 深圳顺络电子股份有限公司 | Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element |
| CN104788127B (en) * | 2015-03-31 | 2017-03-29 | 深圳顺络电子股份有限公司 | Electronic ceramic component is suppressed to climb the surface treatment method and electronic ceramic component of plating |
| CN105355410A (en) * | 2015-12-15 | 2016-02-24 | 深圳市麦捷微电子科技股份有限公司 | Deplating treatment method of multilayer chip inductor |
| CN105632672A (en) * | 2015-12-30 | 2016-06-01 | 深圳顺络电子股份有限公司 | Surface treatment method and surface treatment fluid for electronic ceramic element |
| CN105632672B (en) * | 2015-12-30 | 2017-12-01 | 深圳顺络电子股份有限公司 | A kind of electronic ceramic component surface treatment method and surface treatment liquid |
| CN110293220A (en) * | 2019-07-26 | 2019-10-01 | 深圳市麦捷微电子科技股份有限公司 | A kind of alloy core metallization treating method |
| CN111472030A (en) * | 2020-06-05 | 2020-07-31 | 麦德美科技（苏州）有限公司 | Manganese zinc ferrite chemical coarsening electroplating process |
| CN113046756A (en) * | 2021-01-29 | 2021-06-29 | 广东风华高新科技股份有限公司 | Solution for improving creeping plating of chip ferrite product and application thereof |
| CN114133231A (en) * | 2021-11-05 | 2022-03-04 | 深圳顺络电子股份有限公司 | Nickel-zinc ferrite material and method for producing same |
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| CN103614754B (en) | 2016-01-27 |
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